SG179389A1 - Methods of forming wire bonds for wire loops and conductive bumps - Google Patents

Methods of forming wire bonds for wire loops and conductive bumps Download PDF

Info

Publication number
SG179389A1
SG179389A1 SG2011070091A SG2011070091A SG179389A1 SG 179389 A1 SG179389 A1 SG 179389A1 SG 2011070091 A SG2011070091 A SG 2011070091A SG 2011070091 A SG2011070091 A SG 2011070091A SG 179389 A1 SG179389 A1 SG 179389A1
Authority
SG
Singapore
Prior art keywords
bonding
wire bond
forming
wire
control value
Prior art date
Application number
SG2011070091A
Other languages
English (en)
Inventor
Qin Wei
w brunner Jon
A Reid Paul
Original Assignee
Kulicke & Soffa Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke & Soffa Ind Inc filed Critical Kulicke & Soffa Ind Inc
Publication of SG179389A1 publication Critical patent/SG179389A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Wire Bonding (AREA)
SG2011070091A 2010-09-27 2011-09-27 Methods of forming wire bonds for wire loops and conductive bumps SG179389A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US38670110P 2010-09-27 2010-09-27

Publications (1)

Publication Number Publication Date
SG179389A1 true SG179389A1 (en) 2012-04-27

Family

ID=45869649

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2011070091A SG179389A1 (en) 2010-09-27 2011-09-27 Methods of forming wire bonds for wire loops and conductive bumps

Country Status (6)

Country Link
US (1) US20120074206A1 (enExample)
JP (1) JP6029269B2 (enExample)
KR (1) KR101254218B1 (enExample)
CN (1) CN102420150B (enExample)
SG (1) SG179389A1 (enExample)
TW (1) TWI489568B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9153554B2 (en) * 2012-04-22 2015-10-06 Kulicke And Soffa Industries, Inc. Methods of adjusting ultrasonic bonding energy on wire bonding machines
TWI534918B (zh) * 2012-06-29 2016-05-21 庫利克和索夫工業公司 用以補償打線機上線徑變化之方法和系統
US8899469B2 (en) * 2013-03-04 2014-12-02 Kulicke And Soffa Industries, Inc. Automatic rework processes for non-stick conditions in wire bonding operations
US9093515B2 (en) * 2013-07-17 2015-07-28 Freescale Semiconductor, Inc. Wire bonding capillary with working tip protrusion
US9257403B2 (en) * 2013-11-26 2016-02-09 Freescale Semiconductor, Inc. Copper ball bond interface structure and formation
US20150194395A1 (en) * 2014-01-03 2015-07-09 Sohrab Safai Bond pad having a trench and method for forming
US9889521B2 (en) * 2014-12-02 2018-02-13 Asm Technology Singapore Pte Ltd Method and system for pull testing of wire bonds
JP6445943B2 (ja) * 2015-08-24 2018-12-26 東芝メモリ株式会社 半導体装置の測定方法
US10121759B2 (en) * 2015-11-04 2018-11-06 Kulicke And Soffa Industries, Inc. On-bonder automatic overhang die optimization tool for wire bonding and related methods
CN105760591B (zh) * 2016-02-04 2019-01-25 广州兴森快捷电路科技有限公司 封装基板键合引线的邦定方法
US10325878B2 (en) 2016-06-30 2019-06-18 Kulicke And Soffa Industries, Inc. Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
CN110391129B (zh) * 2018-04-20 2020-10-02 岛津分析技术研发（上海）有限公司 离子化装置、质谱仪、离子迁移谱仪及离子化方法
EP3603826B1 (en) * 2018-07-31 2023-05-10 Infineon Technologies AG Method for calibrating an ultrasonic bonding machine
WO2022098697A1 (en) 2020-11-05 2022-05-12 Kulicke And Soffa Industries, Inc. Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bonding force on a wire bonding machine, and related methods
US12183711B2 (en) 2022-02-15 2024-12-31 Kulicke And Soffa Industries, Inc. Methods of determining a sequence for creating a plurality of wire loops in connection with a workpiece

