TW201212151A - Systems for treating a substrate - Google Patents

Abstract

The present inventive concept provides a substrate treating system. The substrate treating system has a plurality of process facilities and at least one buffer station. Each of the process facilities respectively includes a transfer module in which a transfer robot is provided and a treating module connected to the transfer module. A buffer station is located between each of adjacent transfer modules. The buffer stations are provided to transfer substrates between the transfer modules. The plurality of process facilities includes a first facility in which the treating module is located on a first side of an imaginary connection line provided along a direction in which the transfer modules and the buffer stations are arranged and a second facility in which the treating module is located on a second side of the imaginary connection line. The transfer module of the first facility further protrudes toward the first side of the imaginary connection line farther than the transfer module of the second facility.

Description

201212151 VI. Description of the Invention: [Technical Field] The present invention relates to a system for processing a substrate, and more particularly to processing a substrate between a plurality of process facilities including a transfer module Material system. This non-temporary special-purpose petition in the United States is based on the 35 usc § ιΐ9 claim that the Korean patent application filed on the 12th of January 1st, _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Please refer to the case (4). The priority of 0013853 is included in this document. The patent applications are hereby incorporated by reference in its entirety in its entirety in the the the the the the the the the the the the Each of the process facilities can include a load port, a transfer module, and a processing module. A vessel comprising a substrate is placed on the loading magazine. The transfer mold (4) is disposed between the charge and the processing module and may include a transfer robot that returns between the vessel placed on the charge and the processing mold. The process set forth above is not disclosed in U.S. Patent Application Publication No. 2008/0255697, which is incorporated herein by reference. The process facilities are configured to be separated from each other in a clean room. The substrate on one dish is transferred by one. Returning to a device or a worker at the process facility [Abstract] 157792.doc 201212151 An embodiment of the inventive concept provides a substrate processing system. The substrate processing system includes a plurality of process facilities, each of which includes a transfer module provided in the transfer robot and connected to the transfer module. The substrate processing system also includes a buffer station located between each of the adjacent communication modules, the group and provided to transport the substrate between the transfer modules. The plurality of process facilities includes: at least one first facility, wherein the processing module is located on a first side of one of the imaginary connecting lines provided along one of the transmitting modules and one of the buffer stations And at least one second facility, wherein the processing module is located on a second side of the imaginary connection line. The transmitting module of the first facility protrudes further from the first side of the imaginary connecting line than the second transmitting module. An embodiment of the inventive concept also provides a substrate processing system, including: a first transfer module, wherein a first transfer robot is provided; and a second transfer module, wherein a second transfer robot is provided; a buffer table a station disposed between the first transfer module and the second transfer module and configured to transfer a substrate between the first and the second module; a first processing module: the same The first-transmission module assembly is simultaneously disposed on a first side of an imaginary connection line, wherein the imaginary connection line is disposed along the first transmission module, the first buffer station, and the second transmission module The direction is extended; a first processing module is disposed on the second side of one of the imaginary connecting lines simultaneously with the second transmitting module. The first transmission module protrudes further from the first side of the imaginary connection line than the second transmission module. Embodiments of the present invention also provide a substrate processing system including: a first transfer module; a second transfer module; a buffer station, the step of which is d.c. And the second transmission module, wherein the first and the first transmission module and the buffer station are arranged along an imaginary line, the imaginary line extending along a first axis; a first processing module Disposed on a first side of one of imaginary lines perpendicular to a second axis of the first axis of the crucible; and a second processing module disposed one of the imaginary lines along the second axis On the side, the side of the first transfer module that is located on the first side of the imaginary line and extends parallel to the imaginary line is located on the first side of the imaginary line and extends parallel to the imaginary line One of the second transfer modules is laterally far from the imaginary line. [Embodiment] As used throughout the specification, the same reference numerals may be used to refer to the same or similar parts. Other features will be apparent. In the drawings, the thickness of layers and regions may be exaggerated for clarity. Embodiments of the inventive concept are explained in more detail below with reference to the accompanying drawings. However, the embodiments of the inventive concept may be embodied in different forms and should not be construed as being limited to the embodiments set forth herein. In the drawings, the shape of the elements may be exaggerated for clarity. Throughout the text, the same reference numerals may be used to refer to the same elements. Those skilled in the art will appreciate that aspects of the inventive concept can be embodied in a system, method, or computer program product. Therefore, aspects of the inventive concept may take the form of a complete hardware embodiment, a fully software embodiment (including firmware, resident software, microcode, etc.), or an embodiment combining soft and hard aspects. 'In this article, the software and hardware are collectively referred to as a "Electric 157792.doc -6 - 201212151 Road" module "4" system. Furthermore, aspects of the inventive concept may be embodied in the form of a computer program product embodied in or on a plurality of computer readable media having a computer readable code embodied thereon. Any combination of - or a plurality of computer readable media may be utilized. The computer readable medium can be a medium readable media or a computer readable storage medium. A computer readable storage medium can be, for example, but not limited to, any suitable combination of an electronic, magnetic ':, optical, electromagnetic, infrared, or semiconductor system, device, or device or item. More specific examples of computer readable storage media (-non-exhaustive lists) would include items that have one of one or more metal wires, a portable computer disk, a hard disk, a RAM, R〇M, "" erasable programmable read only memory (EPROM or flash memory), a fiber, a portable CD-ROM (CD-ROM), - light storage device - a magnetic storage device or any suitable combination of the foregoing. The above is a stipulation that the 'computer-readable storage medium may contain or store a program for use by the instruction execution system, device or device, or in combination with the instruction execution system, device or device. media. A computer readable signal medium can, for example, be a propagated data signal in the form of a baseband or as part of a carrier including an existing computer readable code therein. The propagated signal can take any of a variety of forms including, but not limited to, an electromagnetic signal, an optical signal, or any suitable combination thereof. A computer readable signal medium can be as follows - a computer readable medium, which is not a computer readable storage medium and can communicate, broadcast, or broadcast a program for execution of an instruction 157792 .doc

S 201212151 A system, device, or device is used or used in conjunction with an instruction to perform a system, device, or device. The program code embodied on a computer readable medium may be transmitted using any suitable medium, including but not limited to: wireless, wireline, fiber optic cable, RF, etc., or any suitable combination of the foregoing. Computer code for performing operations on aspects of the inventive concept may be written in any combination of one or more stylized languages, including one of a target oriented stylization such as Java, Smalltalk, C++, or the like. Languages and custom-ordered stylized languages such as "C" stylized languages or similar stylized languages. The code can be executed entirely on the user's computer, partially on the user's computer, as part of a separate software package, on the user's computer and partly on a remote computer or completely on the remote computer. On the computer or server. In the latter case, the remote computer is connected to the user's computer through a network including any one of a local area network (LAN) or a wide area network (wan), or can be connected to an external computer (burdock) And σ through the use of an Internet service provider's Internet). Reference is made to the flowchart illustrations and/or block diagrams of the method, device (system) and the It will be understood that each of the blocks of the flowchart illustrations and/or block diagrams and combinations of the blocks of the flowcharts and/or block diagrams can be implemented by computer program instructions. Such computer