JP2012044175A - Substrate processing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing system provided between a plurality of process facilities having transfer modules.SOLUTION: The substrate processing system includes a plurality of process facilities and a buffer station. Each process facility includes a transfer module internally having a carrier robot and a processing module connected to the transfer module. The buffer station, placed between a plurality of adjacent transfer modules, is provided to transfer a substrate between the transfer modules. The plurality of process facilities include a first facility in which a processing module is placed on a first side of a connection line from the criterion of the connection line provided along the direction in which the transfer module and the buffer station are disposed, and a second facility in which the processing module is placed on a second side of the connection line, from the criterion of the connection line. The transfer module provided on the first facility is disposed in a manner to protrude toward the first side from the criterion of the connection line, as compared to the transfer module provided on the second facility.

Description

  The present invention relates to a system for processing a substrate, and more particularly to a system for processing a substrate between a plurality of process facilities provided with a transfer module.

  The semiconductor process is performed by a plurality of process facilities provided in the clean room. Generally, each process facility includes a load port, a transfer module, and a processing module. A container containing a substrate is placed in the load port. The transfer module is disposed between the load port and the processing module, and the transfer module is provided with a transfer robot for transferring the substrate between the container placed in the load port and the processing module. An example of such process equipment is disclosed in Patent Document 1 and the like.

  The process facilities described above are arranged apart from each other in the clean room. The substrate is transported between a plurality of process facilities by a transfer device or an operator while being accommodated in a container.

US Patent Application Publication No. 2008/255697 US Patent Application Publication No. 2004/165973

  An object of the present invention is to provide a substrate processing system capable of efficiently performing a process when a process is performed using a plurality of process facilities.

  The problem to be solved by the present invention is not limited here, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

  The present invention provides a substrate processing system. According to one embodiment, a substrate processing system is located between a plurality of process facilities each having a transfer module having a transfer robot provided therein and a processing module connected to the transfer module, and the adjacent transfer module, And a buffer station provided for transferring the substrate between them. The plurality of process facilities may include at least one first facility in which the processing module is located on a first side of the connection line with reference to a connection line provided along a direction in which the transfer module and the buffer station are disposed. And at least one second facility in which the processing module is located on the second side of the connection line with respect to the connection line, and the transfer module provided in the first facility includes the second facility. Compared with the transfer module provided in the above, the connection line is provided so as to protrude further toward the first side with reference to the connection line.

  According to another embodiment, the substrate processing system includes a first transfer module having a transfer robot provided therein, a second transfer module having a transfer robot provided therein, the first transfer module, and the second transfer. A buffer station arranged between the modules and provided for transferring the substrate between them, and a connection line which is a direction in which the first transfer module, the buffer station and the second transfer module are arranged A first processing module located on the first side of the connection line and coupled to the first transfer module; and a second processing module located on the second side of the connection line and coupled to the second transfer module. The first transfer module includes the first transfer module relative to the second transfer module with respect to the connection line. Provided as to protrude further towards the.

  According to the present invention, substrate transfer is efficiently performed between process facilities.

  In addition, according to the present invention, it is possible to efficiently use a limited space of a clean room in which a plurality of process facilities are installed.

1 is a plan view schematically showing an example of a substrate processing system of the present invention. FIG. 2 is a cross-sectional view schematically showing an internal structure of a transfer module and a buffer station of FIG. 1. FIG. 3 is a perspective view schematically showing an example of the buffer member in FIG. 2. It is a perspective view which shows schematically the other example of the buffer member of FIG. FIG. 6 is a perspective view schematically showing another example of the buffer station of FIG. 1. It is a top view which shows roughly the other example of the buffer station of FIG. It is a perspective view which shows roughly the other example of the buffer station of FIG. It is a perspective view which shows roughly the other example of the buffer station of FIG. 2 is a diagram for explaining a shape of a transfer module in the substrate processing system of FIG. 1. It is a top view which shows roughly the other example of the substrate processing system of FIG. It is a top view which shows roughly the other example of the substrate processing system of FIG. It is a top view which shows roughly the other example of the substrate processing system of FIG. It is a top view which shows roughly the other example of the substrate processing system of FIG. It is a top view which shows roughly the other example of the substrate processing system of FIG. It is a top view which shows roughly the other example of the substrate processing system of FIG. 16 is a drawing schematically showing an example of the substrate processing apparatus of FIG. It is a top view which shows roughly the other example of a substrate processing system. It is a top view which shows roughly the other example of a substrate processing system. It is a top view which shows roughly the other example of a substrate processing system. FIG. 20 is a drawing schematically showing an example of the substrate processing apparatus of FIG. 19. FIG. It is a top view which shows roughly the other example of a substrate processing system. It is a top view which shows roughly the other example of a substrate processing system. It is a top view which shows roughly the other example of a substrate processing system. FIG. 2 is a plan view schematically showing an example in which a plurality of substrate processing systems of FIG. 1 are arranged. FIG. 2 is a plan view schematically showing an example in which a plurality of substrate processing systems of FIG. 1 are arranged. FIG. 2 is a plan view schematically showing an example in which a plurality of substrate processing systems of FIG. 1 are arranged. 1 is a diagram schematically illustrating a substrate transfer path in a substrate processing system. 1 is a diagram schematically illustrating a substrate transfer path in a substrate processing system. 1 is a diagram schematically illustrating a substrate transfer path in a substrate processing system.

  Hereinafter, embodiments of the present invention will be described in more detail with reference to FIGS. 1 to 29 of the accompanying drawings. The embodiments of the present invention can be modified into various forms, and the scope of the present invention should not be construed as being limited by the following embodiments. This embodiment is provided to more fully explain the present invention to those skilled in the art. Accordingly, the shape of the elements in the drawings has been exaggerated to emphasize a clearer description.

  FIG. 1 is a perspective view schematically showing a substrate processing system 1000 according to an embodiment of the present invention. Referring to FIG. 1, the substrate processing system 1000 includes a plurality of process facilities 1200 and a plurality of buffer stations 1400. Each process facility 1200 includes a load port 1220, a transfer module 1240, and a processing module 1260. The load port 1220, the transfer module 1240, and the processing module 1260 of one process equipment 1200 are provided so as to be sequentially arranged on the same straight line. The transfer modules 1240 belonging to the other process equipment 1200 are positioned so as to be arranged on the same straight line. The buffer station 1400 is disposed between the transfer modules 1240 of the adjacent process equipment 1200. When viewed from above, the direction in which the load port 1220, the transfer module 1240, and the processing module 1260 of one process equipment 1200 are arranged is provided perpendicular to the direction in which the transfer module 1240 and the buffer station 1400 are arranged. Hereinafter, the direction in which the transfer module 1240 and the buffer station 1400 are disposed is referred to as a first direction 10, and the direction in which the load port 1220, the transfer module 1240, and the processing module 1260 of one process facility 1200 are disposed is the second direction 20. Called.

