JP2012074699A5 - - Google Patents
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- JP2012074699A5 JP2012074699A5 JP2011208268A JP2011208268A JP2012074699A5 JP 2012074699 A5 JP2012074699 A5 JP 2012074699A5 JP 2011208268 A JP2011208268 A JP 2011208268A JP 2011208268 A JP2011208268 A JP 2011208268A JP 2012074699 A5 JP2012074699 A5 JP 2012074699A5
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- 230000015572 biosynthetic process Effects 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US38670110P | 2010-09-27 | 2010-09-27 | |
| US61/386,701 | 2010-09-27 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012074699A JP2012074699A (ja) | 2012-04-12 |
| JP2012074699A5 true JP2012074699A5 (enExample) | 2014-11-06 |
| JP6029269B2 JP6029269B2 (ja) | 2016-11-24 |
Family
ID=45869649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011208268A Active JP6029269B2 (ja) | 2010-09-27 | 2011-09-24 | ワイヤループおよび導電性バンプのためのワイヤボンドを形成する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20120074206A1 (enExample) |
| JP (1) | JP6029269B2 (enExample) |
| KR (1) | KR101254218B1 (enExample) |
| CN (1) | CN102420150B (enExample) |
| SG (1) | SG179389A1 (enExample) |
| TW (1) | TWI489568B (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9153554B2 (en) * | 2012-04-22 | 2015-10-06 | Kulicke And Soffa Industries, Inc. | Methods of adjusting ultrasonic bonding energy on wire bonding machines |
| TWI534918B (zh) * | 2012-06-29 | 2016-05-21 | 庫利克和索夫工業公司 | 用以補償打線機上線徑變化之方法和系統 |
| US8899469B2 (en) * | 2013-03-04 | 2014-12-02 | Kulicke And Soffa Industries, Inc. | Automatic rework processes for non-stick conditions in wire bonding operations |
| US9093515B2 (en) * | 2013-07-17 | 2015-07-28 | Freescale Semiconductor, Inc. | Wire bonding capillary with working tip protrusion |
| US9257403B2 (en) * | 2013-11-26 | 2016-02-09 | Freescale Semiconductor, Inc. | Copper ball bond interface structure and formation |
| US20150194395A1 (en) * | 2014-01-03 | 2015-07-09 | Sohrab Safai | Bond pad having a trench and method for forming |
| US9889521B2 (en) * | 2014-12-02 | 2018-02-13 | Asm Technology Singapore Pte Ltd | Method and system for pull testing of wire bonds |
| JP6445943B2 (ja) * | 2015-08-24 | 2018-12-26 | 東芝メモリ株式会社 | 半導体装置の測定方法 |
| US10121759B2 (en) * | 2015-11-04 | 2018-11-06 | Kulicke And Soffa Industries, Inc. | On-bonder automatic overhang die optimization tool for wire bonding and related methods |
| CN105760591B (zh) * | 2016-02-04 | 2019-01-25 | 广州兴森快捷电路科技有限公司 | 封装基板键合引线的邦定方法 |
| US10325878B2 (en) | 2016-06-30 | 2019-06-18 | Kulicke And Soffa Industries, Inc. | Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops |
| CN110391129B (zh) * | 2018-04-20 | 2020-10-02 | 岛津分析技术研发（上海）有限公司 | 离子化装置、质谱仪、离子迁移谱仪及离子化方法 |
| EP3603826B1 (en) * | 2018-07-31 | 2023-05-10 | Infineon Technologies AG | Method for calibrating an ultrasonic bonding machine |
| KR20230098652A (ko) | 2020-11-05 | 2023-07-04 | 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 | 와이어 본딩 기계 상의 본딩 힘의 정확도를 모니터링하는 방법을 포함하는 와이어 본딩 기계의 작동 방법, 및 관련된 방법 |