program instructions can be provided to a general purpose computer, a special purpose computer or one of the other programmable data processing devices to generate a machine, such that the instructions (such as via a computer or its 157792. Doc 201212151 The processor execution of the programmable data processing device generates means for implementing the functions/actions specified in the flowchart and/or block diagram or block. The computer program instructions can also be stored in a computer readable medium that can be booted - a computer, other programmable data processing device or other device that operates in a particular manner to make the computer readable The instructions in the media produce an article of manufacture that includes instructions for implementing the functions/acts specified in the flowcharts and/or block diagrams or blocks. The computer program can also be loaded onto a computer, its stylized data processing device or other device to initiate a series of steps to be performed on the computer, its = stylized device or other agricultural equipment. To generate an electrical "one pass" so that the instructions (which are executed on a computer or other programmable 5) are provided for implementing the flowchart and/or block diagrams or blocks specified in the block The flowcharts and block diagrams in the figures illustrate the architecture, possible implementations of the systems, methods, and computer program products in accordance with various embodiments of the inventive concepts. LL ^ ... action. In this regard, each of the blocks in the flowchart or block diagram may represent a module, segment, or portion of a code that includes a plurality of executable fingers for performing the (4) specified logic function. 3. In some alternative implementations, the functions noted in the blocks may not occur in the order noted in the search. For example, in fact, the function of the ^ft function can be performed substantially simultaneously with two consecutive displays. Squares, or sometimes in the opposite order, &, 仃忒 仃忒 方块 。. Also note that the block diagrams and / or flowchart illustration φ #立母-squares and the block diagrams and / or process Figure 157792. Doc 201212151 The combination of blocks in the diagram can be implemented by a dedicated hardware-based system that performs the specified functions or actions or by a combination of dedicated hardware and computer instructions. 1 is a perspective view illustrating a substrate processing system 1000 in accordance with an embodiment of the inventive concept. Referring to Figure 1, a substrate processing system 1 includes a plurality of process facilities 1200 and a plurality of buffer stations. Each of the process facilities 1200 includes a load magazine 1220, a transfer module 124, and a processing module 1260. According to one embodiment, in the process facility, the load cassette 1220, the transfer module 1240, and the processing module 1260 are arranged in a straight line sequence. The transfer modules 124 belonging to other process facilities 1200 are arranged along the line. The buffer station 14 is disposed between the transfer modules 1240 adjacent to the process facility. When viewed from a plan top view, in the process facility 1200, one of the loading magazine 220, the transport module 124, and the processing module 1260 is disposed perpendicular to the transport module 124 and the buffer station 1400. direction. Reference picture! In the illustration, the direction in which the transmission module 1240 and the buffer station 14 are arranged is referred to as a first direction (7), and the direction in which the load port 1220, the transfer module 124, and the processing module 126 are configured is called A second direction is 20. In operation, a substrate comprising a substrate is placed on the loading crucible. According to an embodiment, the loader 30 is loaded or unloaded by a return device 4 (e.g., the same overhead conveyor). The vessel 3 can be selectively loaded or unloaded on the loading magazine 122 by an automated guided vehicle, a track guiding vehicle or a worker. A front open unified p〇d can be used as the vessel 3〇. In each process facility u(9), one or more loads 埠 122〇 are provided. In providing multiple loads 埠 157792. In the case of doc 201212151 1220, the load port 122 is provided along one of the lines along the first direction (7). In Figure 1, two loading cassettes 1220 for each process facility 12 are shown. However, the number of load ports 1220 provided to each of the process facilities 12 can be different. Similarly, the process facility 12 can have a different number of load ports 1220. The transfer module 1240 includes a housing 125 and a transfer robot 1242. The outer casing 1250 has a substantially rectangular shape β reference map! 2, the outer casing 125 has a top surface (1251 of FIG. 2), a bottom surface (1252 of FIG. 2), a first side 1253, a second side 1254, a third side 1255, and a fourth side. η%. The first and third sides 1253 and 1255 face each other and the second and fourth sides 1254 and 1256 face each other. The first side 1253 is perpendicular to the second side 1254. The first side 1253 faces the load port 122 and the third side 1255 faces the processing module 126. An opening (not shown) of one of the substrates in the access vessel 3 is provided at a first side 丨 253 of the outer casing 1250 and a door (not shown) for opening and closing the opening. An opening (not shown) for accessing the substrate in the processing module 1260 and a door for opening and closing the opening (not shown) are provided at the third side 1255 of the housing 1250. Similarly, an opening for accessing one of the substrates of the buffer station 14 (1257 of Figure 2) is formed on the second and/or fourth side of the outer casing 125, respectively. A door opener (not shown) for opening one of the doors of the vessel 3 is provided in the outer casing 125A. The outer casing 125 is provided to isolate one of the inner regions of the outer casing 125 from the outer side. A fan filter unit (not shown) is provided on the top surface of the outer casing 1250 and the fan filter unit directs the air that has transitioned in the outer casing 125 to flow in one of the top-down directions. Therefore, the inner side of the outer casing 1250 can be maintained cleaner than the outer side of the outer casing 1250. 157792. Doc 5 -II · 201212151 The transfer robot 1242 is placed between the container 3〇 placed on the loading cassette 122 and the processing module 1260, between the loading cassette 122 and the buffer station 14〇〇, and between the processing module 1260 and A substrate is transferred between the buffer stations 400. A guide 1246 is provided in the housing parallel to the first direction 10 in %. Transfer robot 1242 is positioned on guide 1246 to move along the track 1246 in a straight line. According to an embodiment, the transfer robot 1242 also moves up and down. One of the hand 1244 of the transfer robot 1242 can move forward, move backward, and rotate on a horizontal plane. One or more handcuffs 244 are available. In the figure, a transfer robot 1242 having two hands 1244 is shown. The processing module 1260 includes a load lock chamber 1262, a transfer chamber 1264, and a process chamber 1266. The transfer chamber 1264 has a generally polygonal shape when viewed from a plan top view. In Fig. 1, when viewed from a plan top view, the transfer chamber 1264 is illustrated as having a hexagonal shape. However, the shape of one of the transfer chambers 1264 is not limited thereto and may be changed. A transfer robot 1268 is provided in the transfer chamber 1%4. The transfer robot 1268 can be moved up and down and one of the transfer robots 1268 can move forward, backward, and rotate on a horizontal plane. One or more hands 1269 can be provided. In the picture! In the case, a transfer robot 1268 having two hands 1269 is shown » a load lock chamber 1262 and a process chamber 1266 are provided around the transfer chamber 1264. The load lock chamber 1262 is located at a side portion of the transfer chamber 1264 adjacent to the transfer module 124A. The process chamber 1266 is located at the other side of the transfer chamber 1264. One or more load lock chambers 1262 may be provided. According to an embodiment, two load lock chambers 1262 are provided. To enter the processing module 126〇 to execute 157792. Doc -12-201212151 - The substrate of the process can be temporarily placed in one of the load lock chambers i262 and the substrate output from the process module 126A can be temporarily placed in the load lock chamber 1262 after the process is completed. In one. Substrates prior to performing a process and after completion-process can be placed in each of the load lock chambers (10). The inner side of the transfer chamber and the process chamber 1266 are maintained at a first pressure, the inner side of the transfer module mo is maintained at the second pressure and the inner side of the load lock chamber 1262 is between the first pressure and the second pressure. Variety. According to an embodiment, the first pressure is lower than the second pressure. For example, the first pressure system is a vacuum pressure and the second pressure is an atmospheric pressure. A process chamber 1266 performs a --process on the substrate. For example, the process chamber can perform one or more process chambers 1266 by performing processes such as cleaning, ashing, depositing, surging, or measuring. For example, in addition to providing the side portions of the transfer chamber 1264 carrying the lock chamber 1262, the process chamber (10) can be provided to all of the other side portions of the transfer chamber 1264. In the case where a plurality of process chambers 1266 are provided, the process chambers (10) can be mounted on the substrate - the same process or a different process. The process chamber (10) may have a structure for performing a process on the substrate under, for example, a vacuum pressure or at atmospheric pressure. The buffer station 1400 is provided between