  A container 30 that stores a plurality of substrates is placed in the load port 1220. The container 30 is loaded or unloaded onto the load port 1220 by a transport device 40 such as an overhead transfer. The container 30 is optionally loaded or unloaded into the load port 1220 by an automated guided vehicle, rail guided vehicle, or operator. As the container 30, a front open unified pod that is a sealed container is used. One or a plurality of load ports 1220 of each process equipment 1200 are provided. When a plurality of load ports 1220 are provided, the load ports 1220 are provided in a row along the first direction 10. The load ports 1220 are provided so as to be in close contact with each other. In FIG. 1, each process facility 1200 is illustrated as having two load ports 1220. However, the number of load ports 1220 provided in each process facility 1200 may be different from this. In addition, the process facility 1200 may have a different number of load ports 1220 from each other.

  The transfer module 1240 includes a housing 1250 and a transfer robot 1242. The housing 1250 has a substantially rectangular parallelepiped shape. The housing 1250 has a top surface (reference numeral 1251 in FIG. 2), a bottom surface (reference numeral 1252 in FIG. 2), a first side surface 1253, a second side surface 1254, a third side surface 1255, and a fourth side surface 1256. The first side surface 1253 and the third side surface 1255 are provided to face each other, and the second side surface 1254 and the fourth side surface 1256 are provided to face each other. Further, the first side surface 1253 is provided perpendicular to the second side surface 1254. The first side surface 1253 faces the load port 1220, and the third side surface 1255 faces the processing module 1260.

  The first side surface 1253 of the housing 1250 is provided with an opening (not shown) through which the substrate enters and leaves the container 30 and a door (not shown) for opening and closing the opening. The third side surface 1255 of the housing 1250 is provided with an opening (not shown) through which the substrate enters and leaves the processing module 1260 and a door (not shown) that opens and closes the substrate. Further, the second side surface 1254 and / or the fourth side surface 1256 of the housing 1250 are formed with openings (reference numeral 1257 in FIG. 2) through which the substrate enters and leaves the buffer station 1400. In addition, a door opener (not shown) for opening the door of the container 30 is provided in the housing 1250. The housing 1250 is provided such that the inside thereof is isolated from the outside. A fan filter unit (not shown) is provided on the upper surface of the housing 1250, and air rectified in the housing 1250 can be guided so as to flow downward from above. As a result, the inside of the housing 1250 is kept cleaner than the outside.

  The transfer robot 1242 transfers the substrate between the container 30 placed in the load port 1220, the processing module 1260, and the buffer station 1400. The transfer robot 1242 is located at the center in the housing 1250. The transfer robot 1242 is provided so as to move up and down. The hand 1244 of the transfer robot 1242 is provided so as to be able to move forward, backward, rotate, and the like on a horizontal plane. One or a plurality of hands 1244 are provided. In FIG. 1, a transfer robot 1242 having two hands 1244 is illustrated.

  The processing module 1260 includes a loadlock chamber 1262, a transfer chamber 1264, and a process chamber 1266.

  Viewed from above, the transfer chamber 1264 has a substantially polygonal shape. In FIG. 1, the transfer chamber 1264 is illustrated as having a hexagonal shape when viewed from above. However, the shape of the transfer chamber 1264 can be variously changed. A transfer robot 1268 is provided inside the transfer chamber 1264. The transfer robot 1268 is provided so as to move up and down. A hand 1269 of the transfer robot 1268 is provided so as to be able to move forward, backward, and rotate on a horizontal plane. One or a plurality of hands 1269 are provided. In FIG. 1, a transfer robot 1268 having two hands 1269 is shown.

  A load lock chamber 1262 and a process chamber 1266 are provided around the transfer chamber 1264. The load lock chamber 1262 is located on the side of the transfer chamber 1264 adjacent to the transfer module 1240, and the process chamber 1266 is located on the other side of the transfer chamber 1264. One or a plurality of load lock chambers 1262 are provided. According to an example, two load lock chambers 1262 are provided. One of the two load lock chambers 1262 temporarily holds a substrate to be loaded into the processing module 1260 to proceed with the process, and the other one is unloaded from the processing module 1260 after the process is completed. The substrate that remains is temporarily retained. Unlike this, one or a plurality of load lock chambers 1262 are provided, and in each load lock chamber 1262, all of the substrates before the process and the substrates that have undergone the process remain. The interior of the transfer chamber 1264 and the process chamber 1266 is maintained at the first pressure, the interior of the transfer module 1240 is maintained at the second pressure, and the interior of the load lock chamber 1262 can be switched to the first pressure and the second pressure. . The first pressure is a pressure lower than the second pressure. For example, the first pressure is a vacuum pressure and the second pressure is an atmospheric pressure.

  The process chamber 1266 performs a predetermined process on the substrate. For example, the process chamber 1266 may perform processes such as cleaning, ashing, vapor deposition, etching, or measurement. One or more process chambers 1266 are provided on the side of the transfer chamber 1264. The process chamber 1266 is provided on each of the other side portions other than the side portion of the transfer chamber 1264 in which the load lock chamber 1262 is provided, or is provided only on a part of these side portions. When a plurality of process chambers 1266 are provided, the process chambers 1266 can perform the same process on the substrate. The process chambers 1266 can perform different processes arbitrarily. The process chamber 1266 may have a structure for performing a process on a substrate with a vacuum pressure. The process chamber 1266 may have a structure for performing a process on a substrate at an atmospheric pressure.

  The buffer station 1400 is provided between adjacent transfer modules 1240a and 1240b, respectively. FIG. 2 is a view illustrating an example of the buffer station 1400 provided between the transfer modules 1240a and 1240b, and FIG. 3 is a perspective view illustrating the buffer member 1440 of FIG. Referring to FIGS. 2 and 3, the buffer station 1400 includes a housing 1420 and a buffer member 1440. The housing 1420 is provided in the shape of a rectangular parallelepiped with a space provided therein. One end of the housing 1420 is coupled to the first transfer module 1240a, and the other end of the housing 1420 is coupled to the second transfer module 1240b. One end and the other end of the housing 1420 are surfaces that are separated from each other in the first direction 10 and face each other.

  The buffer member 1440 can be fixedly installed in the housing 1420. The buffer member 1440 can include a main body 1442 and a plurality of buffers 1444. The main body 1442 has a substantially rectangular parallelepiped cylindrical shape, and a surface perpendicular to the first direction 10 is opened. The buffer 1444 is provided inside the main body 1442. The buffer 1444 is provided so as to be separated in the vertical direction. Each buffer 1444 has two plates 1444a, 1444b that support the edge portion of the substrate. The plates 1444 a and 1444 b are provided so as to be separated from each other along the second direction 20. The hand 1244 of the transfer robot 1242 moves up and down along the isolated space between the plates 1444a and 1444b. The transfer robots 1242 of the transfer modules 1240a and 1240b located on both sides of the buffer station 1400 are provided so that substrates can be loaded and unloaded to all the buffers 1444. Unlike the above, the buffer member 1440 may have one buffer 1445 as shown in FIG.

