JP2012043839A - Degate device and resin molding apparatus equipped with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a degate device which can separate unnecessary resin connecting to both sides of a package.SOLUTION: For a molding 18 mounted on a degate pallet 27, a first unnecessary resin 18 is separated by a cutting blade 44d during a first up-down motion of a degate hand 28, and then a second unnecessary resin 18a is separated by a combination of a second up-down motion and a rotation of the degate pallet 27 about the rotary shaft 31 thereof.

Description

  The present invention relates to a degate device that separates first and second unnecessary resins that are connected to both sides of a package portion of a resin-molded molded product, and a resin mold device that includes the degate device.

  For example, in a resin molding machine using transfer molding, etc., the molded product molded by the press device is taken out by an unloader, etc., and transferred to the delegation part, and only the molded product from which unnecessary resin such as molded product cal is separated is stored. It is designed to be stored in the part.

  Explaining the delegation method of the delegation part, for example, when a lead frame is used as a molded product, the molded product cull present at the center part of the molded product placed on the pair of left and right delegate pallets is sandwiched vertically A method is known in which a delegate pallet is rotated by a push rod or the like around a rotation shaft provided in the vicinity of a molded product cull so as to be V-shaped to perform degate and separate unnecessary resin ( Patent Document 1). Alternatively, there is a method of delegation by pushing unnecessary resin filled in a hole drilled in the lead frame with a pin or the like from the opposite side.

  Further, when a resin substrate is used, unnecessary resin is forcibly bent while the package portion is pressed by a pressing member, and the unnecessary resin is separated and removed by a separation portion formed on the end surface of the substrate with a thin resin thickness. A method has also been proposed (Patent Document 2).

JP-A-3-290218 JP 2006-269486 A

  However, for example, in a product in which a plurality of semiconductor chips are mounted on a substrate and are collectively resin-sealed with respect to a substrate that is a product to be molded, the area of the package portion is widely formed, and a sealing resin is placed on the substrate. There are cases where the overflow area cannot be secured. In general, an air vent is provided on the opposite side of the mold cavity connected from the mold mold pot insert (mold cull) through the mold runner gate, and the sealing resin is provided in the outer region of the substrate where the air vent is provided. There is a molded product that is resin-molded by overflowing. That is, the molded product includes the first and second unnecessary resins connected to both sides of the package portion.

  In this case, in the conventional delegation method, the first and second unnecessary resins connected to both sides of the package portion of the molded product cannot be separated at the same position, and the first unnecessary resin and the second unnecessary resin are processed. Therefore, it is necessary to perform the degate separately, and the installation area increases, the degate mechanism becomes complicated and large, and the manufacturing cost also increases.

  SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art and provide a degate device capable of efficiently separating unnecessary resin connected to both sides of a package part and a resin mold device provided with the same and capable of being installed compactly. .

In order to achieve the above object, the present invention comprises the following arrangement.
A delegation device for separating the first and second unnecessary resins connected to both sides of a package part of a molded part molded with a resin, provided on both sides of a cull receiving part for receiving the molded part cull, and placing the molded article A pair of delegate pallets that are pivotally supported around a rotation shaft while maintaining the horizontal posture by supporting the free end side of the delegate pallet, and the pair of digs A cull pressing part that presses the molded product cull supported by the cull receiving part on a delegate hand body that is vertically movable facing the gate pallet, and a substrate portion of the molded product on both sides of the cull pressing part And a cutting means for cutting the first unnecessary resin connected to the side opposite to the molded product cull of the package part. Characterized by comprising a de, a.

  Further, the detent hand is supported by the pallet supporting means that presses the molded product cul against the cull receiving portion by the cull pressing portion and is in contact with the free end side of each delegate pallet from the back surface side. The first unnecessary resin is cut by the cutting means by moving downward.

  Further, after separating the first unnecessary resin, the delegate hand is moved up and down to press the molded product cull against the cull receiving portion by the cull pressing portion, and the substrate portion is delegated by the pair of substrate pressing portions. The second pallet is connected to the molded product cull by rotating the gate pallet so that the free end descends around the rotation axis by removing the support of the pallet pallet by the pallet support means while being held in place. The resin is separated.

