JP2012069917A - オーバーレイミスアライメントを減少させた直接ボンディング法 - Google Patents
オーバーレイミスアライメントを減少させた直接ボンディング法 Download PDFInfo
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Abstract
【解決手段】本発明の方法は、固有湾曲を有する第1のウェーハ(100)を固有湾曲を有する第2のウェーハ(200)に直接ボンディングする方法であり、2枚のウェーハのうちの少なくとも一方(100)が少なくとも一組のマイクロコンポーネント(110)を備える。本方法は、2枚のウェーハ間でのボンディング波の伝搬を開始させるように、2枚のウェーハ(100、200)を互いに接触させる少なくとも1つのステップを含む。接触させるステップ中に、回転放物面の形態の所定のボンディング湾曲(KB)が、ウェーハ(100)のボンディング前の固有湾曲に依存して2枚のウェーハのうちの一方に与えられ、他方のウェーハが所定のボンディング湾曲(KB)と一致するように自由である。
【選択図】 図5D
Description
ボンディング前に各ウェーハの湾曲が測定されるステップと、
所定のボンディング湾曲が計算されるステップと
を含む。
KB=K1−((K2−K1)/6)
から計算され、ここで、KBが回転放物面の形態の所定のボンディング湾曲であり、K1がボンディング前の第1のウェーハの固有湾曲であり、K2がボンディング前の第2のウェーハの固有湾曲である。
KB=(K1+K2)/2
から計算され、ここで、KBが回転放物面の形態の所定のボンディング湾曲であり、K1がボンディング前の第1のウェーハの固有湾曲であり、K2がボンディング前の第2のウェーハの固有湾曲である。
互いに向い合った第1のウェーハ及び第2のウェーハが、それぞれ第1の保持部及び第2の保持部によって保持されるステップであって、第1の保持部が、回転放物面の形態の所定のボンディング湾曲を第1のウェーハに与えるステップと、
前記ウェーハが、前記ウェーハ間でのボンディング波の伝搬を開始させるために互いに接触させられるステップと、
第2のウェーハがボンディング波の伝搬中に第1のウェーハに与えられた回転放物面の形態の所定のボンディング湾曲に一致するように、第2のウェーハが、第1のウェーハと接触する前又は接触中に第2の保持部から解放されるステップと
を含む。
KF=(2(K1+K2)+12KB)/16 (1)
x2+y2=2pz (2)
ここで、xや、yや、zは回転放物面のデカルト座標であり、pは定数である。
ρ2=2pz (3)
ここで、ρは(ρ=x2+y2となるように)回転放物面の円柱座標である。
KP=p2/(ρ2+p2) (4)
KB=K1−((K2−K1)/6) (5)
のように求められる。
KB=(K1+K2)/2 (6)
のように求められる。
40 ウェーハ
50 第1のウェーハ
60 支持ウェーハ
100 第1のウェーハ
101 基板
102 埋め込み酸化膜層
103 シリコン層
200 第2のウェーハ
300 ボンディング機
310 第1の保持部
311 保持面
312 シリンダ
313 ロッド
313a 自由端
320 第2の保持部
321 保持面
350 三次元構造
360 三次元構造
400 三次元構造
410 初期基板
420 最終基板
411〜419 マイクロコンポーネント
421〜429 マイクロコンポーネント
500 第1のウェーハ
510 第1の組のマイクロコンポーネント
600 第2のウェーハ
610 第2の組のマイクロコンポーネント
700 ボンディング機
710 第1の保持部
711 保持面
712 シリンダ
713 ロッド
713a 自由端
720 第2の保持部
721 保持面
P 基準面
K1 第1のウェーハの固有湾曲
K2 第2のウェーハの固有湾曲
KB ボンディング湾曲
KF ボンディング後湾曲
D 湾曲させようとしているウェーハの直径
Claims (14)
- ボンディング前に固有湾曲(K1)を有する第1のウェーハ(100)をボンディング前に固有湾曲(K2)を有する第2のウェーハ(200)に直接ボンディングする方法であって、前記2枚のウェーハのうちの少なくとも一方(100)が少なくとも一組のマイクロコンポーネント(110)を備え、前記2枚のウェーハ間でのボンディング波の伝搬を開始させるように前記2枚のウェーハ(100、200)を互いに接触させる少なくとも1つのステップを含む前記方法において、
前記接触させるステップ中に、回転放物面の形態の所定のボンディング湾曲(KB)が前記2枚のウェーハのうちの一方に与えられ、前記ボンディング湾曲が一組のマイクロコンポーネント(110)を備えた前記ウェーハ(100)のボンディング前の固有湾曲(K1)に少なくとも依存し、他方のウェーハが前記所定のボンディング湾曲(KB)に一致するように自由であることを特徴とする方法。 - 前記ウェーハ(100、200)が一緒に貼り合わせられる前に、
ボンディング前に各ウェーハ(100、200)の前記湾曲(K1、K2)が測定されるステップと、
前記所定のボンディング湾曲(KB)が計算されるステップと
を含むことを特徴とする、請求項1に記載の方法。 - 前記第1のウェーハだけが少なくとも一組のマイクロコンポーネントを備え、回転放物面の形態の前記所定のボンディング湾曲が次式
KB=K1−((K2−K1)/6)
から計算され、ここで、KBが回転放物面の形態の前記所定のボンディング湾曲であり、K1がボンディング前の前記第1のウェーハの前記固有湾曲であり、K2がボンディング前の前記第2のウェーハの前記固有湾曲であることを特徴とする、請求項1又は2に記載の方法。 - 前記2枚のウェーハの各々が少なくとも一組のマイクロコンポーネントを備え、回転放物面の形態の前記所定のボンディング湾曲が次式