  Referring again to FIG. 2, a door 1258 for opening and closing an opening 1257 formed on a surface facing the buffer station 1400 is provided in the housing 1250 of the transfer modules 1240 a and 1240 b. When an error occurs in any one of the process facilities 1200, the opening 1257 is closed by the door 1258, and each process facility 1200 can be separated from the other process facilities 1200 and used independently. . In this case, the transfer of the substrate between the process facilities 1200 is performed through the overhead transfer 40 in a state where the substrate is stored in the container 30. The container 30 in which the substrate is stored is optionally transported between the process equipment 1200 by the automatic guide vehicle AGV, the rail guide vehicle RGV, or an operator.

  FIG. 5 is a view showing another example of the buffer station 1401. In the buffer station 1401 of FIG. 5, the housing 1421 is removed to show the inside. Referring to FIG. 5, the buffer station 1401 includes a housing 1421, a buffer member 1441, and a buffer driving member 1460. The housing 1421 and the buffer member 1441 in FIG. 5 have substantially the same structure as the housing 1420 and the buffer member 1440 in FIGS. However, the housing 1421 in FIG. 5 has a longer length along the first direction 10 than the housing 1420 in FIG. 2. The buffer driving member 1460 moves the buffer member 1441 in the housing 1421 along the first direction 10 between the first position and the second position. The first position is a position adjacent to a transfer module 1240a (hereinafter referred to as a first transfer module) located on one side of the buffer station 1401, and the second position is another transfer module located on the other side of the buffer station 1401. It is a position adjacent to 1240b (hereinafter referred to as the second transfer module). The buffer driving member 1460 includes a guide rail 1461 and a base 1462. The guide rail 1461 is provided in the housing 1421 so that the lateral direction thereof is parallel to the first direction 10 and extends from the first position to the second position. Base 1462 is coupled to guide rail 1461 so that it can be moved along guide rail 1461 by a driver (not shown). The buffer member 1441 is fixedly coupled to the base 1462 and moves together with the base 1462. The buffer station 1401 of FIG. 5 is used when the distance between adjacent transfer modules 1240a, 1240b is relatively long.

  FIG. 6 is a plan view schematically showing another example of the buffer station 1402. Referring to FIG. 6, the buffer station 1402 includes a housing 1422, a first buffer member 1442 a, a second buffer member 1442 b, and a transport member 1480. The housing 1422 of FIG. 6 has a structure similar to the housing 1420 of FIG. 2, and the first buffer member 1442a and the second buffer member 1442b of FIG. 6 all have a structure substantially similar to the buffer member 1440 of FIG. Can have. However, the housing 1422 of FIG. 6 has a longer length along the first direction 10 than the housing 1420 of FIG. The first buffer member 1442a is positioned adjacent to the first transfer module 1240a located on one side of the buffer station 1402, and the second buffer member 1442b is positioned on the other side of the buffer station 1402 in the second transfer module 1240b. It is located adjacent to The transport member 1480 moves the substrate between the first buffer member 1442a and the second buffer member 1442b. The transport member 1480 includes a guide rail 1481 and a transport robot 1482. The guide rail 1481 is disposed in the housing 1422 so that its lateral direction is parallel to the first direction 10 and extends from a position adjacent to the first buffer member 1442a to a position adjacent to the second buffer member 1442b. . The transfer robot 1482 is coupled to the guide rail 1481 so as to be moved along the guide rail 1481 by a driver (not shown). The transfer robot 1482 transfers the substrate from the first buffer member 1442a to the second buffer member 1442b. The transfer robot 1482 includes one or more hands 1483. For example, the transfer robot 1482 may have two hands or the same number of hands as the number of substrates that can be stacked on the first buffer member 1442a. The buffer station 1402 of FIG. 6 is used when the distance between adjacent transfer modules 1240a, 1240b is relatively long.

  Referring back to FIG. 1, the buffer station 1400 is provided integrally with the transfer module 1240. The buffer station 1400 is provided to be arbitrarily detachable from the transfer module 1240.

  The substrate processing system 1000 can be installed as follows. The process equipment 1200 and the buffer station 1400 can be installed alternately one after another, and finally the process equipment 1200 can be installed. When installing the buffer station 1400, it is installed so as to be in direct contact with the transfer module 1240 of the previously installed process equipment 1200, and when installing the process equipment 1200, the transfer module 1240 is in direct contact with the buffer station 1400 installed in front. Install as follows. Thereafter, the transfer module 1240 and the buffer station 1400 are fixed using a fastening member (not shown) such as a screw.

  The substrate processing system 1000 can be arbitrarily installed as follows. First, the process equipment 1200 is installed such that the plurality of transfer modules 1240 are positioned so as to be spaced apart at regular intervals. Thereafter, the buffer station 1400 is installed between each of the plurality of transfer modules 1240. In this case, the buffer station 1400 is provided so that the length along the first direction 10 can be changed. After the buffer station 1400 is positioned between the plurality of transfer modules 1240, the length of the buffer station 1400 is extended to bring the buffer station 1400 and the transfer module 1240 into close contact. Thereafter, the buffer station 1400 and the transfer module 1240 are fixed using a fastening member (not shown) such as a screw.

  FIG. 7 is a perspective view illustrating an example of a buffer station 1403 whose length can be changed. Referring to FIG. 7, the housing 1423 of the buffer station 1403 includes a body 1423a, a bellows 1423b, and a fastening plate 1423c. The body 1423a is provided with a structure or material whose length along the first direction 10 does not change. The bellows 1423b extends from the body 1423a and is provided so that the length can be changed by extending and contracting along the first direction 10. The fastening plate 1423c is provided at the end of the body 1423a and the end of the bellows 1423b, respectively. In order to couple the buffer station 1403 and the transfer module 1240, first, the buffer station 1403 is positioned between the plurality of transfer modules 1240 with the bellows 1423b contracted. At this time, the fastening plate 1423c coupled to the body 1423a is brought into close contact with the transfer module 1240, and these are coupled by a fastening member (not shown). Thereafter, the length of the bellows 1423b is extended so that the fastening plate 1423c coupled to the bellows 1423b is in close contact with the other transfer module 1240, and thereafter, these are coupled with a fastening member (not shown).

  Unlike FIG. 7, the housing can optionally have bellows on each side of the body. The entire housing is optionally provided with a bellows.

  FIG. 8 is a perspective view illustrating another example of the buffer station 1404 whose length can be changed. Referring to FIG. 8, the housing 1424 includes a first body 1424a, a second body 1424b, and a fastening plate 1424c. The second body 1424b is coupled to the first body 1424a so as to protrude from the first body 1424a along the first direction 10 and to be inserted into the first body 1424a. That is, the length of the housing 1424 can be changed along the first direction 10 by a telescope method. Fastening plates 1424c are provided at the end of the first body 1424a and the end of the second body 1424b, respectively. In order to couple the buffer station 1404 and the transfer module 1240, first, the buffer station 1404 is positioned between the plurality of transfer modules 1240 with the second body 1424b inserted into the first body 1424a. At this time, the fastening plate 1424c coupled to the first body 1424a is in close contact with the transfer module 1240, and these are coupled by a fastening member (not shown). Thereafter, the second body 1424b is protruded from the first body 1424a so that the fastening plate 1424c coupled to the second body 1424b is in close contact with the other transfer module 1240, and then coupled with a fastening member (not shown). Let

  The sealing plate 1423c or 1424c and the transfer module 1240 in FIGS. 7 and 8 are sealed on the contact surface so that the inside of the transfer module 1240 and the inside of the housing 1423 or 1424 of the buffer station 1403 or 1404 are isolated from the outside. A member (not shown) is provided.