  In addition, the substrate pressing part includes a pressing plate that is supported by a fulcrum plate that is pivotally supported around the fulcrum shaft with respect to the delegate hand body, and a pressing block that presses the substrate part against the delegation pallet. Are supported so as to be slidable, and each presser plate is relative to the fulcrum plate following the rotational movement of the fulcrum plate about the fulcrum axis as the delegation pallet rotates. It is characterized by sliding.

  In the resin molding apparatus, a supply unit for placing a molded product on which a semiconductor element is mounted on a substrate facing the pot, and the molded product supplied to the supply stage are carried by a loader and resin molded. A depressing unit that separates the first and second unnecessary resins connected to both sides of the package unit by the above-described degate device from the molded product taken out from the press unit by an unloader; , And a storage unit that stores only the product from which the second unnecessary resin is separated.

  If the above degait device is used, the first unnecessary resin is separated by the cutting means by the first vertical movement of the delegate hand from the molded product placed on the delegate pallet, and the second vertical movement and the delegate pallet. The second unnecessary resin can be separated by a combination with the rotation operation around the rotation axis. Therefore, the first and second unnecessary resins connected to both sides of the package part can be separated efficiently only by repeating the up and down movement of the delegate hand, and at the same position without moving the molded product with a simple configuration. Can remove unnecessary resin at a plurality of locations.

  Further, the molded product cull is pressed against the cull receiving portion by the cull pressing portion, and the substrate is held by the substrate pressing portion while being supported in the horizontal direction by the pallet supporting means that comes into contact with the free end side of each delegate pallet from the back side. The first unnecessary resin connected to the side opposite to the molded product cull of the package part is cut by the cutting means while holding the part. Therefore, it is possible to reliably separate the first unnecessary resin while positioning the molded product on the delegate pallet supported in the horizontal direction.

  In addition, after separating the first unnecessary resin, the detent pallet is unsupported by the pallet supporting means while the molded product cull is pressed against the cull receiving portion by the cull pressing portion and the substrate portion is pressed by the substrate pressing portion. As a result, the second unnecessary resin connected to the molded product cull is cut by rotating each delegate pallet so that the free end descends about the rotation axis. Therefore, it is possible to concentrate the bending stress on the connection portion between the package portion and the second unnecessary resin and to separate them by simply removing the support of each delegate pallet by the pallet support means and lowering the free end side of the delegate pallet. .

  Further, the presser plates slide relative to each other following the rotating operation of the fulcrum plate rotating about the fulcrum axis as the delegating palette rotates. As a result, the difference between the rotation amount of the delegate pallet about the rotation axis and the rotation amount of the fulcrum plate rotating about the fulcrum shaft is absorbed by the pressing plate sliding relative to the fulcrum plate. Therefore, the presser plate slides with respect to the fulcrum plate following the rotation of the delegation pallet, so that the position of the presser block that presses the substrate portion is not displaced, and the molded product is prevented from being damaged. it can.

  Moreover, in the resin mold apparatus provided with the above-mentioned degate apparatus, a degate apparatus can be installed compactly and the molding quality of a molded product can be maintained.

It is a plane layout figure which shows the example of whole structure of the resin mold apparatus. It is front explanatory drawing of the degate apparatus of the state which pinched | interposed the molded product cull. It is front explanatory drawing of the degate apparatus of the state which cut | disconnected 1st unnecessary resin. It is front explanatory drawing of the delegation apparatus of the state which the delegate hand raised. It is front explanatory drawing of the degate apparatus of the state which lowered the support cylinder and cut | disconnected 2nd unnecessary resin. It is a top view by the side of the delegate pallet of a degate device. It is explanatory drawing which shows operation | movement of the support cylinder which supports a delegate pallet. It is explanatory drawing which shows operation | movement of the cull receptacle part accompanying raising / lowering of a delegate hand. It is the molded product top view and right side view of an upper molded product cull and an upper package part. FIG. 10 is an explanatory diagram of a state in which a first unnecessary resin and a second unnecessary resin are separated from the molded product of FIG. 9. It is the molded product top view and left side view of a lower molded product cull and a lower package part. It is state explanatory drawing which isolate | separates 1st unnecessary resin and 2nd unnecessary resin from the molded article of FIG.