adjacent transfer modules (eg, 124〇a, 4〇b). Circle 2 illustrates a diagram of one of the examples of a buffer station 14 提供 provided between the transfer modules, 1240b). Figure 3 is a perspective view illustrating one example of a cushioning member 1440 of Figure 2. Referring to Figures 2 and 3, the buffer station just 0 includes a housing 1420 and a cushioning member 1440. According to an embodiment, the outer casing 142 has a rectangular container shape having a space therein. One end of the outer casing 142 is coupled to a first transfer module 157792. The doc -13-201212151 1240a combination and the other end of the outer casing 1420 is combined with a second transfer module 124〇b. One end and the other end of the outer casing 1420 are spaced apart from each other in the first direction 1 且 and face each other. According to an embodiment, the cushioning member 1440 is fixedly mounted in the outer casing 1420. The buffer component 1440 includes a body 1442 and a plurality of cushions 1444. The body 1442 has a rectangular container shape and is open on some sides (for example, both sides) perpendicular to the first direction 1 。. A cushion 丨 444 is provided inside the body 1442. The cushions 1444 are spaced apart from one another in an up and down direction. Each of the cushions 1444 includes two plates 1444a and 1444b that support one of the edge portions of the substrate. The plates 1444a and 1444b are spaced apart from one another in the second direction 20. A hand 1244 of a transfer robot 1242 moves up and down along a separation space between the plates (1444a, 1444b). Transfer robots 2U of transfer modules 1240a, 1240b located at both sides of the buffer station 14 are provided to load or unload the substrate. According to an embodiment, the cushioning member 144A may have a buffer 塾 1445 as shown in FIG. Referring back to Figure 2', a door 1258 is formed in the housing 1250 of the transfer module (丨 240a, 1240b) for opening and closing the respective openings 1257 formed on the side facing the buffer station. In the event of a mistake in the process facility, the door 12W is used to close an opening I257 and each process facility 1200 can be used independently of other process facilities. In this case, a transfer of the substrate in the vessel 30 between the process facilities 12A can be performed by the overhead conveyor 40. As an alternative, an automated guided vehicle, a track guiding vehicle or a worker can be used to transport the vessel 30 comprising the substrate between the process facilities 12A. 157792. Doc • 14· 201212151 FIG. 5 is a diagram illustrating one example of another example of a buffer station 1401. The outer casing 1421 is removed in Fig. 5 to show the inside of the buffer station 1401. Referring to Figure 5, the buffer station 14〇1 includes a housing 14Z1, a buffer unit Μ" and a buffer drive unit 1460. The outer casing 1421 and the cushioning member 1441 in Fig. 5 have a structure similar to that of the outer casing 1420 and the cushioning member 1440 of Figs. 2 and 3. The outer casing 1421 of Fig. 5 has a relatively large length in the first direction compared to the outer casing 1420 of Fig. 2. In the housing 1421, the buffer driving member 1460 moves the buffer member 1441 from a first position to a second position in the first direction 1?. The first position is adjacent to one of the transfer modules 1240a (also referred to as "a first transfer module") located at one side of the buffer station 14〇丨 and the 3H-position system® is adjacent to One of the other transmission modules 1240b (also referred to as "a second transmission module") located on the other side of the buffer station 1401. The buffer drive component 1460 includes a guide 1461 and a base 1462. One of the longitudinal directions of the guide 1461 is disposed in the outer casing 1421 parallel to the first direction 10 and extends from the first position to the second position. The base 1462 is combined with the rail 1461 to be movable along the rail 1461 by a drive (not shown). The cushioning member 1441 is fixedly coupled to the base 1462 to move with the base 1462. The buffer station 1401 of Figure 5 can be used when the distance between the adjacent transport modules 124 & and 1240b is relatively long. Figure 6 is a plan elevation view of one of the other examples of a buffer station 1402. Referring to Figure 6, the buffer station 1402 includes a housing 1422, a first buffer member 1422a, a second buffer member 1442b, and a return member 1480. The outer casing 1422 of Figure 6 has a structure similar to that of the outer casing 1420 of Figure 2 . The first buffering member 1442a and the second buffering member 1442b have a similar s 157792. Doc _ 201212151 One of the structures of the buffer component 1440 of FIG. However, compared to the outer casing 142 of Figure 2, the outer casing 1422 of Figure 6 has a relatively large length along a first direction. The first cushioning member 1442a is positioned adjacent to the first transport group 1240a disposed on one side of the buffer station 14A. The second buffering member 14421 is positioned adjacent to the second transport module 12 disposed on the other side of the buffer station. The return member 1480 transfers a substrate between the first buffer member 1442 & and the second buffer member 1442b. The return component 148 has a guide Μ " and a transfer robot 1482. The guide rails 1481 are disposed in the outer casing 1422 such that the longitudinal direction of the guide rails 1481 is parallel to the first direction 1 〇. The rails are extended from a position adjacent to the first cushioning member 14 4 2 a to a position adjacent to the second buffer member 1442b. The transfer robot 1482 is combined with the guide rail 1481 such that the transfer robot 1482 is transported along the guide rail 1481 by a driver (not shown). The transfer robot Mu transfers a substrate from the first buffer member to the second buffer member 1442b. The transfer robot MU has one or a plurality of hands 1483. For example, the transfer robot 1482 can have two hands or can have the same number of hands as the number of substrates that can be loaded on the first cushioning member 1442a. The buffer station 14〇2 of Fig. 6 can be used when a distance between adjacent transfer modules 1240a, 1240b is relatively long. Referring back to Figure 1 'According to an embodiment, buffer station 1400 and transfer mode, 'and 1240 are a single body. As an alternative, the buffer station 1400 can be easily attached to and detached from the transport module 1240. The substrate processing system 丨000 was mounted in the following manner according to the embodiment. The process facility 1200 and the buffer station 1400 are sequentially and repeatedly installed until the last process facility 1200 is installed. When the buffer station is installed 14 ,, the buffer station will be 157792. The doc 201212151 station 1400 is installed to be coupled to a transport module 1240 adjacent to the installed process facility 12, and the transport module 1240 is installed to be adjacent to an installed buffer station 14 when the process facility 12 is installed. 〇〇 Connected together. Next, the transfer module 1240 and the buffer station 1400 are fixed using a combination component (not shown) such as, for example, a screw. As an alternative, the substrate processing system 1 is mounted in the following manner. First, the process facility 1200 is installed such that the transfer modules 124 are positioned to be spaced apart from each other at regular intervals. Thereafter, the buffer station 14 is placed between the transport modules 124A. According to an embodiment, the length of the buffer station μ (eight) along the first direction may be adjustable. After the buffer station 14 is positioned between the transport modules 1240, one of the buffer stations is adjusted (e.g., increased) to connect to an adjacent transport module 240. Next, the transport module 124 and the buffer station 1400 are fixed using a combination of components such as, for example, a screw (not shown). FIG. 7 is a diagram illustrating an example of one of the length adjustable buffer stations 1403. Figure. Included in a body 1423a Referring to Figure 7, a buffer station 丨4〇3 has a housing 1423 package, a bellows 1423b, and a combination panel 1423c. The body 1423a has a structure or material such that the body is fixed in the length of the first direction μ. The bellows 1423b extends from the body 1423a and one of the lengths of the bellows 1423b can vary along the first direction. A combination plate 1423c is provided on the body 1423a. .  And is provided at one end of the bellows 1423b. In order to combine the buffer station 1403 with the transmission module 124, first, the length of the bellows 14 is reduced to ~~.  U K At , .  ^, the cancer, medium, and the buffer station 14〇3 is located between the transfer modules 1240. The connection test will be connected to the combination board 1423c combined with the body 1423a.  157792. Doc -17- 201212151 To the transfer module 1240 and using a combination component (not shown) to combine the combination panel 1423c with the transfer module 1240. Next, one of the lengths of the bellows 1423b is increased to connect the combination panel 1423c combined with the bellows 1423b to the other transfer module 1240. Next, the combination plate 1423c and the other transfer module 1240 are combined with each other using a combination member (not shown). As an alternative, unlike Figure 7, the housing may include a bellows on both sides of the body. Also, as an alternative, the entire area of one of the outer casings may also be formed as a bellows. Figure 8 is a perspective view of another example of a buffer station 1404 that can be changed in length. Referring to Figure 8, a housing 1424 can include a first body 1424a, a second body 1424b, and a combination panel 1424c. The second body 1424b is combined with the first body 1424a such that the second body 1424b projects or is inserted into the first body 1424a from the first body 1424a in the first direction 10. That is, one length of the outer casing 1424 can be varied in the first direction 10 by a telescoping method. A composite panel 1424c is provided at both ends of the first and second bodies 1424a and 1424b. To combine the buffer station 1404 with the transport module 1240, first, in a state in which the second body 1424b is inserted into the first body 1424a, the buffer station 1404 is positioned between the transport modules 1240. Next, the combination panel 1424c combined with the first body 1424a is coupled to the transfer module 1240 and the buffer station 1404 and the transfer module 1240 are combined with each other using a combination member (not shown). Thereafter, the second body 1424b protrudes from the first body l424a such that the combination component 1424c provided at the end of the second body 1424b can be coupled to another transfer module 1240 and then buffered using a combination component (not shown) Station 1404 and another transfer module 1240 are grouped 157792 with each other. Doc -18- 201212151. In FIGS. 7 and 8, a sealing member (not shown) may be applied to a contact surface between the combination plate 1423c or 1424c and the transfer module 1240 such that the inside of the transfer module 1240 and the buffer station are sealed from the outside. The inside of the outer casing 1423 or 1424 of 14〇3 or 14〇4. Referring back to Figure 1, according to an embodiment, the process facilities 12A have the same structure as one another. The transfer modules 丨24〇 and the buffer stations 丨4〇〇 connected to each other can be placed along an imaginary line (referred to as a connecting line 5〇). According to an embodiment, the wiring 50 is as a straight line as shown in FIG. Alternatively, the connecting line 50 can have various shapes, such as a capital letter "L" or a large letter "Ding". According to an embodiment, the processing modules 126 of the process facility 12 are sequentially and alternately disposed at one of the first side and the second side of the connecting line 50. Rails 42 are provided to one of the first side and a second side of the connecting line 50 such that the rails 42 face the loading pockets 122 on the first and second sides of the connecting line 50. A return device such as an overhead conveyor 40 is movable along the rail 42. According to an embodiment, the guide 42 provided to the first side of the connector 50 is independent of the rail provided to the second side of the connector 50. As an alternative, the rail 42 provided to the first side of the connecting line and the rail 42 provided to the second side of the connecting line 5 are part of a track. Figure 9 is an enlarged view of one of the three process facilities provided in Figure 1 and a buffer station disposed between the process facilities. For ease of explanation, in Fig. 9, a process facility provided to one of the first sides of the connecting line 5 is referred to as a first facility 12A. Provided to the first facility 1200a one of the loading itch, a transfer module and a processing module are respectively referred to as 157792. Doc S· -19· 201212151 A first loading module 、l22〇a, a first transfer module 124〇& and a first processing module 1260a^ are provided to one of the second side of the connecting line 50 It is called a second facility 1200b. One of the uoobs, a transport module and a processing module are respectively referred to as a second load port 1220b, a second transfer module 1240b and a second process module 1260b. As described above, the first processing module 126a is combined with the third side wall 1255a of the first transfer module 1240a and the second processing module 126b is connected to the third side wall of the second transfer module 1240b. 1255b combination. The third side wall 1255a of the first transfer module 1240a protrudes further from the connection line 50 toward the first processing module 126a from the first side wall 1253b of the second transfer module 1240b. The third side wall 12551 of the second transfer module 12401) protrudes further from the connecting line 5 to the first processing module 1260b than the first side wall 1253a of the first transfer module 1240a. A buffer station 1400 disposed between the first transfer module 1240a and the second transfer module 124A includes a first sidewall 1453, a second sidewall 1454, a second sidewall 1455, and a fourth sidewall 1456. The first side wall 1453 and the second side wall 1455 face each other. The second side wall 1454 and the fourth side wall 1456 face each other. The second side wall 1454 and the fourth side wall 1456 are combined with a first transfer module 1240a and a first transfer module 1240b, respectively. The first side wall 1453 is mounted on a plane extending from the first side wall I253a of the first transfer module 1240a. The second side wall 1455 is disposed on a plane extending from the first side wall 12 5 3 b of the second transfer module 124〇b. A first service space 1800a is surrounded by a portion l7〇Oa, a second load port 1220b, and a buffer station 14 that protrude from the first transfer module 1240a. 157792. Doc -20· 201212151 The first service space 1800a is a worker can be located when the first transfer module 1240a, the load lock chamber 1262a of the first process module 1260a, the buffer station 1400, and the second load port 1220b need to be maintained. A space. Similarly, a second service space 1800b is surrounded by a portion 1700b protruding from the second transfer module 1240b, the first load port 1220a, and a buffer station 1400. The second service space 1800b is a space in which a worker can be located when it is required to maintain the second transfer module 1240b, the load lock chamber 1262b of the second process module 1260b, the buffer station 1400, and the first load port 1220a. According to an embodiment, process facilities 1200a and 1200b have a same size and an identical shape. The maximum width L1 of the processing module 1260 parallel to the first direction 10 may be greater than the maximum width L2 of the corresponding transfer module 1240 that is parallel to the first direction 10. Figure 10 is a diagram illustrating one example of another example of a substrate processing system 2000. Referring to FIG. 10, substrate processing system 2000 includes a process facility 2200 that includes a transfer module 2240 and a buffer station 2400 disposed between adjacent transfer modules 2240. In the substrate processing system 2000 of FIG. 10, the processing modules 2260 of all the processing facilities 2200 are disposed on the top side or the bottom side of the connecting line 50 on which the transfer module 2240 and the buffer station 2400 are disposed. Instead of being placed on both sides of the connecting line 50. In this case, with respect to the connecting line 50, an overhead conveyor 40 and a guide rail 42 for guiding the movement of one of the overhead conveyors 40 are provided only on the opposite side of the side on which the processing module 2260 is provided. For purposes of illustration, Figure 10 shows the processing module 2260 on both sides of the connector 50 to show how the processing modules will be on either side of the connector 50. However, it should be understood that this embodiment refers to all processing modules 157792. Doc -21 - 201212151 2260 is placed on the same side of one of the connecting lines 50. Figure 11 is a diagram illustrating one example of another example of a substrate processing system 3000. Referring to Figure 11, substrate processing system 3000 includes process facilities 3200 and 3201, which include a transfer module 3240 and a buffer station 3400 provided between adjacent transfer modules 3240. Some process facilities 3201 include two processing modules 3262 and 3264 without a load port 3220. For ease of explanation, in FIG. 11, one of the two processing modules is referred to as a first processing module 3262 and the other of the two processing modules is referred to as a second processing module. 3264. The first and second processing modules 3262 and 3264 can have a structure similar to that of the processing module 1260 of FIG. The first and second processing modules 3262 and 3264 share a transfer module 3240. The first processing module 3262, the transmitting module 3240, and the second processing module 3264 are sequentially provided along one of the second directions 2〇. The first and second processing modules 3262 and 3:264 are symmetrically provided with respect to the transport module 3240. In Fig. 11, the first and second processing modules 3262 and 3264 are illustrated to have the same structure. However, as an alternative, the first and second processing modules 3262 and 3264 may have a different structure from each other. The first and second processing modules 3262 and 3 264 can perform the same process on the substrate. As an alternative, the first and second processing modules 3262 and 3264 can perform a different process from the substrate to the substrate. 