  Referring again to FIG. 1, the process equipment 1200 can all have the same structure. In addition, the plurality of transfer modules 1240 and the plurality of buffer stations 1400 connected to each other are all arranged along one virtual line. Hereinafter, the above-described virtual line is referred to as a connection line 50. The connection line 50 is provided in a straight line as shown in FIG. The connecting line is arbitrarily provided in various forms such as an uppercase letter “L” and an uppercase letter “T”. According to an example, the processing modules 1260 of the process facility 1200 are alternately positioned on the first side and the second side of the connection line 50 in sequence. A guide rail 42 is provided on each of the first side and the second side of the connection line 50 so as to face the load port 1220 in the vertical direction, and a transport device such as the overhead transfer 40 moves along the guide rail 42. . The guide rail 42 provided on the first side of the connection line 50 and the guide rail 42 provided on the second side of the connection line 50 are provided independently of each other. The guide rail 42 provided on the first side of the connection line 50 and the guide rail 42 provided on the second side of the connection line 50 are arbitrarily provided as one rail.

  FIG. 9 is an enlarged view of the three process facilities 1200a and 1200b provided in FIG. 1 and a buffer station 1400 disposed therebetween.

  In order to facilitate the description of FIG. 9, a process facility in which a processing module is provided on the first side of the connection line 50 with reference to the connection line 50 in FIG. 9 is referred to as a first facility 1200 a and is provided in the first facility 1200 a. The loaded load port, transfer module, and processing module are referred to as a first load port 1220a, a first transfer module 1240a, and a first processing module 1260a, respectively. Further, a process facility in which a processing module is provided on the second side of the connection line 50 with reference to the connection line 50 in FIG. 9 is referred to as a second facility 1200b, and a load port, a transfer module provided in the second facility 1200b, and The processing modules are referred to as a second load port 1220b, a second transfer module 1240b, and a second processing module 1260b, respectively.

  As described above, the first processing module 1260a is coupled to the third sidewall 1255a of the first transfer module 1240a, and the second processing module 1260b is coupled to the third sidewall 1255b of the second transfer module 1240b. The third side wall 1255a of the first transfer module 1240a protrudes further from the connection line 50 in the direction in which the first processing module 1260a is coupled as compared to the first side wall 1253b of the second transfer module 1240b. In addition, the third side wall 1255b of the second transfer module 1240b protrudes further from the connection line 50 in the direction in which the second processing module 1260b is coupled to the first side wall 1253a of the first transfer module 1240a.

  In addition, the buffer station 1400 positioned between the first transfer module 1240 a and the second transfer module 1240 b includes a first side wall 1453, a second side wall 1454, a third side wall 1455, and a fourth side wall 1456. The first side wall 1453 and the third side wall 1455 are opposed to each other, and the second side wall 1454 and the fourth side wall 1456 are opposed to each other. The first side wall 1453 and the second side wall 1454 are provided substantially vertically. The second side wall 1454 and the fourth side wall 1456 are respectively coupled to the first transfer module 1240a or the second transfer module 1240b. The first side wall 1453 is substantially located on a plane extending from the first side wall 1253a of the first transfer module 1240a. The third side wall 1455 is substantially located on a plane extending from the first side wall 1253b of the second transfer module 1240b.

  Therefore, a first service space 1800a surrounded by a portion 1700a protruding from the first transfer module 1240a, a second load port 1220b, and a buffer station 1400 positioned therebetween is provided. The first service space 1800a is located when an operator is required to maintain the first transfer module 1240a, the load lock chamber 1262a of the first processing module 1260a, the buffer station 1400, and the second load port 1220b. It is provided as a space. Further, a second service space 1800b surrounded by a portion 1700b protruding from the second transfer module 1240b, a first load port 1220a, and a buffer station 1400 positioned therebetween is provided. The second service space 1800b is provided as a space where an operator is located when maintenance is required for the second transfer module 1240b, the load lock chamber 1262b of the second processing module 1260b, the buffer station 1400, and the first load port 1220a. It is done.

  In addition, the process facilities 1200a and 1200b may have substantially the same size and shape. Among the widths of the first processing module 1260a in the direction parallel to the first direction 10, the maximum width L1 is provided larger than the width L2 of the first transfer module 1240a parallel to the first direction 10. According to an example, the length L1 of the maximum width among the widths in the direction parallel to the first direction 10 of the first processing module 1260a is located on both sides of the width of the transfer module 1240a in the direction parallel to the first direction 10. It is provided larger than the sum L3 of the width length with the buffer station 1400.

  FIG. 10 is a drawing schematically showing another example of the substrate processing system 2000. Referring to FIG. 10, the substrate processing system 2000 includes a process facility 2200 having a transfer module 2240 substantially similar to the substrate processing system 1000 of FIG. 1 and a buffer station 2400 provided between adjacent transfer modules 2240. A guide rail 2246 is provided in parallel to the first direction 10 in the housing 2250 of the transfer module 2240 of the substrate processing system 2000 of FIG. The transfer robot 2242 is attached to the guide rail 2246 so as to move linearly along the guide rail 2246.

  FIG. 11 is a drawing schematically showing another example of the substrate processing system 3000. Referring to FIG. 11, the substrate processing system 3000 includes a buffer station 3400 provided between the process equipment 3200 and 3201 having a transfer module 3240 substantially similar to the substrate processing system 1000 of FIG. 1 and the adjacent transfer module 3240. Have. However, some process equipment 3201 does not have a load port 3220 and has two processing modules 3262 and 3264. Hereinafter, for ease of explanation, one of the processing modules in FIG. 11 is referred to as a first processing module 3262 and the other one is referred to as a second processing module 3264. The first processing module 3262 and the second processing module 3264 may have a structure substantially similar to the processing module 1260 of FIG. The first processing module 3262 and the second processing module 3264 share one transfer module 3240. The first processing module 3262, the transfer module 3240, and the second processing module 3264 are sequentially provided in a line along the second direction 20. The first processing module 3262 and the second processing module 3264 are provided to be symmetric with respect to the transfer module 3240. In FIG. 11, the first processing module 3262 and the second processing module 3264 are illustrated to have the same structure. However, the first processing module 3262 and the second processing module 3264 are provided with arbitrarily different structures. The first processing module 3262 and the second processing module 3264 are provided to perform the same process on the substrate. The first processing module 3262 and the second processing module 3264 are provided to arbitrarily perform different processes on the substrate.

