JP6029269B2 - ワイヤループおよび導電性バンプのためのワイヤボンドを形成する方法 - Google Patents

ワイヤループおよび導電性バンプのためのワイヤボンドを形成する方法 Download PDF

Info

Publication number
JP6029269B2
JP6029269B2 JP2011208268A JP2011208268A JP6029269B2 JP 6029269 B2 JP6029269 B2 JP 6029269B2 JP 2011208268 A JP2011208268 A JP 2011208268A JP 2011208268 A JP2011208268 A JP 2011208268A JP 6029269 B2 JP6029269 B2 JP 6029269B2
Authority
JP
Japan
Prior art keywords
bonding
wire
forming
wire bond
control value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011208268A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012074699A5 (enExample
JP2012074699A (ja
Inventor
キン、ウェイ
ダブリュー． ブルンナー、ジョン
ダブリュー． ブルンナー、ジョン
エイ． リード、ポール
エイ． リード、ポール
Original Assignee
クリック アンド ソッファ インダストリーズ、インク．
クリック アンド ソッファ インダストリーズ、インク．
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クリック アンド ソッファ インダストリーズ、インク．, クリック アンド ソッファ インダストリーズ、インク． filed Critical クリック アンド ソッファ インダストリーズ、インク．
Publication of JP2012074699A publication Critical patent/JP2012074699A/ja
Publication of JP2012074699A5 publication Critical patent/JP2012074699A5/ja
Application granted granted Critical
Publication of JP6029269B2 publication Critical patent/JP6029269B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Wire Bonding (AREA)
JP2011208268A 2010-09-27 2011-09-24 ワイヤループおよび導電性バンプのためのワイヤボンドを形成する方法 Active JP6029269B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38670110P 2010-09-27 2010-09-27
US61/386,701 2010-09-27

Publications (3)

Publication Number Publication Date
JP2012074699A JP2012074699A (ja) 2012-04-12
JP2012074699A5 JP2012074699A5 (enExample) 2014-11-06
JP6029269B2 true JP6029269B2 (ja) 2016-11-24

Family

ID=45869649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011208268A Active JP6029269B2 (ja) 2010-09-27 2011-09-24 ワイヤループおよび導電性バンプのためのワイヤボンドを形成する方法

Country Status (6)

Country Link
US (1) US20120074206A1 (enExample)
JP (1) JP6029269B2 (enExample)
KR (1) KR101254218B1 (enExample)
CN (1) CN102420150B (enExample)
SG (1) SG179389A1 (enExample)
TW (1) TWI489568B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9153554B2 (en) * 2012-04-22 2015-10-06 Kulicke And Soffa Industries, Inc. Methods of adjusting ultrasonic bonding energy on wire bonding machines
TWI534918B (zh) * 2012-06-29 2016-05-21 庫利克和索夫工業公司 用以補償打線機上線徑變化之方法和系統
US8899469B2 (en) * 2013-03-04 2014-12-02 Kulicke And Soffa Industries, Inc. Automatic rework processes for non-stick conditions in wire bonding operations
US9093515B2 (en) * 2013-07-17 2015-07-28 Freescale Semiconductor, Inc. Wire bonding capillary with working tip protrusion
US9257403B2 (en) * 2013-11-26 2016-02-09 Freescale Semiconductor, Inc. Copper ball bond interface structure and formation
US20150194395A1 (en) * 2014-01-03 2015-07-09 Sohrab Safai Bond pad having a trench and method for forming
US9889521B2 (en) * 2014-12-02 2018-02-13 Asm Technology Singapore Pte Ltd Method and system for pull testing of wire bonds
JP6445943B2 (ja) * 2015-08-24 2018-12-26 東芝メモリ株式会社 半導体装置の測定方法
US10121759B2 (en) * 2015-11-04 2018-11-06 Kulicke And Soffa Industries, Inc. On-bonder automatic overhang die optimization tool for wire bonding and related methods
CN105760591B (zh) * 2016-02-04 2019-01-25 广州兴森快捷电路科技有限公司 封装基板键合引线的邦定方法
US10325878B2 (en) 2016-06-30 2019-06-18 Kulicke And Soffa Industries, Inc. Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
CN110391129B (zh) * 2018-04-20 2020-10-02 岛津分析技术研发（上海）有限公司 离子化装置、质谱仪、离子迁移谱仪及离子化方法
EP3603826B1 (en) * 2018-07-31 2023-05-10 Infineon Technologies AG Method for calibrating an ultrasonic bonding machine
WO2022098697A1 (en) 2020-11-05 2022-05-12 Kulicke And Soffa Industries, Inc. Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bonding force on a wire bonding machine, and related methods
US12183711B2 (en) 2022-02-15 2024-12-31 Kulicke And Soffa Industries, Inc. Methods of determining a sequence for creating a plurality of wire loops in connection with a workpiece