  Hereinafter, a preferred embodiment of a resin mold device according to the present invention will be described in detail with reference to the accompanying drawings. In the following embodiments, description will be made using a transfer molding apparatus using a mold die in which a cavity recess is formed on the upper mold side and a pot is formed on the lower mold side. In the transfer molding apparatus, the lower mold is described as a movable mold, and the upper mold is described as a fixed mold.

(Overall configuration of resin molding equipment)
FIG. 1 shows a planar arrangement of each part of an embodiment of a resin molding apparatus according to the present invention. The resin mold apparatus of the present embodiment includes a molded product supply unit A, a molded product thickness measuring unit B, a molded product press unit C, a molded product storage unit D and a transport mechanism E after resin molding. Prepare. Further, a preheating part F is provided between the thickness measurement part B and the press part C. The configuration of each part will be specifically described below.

(Molded product supply section A)
The supply part A for the molded product includes a supply stocker 3 provided with a plurality of supply magazines 2 containing the molded product 1 formed in a strip shape, a pusher 4 for projecting the molded product 1 from the supply magazine 2, and a pusher 4 And a turntable 5 for rearranging the moldings 1 that are projected by the above. On the back side of the turntable 5, a supply stage (set stand) 6 for setting a pair of molded articles 1 arranged facing each other in a state of holding the mutual arrangement position is arranged. On the side of the supply stage 6, there is provided a resin tablet supply unit 8 for supplying the resin tablet 7 in accordance with a planar arrangement of a pot of a mold to be described later.

  In the resin molding apparatus of the present embodiment, as the molded product 1 that is the object of resin molding, for example, a plurality of semiconductor chips are mounted on a resin substrate formed in a strip shape. The semiconductor chip may be mounted on the substrate in one or more stages. The semiconductor chip is resin-molded for each cavity formed in block units. Alternatively, it may be a product in which a plurality of semiconductor chips are accommodated in one cavity and resin-molded, or a product that is resin-molded by being accommodated in a cavity formed individually according to the semiconductor chip. The molded product 18 will be described. A pair of two is molded with resin, and package portions 18a are formed at a plurality of locations in the longitudinal direction of the substrate 18e. A second unnecessary resin 18c connected to the molded product cull 18b and a first unnecessary resin 18d connected to the opposite side are integrally formed on both sides of the package portion 18a (see FIG. 9).

(Thickness measurement part B)
The thickness measuring unit B of the molded product 1 measures the thickness of the molded product 1 while being conveyed from the supply unit A to the press unit C. Specifically, a transport plate 9 that transports the molded product 1 from the loader 24 while being transferred, and an XY scanning mechanism (not shown) that can scan the transport plate 9 in the XY direction. A measuring device 11 is provided below the conveying path of the conveying plate 9 so as to correspond to the product 1 and measures the total thickness of the substrate including the semiconductor chip and the thickness of only the substrate.

(Preheat part F)
The molded product 1 in which the thickness of the molded product 1 is measured in the thickness measuring unit B is supported in the transfer unit 12 by the pick-and-place 12a, which will be described later, from the transport plate 9 to the transport mechanism. Is transferred to the heater block 13. The heater block 13 is transferred from the receiving position to the delivery position to the loader 24 by a transfer mechanism which will be described later while the molding 1 is placed. The heater block 13 is preheated intensively by stopping for a predetermined time by the tunnel cover 14 provided in the middle of the transfer path, and is transported to the delivery position where the loader 24 stands by. The tunnel cover 14 is provided at a position adjacent to the measuring device 11.