  FIG. 12 is a drawing schematically showing another example of the substrate processing system 4000. Referring to FIG. 12, a substrate processing system 4000 is provided between process facilities 4201, 4202, 4203, and 4204 having transfer modules 4240 that are substantially similar to the substrate processing system 1000 of FIG. 1, and adjacent transfer modules 4240. Buffer station 4400. However, the processing modules 4261, 4262, 4263, and 4264 of the process facilities 4201, 4202, 4203, and 4204 have different structures. Among the process facilities, the process module 4261 of some process facilities 4201 includes a load lock chamber 4261a, a polygonal transfer chamber 4261b, and a plurality of process chambers 4261c like the process module 1260 of FIG. A processing module 4262 of another part of the process equipment 4202 has a structure in which one load lock chamber 4262a and one process chamber 4262c are coupled to the transfer chamber 4262b. The chamber 4262b and the process chamber 4262c are sequentially provided in a row along the second direction 20. Among the process facilities, the processing module 4263 of some other process facilities 4203 has a structure in which a transfer chamber 4263b having a rectangular shape, a load lock chamber 4263a and two process chambers 4263c are coupled to the periphery of the transfer chamber 4263b. Among the process facilities, the processing module 4264 of some other process facilities 4204 does not have a load lock chamber, has a polygonal transfer chamber 4264b and a plurality of process chambers 4264c arranged around it. Transfer chamber 4264b is directly coupled to transfer module 4244. The structures of the processing modules 4261, 4262, 4263, and 4264 shown in FIG. 12 show an example, and the processing modules can have various different structures.

  In the case of FIG. 12, some of the process equipment 4201, 4202, and 4203 perform the process on the substrate in a vacuum state, and the other part of the process equipment 4204 is applied to the substrate in a normal pressure state. On the other hand, the process can be performed.

  In FIG. 12, the processing modules 4261, 4262, 4263, and 4264 are illustrated as being provided on both sides of the connection line 50 in which the buffer station 4400 and the transfer modules 4240, 4244 are disposed. 10, the processing modules 4261, 4262, 4263, and 4264 are provided on the same side with respect to the connection line 50.

  FIG. 13 is a drawing schematically showing another example of the substrate processing system 5000. Referring to FIG. 13, the substrate processing system 5000 includes a buffer station 5400 provided between a process facility 5200, 5201 having a transfer module 5240 substantially similar to the substrate processing system 1000 of FIG. 1 and an adjacent transfer module 5240. Have. However, some of the process facilities 5201 do not have the load port 5220 and have a transfer module 5240 and a processing module 5260.

  FIG. 14 is a drawing schematically showing another example of the substrate processing system 6000. Referring to FIG. 14, the substrate processing system 6000 includes a buffer station 6400 provided between process facilities 6201 and 6202 and a transfer module 6240 adjacent to each other with a transfer module 6240 substantially similar to the substrate processing system 1000 of FIG. Have. However, the process facility 6201 provided with the processing module 6260 on the first side with respect to the connection line 50 where the transfer module 6240 and the buffer station 6400 are arranged is provided with the load port 6220, but the processing port 6220 is provided on the second side. The process facility 6202 provided with the module 6260 is not provided with a load port. In this case, the overhead transfer 40 and the guide rail 42 for guiding the movement are provided only on the second side of the connection line 50.

  In FIG. 13 and FIG. 14, the processing modules 5200, 5201, 6201, and 6202 are all described as having the same structure. However, unlike this, the processing modules 5200, 5201, 6201, and 6202 are provided with different structures as shown in FIG. The processing modules positioned on the same side with respect to the connection line 50 in FIG. 14 are all optionally provided with the same structure, and provided on the second side with the processing module 6201 provided on the first side with the connection line 50 as a reference. The processing module 6202 is provided with a different structure.

  FIG. 15 is a drawing schematically showing another example of the substrate processing system 7000. Referring to FIG. 15, the substrate processing system 7000 includes a buffer station 7400 provided between a process facility 7200, 7201 having a transfer module 7240 substantially similar to the substrate processing system 1000 of FIG. 1 and an adjacent transfer module 7240. Have. The substrate processing system 7000 further includes a process processing apparatus 7800. The process processing apparatus 7800 is provided so as to be coupled to a load port 7220 of some process equipment 7201. The process module 7260 of the process facility 7201 to which the process processing apparatus 7800 is coupled with the connection line 50 as a reference is positioned on the opposite side. The process processor 7800 is simultaneously coupled to the load port 7220 of the two process facilities 7201. At this time, the buffer station 7400 may not be provided between the transfer modules 7240 of the two process facilities 7201 to which the process processing apparatus 7800 is coupled. The two process facilities 7201 are process facilities adjacent to each other.

  The process processing apparatus 7800 is a batch-type process apparatus that simultaneously performs a process on a plurality of substrates. For example, the process performed by the process processing apparatus 7800 is a cleaning process or a strip process. According to an example, the process processing apparatus 7800 is provided with an apparatus having the same or similar structure as the apparatus disclosed in FIG.

  In accordance with the internal structure of the process processing apparatus 7800, the process processing apparatus 7800 is provided with a rotating member 7820 for rotating the container 30 in which the substrate is stored. The overhead transfer 40 places the container 30 on the load port 7220 such that the opening of the container 30 faces the transfer module 7240. The process processing apparatus 7800 can unload a substrate from the container 30 after transferring the container 30 to the inside and rotating the container 30 by 180 °. A rotating member that rotates the container 30 is optionally provided in the load port 7220 or the overhead transfer 40. The container 30 is moved to the process processing apparatus 7800 while being placed in the load port 7220 of the process facility 7201. After the process is completed in the process processing apparatus 7800, the container 30 is loaded with the load port 7200 of the other process facility 7201. Move to. In the state where the container 30 is arbitrarily placed in the load port 7220, the substrate is directly transferred into the process processing apparatus 7800.

  FIG. 17 is a drawing schematically showing another example of the substrate processing system 8000. The substrate processing system 8000 of FIG. 17 includes a buffer station 8400, 8401, a process facility 8200, 8201 having a transfer module 8240 substantially similar to the substrate processing system 7000 of FIG. And a process processing apparatus 8800. A buffer station 8401 is provided between the transfer modules 8240 of the process equipment 8201 to which the process processing apparatus 8800 of the substrate processing system 8000 is coupled. At this time, the buffer station 8401 may have a structure similar to the buffer station 1401 or 1402 of FIG. 5 or FIG.

  FIG. 18 is a drawing schematically showing another example of the substrate processing system 9000. The substrate processing system 9000 includes process facilities 9200 and 9201 having transfer modules 9240 substantially similar to the substrate processing system 7000 of FIG. 15, a buffer station 9400 provided between adjacent transfer modules 9240, and a process processing apparatus 9800. , 9801. However, the process processing apparatus 9801 of the substrate processing system 9000 is coupled to the load port 9220 of the process facility 9200 in which another process facility 9201 is located.