12 is a diagram illustrating another example of a substrate processing system 4000. Referring to FIG. 12, a substrate processing system 4000 includes process facilities 4201, 4202, 4203, and 4204, which include a transfer module 424. And processing modules 4261, 4262, 4263 and 157792 provided in the buffer station 4400 » process facilities 4201, 4202 ' 4203 and 4204 between adjacent transmission modules 4240. Doc -22- 201212151 4264 has different structures from each other. The processing module 4261 of the process facility 4201 includes a load lock chamber 42 61a, a polygonal transfer chamber 42 61b, and a plurality of process chambers 4261c. The processing module 4262 of the process facility 4202 has one of the load lock chamber 4262a and a process chamber 4262c combined with a transfer chamber 4262b and the load lock chamber 4262a, the transfer chamber 4262b and the process chamber 4262c are along a line along the second direction 20. One structure is provided in order. The processing module 4263 of the process facility 4203 has a structure in which a transfer chamber 4263b having, for example, a square or rectangular shape is combined with a load lock chamber 4263a and a process chamber 4263c disposed around the transfer chamber 4263b. The process module 4264 has a polygonal transfer chamber 4264b and a plurality of process chambers 4264c disposed around the transfer chamber 4264b. The transfer chamber 4264b is directly combined with the transfer module 4244. The structural examples of the processing modules 4261, 4262, 4263, and 4264 illustrated in Figure 12 and the processing modules can have various configurations. In the case of Figure 12, in accordance with an embodiment, the process facility, 42〇2, and 4203 can perform a process on the substrate under vacuum and the process facility 4204 can perform a process on the substrate at atmospheric pressure. In Fig. 12, processing modules 4261, 4262, 4263, and 4264 are provided on both sides of the buffer station 4400 and the connection lines 50 on which the transfer modules 4240 and 4244 are disposed. However, the processing modules 4261, 4262, 4263, and 4264 as described above in connection with Fig. 1A can be provided on one side of the connecting line 50. Figure 13 is a diagram illustrating one example of another example of a substrate processing system 5000. Referring to Figure 13, a substrate processing system 5000 includes process facilities 5200 and 5201, which include a transfer module 5240 and are provided for adjacent transfer 157792. Doc -23- 201212151 Buffer station 5400 between modules 5240. The process facility 5201 includes a transfer module 5240 and a processing module 5260 without a load port 5220. Figure 14 is a diagram illustrating one example of another example of a substrate processing system 6000. Referring to Figure 14, substrate processing system 6000 includes process facilities 6201 and 6202, which include a transfer module 6240 and a buffer station 6400 provided between adjacent transfer modules 6240. The loading cassette 6220 is provided to a processing facility 6201 including a processing module 6260 disposed on a first side of one of the connecting lines 50 on which the transfer module 6240 and the buffer station 6400 are disposed, but the load cassette 6220 is not provided for placement. Process facility 6202 on a second side of one of the connection lines 50. In this case, only one of the overhead conveyor 40 and one of the guided overhead conveyors 40 is provided on the second side of the connecting line 50 to move one of the guide rails 42. In Figures 13 and 14, the processing modules 5200, 5201, 6201, and 6202 have the same structure. However, according to an embodiment, the processing modules 5200, 5201, 6201, and 6202 may have different structures from each other as illustrated in FIG. As an alternative, in FIG. 14, the processing modules disposed on the same side of one of the connecting lines 50 may have the same structure as each other, but have a different processing module from the other side disposed on the other side of the connecting line 50. structure. For example, the processing modules 620 1 may have the same structure as each other, and the processing module 6202 may have a different structure from the processing module 6201, but have the same structure as each other. Figure 15 is a diagram illustrating one example of another example of a substrate processing system 7000. Referring to Figure 15, substrate processing system 7000 includes process facilities 7200 and 7201, which include a transfer module 7240 and a buffer station 7400 provided between adjacent transfer modules 7240. Substrate processing system 7000 further 157792. Doc -24- 201212151 includes a process processing device 7800. The process processing device 7800 is combined with one of the process cartridges 7201. The processing module 7260 and the processing device 7800 of the process facility 7201 in combination with the processing device 7800 are located at opposite sides with respect to the connecting line 50. The process processing unit 7800 is combined with the load cassette 7220 of the two process facilities 7201 at the same time. The buffer station 7400 is not provided between the transfer modules 7240 of the two process facilities 7201 combined with the process processing device 7800. Two process facilities 7201 are adjacent to each other. According to one embodiment, the process processing device 7800 can perform a batch process for a plurality of substrates simultaneously. For example, one of the processes performed in the process processing device 7800 can be a cleaning process or a stripping process. According to an embodiment, as in FIG. 16, the process processing device 7800 can be a device having a structure similar to or identical to that of the device disclosed in FIG. 10 of U.S. Patent Publication No. 2004/0165973, the disclosure of which is common to The assignee of the present application is hereby incorporated by reference. A rotating member 7820 of a vessel 30 including a substrate is provided in the process processing device 7800 in accordance with an internal structure of one of the processing devices 7800. The overhead conveyor 40 places the orphan 30 on the magazine 7220 such that one of the openings of the vessel 30 faces the transfer module 7240. The process processing device 7800 transfers the vessel 30 to the inside of the process processing device 7800, rotates the vessel 30 by 180 degrees, and then unloads the substrate from the vessel. As an alternative, the rotating component of the rotator 30 can be provided on the loading cassette 7220 or the overhead conveyor 40. According to an embodiment, the vessel 30 is moved to process after being placed on the loading cassette 7220 of the processing facility 7201. The device 7800 is moved to a loading port 157792 of another process facility 7201 after completion in a process in the process processing device 7800. Doc -25- 201212151 7220. As an alternative, the substrate can be moved directly to the process processing unit 7800 while the vessel 30 remains on the load cassette 7220. Figure 17 is a diagram illustrating one example of another example of a substrate processing system 8000. Similar to the substrate processing system 7000 of FIG. 15, the substrate processing system 8000 of FIG. 17 includes process facilities 8200 and 8201, and the process facilities include a transfer module 8240, and a buffer station 8400 provided between adjacent transfer modules 8240. , 8401 and process processing device 8800. In the substrate processing system 8000, a buffer station 8401 is provided between the process processing unit 8800 and the transfer module 8240 of the process facility 8201 in combination therewith. According to an embodiment, the buffer station 8401 has a structure similar to that of the buffer stations 1401, 1402 of Fig. 5 or Fig. 6. Figure 18 is a diagram illustrating one example of another example of a substrate processing system 9000. Similar to the substrate processing system 7000 of FIG. 15, the substrate processing system 9000 includes process facilities 9200 and 9201, and the process facilities include a transfer module 9240, a buffer station 9400 provided between adjacent transfer modules 9240, and a process Processing devices 9800, 9801. In substrate processing system 9000, process processor 9801 is combined with load port 9220 of process facility 9200 with process facility 9201 disposed therebetween. Figure 19 is a diagram illustrating one example of another example of a substrate processing system 10000. Similar to the substrate processing system 7000 of FIG. 15, the substrate processing system 10000 includes a process facility 10200 that includes a transfer module 10240, a buffer station 10400 disposed between adjacent transfer modules 10240, and a process processing device 10800. In the substrate processing system 10000, the process processing device 10800 is loaded with a 10220 group of one of the process facilities 10200 157792. Doc -26- 201212151 Process processing device 10800 can perform a diffusion process. . For example - device. For example, the process processing apparatus 1_ as shown in FIG. 2A may be a device having a structure similar to or identical to that of the apparatus disclosed in FIG. 4 of US Laid-Open Patent Publication No. 0255697, the disclosure The patents are commonly assigned to the assignee of the present application and are hereby incorporated by reference. In the process processing apparatus 1800, a rotating member 10820 for rotating a unit including a substrate according to an internal structure of the process processing apparatus 提供8 is provided. The rotating member 1 820 rotates the vessel 3 to rotate the opening of one of the vessels (10) by 180 degrees. As an alternative, the rotating assembly can be provided at a loading cassette 10200 or an overhead conveyor 4". Figure 21 is a diagram showing one example of another example of a substrate processing system 11A. The substrate processing system 11 includes process facilities 1丨2〇丨 and 丨丨202, and the process facilities include transfer modules 11241 and 11242 and buffer stations 114 provided between adjacent transfer modules 11241 and 11242. 