JP2012043985A - Apparatus for examining support structure for semiconductor wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for examining a support structure for a semiconductor wafer which can effectively examine the support structure for the semiconductor wafer and shortens a time required for examination.SOLUTION: In the apparatus for examining the support structure in which a support member 20 interfering to the circumferential part of the semiconductor wafer is provided on a base plate 10 bigger than the semiconductor wafer, a slider 12 which can be moved toward and away from the circumferential part of the semiconductor wafer is arranged on the base plate 10. The support member 20 consists of a first support member 21 holding a circumferential rear part of the semiconductor wafer; a second support member 30 supporting both sides of the circumferential part of the semiconductor wafer; and a third support member 32 holding a circumferential front part of the semiconductor wafer. A displacement detector 40 for detecting a reciprocation amount of the slider 12 is arranged on either the base plate 10 or the slider 12, and a load detector 41 for the semiconductor wafer held by the first and third supporting member 21 and 32 is arranged on the slider 12.

Description

  The present invention relates to a semiconductor wafer support structure examination apparatus used when examining a support structure of a substrate storage container or the like for housing a semiconductor wafer.

  The semiconductor wafer W is stored in the substrate storage container 1 in consideration of safety, contamination resistance, and the like. As shown in FIGS. 5 and 6, the substrate storage container 1 moves a plurality of semiconductor wafers W up and down. And a detachable lid 4 that opens and closes the front of the container body 2 and is used for storage, transportation, transportation, etc. of the semiconductor wafer W (Patent Document 1). 2).

  The container body 2 is formed into a front open box having a front opening using a molding material containing a predetermined resin, and a rear retainer that can interfere with the rear edge of the semiconductor wafer W is formed on the inner surface of the rear wall. A pair of left and right support pieces 3 that horizontally support both sides of the periphery of the semiconductor wafer W are provided on the inner surfaces of the both side walls, and the pair of support pieces 3 are arranged at predetermined intervals in the vertical direction. Yes.

  The lid body 4 is configured to have a substantially rectangular front surface that is tightly fitted to the open front surface of the container body 2 via a seal gasket, and a front retainer 5 is mounted on the back surface so as to face the front edge of the stored semiconductor wafer W. The front retainer 5 is integrally formed with a plurality of flexible elastic pieces 6 that sandwich the front edge of the semiconductor wafer W with V-grooves.

  In such a substrate storage container 1, a semiconductor wafer W is horizontally inserted into and supported by a container body 2 via a support piece 3, and a lid body 4 is press-fitted into the front surface of the container body 2 by a lid body opening / closing device. Thus, the semiconductor wafer W is accommodated. At this time, when the lid 4 is fitted on the front surface of the container body 2 and the elastic piece 6 of the front retainer 5 is pressed against the front edge of the semiconductor wafer W via the V-groove, While being in pressure contact with the inner surface, it is gradually raised by being guided by the inclined surface of the V-groove, slightly lifted from the pair of support pieces 3, and a load is applied to the rear side walls of the container body 2 and the V-groove of the elastic piece 6. Supported in a bent state.

  With such a support structure, generation of particles accompanying sliding contact between the semiconductor wafer W and the support piece 3 can be prevented, and contamination of the semiconductor wafer W by particles can be effectively prevented.

JP 2010-141222 A JP 2009-283537 A

  By the way, because the support structure of the semiconductor wafer W is configured as described above, the front retainer 5 and the like of the lid body 4 are not simply formed, and various studies are desired. That is, in the front retainer 5, the elastic piece 6 is bent while the front edge of the semiconductor wafer W slides up and down on the inclined surface of the V groove or the front edge of the semiconductor wafer W contacts the valley of the V groove. Therefore, the molding material, the shape of the V-groove, and the like are examined in consideration of the characteristics of the semiconductor wafer W sliding up and down, the holding force related to the semiconductor wafer W, the amount of bending of the semiconductor wafer W at the valley position of the V-groove, etc. There is a need.