  FIG. 19 is a drawing schematically showing another example of the substrate processing system 10000. The substrate processing system 10000 includes a process equipment 10200 having a transfer module 10240 substantially similar to the substrate processing system 7000 of FIG. 15, a buffer station 10400 provided between adjacent transfer modules 10240, and a process processing apparatus 10800. . The process processing apparatus 10800 of the substrate processing system 10000 is coupled to the load port 10220 of one process facility 10200. The process processing apparatus 10800 is an apparatus that performs a diffusion process. For example, the process processing apparatus 10800 is an apparatus having the same or similar structure as that of FIG.

  The process processing apparatus 10800 is provided with a rotating member 10820 for rotating the container 30 in which the substrate is stored according to the internal structure. The rotating member 10820 rotates the container 30 so that the opening direction of the container 30 is changed by 180 °. The rotating member is optionally provided in the load port 10200 or the overhead transfer 40.

  FIG. 21 is a drawing schematically showing another example of the substrate processing system 11000. The substrate processing system 11000 includes process facilities 11201 and 11202 having transfer modules 11241 and 11242 substantially similar to the substrate processing system 1000 of FIG. 1 and buffer stations 11400 and 11401 provided between adjacent transfer modules 11241 and 11242. Have However, some of the transfer modules 11241 and 11242 and the buffer station 11401 of the substrate processing system 11000 have a different connection structure from the transfer module 1240 and the buffer station 1400 of FIG. The process facilities 11201 and 11202 include transfer modules 11241 and 11242 and processing modules 11261 and 11262, respectively. The transfer module 10241 and the processing module 10261 of the process equipment 11201 are provided along the second direction 20. The transfer module 11242 and the processing module 11262 of the other process equipment 11202 are provided along the first direction 10. Hereinafter, for ease of explanation, the transfer module 10241 in FIG. 21 is referred to as a first transfer module, and the transfer module 10242 is referred to as a second transfer module.

  The buffer station 11401 includes a housing 11420 and a buffer member 11440. The buffer member 11440 may have the same or similar structure as the buffer member 1440 of FIG. 2 or the buffer member 1440 of FIG. The housing 11420 includes an upper surface (not shown), a lower surface (not shown), a first side surface 11423, a second side surface 11424, a third side surface 11425, and a fourth side surface 11426, and has a substantially rectangular parallelepiped or cubic shape. . The first side surface 11423 and the third side surface 11425 are surfaces facing each other, the second side surface 11424 and the fourth side surface 11426 are surfaces facing each other, and the first side surface 11423 and the second side surface 11424 are It is provided almost vertically. The first side surface 11423 and the second side surface 11424 are provided with an opening (not shown) through which the substrate enters and exits and a door (not shown) that opens and closes the substrate. A first transfer module 11241 is coupled to the first side surface 11423, and a second transfer module 11242 is coupled to the second side surface 11424. With such a structure, the substrate is transferred between the first transfer module 11241 and the second transfer module 11242 arranged substantially vertically through the buffer station 11401 arranged therebetween.

  FIG. 22 is a drawing schematically showing another example of the substrate processing system 12000. Referring to FIG. 22, the substrate processing system 12000 includes a process facility 12200 including transfer modules 12241 and 12242 that are substantially similar to the substrate processing system 1000 of FIG. 1, and a buffer provided between adjacent transfer modules 12241 and 12242. A station 12400 is included. However, the load port 12260 is coupled to the second side wall 12254 or the fourth side wall 12256 of the transfer module 12241 located at both ends of the transfer modules 12241 and 12242 provided along the connection line described above. Accordingly, load ports 12260 are provided at both ends of the substrate processing system 12000, and transfer modules 12241 and 12242 and buffer stations 12400 are alternately provided between the load ports 12260 one after another. In addition, a guide rail 42 that passes through the upper portion of the load port 12260 is provided so as to face the load port 12260, and a transport device such as the overhead transfer 40 that transports the container moves along the guide rail 42. In FIG. 22, the connecting line is overlapped with the guide rail 42 although not shown.

  FIG. 23 is a drawing schematically showing another example of the substrate processing system 13000. Referring to FIG. 23, the substrate processing system 13000 includes a process facility 13200 having a transfer module 13240 that is substantially similar to the substrate processing system 1000 of FIG. 1, and a buffer station 13400 provided between adjacent transfer modules 13240. . Further, the processing modules 13260 are alternately arranged on the first side and the second side of the connection line 50. The transfer modules 13240 are provided to align with each other along the connection line 50. That is, all the transfer modules 13240 are provided so that the lengths protruding toward the first side and the second side of the connection line 50 are all equal. The width TL of the transfer module 13240 in a direction parallel to the second direction 20 is longer than the width BL of the buffer station 13400. Accordingly, the transfer module 13240 protrudes longer than the buffer station 13400 on the first side and the second side of the connection line 50, respectively.

  The transfer robot provided in each of the transfer modules in the substrate processing systems shown in FIGS. 11 to 15, 17 to 19, and 21 to 23 described above includes a container and a buffer station placed in a load port. According to the distance, the moving module described in the substrate processing system of FIG. 10 is provided so as to be movable in the first direction like the transfer robot of the transfer module.

  In the above-described substrate processing system, it has been described that all process facilities are connected to each other through a buffer station or a substrate processing apparatus. However, unlike this, there are a plurality of process facilities, and the process facilities belonging to each group are connected to the buffer station.

  According to an example, the process equipment 1200 is grouped into a first group 1000a and a second group 1000b as shown in FIG. The process facilities 1200 belonging to the first group 1000a are connected to each other through the buffer station 1400, and the process facilities 1200 belonging to the second group 1000b are connected to each other through the buffer station 1400. The containers in which the substrates are stored are between the process equipment 1200 belonging to the first group 1000a, between the process equipment 1200 belonging to the second group 1000b, and between the process equipment 1200 of the first group 1000a and the process of the second group 1000b. It is transported between the equipment 1200 by a transport device such as an overhead transfer OHT, an automatic guide vehicle AGV, a rail guide vehicle RGV, or the like.

  In addition, as shown in FIG. 25, one or a plurality of process facilities 1209 to which no buffer station is connected are independently provided between the first group 1000a and the second group 1000b.

  As shown in FIG. 26, a plurality of substrate processing systems as shown in FIG. 1 or FIG. 24 are provided, and these are separated from each other along the second direction 20 and provided in parallel.

  In FIGS. 24 to 26 described above, the substrate processing system having the structure as in the embodiment shown in FIG. 1 is shown. However, the substrate processing system shown in the other embodiments is different from that shown in FIGS. It is provided in such an arrangement.