(Press part C)
The press part C is provided with a press device 15 to which a mold die for clamping the molded product 1 and resin molding is mounted. The press device 15 includes a press mechanism that pushes the lower mold in the mold opening / closing direction, and a transfer mechanism that fills the cavity with resin melted in the pot of the mold. The press mechanism and transfer mechanism in the press apparatus 15 are the same as the mechanism of the press part used in the well-known resin mold apparatus. The resin mold apparatus according to the present embodiment is characterized by the fact that when the molded product 1 is resin-molded, the upper mold cavity insert (cavity) The amount of movement of the insert block (which defines the depth) is controlled. For example, the pressing device 15 is a film driving mechanism 16 that pushes an upper insert member in the mold opening / closing direction, and a long release film that covers the clamp surface of the cavity insert, and a film that repeats feeding and winding between reels. A supply mechanism 17 is provided. In the mold, the cavity may be formed in the lower mold.

  The release film is sucked and held on the upper mold surface by a known suction mechanism using a gap between the insert blocks. The release film has heat resistance that can withstand the heating temperature of the mold, is easily peeled off from the mold surface, and has flexibility and extensibility, such as PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidin chloride and the like are preferably used. For example, a long film material is used as the release film, and the release film is provided so as to be drawn out from a supply reel wound up in a roll shape, passed through the upper clamp surface, and wound up onto the take-up reel.

(Degate part G)
The molded product 18 taken out from the press part C to the take-out part 19 by the unloader 25 is transferred to the delegation device 20. The degate device 20 separates the first and second unnecessary resins 18d and 18c connected to both sides of the package portion 18a of the molded product 18, respectively. Specifically, the degate device 20 separates the second unnecessary resin 18c connected to the molded product cull 18b across the package part 18a and the first unnecessary resin 18d connected to the opposite side of the package part 18a (FIG. 6). reference).

(Molded product storage D)
The molded product storage section D includes a storage magazine 22 for storing the product 21 from which unnecessary resin has been removed by the delegate section G. The product 21 is stored in a storage magazine 22, and the storage magazine 22 is sequentially stored in a storage stocker 23.

(Transport mechanism E)
The transport mechanism E includes a loader 24 that transports the molded product 1 to the press unit C and an unloader 25 that transports the molded product from the press unit C. The loader 24 and the unloader 25 move by using a guide rail 26 connected between the supply unit A, the thickness measurement unit B, the preheating unit F, the press unit C, and the storage unit D arranged in series. It is provided so as to be able to move forward and backward with respect to part C. The loader 24 receives the substrate 1 and the resin tablet 7 which are the molded product 1 from the supply unit A, delivers the molded product 1 to the transport plate 9, receives the molded product 1 preheated by the heater block 13, and receives them. The operation of carrying into the mold mold of the press part C opened is repeated. Further, the unloader 25 repeats the operation of receiving the molded product 18 released after the resin molding from the mold and transferring it to the take-out unit 19 of the storage unit D.

  Therefore, the apparatus configuration can be changed without changing the transport mechanism E by connecting the guide rail 26 even if the units constituting the resin molding apparatus are changed. For example, the example shown in FIG. 1 is an example in which one press device 15 is installed, but it is also possible to configure a resin molding device in which a plurality of press units C and thickness measuring units B are connected.

(Specific configuration example of the degate device 20)
Here, a specific configuration example of the degate device 20 will be described with reference to FIGS. In FIG. 2, the delegation device 20 includes a pair of left and right delegation pallets 27 on which the molded product 18 is placed, and a delegation hand 28 provided so as to be movable up and down.

  In FIG. 6, the delegate pallet 27 is provided adjacent to both sides of the cull receiving portion 30 supported so as to partition the central portion in the frame body 29 along the longitudinal direction. Each delegate pallet 27 rotates around a rotation shaft 31 provided on the short side portion 29a of the frame body 29 adjacent to the cull receiving portion 30 on both sides in the longitudinal direction (rotates in both forward and reverse directions). It is assembled as possible. Further, the frame body 29 has two pallet stoppers 32 on the long side portion 29b of the frame body 29 which are in contact with the upper surfaces of the free end sides of the pair of delegate pallets 27 and restrict the upward rotation. Is provided.