KB=(K1+K2)/2
から計算され、ここで、KBが回転放物面の形態の前記所定のボンディング湾曲であり、K1がボンディング前の前記第1のウェーハの前記固有湾曲であり、K2がボンディング前の前記第2のウェーハの前記固有湾曲であることを特徴とする、請求項1又は2に記載の方法。 - 前記ウェーハ(100、200)が300mmの直径を有する円形のシリコンウェーハであることを特徴とする、請求項1〜4のいずれか一項に記載の方法。
- 互いに向い合った前記第1のウェーハ(100)及び前記第2のウェーハ(200)が、それぞれ第1の保持部(310)及び第2の保持部(320)によって保持され、前記第1の保持部が、回転放物面の形態の前記所定のボンディング湾曲を前記第1のウェーハに与えるステップと、
前記ウェーハ(100、200)が前記ウェーハ間でのボンディング波の伝搬を開始させるために互いに接触させられるステップと、
前記第2のウェーハが前記ボンディング波の伝搬中に前記第1のウェーハに与えられた回転放物面の形態の前記所定のボンディング湾曲に一致するように、前記第2のウェーハ(200)が前記第1のウェーハ(100)と接触する前又は接触中に前記第2の保持部(320)から解放されるステップと
を含むことを特徴とする、請求項1〜5のいずれか一項に記載の方法。 - 回転放物面の形態の前記所定のボンディング湾曲(KB)が、前記第1の保持部上に設けられたシリンダ(312)を作動させることによって前記第1のウェーハ(100)に与えられることを特徴とする、請求項6に記載の方法。
- 回転放物面の形態の前記所定のボンディング湾曲が、前記第1のウェーハ(100)と前記第1の保持部(310)との間に挿入されたメンブランによって前記第1のウェーハ(100)に与えられ、前記メンブランが回転放物面の形態の前記所定のボンディング湾曲に対応する回転放物面の形態の湾曲を有することを特徴とする、請求項7に記載の方法。
- 前記所定のボンディング湾曲が、前記第1の保持部(310)によって前記第1のウェーハ(100)に与えられ、前記第1の保持部が回転放物面の形態の前記所定のボンディング湾曲に対応する湾曲を有することを特徴とする、請求項7に記載の方法。
- 前記ウェーハ(100、200)が、それぞれのボンディング面上にマイクロコンポーネント(110、210)を各々備え、前記ウェーハのうちの一方(100)の前記マイクロコンポーネント(110)のうちの少なくとも一部が、前記他方のウェーハ(200)の前記マイクロコンポーネント(210)のうちの少なくとも一部と位置合わせされるように意図されていることを特徴とする、請求項1〜9のいずれか一項に記載の方法。
- ボンディング前に固有湾曲(K1)を有する第1のウェーハ(100)をボンディング前に固有湾曲(K2)を有する第2のウェーハ(200)に直接ボンディングするためのボンディング装置(300)であって、前記2枚のウェーハのうちの少なくとも一方が少なくとも一組のマイクロコンポーネントを備え、前記第1のウェーハ(100)及び前記第2のウェーハ(200)を保持するための第1の保持部(310)及び第2の保持部(320)をそれぞれ備えたボンディング装置において、前記第1の保持部が、前記少なくとも1層のマイクロコンポーネントを備えた前記ウェーハのボンディング前の前記固有湾曲(K1、K2)に少なくとも依存する回転放物面の形態の所定のボンディング湾曲(KB)を前記第1のウェーハ(100)に与えるための手段を備え、前記第2のウェーハ(200)がボンディング波の伝搬中に前記第1のウェーハ(100)に与えられた回転放物面の形態の前記所定のボンディング湾曲に一致するように、前記第1のウェーハ(100)と接触する前又は接触中に前記第2の保持部から前記第2のウェーハ(200)を解放させるために前記第2の保持部(320)を制御することを特徴とするボンディング装置。
- 前記2枚のウェーハの各々のボンディング前の前記固有湾曲(K1、K2)に依存する回転放物面の形態の前記所定のボンディング湾曲(KB)又は回転放物面の形態の前記所定のボンディング湾曲に対応する湾曲の半径を計算するための処理手段を備えることを特徴とする、請求項11に記載のボンディング装置。
- 前記第1の保持部(310)が、前記第1のウェーハ(100)に対して回転放物面の形態の前記所定のボンディング湾曲(KB)を与えることが可能なシリンダ(312)をさらに備え、前記シリンダが、回転放物面の形態の前記所定のボンディング湾曲(KB)に対応する湾曲の半径に従って制御され、前記第2のウェーハ(200)がボンディング波の伝搬中に前記第1のウェーハに与えられた回転放物面の形態の前記所定のボンディング湾曲と一致するように、前記ボンディング装置が、前記第1のウェーハ(100)との接触後に前記第2の保持部から前記第2のウェーハ(200)を解放させるために前記第2の保持部(320)を制御することを特徴とする、請求項11又は12に記載のボンディング装置。
- 前記第1の保持部が、回転放物面の形態の前記所定のボンディング湾曲に対応する湾曲を有することを特徴とする、又は、前記ボンディング装置が、前記第1のウェーハ(100)と前記第1の保持部との間に挿入されたメンブランをさらに含み、前記メンブランが回転放物面の形態の前記所定のボンディング湾曲(KB)に対応する湾曲を有することを特徴とする、請求項11又は12に記載のボンディング装置。
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