〇 and 114〇1. The transfer modules 11241 and 11242 and the buffer station 11401 in the substrate processing system 11 000 have a different combination structure from the transfer module 1240 and the buffer station 1400 of Fig. 1 . Process facilities 11201 and 11202 include transfer modules 241 and 11242 and processing modules 11261 and 11262, respectively. In the process facility 1102, the transfer module 11241 and the processing module 11261 are provided in the second direction 20 with respect to each other. In another process facility 11202, the transfer module 11242 and the process module 1 1262 are provided in a first direction relative to each other. For ease of explanation, in FIG. 21, the transmission module 11241 is referred to as a first transmission module and transmits a mode 157792. Doc •27· 201212151 Group 11242 is called a second transmission module. According to an embodiment, the buffer station 11401 includes a housing 11420 and a buffer member 11440. According to an embodiment, the cushioning member 1 440 has a structure similar to or identical to that of the cushioning member 1440 of Figs. 2 and 3. The housing 1142 includes a top surface (not shown), a bottom surface (not shown), a first side 11423, a second side 11424, a third side 11425, and a fourth side 11426. According to an embodiment, the outer casing 1142 has a rectangular shape or a regular hexahedral shape. The first and third sides 11423 and 11425 face each other and the second and fourth sides 11424 and 11426 face each other. The first side 11423 is perpendicular to the second side 11424. A door (not shown) through which the substrate passes and a door (not shown) that opens and closes the opening are provided at the first side 11423 and the second side π424. The first transfer module 11241 is combined with the first side U423 and the second transfer module 11242 is combined with the second side 11424. A transfer of the substrate between the first transfer module 11241 and the second transfer module 11242 is accomplished through a buffer station U4〇1 disposed between the first and second transfer modules 11241 and 11242. Figure 22 is a diagram illustrating one example of another example of a substrate processing system 12000. Referring to FIG. 22, similar to the substrate processing system 1000 of FIG. 1, the substrate processing system 12000 includes a process facility 122 that includes transfer modules 12241, 12242 and is provided between adjacent transfer modules 12241 and 12242. Buffer station 12400. A loading cassette 12220 is combined with a second side wall UM4 or a fourth side wall 122S6 of the end transfer module 12241, and the transfer modules 12241 and 12242 are provided along the connecting line. Therefore, the load 埠1222〇 is provided at the end of the substrate processing system 12000, and the bee 157792 is loaded. The transfer modules 丨224丨 and i2242 and the buffer station 12400 are sequentially and alternately provided between doc 28-201212151 12220. A returning device through one of the loading pockets 1222 is provided to face one of the rails 42 of the magazine 12220 and a return vessel such as an overhead conveyor 4 is moved along the rail 42. Although the connecting line is not illustrated in Fig. 22, according to an embodiment, the connecting line overlaps the guide rail 42. Figure 23 is a diagram illustrating one example of another example of a substrate processing system 13000. Referring to FIG. 23, similar to the substrate processing system 1 of FIG. 1, the substrate processing system 13000 includes a process facility 132, which includes a transfer module 13240, and is provided between adjacent transfer modules 13240. Buffer station 13400. Similarly, the processing module 1326 is alternately disposed on a first side and a second side of the connecting line. One of the first side wall 13253 adjacent to one of the transport modules 1324 and the third side wall 13255 of the other of the adjacent transport modules 1324 can be located at an equal distance from one of the connecting lines 5〇. Similarly, each of the transfer module 240 and the buffer station 134 can be located at an equal distance from one of the connections 50. In the substrate processing system set forth above, it is stated that all of the process facilities are connected to one another via a buffer station or substrate processing apparatus. According to an embodiment, the red packets are organized into groups, and the process facilities belonging to a group are connected to each other through a buffer station. For example, according to an embodiment, as illustrated in FIG. 24, the process facility 1200 can be grouped into a first group 1a and a second group 1b. The process facilities UOO belonging to the first group l〇〇〇a are connected to each other via the buffer station 14〇〇, and the process facilities (10) belonging to the second group i 000b are connected to each other via the buffer station 1400. One of the substrates including the substrate may be in the first group by a conveyor such as - high, 57792, 00 5 201212151, an automatic guiding vehicle and a track guiding vehicle, or a worker.制a's process facilities 12〇〇, between the process facilities belonging to the second group 1000b 12〇〇 and the process facilities of the first group 1000a丨2〇〇 and the second group i〇0〇b Transfer between process facilities 1200. As illustrated in Figure 25, a buffer station is not connected to one or a plurality of process facilities 1209 are independently provided between the first group 1 & and the second group 1000b. As illustrated in Figure 26, a plurality of substrate processing systems such as, for example, the substrate processing systems of Figure 1 or Figure 24 can be provided. The substrate processing systems can be parallel to one another in a second direction and can be separated from each other. A substrate processing system having the same structure as the embodiment of FIG. i is illustrated in FIGS. 24 to 26, but as shown in the other embodiments illustrated in FIGS. 24 to 26 The processing system can be placed in groups and/or placed with other substrate systems. Referring to Figures 27 through 29, an example of a method of performing a process on a substrate using a substrate processing system including a buffer station will be described. For ease of explanation, the process facilities illustrated in FIGS. 27 to 29 are sequentially referred to as first process facilities 14201, 15201, and 16201, second process facilities 14202, 15202, and 16202, and third, respectively, from left to right. Process facilities 142〇3, 152〇3 and 16203. Similarly, one of the transfer modules provided to one of the first process facilities 14201, 15201, and 16201 and the first process facility 142 (the processing modules of one of H, 15201, and 16201 are respectively referred to as first transfer robots 14271, 15271, respectively. And 16271 and the first processing modules 14261, 15261 and 157792. Doc •30· 201212151 16261. One of the transfer robots provided to one of the second process facilities 14202, 15202, and 16202 and one of the second process facilities 14202, 15202, and 16202 are referred to as second transfer robots 14272, 15272, and 16272, respectively. Two processing modules 14262, 15262 and 16262. One of the transfer robots provided to one of the third process facilities 14203, 15203, and 16203 and one of the third process facilities 14203, 15203, and 16203 are referred to as third transfer robots 14273, 15273, and 16273, respectively. Three processing modules 14263, 15263 and 16263. Similarly, the buffer stations illustrated in Figures 27 through 29 are sequentially referred to as first buffer stations 14401, 15401, and 16401 and second buffer stations 14402, 15402, and 16402, respectively, from left to right. In Fig. 29, one of the additional process facilities illustrated at the far right portion of the page is referred to as a fourth process facility 16204. One of the transfer robots provided to the fourth process facility 16204 and the process module of the fourth process facility 16204 are referred to as a fourth transfer robot 16274 and a fourth processing module 16264, respectively. One of the buffer stations illustrated at the far right portion of the page is referred to as a third buffer station 16403. One example of the twenty-five substrates placed in a vessel 30 is illustrated as an example, but the number of substrates may be more or less than 25. The twenty-five substrates placed in the vessel 30 are sequentially referred to as a first substrate, a second substrate, and a second substrate. . . , a twenty-fifth substrate. Figure 27 illustrates a route of a substrate in a substrate processing system 14000 in which process facilities 14201, 14202, and 14203 performing the same process are coupled to one another via buffer stations 14401 and 14402. Four process chambers 14266 are 5 157792. Doc -31 - 201212151 is provided to the first process facility 14201, the second process facility 142〇2, and the third process. The same process is performed in each of the four 14203s and in each of the four process chambers 14266. Thus, twelve process chambers 14266 that perform the same process are provided in the substrate processing system 14. According to an embodiment, among the twenty-five substrates, the fourth to the fourth substrate, the thirteenth to sixteenth substrates, and the twenty-fifth substrate are performed in the first processing module Process. Performing processes for the fifth to eighth substrates and the seventeenth to tenth substrates in the second processing module 14262 and performing the ninth to twelfth substrates in the third processing module i4263 and One of the twenty-first to twenty-fourth substrates. In FIG. 27, "2", & 3, and & 4 sequentially represent one of the substrates on which the first processing module UMi_ executes a process, ...^(4)(4) is sequentially indicated in the second processing module In the chest for the execution-process substrate - route Μ, e2n4 order is represented in the processing module! 4263 t One of the substrates for which the process-process is performed. The vessel 3 comprising the substrate is placed on the loading cassette 14221 by an overhead conveyor such as the first process. The first transfer robot 14271 transfers the substrate self-vehicle 3G for which execution is performed in the first processing module 14261 to the first processing module i426i and will be targeted in the second processing unit 14262 and the third processing mode. The substrate carrying the process is transferred from the device to the first buffer station. Similarly, the first transfer robot 14271 transfers the substrate that has been processed for the process in the first processing module to the first buffer station. 14401. 