  Further, as shown in FIG. 7, on the opposite surface (back surface) side of the free end side of the delegate pallet 27, support cylinders 33 (pallet support means) are provided so as to be able to move downward while supporting both ends in the longitudinal direction. . As shown in the right half of FIG. 7, the delegate pallet 27 is sandwiched between the pallet stopper 32 with the support cylinder 33 moved upward so that the free end of the pivot pallet 31 is in the horizontal direction. It is supported.

In FIG. 7, the cull receiving portion 30 is supported by a support base 35 fixed to a support plate 34 supported by a frame body 29 (short side portion 29a). Pallet support springs 36 are provided at a plurality of locations in the longitudinal direction of the delegation pallet 27 between the support plate 34 and the delegation pallet 27 facing each other.
As shown in the left half of FIG. 7, the pallet support spring 36 is configured such that when the support cylinder 33 is moved downward and the support of the delegate pallet 27 is removed, the delegate pallet 27 is centered on the rotation shaft 31. It is provided to receive the load by being compressed when the free end rotates in the downward direction. A pallet stopper adjusting screw 27 a for adjusting the abutting position of the delegate pallet 27 against the pallet stopper 32 is provided at the free end of the delegate pallet 27.

  In FIG. 8, the support plate 34 is supported by the frame body 29 and constantly urges the cull receiving portion 30 downward via a support spring 37. The cull receiving portion 30 moves up against the compression spring 37 when the support mechanism 38 moves up. A load when the molded product cull 18b is pressed and pinched by the cull pressing portion 40 by the delegate hand 28 is received. The support mechanism 38 supports the cull receiving portion 30 by a vertical movement cylinder 39 so as to be movable up and down.

  In FIG. 2, the delegation hand 28 is supported by a delegation hand main body 28 a suspended from a cull pressing portion 40 and a pair of substrate pressing portions 41 on both sides thereof. The cull pressing portion 40 is disposed at the center of the delegate hand main body 28a so as to face the cull receiving portion 30, and presses the molded product cull 18b against the opposing cull receiving portion 30 as will be described later. The cull presser 40 is suspended and supported by a suspension rod 40a that vertically penetrates the delegate hand body 28a. A stopper 40b is provided at the upper end of the hanging rod 40a, and a spacer 40c is provided coaxially at the lower end side. The cull pressing portion 40 is supported by being suspended so that the lower end position is defined by the stopper 40b and the upper end position is defined by the spacer 40c.

  The substrate pressing portion 41 presses a substrate portion (substrate 18e; see FIG. 9) other than the package portion 18a of the molded product 18 placed on the opposing delegation pallet 27. In the substrate pressing portion 41, the substrate pressing portion main body 41b is suspended and supported by a hanging rod 41a penetrating vertically through the delegate hand main body 28a. A suspension spring 41c is provided between the upper end of the suspension rod 41a and the delegate hand main body 28a, and urges the suspension rod 41a upward.

  A fulcrum plate 42 is assembled to the substrate pressing portion main body 41b so as to be rotatable about a fulcrum shaft 42a. A linear motion guide 42 b is provided on the lower surface side of the fulcrum plate 42. The linear motion guide 42b supports a holding plate 43 provided with a guide rail 43a. As will be described later, the presser plate 43 slides relative to the fulcrum plate 42 following the rotation of the fulcrum plate 42 about the fulcrum shaft 42 a as the pallet pallet 27 rotates. The fulcrum plate 42 is provided with a regulation spring 42 c that regulates the sliding of the pressing plate 43.

Further, on the lower surface of the pressing plate 43, a second pressing block 44a that holds the substrate 18e corresponding to the boundary portion between the package portion 18a and the second unnecessary resin 18c, and a boundary portion between the package portion 18a and the first unnecessary resin 18d. A first pressing block 44b for pressing the substrate 18e corresponding to the above is provided. The first pressing block 44b is suspended and supported by the pressing plate 43 via a pressing spring 44c, and is disposed so as to protrude downward from the second pressing block 44a. Further, a cutting blade 44d (cutting means) is fixed to the outer surface portion of the pressing plate 43 outside the first pressing block 44b. The lower end of the cutting blade 44d is assembled so as to be above the lower end of the first pressing block 44b. The cutting blade 44d cuts the first unnecessary resin 18d connected to the package part 18a.
The delegate hand 28 is configured such that the delegate hand main body 28a moves up and down by a vertically moving cylinder (not shown).