  Next, an example of a method for performing a process on a substrate using a substrate processing system including a buffer station will be described with reference to FIGS. Hereinafter, for ease of explanation, the process facilities shown in FIGS. 27 to 29 are sequentially arranged from the left side in the first process facilities 14201, 15201, 16201, the second process facilities 14202, 15202, 16202, and the third process. These are referred to as facilities 14203, 15203, 16203. Further, the transfer robot provided in the transfer module of the first process equipment 14201, 15201, 16201 and the processing module of the first process equipment 14201, 15201, 16201 are respectively replaced with the first transfer robots 14271, 15271, 16271, and the first process module. 14261, 15261, 16261, and the transfer robot provided in the transfer module of the second process equipment 14202, 15202, 16202 and the processing module of the second process equipment 14202, 15202, 16202 are respectively the second transfer robots 14272, 15272, 16272. And the second processing modules 14262, 15262, 16262, and the transfer robot and the third process equipment 14203 provided in the transfer module of the third process equipment 14203, 15203, 16203. The 15203,16203 processing module is referred to as a respective third transfer robot 14273,15273,16273, and a third processing module 14263,15263,16263. In addition, the buffer stations shown in FIG. 28 are referred to as a first buffer station 14401, 15401, 16401 and a second buffer station 14402, 15402, 16402 sequentially from the left side. 29 is called a fourth process facility 16204, and the transfer robot provided in the fourth process facility 16204 and the processing module of the fourth process facility 16204 are the fourth transfer robot 16274 and This is referred to as a fourth processing module 16264. The buffer station shown on the rightmost side in FIG. 29 is referred to as a third buffer station 16403.

  In the following example, a case where 25 substrates are stored in one container 30 will be described as an example. The 25 substrates housed in the container 30 are sequentially referred to as a first substrate, a second substrate,..., A 25th substrate.

  FIG. 27 shows a path through which a substrate moves in a substrate processing system 14000 in which process facilities 14201, 14202, and 14203 that perform the same process are connected through buffer stations 14401 and 14402.

  The first process facility 14201, the second process facility 14202, and the third process facility 14203 are each provided with four process chambers 14266, and these four process chambers 14266 all perform the same process. Accordingly, the substrate processing system 14000 includes 12 process chambers 14266 that perform the same process. Among the 25 substrates, the first to fourth substrates, the thirteenth to sixteenth substrates, and the twenty-fifth substrate are processed by the first processing module 14261, and the fifth to eighth substrates and the seventeenth substrate are processed. The processes of the 20th to 20th substrates are performed by the second processing module 14262, and the processes of the 9th to 12th substrates and the 21st to 24th substrates are performed by the third processing module 14263. In FIG. 27, a1, a2, a3, and a4 sequentially indicate the substrate movement paths that are performed by the first processing module 14261, and b1, b2, b3, and b4 are performed by the second processing module 14262. , C1, c2, c3, and c4 sequentially indicate substrate movement paths that are performed by the third processing module 14263.

  First, the container 30 in which the substrate is stored by the overhead transfer 40 is placed in the load port 14221 of the first process equipment 14201.

  The first transfer robot 14271 transfers a substrate on which a process is performed by the first processing module 14261 from the container 30 to the first processing module 14261, and a substrate on which the process is performed by the second processing module 14262 and the third processing module 14263. From the container 30 to the first buffer station 14401. Further, the first transport robot 14271 transports the substrate that has been processed by the first processing module 14261 to the first buffer station 14401.

  When all the substrates are removed from the container 30, the container 30 is transferred to the load port 14223 of the third process facility 14203.

  The second transport robot 14272 transports the substrate on which the process is performed by the second processing module 14262 from the first buffer station 14401 to the second processing module 14262, and the substrate on which the process is performed by the third processing module 14263 is the first. Transport from the buffer station 14401 to the second buffer station 14402. Further, the second transport robot 14272 transports the substrate that has been processed by the first processing module 14261 from the first buffer station 14401 to the second buffer station 14402, and the second substrate that has been processed by the second processing module 14262 is second. Transport from the processing module 14262 to the second buffer station 14402.

  The third transfer robot 14273 transfers the substrate on which the process is performed by the third processing module 14263 from the second buffer station 14402 to the third processing module 14263. Further, the third transfer robot 14273 transfers the substrate, which has been processed by the first processing module 14261 and the second processing module 14262, from the second buffer station 14402 to the container 30 placed at the load port 14223 of the third process facility 14203. To do. The third transport robot 14273 transports the substrate, which has been processed by the third processing module 14263, from the third processing module 14263 to the container 30 placed in the load port 14223 of the third processing facility 14203.

  When transferring a substrate from the container 30 to the first buffer station 14401, when transferring a substrate from the first buffer station 14401 to the second buffer station 14402, and when transferring a substrate from the second buffer station 14402 to the container 30. , Each of the first transfer robot 14271, the second transfer robot 14272, and the third transfer robot 14273 can transfer a plurality of substrates simultaneously.

  According to the substrate processing method of FIG. 27, a plurality of substrates stored in one container 30 can be divided and performed simultaneously by a plurality of process equipments 14201, 14202, 14203, so that a plurality of substrates stored in one container 30 can be performed. Process time required for the entire substrate can be shortened.

  FIG. 28 shows a path through which a substrate moves in a substrate processing system 15000 in which process facilities 15201, 15202, and 15203 performing different processes are connected through buffer stations 15401 and 15402.

  The first process facility 15201, the second process facility 15202, and the third process facility 15203 are provided so as to sequentially perform processes on one substrate. In FIG. 28, d1, d2, d3, d4, d5, and d6 indicate paths through which the substrate sequentially moves. All the substrates provided in the container 30 of the substrate processing system 15000 of FIG. 28 are sequentially processed by the first processing module 15261, the second processing module 15262, and the third processing module 15263.

  First, the container 30 in which the substrate is stored by the overhead transfer 40 is placed in the load port 15221 of the first process equipment 15201.

  The first transfer robot 15271 transfers the substrate from the container 30 to the first processing module 15261. When all the substrates in the container 30 are transferred to the first processing module 15261, the container 30 is transferred to the load port 15223 of the third process facility 15203 by the overhead transfer 40. The substrate for which the process has been completed in the first processing module 15261 is transferred to the first buffer station 15401 by the first transfer robot 15271 before the other substrates. The second transfer robot 15272 transfers the substrate from the first buffer station 15401 to the second processing module 15262. The substrate for which the process is completed in the second processing module 15262 is transferred to the second buffer station 15402 before other substrates. The third transfer robot 15273 transfers the substrate from the second buffer station 15402 to the third processing module 15263. The substrate for which the process is completed in the third processing module 15263 is transferred to the container 30 before the other substrates.

  According to the substrate processing method of FIG. 28, since the substrates can be directly moved between the process facilities 15201, 15202, and 15203 using the buffer stations 15401 and 15402, each substrate is relative to all the other substrates in the container 30. There is no need to wait until a specific process is completed, and other processes can be performed immediately. Further, since the substrate can be directly transferred between the process facilities 15201, 15202, and 15203 through the buffer stations 15401 and 15402, the substrate is transferred compared to when the substrate is transferred between the process facilities 15201, 15202, and 15203 using the overhead transfer 40. You can save time.