| TW202347637A (zh) | 2022-02-15 | 2023-12-01 | 美商庫利克和索夫工業公司 | 確定用於產生與工件相關的複數個導線迴路的順序的方法 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3458921A (en) * | 1965-07-19 | 1969-08-05 | Western Electric Co | Short pulse vibratory bonding |
| US5201454A (en) * | 1991-09-30 | 1993-04-13 | Texas Instruments Incorporated | Process for enhanced intermetallic growth in IC interconnections |
| JP3178567B2 (ja) * | 1993-07-16 | 2001-06-18 | 株式会社カイジョー | ワイヤボンディング装置及びその方法 |
| JP2992427B2 (ja) * | 1993-07-16 | 1999-12-20 | 株式会社カイジョー | ワイヤボンディング装置及びその方法 |
| US5858142A (en) * | 1997-02-27 | 1999-01-12 | Inertia Friction Welding, Inc. | Angular orientation control system for friction welding |
| JP2000299348A (ja) | 1999-04-13 | 2000-10-24 | Rohm Co Ltd | ボール式ワイヤボンディングにおけるボール部の最適接合条件の算出方法 |
| KR100604316B1 (ko) | 2004-06-18 | 2006-07-24 | 삼성테크윈 주식회사 | 본딩 파라메터들이 자동적으로 설정되는 와이어 본더 |
| US8658942B2 (en) * | 2004-12-16 | 2014-02-25 | Illinois Tool Works Inc. | Method and system of welding with auto-determined startup parameters |
| US8546728B2 (en) * | 2005-03-04 | 2013-10-01 | Illinois Tool Works Inc. | Welder with integrated wire feeder having single-knob control |
| US7845542B2 (en) * | 2005-09-22 | 2010-12-07 | Palomar Technologies, Inc. | Monitoring deformation and time to logically constrain a bonding process |
| JP4547330B2 (ja) * | 2005-12-28 | 2010-09-22 | 株式会社新川 | ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法 |
| DE602006015192D1 (de) * | 2006-09-05 | 2010-08-12 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zur Regelung der Herstellung von Drahtbondverbindungen |
| JP2008084897A (ja) * | 2006-09-25 | 2008-04-10 | Nagase Denshi Kiki Service Kk | 半導体パッケージの設計・製造システムおよびプログラム |
| JP4786500B2 (ja) * | 2006-10-26 | 2011-10-05 | 株式会社東芝 | ワイヤボンディング装置及びワイヤボンディング方法 |
| DE102007054626A1 (de) * | 2007-11-12 | 2009-05-14 | Hesse & Knipps Gmbh | Verfahren und Vorrichtung zum Ultraschallbonden |
| KR20090110406A (ko) * | 2008-04-18 | 2009-10-22 | 삼성테크윈 주식회사 | 와이어 본딩 방법 |
| US20090283501A1 (en) * | 2008-05-15 | 2009-11-19 | General Electric Company | Preheating using a laser beam |
| US8378249B2 (en) * | 2008-05-29 | 2013-02-19 | Illinois Tool Works Inc. | Method and apparatus for proportional valve actuation in a plasma cutter |
| US8927913B2 (en) * | 2008-06-30 | 2015-01-06 | The Invention Science Fund I, Llc | Microwave processing systems and methods |
| JP5739804B2 (ja) * | 2008-08-11 | 2015-06-24 | メガスター・テクノロジーズ・エルエルシー | 修正可能な工具制御パラメータを使用して摩擦攪拌溶接中の工具の温度を制御する方法 |
| US7762449B2 (en) * | 2008-11-21 | 2010-07-27 | Asm Assembly Automation Ltd | Bond head for heavy wire bonder |
| US8274020B2 (en) * | 2010-05-04 | 2012-09-25 | Whirlpool Corporation | Apparatus and method of controlling a triple heating element of a cooking appliance |
-
2011
- 2011-09-19 US US13/235,844 patent/US20120074206A1/en not_active Abandoned
- 2011-09-24 JP JP2011208268A patent/JP6029269B2/ja active Active
- 2011-09-26 KR KR20110096872A patent/KR101254218B1/ko active Active
- 2011-09-26 CN CN201110294325.1A patent/CN102420150B/zh active Active
- 2011-09-27 TW TW100134754A patent/TWI489568B/zh active
- 2011-09-27 SG SG2011070091A patent/SG179389A1/en unknown