  For example, polycarbonate (PC) is a resin that is excellent in dimensional stability, heat resistance, impact resistance, and the like, and is not easily deformed. However, since it has a characteristic of being easily damaged, it may not be suitable for forming the front retainer 5 in which the front edge of the semiconductor wafer W is in sliding contact with the V-groove. About this point, the support piece 3 of the container main body 2 which contacts the peripheral side part of the semiconductor wafer W is also the same.

  Conventionally, when such an examination is performed, there is no dedicated device, so the development designer simply uses or modifies the existing substrate storage container 1 and researches it with reference to past experiences. It was. Therefore, there is a big problem that the efficiency is very poor and it takes a long time to examine the support structure.

  The present invention has been made in view of the above, and an object of the present invention is to provide a semiconductor wafer support structure examination apparatus capable of efficiently examining a semiconductor wafer support structure and reducing the time required for the examination.

In the present invention, in order to solve the above-mentioned problem, an apparatus provided with a support tool that interferes with the peripheral edge of a semiconductor wafer on a base plate larger than the semiconductor wafer,
Attach a slider that can move forward and backward to the front edge of the semiconductor wafer,
A support tool is attached to the base plate, a first support tool that sandwiches the rear edge of the semiconductor wafer, a second support tool that is attached to the base plate to support the peripheral edge of the semiconductor wafer, and is attached to the slider. And a third support tool sandwiching the front edge of the periphery of the semiconductor wafer,
A displacement detector that detects the amount of forward / backward movement of the slider is attached to either the base plate or the slider.
A load detector for a semiconductor wafer sandwiched between first and third support tools of the support tool is attached to the slider.

The base plate and the slider are each provided with a guide groove along the peripheral edge of the semiconductor wafer, and a plurality of fixing holes for the support tool are arranged at intervals in the longitudinal direction in the vicinity of each guide groove. The first and second support tools of the support tool can be slidably fitted into the groove, and the third support tool of the support tool can be slidably fitted into the guide groove of the slider.
Further, the base plate can be provided with an upright stopper pin that contacts the peripheral portion of the semiconductor wafer and is centered, and a plurality of grip handles can be attached to the peripheral portion of the base plate.

Also, a plurality of guide grooves can be provided on the base plate, and the plurality of guide grooves can be provided along the peripheral edge of a plurality of types of semiconductor wafers having different diameters.
In addition, the sandwiching portions that sandwich the semiconductor wafers of the first and third support tools can be formed in a substantially V-shaped cross section, respectively, and the bottom surface can be subjected to embossing with the valley of each sandwiching portion as a boundary.
In addition, the peripheral structure of the base plate is supported by a plurality of upright guide bars for drop test so that it can be moved up and down. Can also be tested.

  Here, the semiconductor wafer in the claims includes at least φ200, 300, 450 mm silicon wafers and the like. Moreover, the 1st, 2nd, 3rd support tool of a support tool does not ask | require especially a single plural. There are various types of displacement detectors, such as an eddy current type, an optical type, and a contact type, but there is no particular limitation. Furthermore, although there exist types, such as a compression type | mold and a tension type | mold, a load detector can use any as long as it can detect the load added to a semiconductor wafer.

  According to the present invention, when it is desired to examine the support structure of the semiconductor wafer, the semiconductor wafer is supported by the second support tool and the slider is advanced toward the front edge of the periphery of the semiconductor wafer. Then, the amount of advancement of the slider is detected by the displacement detector, the third support tool contacts the front edge of the semiconductor wafer, the rear edge of the semiconductor wafer contacts the first support tool, and slides up. The semiconductor wafer is sandwiched and held by the third support tool, and the semiconductor wafer floats from the second support tool. At this time, the load acting on the semiconductor wafer is detected by a load detector.

  When the semiconductor wafer is held between the first and third support tools, the slider is retracted from the front edge of the semiconductor wafer. Then, the semiconductor wafer rattles and tilts, and the semiconductor wafer falls while the peripheral rear portion contacts the first support tool, and the semiconductor wafer is supported by the second support tool. When the semiconductor wafer is supported by the second support tool, the above operation may be repeated a plurality of times. By performing such examination work, it is possible to evaluate the load of sliding up and down of the semiconductor wafer and determine the characteristics of each molding material.