Next, an example of the degate operation of the degate device 20 configured as described above will be described with reference to FIGS.
In FIG. 2, it is lifted through a support mechanism 38 that supports the cull receiving portion 30 (see FIG. 8), and the support cylinder 33 is moved upward to support the lower surface of the pair of delegate pallets 27 on the free end side. It abuts against the pallet stopper 32 and is supported in the horizontal direction. In this state, the molded product 18 is placed on the delegate pallet 27. Then, the delegate hand 28 is moved down, and the molded product cull 18 b is first sandwiched between the cull receiving unit 30 and fixed by the cull pressing unit 40.

  In FIG. 3, when the above-mentioned delegate hand 28 is further moved downward, the first pressing block 44b presses the substrate 18e corresponding to the boundary between the package portion 18a and the first unnecessary resin 18d and further moves the hand 28 further downward. Accordingly, the cutting blade 44d cuts the first unnecessary resin 44d from the package portion 18a. At this time, the pushing amount when the delegate hand 28 moves downward with the molded product cull 18b being sandwiched is absorbed by the cull receiving spring (not shown) and the support spring 37 (see FIGS. 7 and 8).

  Next, in FIG. 4, after the first unnecessary resin 18d is separated, the one-end delegation hand 28 is raised. At this time, the first pressing block 44b rises to a position away from the substrate 18e, but the molded product kull 18b remains pressed against the cull receiving unit 30 by the cull pressing unit 40.

  Next, in FIG. 5, the delegation hand 28 is lowered again, and first, the substrate 18e is pressed by the first pressing block 44b, and further, the second pressing block 44a corresponds to the boundary portion between the package portion 18a and the first unnecessary resin 18c. The substrate 18e to be pressed is pressed. At this time, the pressing spring 44c absorbs the increased pressing force of the first pressing block 44b.

  Next, the support cylinder 33 is retracted, and the support of each delegate pallet 27 is removed. At this time, the delegate pallet 27 rotates downward on the free end side about the rotation shaft 31. At this time, the delegate pallet 27 is supported by being inclined in a letter C shape in a state where the pallet support spring 36 provided on the support plate 34 is compressed (see FIG. 7).

  Further, the presser plates 43 (second presser block 44a and first presser block 44b) move relative to each other by following the rotating operation in which the fulcrum plate 42 rotates about the fulcrum shaft 42a in accordance with the rotating operation of each delegation pallet 27. Slide. As a result, the difference between the rotation amount of the delegate pallet 27 around the rotation shaft 31 and the rotation amount of the fulcrum plate 42 rotating around the fulcrum shaft 42 a is pressed against the support plate 43 relative to the fulcrum plate 42. To absorb.

  As a result, the delegate pallet 27 rotates while the substrate 18e corresponding to the boundary portion between the package portion 18a and the second unnecessary resin 18c is held without being displaced by the second holding block 44a, so the package portion 18a and the second unnecessary resin are not required. Bending stress concentrates on the connecting portion of the resin 18c, and the second unnecessary resin 18c is separated.

  Finally, the support cylinder 33 is moved up to return the delegate pallet 27 to the horizontal state, and the delegate hand 28 is raised. Further, by raising a cylinder (not shown) that has pressed the stopper 40b from above, the support mechanism 38 is further raised, and the cull receiving portion 30 is raised while sandwiching the molded product cull 18b, so that the cull holding portion 40 is raised. It is adsorbed by a suction pad (not shown) incorporated in the inside. When the stopper 40b further rises, the cull pressing portion 40 rises away from the cull receiving portion 30 while adsorbing the molded product cull.