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3458921A (en) * 1965-07-19 1969-08-05 Western Electric Co Short pulse vibratory bonding
US5201454A (en) * 1991-09-30 1993-04-13 Texas Instruments Incorporated Process for enhanced intermetallic growth in IC interconnections
JP2992427B2 (ja) * 1993-07-16 1999-12-20 株式会社カイジョー ワイヤボンディング装置及びその方法
JP3178567B2 (ja) * 1993-07-16 2001-06-18 株式会社カイジョー ワイヤボンディング装置及びその方法
US5858142A (en) * 1997-02-27 1999-01-12 Inertia Friction Welding, Inc. Angular orientation control system for friction welding
JP2000299348A (ja) 1999-04-13 2000-10-24 Rohm Co Ltd ボール式ワイヤボンディングにおけるボール部の最適接合条件の算出方法
KR100604316B1 (ko) 2004-06-18 2006-07-24 삼성테크윈 주식회사 본딩 파라메터들이 자동적으로 설정되는 와이어 본더
US8658942B2 (en) * 2004-12-16 2014-02-25 Illinois Tool Works Inc. Method and system of welding with auto-determined startup parameters
US8546728B2 (en) * 2005-03-04 2013-10-01 Illinois Tool Works Inc. Welder with integrated wire feeder having single-knob control
US7845542B2 (en) * 2005-09-22 2010-12-07 Palomar Technologies, Inc. Monitoring deformation and time to logically constrain a bonding process
JP4547330B2 (ja) * 2005-12-28 2010-09-22 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
EP1897648B1 (en) * 2006-09-05 2010-06-30 Technische Universität Berlin Method and device for controlling the generation of ultrasonic wire bonds
JP2008084897A (ja) * 2006-09-25 2008-04-10 Nagase Denshi Kiki Service Kk 半導体パッケージの設計・製造システムおよびプログラム
JP4786500B2 (ja) * 2006-10-26 2011-10-05 株式会社東芝 ワイヤボンディング装置及びワイヤボンディング方法
DE102007054626A1 (de) * 2007-11-12 2009-05-14 Hesse & Knipps Gmbh Verfahren und Vorrichtung zum Ultraschallbonden
KR20090110406A (ko) * 2008-04-18 2009-10-22 삼성테크윈 주식회사 와이어 본딩 방법
US20090283501A1 (en) * 2008-05-15 2009-11-19 General Electric Company Preheating using a laser beam
US8278588B2 (en) * 2008-05-29 2012-10-02 Illinois Tool Works Inc. System and method for start flow approach control for a proportional valve in a plasma cutter
US8927913B2 (en) * 2008-06-30 2015-01-06 The Invention Science Fund I, Llc Microwave processing systems and methods
EP2323800A4 (en) * 2008-08-11 2017-03-01 Megastir Technologies LLC A method for using modifiable tool control parameters to control the temperature of the tool during frictions stir welding
US7762449B2 (en) * 2008-11-21 2010-07-27 Asm Assembly Automation Ltd Bond head for heavy wire bonder
US8274020B2 (en) * 2010-05-04 2012-09-25 Whirlpool Corporation Apparatus and method of controlling a triple heating element of a cooking appliance

Also Published As

Publication number Publication date
JP6029269B2 (ja) 2016-11-24
CN102420150A (zh) 2012-04-18
CN102420150B (zh) 2016-12-07
TW201214591A (en) 2012-04-01
KR20120031909A (ko) 2012-04-04
JP2012074699A (ja) 2012-04-12
US20120074206A1 (en) 2012-03-29
TWI489568B (zh) 2015-06-21
KR101254218B1 (ko) 2013-04-18

Similar Documents

Publication Publication Date Title
SG179389A1 (en) Methods of forming wire bonds for wire loops and conductive bumps
US11495570B2 (en) Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
KR102434915B1 (ko) 와이어 루프에 대한 와이어 루프 프로파일을 생성하는 방법 및 인접한 와이어 루프 사이의 적절한 클리어런스를 검사하는 방법
US10665564B2 (en) On-bonder automatic overhang die optimization tool for wire bonding and related methods
CN103377959B (zh) 调整导线键合机上的超声键合能量的方法
US20250079396A1 (en) Methods of determining a sequence for creating a plurality of wire loops in connection with a workpiece
US7735716B2 (en) Method of controlling the trajectory of a bonding tool during the formation of a wire loop
CN101652844B (zh) 在引线环中形成弯曲的方法
Qin et al. Wire bonding looping solutions for advanced high pin count devices
KR20050080282A (ko) 자동 와이어 본딩 시스템의 본더 뷰어 시스템
US20230352443A1 (en) Methods of improving wire bonding operations
Xu et al. Wire Bonding Advances for Multi-Chip and System in Package Devices
US20230325552A1 (en) Methods of determining suitability of a wire bonding tool for a wire bonding application, and related methods
Nan et al. Golden bump for 20 micron diameter wire bond enhancement at reduced process temperature
KR20240100438A (ko) 와이어 본딩 시스템에 대한 초음파 특성을 캘리브레이션하는 방법
Sibalija et al. Multi-response optimisation in microelectronics’ assembly
Kumar et al. A Wire Bond Process Optimization Strategy for Very Fine Pitch Development