  According to the present invention, there is an effect that the support structure of the semiconductor wafer can be efficiently examined and the time required for the study can be shortened.

According to the second aspect of the present invention, the first, second, and third support tools are slid along the guide grooves as necessary, and these are positioned and fixed at arbitrary positions to support the support structure. It is possible to facilitate the examination.
Further, according to the invention described in claim 3, not only the examination of one type of semiconductor wafer but also other types of semiconductor wafers having different sizes can be examined, and the examination can be facilitated. it can.

  Furthermore, according to the invention described in claim 4, the peripheral edge of the semiconductor wafer is brought into contact with the inclined lower surface of the clamping portion in the first and third support devices, and the semiconductor wafer is smoothly moved up and down without causing a primary stop or the like. It becomes possible to move.

It is a plane explanatory view showing typically an embodiment of a semiconductor wafer support structure examination device concerning the present invention. It is a perspective explanatory view showing typically an embodiment of a semiconductor wafer support structure examination device concerning the present invention. It is a plane explanatory view showing typically the base board in the embodiment of the semiconductor wafer support structure examination device concerning the present invention. It is side surface explanatory drawing of FIG. It is a disassembled perspective view which shows a board | substrate storage container typically. It is sectional explanatory drawing which shows typically the support structure of a substrate storage container.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. A semiconductor wafer support structure examination apparatus according to the present embodiment has a base plate 10 larger than a semiconductor wafer W, as shown in FIGS. The apparatus is provided with a support tool 20 that interferes with the peripheral edge of the semiconductor wafer W. The slider 12 is arranged on the base plate 10 so that the support tool 20 can move forward and backward with respect to the front edge of the semiconductor wafer W. A displacement detector 40 for the slider 12 is installed on one of the base plate 10 and the slider 12 as the first, second, and third support tools 21, 30, and 32. A load detector 41 for the semiconductor wafer W sandwiched between the three support tools 21 and 32 is installed.

  As shown in FIGS. 5 and 6, the semiconductor wafer W is made of a silicon wafer having a diameter of, for example, φ300 or 450 mm, and faces the region excluding the front portion 11 of the base plate 10 via the support tool 20.

  As shown in FIGS. 1 to 4, the base plate 10 is formed into a substantially polygonal flat plate using a predetermined material made of, for example, wood or metal, and the surface of the front portion 11 (the right side in FIG. 1). In addition, a slider 12 that slides horizontally in the rear direction (left side in FIG. 1) is disposed, and an operating handle 13 connected to the slider 12 is installed to be able to rise and fall, and the operating handle 13 rotates in the vertical direction. By being operated, the slider 12 moves forward and backward with respect to the front edge of the semiconductor wafer W.

  Guide grooves 14 along the peripheral edge of the semiconductor wafer W are respectively drilled in the region excluding the front portion 11 of the base plate 10 and the slider 12, and the support tool 20 is fixed in the longitudinal direction in the vicinity of each guide groove 14. A plurality of screw holes 15 are arranged at intervals. The guide groove 14 of the base plate 10 has a plurality of arc grooves located near the rear portion of the base plate 10 and a plurality of arc grooves located near both side portions of the base plate 10 arranged in a substantially plane C shape at intervals. Is formed.

  The guide grooves 14 of the base plate 10 are divided into a plurality of inner and outer pairs at intervals and correspond to the peripheral portions of a plurality of types of semiconductor wafers W having different diameters. Specifically, the inner guide groove 14A corresponds to the peripheral edge portion of the φ300 mm semiconductor wafer W, and the outer guide groove 14B corresponds to the peripheral edge portion of the φ450 mm semiconductor wafer W.

  Note that a plurality of stopper pins 16 (see FIG. 1) that center and come into contact with the peripheral edge of the semiconductor wafer W are detachably erected on the surface of the base plate 10. A circular through-hole 17 (see FIG. 3) surrounded by the inner guide groove 14 is selectively perforated from the viewpoint of weight reduction, and the left and right sides of the base plate 10 are omitted from the viewpoint of convenience of transportation. U-shaped gripping handles 18 (see FIGS. 3 and 4) are screwed respectively.

