KR101254218B1 - 와이어 루프와 도전성 범프들 간의 와이어 본드 형성 방법 - Google Patents

와이어 루프와 도전성 범프들 간의 와이어 본드 형성 방법 Download PDF

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KR101254218B1
KR101254218B1 KR20110096872A KR20110096872A KR101254218B1 KR 101254218 B1 KR101254218 B1 KR 101254218B1 KR 20110096872 A KR20110096872 A KR 20110096872A KR 20110096872 A KR20110096872 A KR 20110096872A KR 101254218 B1 KR101254218 B1 KR 101254218B1
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bonding
wire
wire bond
forming
control dimension
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KR20120031909A (ko
Inventor
웨이 킨
존 더블유. 브루너
폴 에이. 레이드
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쿨리케 앤드 소파 인더스트리즈, 인코포레이티드
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

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  • Wire Bonding (AREA)
KR20110096872A 2010-09-27 2011-09-26 와이어 루프와 도전성 범프들 간의 와이어 본드 형성 방법 Active KR101254218B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38670110P 2010-09-27 2010-09-27
US61/386,701 2010-09-27

Publications (2)

Publication Number Publication Date
KR20120031909A KR20120031909A (ko) 2012-04-04
KR101254218B1 true KR101254218B1 (ko) 2013-04-18

Family

ID=45869649

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20110096872A Active KR101254218B1 (ko) 2010-09-27 2011-09-26 와이어 루프와 도전성 범프들 간의 와이어 본드 형성 방법

Country Status (6)

Country Link
US (1) US20120074206A1 (enExample)
JP (1) JP6029269B2 (enExample)
KR (1) KR101254218B1 (enExample)
CN (1) CN102420150B (enExample)
SG (1) SG179389A1 (enExample)
TW (1) TWI489568B (enExample)

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US9153554B2 (en) * 2012-04-22 2015-10-06 Kulicke And Soffa Industries, Inc. Methods of adjusting ultrasonic bonding energy on wire bonding machines
TWI534918B (zh) * 2012-06-29 2016-05-21 庫利克和索夫工業公司 用以補償打線機上線徑變化之方法和系統
US8899469B2 (en) * 2013-03-04 2014-12-02 Kulicke And Soffa Industries, Inc. Automatic rework processes for non-stick conditions in wire bonding operations
US9093515B2 (en) * 2013-07-17 2015-07-28 Freescale Semiconductor, Inc. Wire bonding capillary with working tip protrusion
US9257403B2 (en) * 2013-11-26 2016-02-09 Freescale Semiconductor, Inc. Copper ball bond interface structure and formation
US20150194395A1 (en) * 2014-01-03 2015-07-09 Sohrab Safai Bond pad having a trench and method for forming
US9889521B2 (en) * 2014-12-02 2018-02-13 Asm Technology Singapore Pte Ltd Method and system for pull testing of wire bonds
JP6445943B2 (ja) * 2015-08-24 2018-12-26 東芝メモリ株式会社 半導体装置の測定方法
US10121759B2 (en) * 2015-11-04 2018-11-06 Kulicke And Soffa Industries, Inc. On-bonder automatic overhang die optimization tool for wire bonding and related methods
CN105760591B (zh) * 2016-02-04 2019-01-25 广州兴森快捷电路科技有限公司 封装基板键合引线的邦定方法
US10325878B2 (en) 2016-06-30 2019-06-18 Kulicke And Soffa Industries, Inc. Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
CN110391129B (zh) * 2018-04-20 2020-10-02 岛津分析技术研发（上海）有限公司 离子化装置、质谱仪、离子迁移谱仪及离子化方法
EP3603826B1 (en) * 2018-07-31 2023-05-10 Infineon Technologies AG Method for calibrating an ultrasonic bonding machine
WO2022098697A1 (en) 2020-11-05 2022-05-12 Kulicke And Soffa Industries, Inc. Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bonding force on a wire bonding machine, and related methods
US12183711B2 (en) 2022-02-15 2024-12-31 Kulicke And Soffa Industries, Inc. Methods of determining a sequence for creating a plurality of wire loops in connection with a workpiece

Citations (4)

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JP2000299348A (ja) 1999-04-13 2000-10-24 Rohm Co Ltd ボール式ワイヤボンディングにおけるボール部の最適接合条件の算出方法
KR100604316B1 (ko) 2004-06-18 2006-07-24 삼성테크윈 주식회사 본딩 파라메터들이 자동적으로 설정되는 와이어 본더
KR20090110406A (ko) * 2008-04-18 2009-10-22 삼성테크윈 주식회사 와이어 본딩 방법
KR20100087214A (ko) * 2007-11-12 2010-08-03 헤서 운트 크니프스 게엠베하 초음파 본딩 방법 및 장치

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US5201454A (en) * 1991-09-30 1993-04-13 Texas Instruments Incorporated Process for enhanced intermetallic growth in IC interconnections
JP2992427B2 (ja) * 1993-07-16 1999-12-20 株式会社カイジョー ワイヤボンディング装置及びその方法
JP3178567B2 (ja) * 1993-07-16 2001-06-18 株式会社カイジョー ワイヤボンディング装置及びその方法
US5858142A (en) * 1997-02-27 1999-01-12 Inertia Friction Welding, Inc. Angular orientation control system for friction welding
US8658942B2 (en) * 2004-12-16 2014-02-25 Illinois Tool Works Inc. Method and system of welding with auto-determined startup parameters
US8546728B2 (en) * 2005-03-04 2013-10-01 Illinois Tool Works Inc. Welder with integrated wire feeder having single-knob control
US7845542B2 (en) * 2005-09-22 2010-12-07 Palomar Technologies, Inc. Monitoring deformation and time to logically constrain a bonding process
JP4547330B2 (ja) * 2005-12-28 2010-09-22 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
EP1897648B1 (en) * 2006-09-05 2010-06-30 Technische Universität Berlin Method and device for controlling the generation of ultrasonic wire bonds
JP2008084897A (ja) * 2006-09-25 2008-04-10 Nagase Denshi Kiki Service Kk 半導体パッケージの設計・製造システムおよびプログラム
JP4786500B2 (ja) * 2006-10-26 2011-10-05 株式会社東芝 ワイヤボンディング装置及びワイヤボンディング方法
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Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2000299348A (ja) 1999-04-13 2000-10-24 Rohm Co Ltd ボール式ワイヤボンディングにおけるボール部の最適接合条件の算出方法
KR100604316B1 (ko) 2004-06-18 2006-07-24 삼성테크윈 주식회사 본딩 파라메터들이 자동적으로 설정되는 와이어 본더
KR20100087214A (ko) * 2007-11-12 2010-08-03 헤서 운트 크니프스 게엠베하 초음파 본딩 방법 및 장치
KR20090110406A (ko) * 2008-04-18 2009-10-22 삼성테크윈 주식회사 와이어 본딩 방법

Also Published As

Publication number Publication date
SG179389A1 (en) 2012-04-27
JP6029269B2 (ja) 2016-11-24
CN102420150A (zh) 2012-04-18
CN102420150B (zh) 2016-12-07
TW201214591A (en) 2012-04-01
KR20120031909A (ko) 2012-04-04
JP2012074699A (ja) 2012-04-12
US20120074206A1 (en) 2012-03-29
TWI489568B (zh) 2015-06-21

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