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3458921A (en) * 1965-07-19 1969-08-05 Western Electric Co Short pulse vibratory bonding
US5201454A (en) * 1991-09-30 1993-04-13 Texas Instruments Incorporated Process for enhanced intermetallic growth in IC interconnections
JP2992427B2 (ja) * 1993-07-16 1999-12-20 株式会社カイジョー ワイヤボンディング装置及びその方法
JP3178567B2 (ja) * 1993-07-16 2001-06-18 株式会社カイジョー ワイヤボンディング装置及びその方法
US5858142A (en) * 1997-02-27 1999-01-12 Inertia Friction Welding, Inc. Angular orientation control system for friction welding
JP2000299348A (ja) 1999-04-13 2000-10-24 Rohm Co Ltd ボール式ワイヤボンディングにおけるボール部の最適接合条件の算出方法
KR100604316B1 (ko) 2004-06-18 2006-07-24 삼성테크윈 주식회사 본딩 파라메터들이 자동적으로 설정되는 와이어 본더
US8658942B2 (en) * 2004-12-16 2014-02-25 Illinois Tool Works Inc. Method and system of welding with auto-determined startup parameters
US8546728B2 (en) * 2005-03-04 2013-10-01 Illinois Tool Works Inc. Welder with integrated wire feeder having single-knob control
US7845542B2 (en) * 2005-09-22 2010-12-07 Palomar Technologies, Inc. Monitoring deformation and time to logically constrain a bonding process
JP4547330B2 (ja) * 2005-12-28 2010-09-22 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
EP1897648B1 (en) * 2006-09-05 2010-06-30 Technische Universität Berlin Method and device for controlling the generation of ultrasonic wire bonds
JP2008084897A (ja) * 2006-09-25 2008-04-10 Nagase Denshi Kiki Service Kk 半導体パッケージの設計・製造システムおよびプログラム
JP4786500B2 (ja) * 2006-10-26 2011-10-05 株式会社東芝 ワイヤボンディング装置及びワイヤボンディング方法
DE102007054626A1 (de) * 2007-11-12 2009-05-14 Hesse & Knipps Gmbh Verfahren und Vorrichtung zum Ultraschallbonden
KR20090110406A (ko) * 2008-04-18 2009-10-22 삼성테크윈 주식회사 와이어 본딩 방법
US20090283501A1 (en) * 2008-05-15 2009-11-19 General Electric Company Preheating using a laser beam
US8278588B2 (en) * 2008-05-29 2012-10-02 Illinois Tool Works Inc. System and method for start flow approach control for a proportional valve in a plasma cutter
US8927913B2 (en) * 2008-06-30 2015-01-06 The Invention Science Fund I, Llc Microwave processing systems and methods
EP2323800A4 (en) * 2008-08-11 2017-03-01 Megastir Technologies LLC A method for using modifiable tool control parameters to control the temperature of the tool during frictions stir welding
US7762449B2 (en) * 2008-11-21 2010-07-27 Asm Assembly Automation Ltd Bond head for heavy wire bonder
US8274020B2 (en) * 2010-05-04 2012-09-25 Whirlpool Corporation Apparatus and method of controlling a triple heating element of a cooking appliance

Also Published As

Publication number Publication date
SG179389A1 (en) 2012-04-27
CN102420150A (zh) 2012-04-18
CN102420150B (zh) 2016-12-07
TW201214591A (en) 2012-04-01
KR20120031909A (ko) 2012-04-04
JP2012074699A (ja) 2012-04-12
US20120074206A1 (en) 2012-03-29
TWI489568B (zh) 2015-06-21
KR101254218B1 (ko) 2013-04-18

Similar Documents

Publication Publication Date Title
JP6029269B2 (ja) ワイヤループおよび導電性バンプのためのワイヤボンドを形成する方法
JP5830204B2 (ja) 低プロファイルのワイヤループを形成する方法およびその装置
US8143155B2 (en) Wire bonding method and semiconductor device
US7815095B2 (en) Wire loop, semiconductor device having same and wire bonding method
KR102434915B1 (ko) 와이어 루프에 대한 와이어 루프 프로파일을 생성하는 방법 및 인접한 와이어 루프 사이의 적절한 클리어런스를 검사하는 방법
CN103794586B (zh) 短的和低的回路丝线键合
JP2004282015A (ja) ワイヤボンディング機を用いて半導体相互接続のためのバンプを形成する方法及び装置
Heuck et al. Lifetime analysis of power modules with new packaging technologies
US7188759B2 (en) Methods for forming conductive bumps and wire loops
US20160365330A1 (en) Method for producing semiconductor device, and wire-bonding apparatus
US20160358883A1 (en) Bump forming method, bump forming apparatus, and semiconductor device manufacturing method
JP2017092464A (ja) ワイヤーボンディングのためのボンダー上の自動オーバーハングダイ最適化ツールと関連する方法
CN102439706B (zh) 用于优化形成引线环路的成环参数和成环轨迹的系统和方法
US20100147552A1 (en) Method of forming bends in a wire loop
US20220208721A1 (en) Wire bonding apparatus, method for manufacture of semiconductor device, and semiconductor device
US6270000B1 (en) Wire bonding method
TWI739379B (zh) 半導體裝置、半導體裝置的製造方法、以及打線接合裝置
TWI721404B (zh) 打線接合裝置、半導體裝置的製造方法以及半導體裝置
US20240055388A1 (en) Bump-forming device, bump-forming method, and non-transitory computer-readable medium
EP1722409A1 (en) Wire loop, semiconductor device having same and wire bonding method
Shanshan et al. The copper stud bumping shaping simulation based on thermal-solid couple analysis

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140924

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140924

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150824

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150901

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20151201

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20151231

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20160130

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160301

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160927

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20161018

R150 Certificate of patent or registration of utility model

Ref document number: 6029269

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250