  As shown in FIG. 1 and FIG. 2, the slider 12 is formed of an elongated flat plate having a substantially polygonal shape extending in the direction of the left and right sides of the base plate 10 (the vertical direction in FIG. 1). Equivalent to. A pair of left and right arc grooves are perforated on the slider 12 at intervals, and the pair of left and right arc grooves define a guide groove 14 and correspond to the front edge of the semiconductor wafer W.

  As shown in FIGS. 1 and 2, the support tool 20 is inserted into the guide groove 14 of the base plate 10 so that the position can be adjusted, and a plurality of first support tools 21 that sandwich the peripheral rear portion of the semiconductor wafer W, and a base A plurality of second support tools 30 that can be inserted into the guide groove 14 of the plate 10 so as to be position-adjustable and can support both sides of the periphery of the semiconductor wafer W, and a semiconductor that is inserted into the guide groove 14 of the slider 12 so that the position can be adjusted. And a plurality of third support tools 32 that sandwich the front edge of the wafer W.

  The first support 21 includes a flat slide block 22 slidably fitted in the guide groove 14 of the base plate 10, and a substantially L-shaped mounting block 23 is rotatably supported on the slide block 22. A resin-made sandwiching block 24 that sandwiches the rear edge of the periphery of the semiconductor wafer W is detachably screwed to the vertical surface of the mounting block 23. A plurality of screw holes 25 facing the fixed screw holes 15 of the base plate 10 are formed side by side on the lower peripheral edge of the slide block 22, and screw tools that pass through the screw holes 25 are screwed into the fixed screw holes 15. Thus, the first support tool 21 is positioned and fixed.

  The sandwiching block 24 is formed of a resin for examination to be used for the support structure of the semiconductor wafer W, and a sandwiching portion 26 that sandwiches the rear end of the periphery of the semiconductor wafer W is formed in a concave shape in a substantially V-shaped cross section. The sloping upper surface 28 with the deep valley 27 as a boundary is polished and the sloping lower surface 29 is subjected to a smooth texture. The resin for study is not particularly limited, but examples thereof include thermoplastic resins such as cycloolefin polymer, polyether imide, polyether ketone, polybutylene terephthalate, polyether ether ketone, and liquid crystal polymer, and alloys thereof. It is done.

  A conductive agent such as carbon black, carbon fiber, carbon nanotube, metal fiber, metal oxide, and conductive polymer, and various antistatic agents such as anion, cation, and nonionic are selectively added to the resin. It is also possible to add benzotriazole-based, salicylate-based, cyanoacrylate-based, oxalic acid anilide-based, hindered amine-based UV absorbers, or glass fibers or carbon fibers that improve rigidity.

  The second support tool 30 includes a flat slide block 22 that is slidably fitted in the guide groove 14 of the base plate 10, and a flat mounting block 23 is pivotally supported on the slide block 22. On the mounting block 23, a resin support block 31 that supports the peripheral side portion of the back surface of the semiconductor wafer W from below is detachably screwed. A plurality of screw holes 25 facing the fixed screw holes 15 of the base plate 10 are drilled in the slide block 22, and a screw tool penetrating each screw hole 25 is screwed into the fixed screw hole 15, so that the second The support tool 30 is positioned and fixed.

  The support block 31 conforms to the support piece 3 of the existing container main body 2 and is formed of a resin for examination to be used for the support structure of the semiconductor wafer W. The support block 31 is slippery on the surface in point contact with the back surface of the semiconductor wafer W. The graining process is applied. The resin for studying the support block 31 is the same as that for the holding block 24.

  The third support tool 32 includes a mounting block 23 that is slidably fitted into the guide groove 14 of the slider 12. The third support tool 32 is made of resin that sandwiches the front edge of the semiconductor wafer W between the vertical surfaces of the mounting block 23. The clamping block 24 is detachably screwed. A plurality of screw holes 25 facing the fixed screw holes 15 of the slider 12 are drilled in the mounting block 23, and a screw tool penetrating each screw hole 25 is screwed into the fixed screw hole 15, thereby providing a third The support tool 32 is positioned and fixed.