157792. Doc -32· 201212151 According to an embodiment, if all the substrates are taken out of the vessel 30, the vessel 3〇 is transferred to one of the third process facilities i4203 to load the crucible 14223. The second transfer robot 14272 transfers the substrate for which a process is executed in the second processing module 14262 from the first buffer station 144〇1 to the second processing module 14262 and will be at the third processing module 14263. The substrate for which a process is performed is transferred from the first buffer station 144〇1 to the second buffer station 14402. Similarly, the first transfer robot 14272 transfers the substrate for which a process has been completed in the first processing module 14261 from the first buffer station (1) to the second buffer station 14402 and will have been in the second processing mode. The substrate for group 1262 for which a process is completed is transferred from the second processing module 14262 to the second buffer station 14402. The second transfer robot 14273 transfers the substrate for which a process is executed in the third processing module 14263 from the second buffer station 144〇2 to the third processing module 14263. Similarly, the third transfer robot 14273 transfers the substrate for which a process has been completed in the first processing module 1426 1 and the second processing module 丨 4262 from the second buffer station 144 〇 2 to the third process. The vessel 14 of the facility 14203 is loaded on the crucible 14223. The third transfer robot 14273 transfers the substrate for which a process has been completed in the third process module 丨4 2 6 3 from the third process module 14263 to the third process facility 们 "the loader 14223" The vessel 30 is transported from the vessel 30 to the first buffer station 144〇1, from the first buffer station 14401 to the second buffer station 144〇2 and from the second buffer station 14402 to the vessel 30. Each of the first, second, and third robots i427i, 14272, and 14273 can simultaneously transmit a plurality of substrates. 157792. Doc 5 •33- 201212151 According to the method of processing the substrate of FIG. 27, in a plurality of process facilities 142〇1, 142〇2, and 142〇3, the process can be simultaneously assigned to the process facilities 142〇1, 14202, and 14203. The substrate of each of them performs the process, thereby reducing the time required to perform a process for supplying all of the substrate to the vessel 30. Figure 28 illustrates one of the routes of the substrate in the substrate processing system 15 . The process facilities 15201, 15202, and 15203 each perform a different process, and are connected to each other through the buffer stations 15401 and 15402. The first process facility 15201, the second process facility ls2〇2, and the third process facility i52〇3 are a substrate. The process is executed sequentially. In Fig. 28, di, 、, d3, d4, d5 and d6 sequentially represent one of the routes of the substrates. In the substrate processing system 15000 of FIG. 28, a first processing module 15261, a second processing module 15262, and a third processing module 丨 5263 are sequentially executed on the substrate provided to the device. Process. First, the vessel 3 including the substrate is placed on the loading port 15221 of the first process facility lWO1 by the overhead conveyor 40. A first transfer robot 1 5271 transfers the substrate from the vessel 3 to the first processing module 15261. According to an embodiment, if all of the substrates in the vessel 3 are processed by the first processing module 15261', the vessel 3 is transported by the overhead conveyor 4 to the loading chamber 15223 of the third process facility 152〇3. First, the substrate for which a process has been completed in the first processing module 15261 is transferred to the first buffer station ΐ54〇 by the first transfer robot 15271. A second transfer robot 15272 transfers the substrate in the first buffer station 154〇1 to the first processing module 15262. Will have been completed in the second processing module 15262 for it 157792. Doc -34· 201212151 The substrate of the integrated process is transferred to the second buffer station 15402. A third transfer robot 15273 transfers the substrate in the second buffer station 15402 to the third processing module 15263. The substrate for which a process has been completed in the third processing module 15263 is transferred to the vessel 30. According to one embodiment, certain substrates can pass through system 15000 faster than other substrates. Therefore, other substrates can be processed after processing the substrates in the substrates. According to the method of processing the substrate of Fig. 28, since the buffer stations 15401 and 154〇2 can be used to move the substrates independently of each other between the process facilities i52〇1, mo2 and i52〇3, there is no need to wait until the device is alone. All other substrates in the crucible can perform another process on a substrate by performing a specific process. Similarly, since the substrates can be independently transferred to the process facilities 15201, 15202, and 15203 through the buffer stations 15401 and 15402, as compared to when the overhead conveyor 40 is used to transfer substrates between the process facilities 15201, 15202, and 15203. , can reduce the time required to transfer the substrate. Figure 29 illustrates one of the routes of the substrate in the substrate processing system 16 . The process facilities 162〇1, 162〇2, 16203, and 16204 perform the same process as each other or processes different from each other and are connected to each other through the buffer stations 164〇1, 164〇2, and 164〇3. For example, according to an embodiment, the first and third process facilities 16201 and 16203 perform the same process for each other on the substrate. The second and fourth process facilities 16202 and 16204 perform a process different from the first and third process facilities, and perform the same process for the substrates. Also, according to an embodiment, the second process facility 162 对 2 performs a process for the substrate relative to the process performed in the first process facility 16201 for a subsequent process. 157792. Doc 5 •35· 201212151 Four process rooms 16266 are supplied to each of the first process facility 162〇1 and the third process facility 16203. Adding to the two systems 16267 is provided to each of the second process facility (10) 2 and the fourth process facility _4. According to a conventional example, one of the processes required to perform a process for one of the process chambers of the second process facility 162()2 is 拄„high time comparable to the process room 16266 of the first process facility 16201. The substrate is executed - the time required for the process is small. Among the twenty-five substrates, the first to the fourth substrate are sequentially executed in the first processing die (four) and the second processing module 16262. 9 to 10 soil materials, a process of one of the seventeenth to twentieth substrates and the twenty-fifth substrate. The fifth to eighth bases are sequentially executed in the third processing module 14263 and the fourth processing module (6) a material, a thirteenth to sixteenth substrate, and one of the twenty first to twenty-fourth substrates. In FIG. 29, the el, e2, e3, e4, e5, and e6 sequence tables are not in the first processing module (6) and the second processing module 16262 for the substrate-execution-process route and fl, f2. The f3, and f6 sequences represent one route of the substrate for which the third processing module (10) recognizes the fourth processing module 16264 for performing a process. The container including the substrate 30 is placed on the overhead conveyor 4 One of the first process facilities 16201 is loaded on the 埠ι 6221. The first transfer robot 16271 will transfer the substrate from the first process module 16261 and the second process module 16262 to the first process to the first process. The module 16261 will transfer the substrate-to-vehicle % for performing the process in the third processing module 16263 and the fourth processing module 6264 to the first buffer station 164〇1. Similarly, the first transfer robot 16271 will transfer the substrate in the first processing module 16261 for which a process is completed to 157792. Doc • 36 - 201212151 First buffer station 16401. According to one embodiment, if all of the substrate is detached by the extractor 30, the vessel 30 is transferred to one of the fourth process facilities 16204 for loading 埠 16224. The second transfer robot 16272 transfers the substrate for which a process is executed in the third processing module 16263 and the fourth processing module 1626 from the first buffer station 16401 to the second buffer station 16402. Similarly, the second transfer robot 16272 transfers the substrate for which a process has been completed in the first processing module 16261 from the first buffer station 16401 to the second processing module 16262 and will be in the second processing module 1 The substrate for which a process is completed in 6262 is transferred from the second processing module 16262 to the third buffer station 16403. The third transfer robot 16273 transfers the substrate for which a process is executed in the third processing module 16263 and the fourth processing module 16264 from the second buffer station 16402 to the third processing module 16263. Similarly, the third transfer robot 16273 transfers the substrate from which the process has been completed in the second processing module 16262 from the second buffer station 16402 to the third buffer station 16403. The third transfer robot 16273 transfers the substrate for which a process has been completed in the third processing module 16263 to the third buffer station 16403. The fourth transfer robot 16274 transfers the substrate for which a process has been completed in the third processing module 16263 from the third buffer station 1 6403 to the fourth processing module 16264. Similarly, the fourth transfer robot 16274 transfers the substrate for which a process has been completed in the fourth processing module 16264 from the fourth processing module 16264 to the load port 16224 placed on the fourth process facility 16204. . The fourth transfer robot 16274 transmits the substrate for which a process has been completed in the second processing module 16262 from the third buffer station 16403.

