SG179389A1 - Methods of forming wire bonds for wire loops and conductive bumps - Google Patents

Methods of forming wire bonds for wire loops and conductive bumps Download PDF

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Publication number
SG179389A1
SG179389A1 SG2011070091A SG2011070091A SG179389A1 SG 179389 A1 SG179389 A1 SG 179389A1 SG 2011070091 A SG2011070091 A SG 2011070091A SG 2011070091 A SG2011070091 A SG 2011070091A SG 179389 A1 SG179389 A1 SG 179389A1
Authority
SG
Singapore
Prior art keywords
bonding
wire bond
forming
wire
control value
Prior art date
Application number
SG2011070091A
Other languages
English (en)
Inventor
Qin Wei
w brunner Jon
A Reid Paul
Original Assignee
Kulicke & Soffa Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke & Soffa Ind Inc filed Critical Kulicke & Soffa Ind Inc
Publication of SG179389A1 publication Critical patent/SG179389A1/en

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    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
SG2011070091A 2010-09-27 2011-09-27 Methods of forming wire bonds for wire loops and conductive bumps SG179389A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US38670110P 2010-09-27 2010-09-27

Publications (1)

Publication Number Publication Date
SG179389A1 true SG179389A1 (en) 2012-04-27

Family

ID=45869649

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2011070091A SG179389A1 (en) 2010-09-27 2011-09-27 Methods of forming wire bonds for wire loops and conductive bumps

Country Status (6)

Country Link
US (1) US20120074206A1 (enExample)
JP (1) JP6029269B2 (enExample)
KR (1) KR101254218B1 (enExample)
CN (1) CN102420150B (enExample)
SG (1) SG179389A1 (enExample)
TW (1) TWI489568B (enExample)

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US9153554B2 (en) 2012-04-22 2015-10-06 Kulicke And Soffa Industries, Inc. Methods of adjusting ultrasonic bonding energy on wire bonding machines
TWI534918B (zh) * 2012-06-29 2016-05-21 庫利克和索夫工業公司 用以補償打線機上線徑變化之方法和系統
US8899469B2 (en) * 2013-03-04 2014-12-02 Kulicke And Soffa Industries, Inc. Automatic rework processes for non-stick conditions in wire bonding operations
US9093515B2 (en) * 2013-07-17 2015-07-28 Freescale Semiconductor, Inc. Wire bonding capillary with working tip protrusion
US9257403B2 (en) * 2013-11-26 2016-02-09 Freescale Semiconductor, Inc. Copper ball bond interface structure and formation
US20150194395A1 (en) * 2014-01-03 2015-07-09 Sohrab Safai Bond pad having a trench and method for forming
US9889521B2 (en) * 2014-12-02 2018-02-13 Asm Technology Singapore Pte Ltd Method and system for pull testing of wire bonds
JP6445943B2 (ja) * 2015-08-24 2018-12-26 東芝メモリ株式会社 半導体装置の測定方法
US10121759B2 (en) * 2015-11-04 2018-11-06 Kulicke And Soffa Industries, Inc. On-bonder automatic overhang die optimization tool for wire bonding and related methods
CN105760591B (zh) * 2016-02-04 2019-01-25 广州兴森快捷电路科技有限公司 封装基板键合引线的邦定方法
US10325878B2 (en) 2016-06-30 2019-06-18 Kulicke And Soffa Industries, Inc. Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
CN110391129B (zh) * 2018-04-20 2020-10-02 岛津分析技术研发（上海）有限公司 离子化装置、质谱仪、离子迁移谱仪及离子化方法
EP3603826B1 (en) * 2018-07-31 2023-05-10 Infineon Technologies AG Method for calibrating an ultrasonic bonding machine
KR20230098652A (ko) * 2020-11-05 2023-07-04 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 와이어 본딩 기계 상의 본딩 힘의 정확도를 모니터링하는 방법을 포함하는 와이어 본딩 기계의 작동 방법, 및 관련된 방법
WO2023158625A1 (en) 2022-02-15 2023-08-24 Kulicke And Soffa Industries, Inc. Methods of determining a sequence for creating a plurality of wire loops in connection with a workpiece

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KR20120031909A (ko) 2012-04-04
JP2012074699A (ja) 2012-04-12
TW201214591A (en) 2012-04-01
KR101254218B1 (ko) 2013-04-18
US20120074206A1 (en) 2012-03-29
TWI489568B (zh) 2015-06-21
CN102420150A (zh) 2012-04-18
JP6029269B2 (ja) 2016-11-24

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