  As in the case of the first support tool 21, the holding block 24 is formed of a resin desired to be used for the support structure of the semiconductor wafer W, and the holding portion 26 that holds the front edge of the semiconductor wafer W is recessed in a substantially V-shaped cross section. The slanted upper surface 28 with the deep valley 27 of the sandwiching portion 26 as a boundary is polished, and the slanted lower surface 29 is subjected to a smooth texture.

  As shown in FIG. 1, the displacement detector 40 includes a laser displacement meter that receives a laser beam (for example, a semiconductor laser) irradiated from a light emitting element by a light receiving element, and is installed on the front surface of the base plate 10. Thus, the slider 12 is opposed to the rear portion of the slider 12 with an interval, and is connected to a measuring instrument such as an oscilloscope (not shown). Such a displacement detector 40 functions to detect the advance / retreat amount (mm) of the slider 12 with high accuracy by receiving at least part of the laser beam applied to the slider 12 as reflected light.

  As shown in FIG. 1, the load detector 41 is composed of, for example, a strain gauge type load cell that converts the magnitude of the load into an electric signal, and is installed near the center of the surface of the slider 12 and is measured by an oscilloscope (not shown). It is connected to the vessel and functions to detect the load (N) acting on the semiconductor wafer W sandwiched between the first and third support tools 21 and 32 with high accuracy.

  In the above configuration, when it is desired to examine the support structure of the semiconductor wafer W, first, the sandwiching block 24 and the support block 31 formed on the plurality of first, second, and third support tools 21, 30, and 32 for examination. The first, second and third support tools 21, 30 and 32 are appropriately slid and positioned and fixed, and the plurality of second support tools 30 are horizontally supported by the semiconductor wafer W. After confirming whether the supporting state is appropriate or not, the operation handle 13 is rotated upward to gradually advance the slider 12 toward the front edge of the semiconductor wafer W.

  At this time, if necessary, the first, second, and third support devices 21, 30, and 32 are slid so as to correspond to the locations of the rear retainer of the container body 2, the support piece 3, and the front retainer 5 of the lid body 4. Can be positioned and fixed.

  When the slider 12 is advanced to the front edge of the semiconductor wafer W, the advance amount (distance) of the slider 12 is detected by the displacement detector 40 and displayed on the measuring instrument, and a third support is provided on the front edge of the semiconductor wafer W. The trough 27 of the clamping part 26 in the tool 32 is contact-fitted, and the rear edge of the periphery of the semiconductor wafer W comes into contact with the smooth inclined lower surface 29 of the clamping part 26 in the first support tool 21 and gradually slides up. The semiconductor wafer W is sandwiched while being bent in the valleys 27 of the sandwiching portions 26 in the third support tools 21 and 32, and the semiconductor wafer W slightly floats from each second support tool 30.

  At this time, a load acts on the semiconductor wafer W in the same manner as when supported by the substrate storage container 1. This load is detected with high accuracy by the load detector 41 in contact with the semiconductor wafer W and displayed on the measuring instrument.

  After the semiconductor wafer W is clamped between the first and third support tools 21 and 32, the display of the measuring instrument is confirmed or recorded, and then the operating handle 13 is rotated downward to move the slider 12 to the semiconductor wafer. It is gradually retracted from the front edge of W to the original position.

  Then, the semiconductor wafer W is tilted back and forth, and the rear edge of the semiconductor wafer W falls while sliding on the clamping portion 26 of the first support tool 21, so that the semiconductor wafer W falls on the plurality of second support tools 30. W is supported, and the load acting on the semiconductor wafer W is approximately 0 gf. When the semiconductor wafer W is supported by the second support tool 30, the above operation may be repeated a plurality of times.