S 157792.doc -37- 201212151 A vessel that is placed on a load magazine 16224 placed on a fourth process facility 16204. 30 In accordance with an embodiment of the inventive concept, a substrate transfer between process facilities can be efficiently performed. According to an embodiment of the inventive concept, a limited space of one of the clean rooms in which a plurality of process facilities are installed can be effectively used. Although the exemplary embodiments of the present invention have been described above, it should be understood that the concept of the present invention is not limited to the embodiments, and those skilled in the art can do without departing from the spirit and scope of the inventive concept. Make a change. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing one of an example of a substrate processing system. Figure 2 is a cross-sectional view showing the internal structure of a transfer module and a buffer station. Figure 3 is a perspective view illustrating an example of one of the cushioning members of Figure 2. 4 is a perspective view illustrating another example of the cushioning member of FIG. 2. Figure 5 is a perspective view illustrating an example of one of the buffer stations of Figure 1. Figure 6 is a graphical illustration! A plan top view of another example of a buffer station. 7 and 8 are perspective views respectively illustrating other examples of the buffer station of Fig. 1. Figure 9 is a diagram for explaining the shape of one of the transfer modules in a substrate processing system. Figures 10 through 15 are plan top views each illustrating another example of a substrate processing system 157792.doc -38 - 201212151. Figure 16 illustrates an example of a substrate processing apparatus of Figure 15. 17 through 19 are plan top views respectively illustrating other examples of a substrate processing system. Figure 20 is a diagram showing an example of one of the substrate processing apparatuses of Figure 19. 21 to 23 are plan top views illustrating other examples of a substrate processing system. 24 through 26 are plan top views illustrating an example of a plurality of substrate processing systems. Figures 27 through 29 illustrate a return path for a substrate in a substrate processing system, respectively. [Main component symbol description] 30 Ware 40 Return device 42 Guide rail 50 Connection line 1000 Substrate processing system 1200 Process facilities 1200a First facility 1200b Second facility 1209 Process facilities 1220 Loading 埠 1220a First loading 埠 1220b Second loading 埠

S 157792.doc -39- 201212151 1240 Transfer Module 1240a First Transfer Module 1240b Second Transfer Module 1242 Transfer Robot 1244 Hand 1246 Rail 1250 Housing 1251 Top Surface 1252 Bottom Surface 1253 First Side 1253b First Side Wall 1254 Second Side 1255 third side 1255a third side wall 1255b third side wall 1256 fourth side 1257 opening 1258 door 1260 processing module 1260a first processing module 1260b second processing module 1262 load lock chamber 1262a load lock chamber 1262b load lock chamber 157792 .doc -40- 201212151 1264 Transfer Room 1266 Process Room 1268 Transfer Robot 1269 Hand 1400 Buffer Station 1401 Buffer Station 1402 Buffer Station 1403 Buffer Station 1404 Buffer Station 1420 Housing 1421 Housing 1422 Housing 1423 Housing 1423a Body 1423b Wind Box 1423c Combination plate 1424 Housing 1424a First body 1424b Second body 1424c Combination plate 1440 Buffer member 1441 Combination plate 1442 Body 1442a First cushioning member 157792.doc -41 - 201212151 1442b Second cushioning member 1444 Cushion 1444a Plate 1444b Board 1445 Punch pad 1453 first side wall 1454 second side wall 1455 third side wall 1456 fourth side wall 1460 buffer drive part 1461 rail 1462 base 1480 return part 1481 rail 1482 transfer robot 1483 hand 1700a part 1700b part 1800a first service space 1800b second Service Space 2000 Substrate Processing System 2200 Process Facilities 2240 Transfer Module 2400 Buffer Station - 42- 157792.doc 201212151 3000 Substrate Processing System 3200 Process Facilities 3201 Process Facilities 3220 Loading 埠 3240 Transfer Module 3262 First Processing Module 3264苐二处理核组3400 Buffer station 4000 Substrate processing system 4201 Process facility 4202 Process facility 4203 Process facility 4204 Process facility 4240 Transfer module 4244 Transfer module 4261 Processing module 4261a Load lock chamber 4261b Polygon transfer chamber 4261c Process chamber 4262 Processing module 4262a Load lock chamber 4262b Transfer chamber 4262c Process chamber 4263 Process module 5 157792.doc -43- 201212151 4263a Load lock chamber 4263b Transfer chamber 4263c Process chamber 4264 Processing module 4264b Polygon transfer 4264c Process Room 4400 Buffer Station 5000 Substrate Processing System 5200 Process Facilities 5201 Process Facilities 5220 Loading 240 5240 Transfer Module 5260 Processing Module 5400 Buffer Station 6000 Substrate Processing System 6201 Process Facilities 6202 Process Facilities 6220 Loading 埠 6240 Transfer Module 6260 Processing Module 6400 Buffer Station 7000 Substrate Processing System 7200 Process Facility 7201 Process Facilities 157792.doc -44- 201212151 7220 Loader 7240 Transfer Module 7260 Process Module 7400 Buffer Station 7800 Process Processor 7820 Rotation Parts 8000 Substrate Processing System 8200 Process Facilities 8201 Process Facilities 8240 Transfer Module 8400 Buffer Station 8401 Buffer Station 8800 Process Processing Unit 9000 Substrate Processing System 9200 Process Facilities 9201 Process Facilities 9220 Loading 埠 9240 Transfer Module 9400 Buffer Table Station 9800 Process Processing Device 9801 Process Processing Device 10000 Substrate Processing System 10200 Process Facilities 10220 Loading 埠 157792.doc -45- 201212151 10240 Transmission Module 10400 Buffer Station 10800 Process Processing Device 10820 Rotation 11000 Substrate Processing System 11201 Process Facilities 11202 Process Facilities 11241 Transfer Module 11242 Transfer Module 11261 Process Module 11262 Process Module 11400 Buffer Station 11401 Buffer Station 11420 Housing 11423 First Side 11424 Second Side 11425 Third Side 11426 Fourth side 11440 Buffer parts 12000 Substrate processing system 12200 Process facilities 12220 Loading 241 12241 Transfer module 12242 Transfer module 157792.doc -46- 201212151 12254 Second side wall 12256 Fourth side wall 12400 Buffer station 13000 Substrate processing System 13200 Process Facilities 13240 Transfer Module 13253 First Side Wall 13255 Third Side Wall 13260 Process Module 13400 Buffer Station 14000 Substrate Processing System 14201 First Process Facility 14202 Second Process Facility 14203 Third Process Facility 14221 Load 埠 14223 Loading cassette 14261 first processing module 14262 second processing module 14263 third processing module 14266 processing chamber 14271 first transfer robot 14272 second transfer robot 14273 third transfer robot 14401 first buffer station -47- 157792.doc 201212151 144 02 Second buffer station 15000 Substrate processing system 15201 First process facility 15202 Second process facility 15203 Third process facility 15221 Loading port 15223 Loading port 15261 First processing module 15262 Second processing module 15263 Third processing mode Group 15271 first transfer robot 15272 second transfer robot 15273 third transfer robot 15401 first buffer station 15402 second buffer station 16000 substrate processing system 16201 first process facility 16202 second process facility 16203 third process facility 16204 Fourth Process Facility 16221 Loading 埠16224 Loading 埠16261 First Processing Module 16262 Second Processing Module-48- 157792.doc 201212151 16263 Third Processing Module 16264 弟四处理核组16266 Process Room 16267 Process Room 16271 A transfer robot 16272 a second transfer robot 16273 a third transfer robot 16274 a fourth transfer robot 16401 a first buffer station 16402 a second buffer station 16403 a third buffer station 157792.doc -49-

Claims (1)

201212151 VII. Patent application scope: 1. A substrate processing system, comprising: a first transfer module comprising a first transfer robot; a second transfer module comprising a second transfer robot; a buffer station disposed between the first transmission module and the second transmission module; a first processing module combined with the first transmission module, wherein the first processing module is disposed And a first processing module, wherein the first processing module, the first buffer station, and the second transmitting module extend one of the imaginary lines a second transmission module, wherein the second processing module is disposed on a second side of the imaginary line, wherein the first transmission module protrudes from the first side of the imaginary line than the second transmission module Farther away. 2. The substrate processing system of claim 1 further comprising: a second transfer module comprising a third transfer robot, wherein the second transfer module is associated with the second transfer module The first transfer module is disposed opposite to each other; a second buffer station is disposed between the second transfer module and the third transfer module; and a third processing module is disposed on the imaginary line And being combined with the third transmission module on one side, wherein the third transmission module protrudes farther from the first side of the connection line than the second transmission module. 157792.doc 5 201212151 3. The substrate processing system of claim 2, wherein the second transfer module protrudes more than the first transfer module and the third transfer module toward the second side of the imaginary line far. 4. The substrate processing system of claim 3, wherein the first transfer module protrudes farther from the first side of the imaginary line than the first buffer station, and wherein the first transfer module More than the first buffer station, the second buffer station 'the first transmission module and the third transmission module protrude further toward the second side of the imaginary line" 5. As claimed in claim 4 a substrate processing system, wherein the first transfer module protrudes toward the second side of the imaginary line - a distance equal to a distance from the first transfer module to the first buffer station and the second buffer station And wherein the distance from the second transmitting module to the first side of the imaginary line is equal to a distance from the second transmitting mode to the first buffer station and the second buffer station. 6. The substrate processing system of claim 2, further comprising: at least one first loading cassette located on the second side of the imaginary line, wherein the first loading cassette and the first transmitting module Combining and including a substrate - a vessel is placed on the first loading cassette; to; a #3 loading magazine on the second side of the imaginary line - wherein the third loading system is The third transfer module is combined, and the -H dish comprising the substrate is placed on the third loading cassette; the female is placed facing the first loading cassette and the loading cassette and the bow guide is The movement of one of the substrates is transmitted to the first two loading cassettes. The substrate processing system of claim 6, further comprising: And a second carrier coupled to the second transfer module and comprising a substrate disposed on the second loading cassette; and a second rail disposed to face the second loading cassette and guiding the substrate to be included - a movement of the vessel to the transport device of the second loading cassette. 8. The substrate processing system of claim 2, wherein one of the second processing modules has a width greater than a width of the second transport module . 9. The substrate processing system of claim 8, wherein the first transfer module, the second transfer module, and the third transfer module have the same size and an identical shape, and wherein the first processing mode The group, the second processing module and the third processing module have the same size and an identical shape. 10. The base village processing system of claim 2, wherein a width of one of the second processing modules is greater than a width of the second transfer module, a width of the first buffer station, and the second buffer station The sum of one width is large. S 157792.doc