  FIG. 29 shows an example of a path along which a substrate moves in a substrate processing system 16000 in which process facilities that perform the same process and process facilities that perform different processes are connected through buffer stations 16401, 16402, and 16403. The first process facility 16201 and the third process facility 16203 perform the same process on the substrate, and the second process facility 16202 and the fourth process facility 16204 perform the same process on the substrate. In addition, the second process facility 16202 performs a process subsequent to the process performed in the first process facility 16201 on the substrate.

  The first process facility 16201 and the third process facility 16203 are each provided with four process chambers 16266, and the second process facility 16202 and the fourth process facility 16204 are each provided with two process chambers 16267. In this case, the process time required for one substrate in the process chamber 16267 of the second process facility 16202 is shorter than the process time required for one substrate in the process chamber 16266 of the first process facility 16201. .

  Of the 25 substrates, the first to fourth substrates, the ninth to twelfth substrates, the seventeenth to twentieth substrates, and the twenty-fifth substrate are sequentially added to the first processing module 16261 and the second processing module 16262. The fifth to eighth substrates, the thirteenth to sixteenth substrates, and the twenty-first to twenty-fourth substrates are sequentially performed by the third processing module 16263 and the fourth processing module 16264. E1, e2, e3, e4, e5, and e6 in FIG. 20 sequentially indicate the movement paths of the substrate on which the processes are performed in the first processing module 16261 and the second processing module 16262, and f1, f2, f3, and f4. , F5, and f6 sequentially indicate the movement paths of the substrates on which the processes are performed in the third processing module 16263 and the fourth processing module 16264.

  First, the container 30 in which the substrate is stored by the overhead transfer 40 is placed in the load port 16221 of the first process equipment 16201.

  The first transfer robot 16271 transfers the substrate on which the process is performed by the first processing module 16261 and the second processing module 16262 from the container 30 to the first processing module 16261, and the third processing module 16263 and the fourth processing module 16264 perform the processing. The substrate on which the process is performed is transferred from the container 30 to the first buffer station 16401. The first transport robot 16271 transports the substrate, which has been processed by the first processing module 16261, to the first buffer station 16401.

  When all the substrates are removed from the container 30, the container 30 is transferred to the load port 16224 of the fourth process facility 16204.

  The second transfer robot 16272 transfers the substrate on which the process is performed by the third processing module 16263 and the fourth processing module 16264 from the first buffer station 16401 to the second buffer station 16402. In addition, the second transfer robot 16272 transfers the substrate that has been processed by the first processing module 16261 from the first buffer station 16401 to the second processing module 16262. In addition, the second transfer robot 16272 transfers the substrate for which the process has been completed by the second processing module 16262 from the second processing module 16262 to the third buffer station 16403.

  The third transport robot 16273 transports the substrate on which the process is performed by the third processing module 16263 and the fourth processing module 16264 from the second buffer station 16402 to the third processing module 16263. In addition, the third transport robot 16273 transports the substrate that has been processed by the second processing module 16262 from the second buffer station 16402 to the third buffer station 16403. In addition, the third transport robot 16273 transports the substrate that has been processed by the third processing module 16263 to the third buffer station 16403.

  The fourth transport robot 16274 transports the substrate that has been processed by the third processing module 16263 from the third buffer station 16403 to the fourth processing module 16264. In addition, the fourth transfer robot 16274 transfers the substrate, which has been processed by the fourth processing module 16264, from the fourth processing module 16264 to the container 30 placed in the load port 16224 of the fourth process facility 16204. Further, the fourth transfer robot 16274 transfers the substrate, which has been processed by the second processing module 16262, from the third buffer station 16403 to the container 30 placed at the load port 16224 of the fourth process facility 16204.

1000 Substrate Processing System 1200 Process Equipment 1220 Load Port 1240 Transfer Module 1260 Processing Module 1400 Buffer Station 1440 Buffer Member

Claims (10)

A first transfer module having a transfer robot provided therein;
A second transfer module having a transfer robot provided therein;
A first buffer station disposed between the first transfer module and the second transfer module and provided to transfer a substrate therebetween;
The first transfer module, the first buffer station, and the second transfer module are disposed on the first side of the connection line with respect to the connection line as a reference, and coupled to the first transfer module. A first processing module;
A second processing module located on the second side of the connection line and coupled to the second transfer module;
The substrate processing system, wherein the first transfer module is provided to protrude further toward the first side than the second transfer module with respect to the connection line. A third transfer module provided inside the transfer robot and positioned on the opposite side of the first transfer module with respect to the second transfer module;
A second buffer station disposed between the second transfer module and the third transfer module and provided to transfer a substrate therebetween;
A third processing module located on the first side of the connection line and coupled to the third transfer module;
2. The substrate processing system according to claim 1, wherein the third transfer module is provided to protrude further toward the first side than the second transfer module with respect to the connection line.   The said 2nd transfer module is provided so that it may protrude further toward the said 2nd side rather than the said 1st transfer module and the said 3rd transfer module on the basis of the said connection line. Substrate processing system. The first transfer module is provided to protrude further to the first side than the first buffer station with respect to the connection line.
The second transfer module protrudes further to the second side of the connection line than the first buffer station, the second buffer station, the first transfer module, and the third transfer module with respect to the connection line. The substrate processing system according to claim 2, wherein the substrate processing system is provided. The first transfer module is provided to protrude at substantially the same distance from the first buffer station and the second buffer station toward the second side of the connection line with respect to the connection line.
The second transfer module may be provided to protrude at substantially the same distance from the first buffer station and the second buffer station toward the first side with respect to the connection line. 5. The substrate processing system according to any one of 2 to 4. One or more first load ports located on the second side of the connection line and coupled to the first transfer module and in which a container containing a substrate is placed;
One or more third load ports located on the second side of the connection line and coupled to the third transfer module and in which a container containing a substrate is placed;
Guiding the movement of a transfer device that is arranged to face the one or more first load ports and the one or more third load ports in the vertical direction and that transports a container in which these substrates are stored. The substrate processing system according to claim 2, further comprising: a first guide rail that performs the above operation. One or more second load ports located on the first side of the connection line and coupled to the second transfer module and in which a container containing a substrate is placed;
A second guide rail that is arranged to face the one or more second load ports in the vertical direction and guides the movement of a transport device that transports a container in which these substrates are stored. The substrate processing system according to claim 1, wherein the substrate processing system is characterized in that:   The maximum width of the second processing module in the direction parallel to the connection line is longer than the width of the second transfer module in the direction parallel to the connection line. The substrate processing system according to claim 1. The first transfer module, the second transfer module, and the third transfer module are provided with substantially the same size and shape,
The substrate processing according to any one of claims 2 to 8, wherein the first processing module, the second processing module, and the third processing module are provided in substantially the same size and shape. system.   The length of the maximum width of the second processing module in the direction parallel to the connection line is the width of the second transfer module, the width of the first buffer station, and the width of the second buffer station in the direction parallel to the connection line. The substrate processing system according to claim 2, wherein the substrate processing system is provided longer than a sum of widths.

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