  If such examination work is carried out, the load of sliding up and down of the semiconductor wafer W is accurately evaluated, the characteristics of the sliding up and down of the semiconductor wafer W, the holding force with respect to the semiconductor wafer W, the valley of the V groove The amount of deflection of the semiconductor wafer W at the 27 position is determined as a characteristic for each molding material, and a new support structure for the semiconductor wafer W is developed, and the rear retainer, the support piece 3 and the front retainer 5 of the container body 2 are greatly modified. Can contribute.

  According to the above configuration, since the dedicated structure imitating the support structure of the substrate storage container 1 is studied with respect to the support structure of the semiconductor wafer W, an efficient study can be expected greatly, and the period required for the review is greatly increased. It can be shortened. Further, since the plurality of guide grooves 14 of the base plate 10 are made to correspond to the peripheral portions of a plurality of types of semiconductor wafers W having different diameters, not only the examination of the φ300 mm semiconductor wafer W but also the examination of the φ450 mm semiconductor wafer W is possible. It can be used, and convenience of examination work can be aimed at.

  In the above embodiment, the load acting on the semiconductor wafer W is detected and examined. However, the present invention is not limited to this. For example, a support structure examination apparatus in which the four corners of the base plate 10 are inserted in a plurality of upright guide bars for drop tests so as to be movable up and down and the semiconductor wafer W is sandwiched between the first and third support tools 21 and 32 is predetermined. The drop impact of the semiconductor wafer W may be reproduced by dropping from the height of the semiconductor wafer W, and the drop characteristics of the semiconductor wafer W may be tested. Further, although the displacement detector 40 is installed on the base plate 10, the displacement detector 40 may be installed on the slider 12 as long as the distance of forward / backward movement of the slider 12 can be detected. Furthermore, the first and third support tools 21 and 32 can be configured to swing vertically.

  The semiconductor wafer support structure examination apparatus according to the present invention can be used in the field of examining a semiconductor wafer support structure.

DESCRIPTION OF SYMBOLS 1 Substrate storage container 2 Container body 3 Supporting piece 4 Lid 5 Front retainer 10 Base plate 11 Front part 12 Slider 14 Guide groove 14A Inner guide groove 14B Outer guide groove 15 Fixed screw hole (fixed hole)
20 support tool 21 first support tool 22 slide block 23 mounting block 24 clamping block 25 screw hole 26 clamping part 27 valley 28 inclined upper surface 29 inclined lower surface 30 second support tool 32 third support tool 40 displacement detector 41 load Detector W Semiconductor wafer

Claims (4)

A semiconductor wafer support structure examination apparatus provided with a support tool that interferes with the peripheral edge of a semiconductor wafer on a base plate larger than the semiconductor wafer,
Attach a slider that can move forward and backward to the front edge of the semiconductor wafer,
A support tool is attached to the base plate, a first support tool that sandwiches the rear edge of the semiconductor wafer, a second support tool that is attached to the base plate to support the peripheral edge of the semiconductor wafer, and is attached to the slider. And a third support tool sandwiching the front edge of the periphery of the semiconductor wafer,
A displacement detector that detects the amount of forward / backward movement of the slider is attached to either the base plate or the slider.
A semiconductor wafer support structure examination apparatus, wherein a load detector for a semiconductor wafer sandwiched between first and third support tools of a support tool is attached to a slider.   The base plate and the slider are each provided with a guide groove along the peripheral edge of the semiconductor wafer, and a plurality of fixing holes for the support tool are arranged at intervals in the longitudinal direction in the vicinity of each guide groove. 2. The semiconductor wafer support according to claim 1, wherein the first and second support tools of the support tool are slidably fitted, and the third support tool of the support tool is slidably fitted in the guide groove of the slider. Structure review device.   3. The semiconductor wafer support structure examination apparatus according to claim 2, wherein a plurality of guide grooves are provided on the base plate, and the plurality of guide grooves are arranged along the peripheral edges of a plurality of types of semiconductor wafers having different diameters.   The first and third support devices, each of which has a sandwiched portion holding the semiconductor wafer, is formed in a substantially V-shaped cross section, and the lower surface of the inclined surface with the valley of each sandwiched portion as a boundary is subjected to a graining process. 3. The semiconductor wafer support structure examination apparatus according to 3.

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