  The product 21 from which the unnecessary resin placed on the delegate pallet 27 is removed moves sideways, is transferred to the storage portion D by transfer means such as a pickup or a transfer table (not shown), and is stored in the storage magazine 22. . Further, in the delegation device 20 after the delegate pallet 27 has moved, when the suction of the cull pressing portion 40 that adsorbs the molded product cull 18b is released, the molded product cull 18b is dropped as it is and is put into a scrap box.

Next, an example of the resin molding operation will be described with reference to FIG.
The molded product 1 placed on the supply stage 6 so as to face the pot is held by a loader 24, and then transferred to a transfer plate 9 holding a resin tablet 7 supplied from a resin tablet supply unit 8, The molded product 1 is transferred to the transport plate 9.
When the transport plate 9 passes through the measuring device 11 by an XY scanning mechanism (not shown), the total thickness of the semiconductor chip area of the molded product 1 and the thickness of the substrate area of each molded product 1 are measured. The result of the thickness measurement is transferred to the control unit 50, and the control unit 50 operates the mold drive mechanism 16 according to the measurement result to adjust the movement amount (cavity depth) of the cavity insert.

After the thickness is measured, the transport plate 9 is held by a pick and place provided in the transfer unit 12 and transferred to the heater block 13. The pre-heating of the article 1 placed on the heater block 13 is started, and when the heater block 13 stops in the tunnel cover 14 provided at the preheating position R, it is preheated intensively. Thereafter, the heater block 13 is transported by the heater block 13 to the delivery position Q where the loader 24 stands by.
When the loader 24 receives the pre-molded product 1 from the heater block 13 and moves along the guide rail 26 to the press part C, the product 1 and the resin tablet 7 are transferred to the mold by a known advance / retreat mechanism. It is brought in.

  When the product 1 and the resin tablet 7 are carried into a mold, they are heated by a heater (not shown). After the loader 24 is withdrawn from the press device 15, the molded product 1 is clamped by a mold, and the resin is molded by filling the cavity with resin. In this resin molding operation, resin molding is performed with the cavity capacity adjusted by driving the mold driving mechanism 16 in advance by the control unit 50 based on the thickness measurement result of the molded article 1 previously measured. The

  After the resin molding, the unloader 25 enters the press device 15, picks up the molded product 18, takes out the molded product 18 from the press device 15, and transfers the molded product 18 to the take-out unit 19. The molded product 18 is conveyed from the take-out unit 19 to the delegation device 20, the second unnecessary resin 18 c and the first unnecessary resin 18 d are removed from the molded product 18, and the products 21 from which all unnecessary resins have been removed are sequentially stored in the storage magazine 22. Stored.

With reference to FIG. 9 thru | or FIG. 12, the form of the molded article 18 containing unnecessary resin is demonstrated. It is assumed that a resin substrate 18e is used for the molded product 18.
FIGS. 9A and 9B are explanatory views of the molded product 18 by the mold for the upper cavity. The package portion 18a is formed on the upper portion of the resin substrate 18e, and unnecessary resins (molded product cull 18b, second unnecessary resin 18c, and first unnecessary resin 18d) are all formed on the upper portion (upper mold side) of the resin substrate 18e.

  10A, 10B, and 10C show the molded product 18 after resin molding, the cutting operation of the first unnecessary resin 18d from the package portion 18a by the cutting blade 44d, and the second unnecessary resin 18c due to the rotation of the delegate pallet 27. This shows the cutting operation.

  11 (a) and 11 (b) are explanatory views of a molded product 18 using a mold for a lower cavity lower cavity. The package portion 18a is formed below the resin substrate 18e, and unnecessary resins (molded product cull 18b, second unnecessary resin 18c, and first unnecessary resin 18d) are all formed below the resin substrate 18e (lower mold side).

  12A, 12B, and 12C show the molded product 18 after resin molding, the cutting operation of the first unnecessary resin 18d from the package portion 18a by the cutting blade 44d, and the second unnecessary resin 18c by the rotation of the delegate pallet 27. This shows the cutting operation.

  As described above, if the above-described degate device is used, the second unnecessary resin 18c connected to the molded product cull 18b and the first unnecessary connected to the opposite side of the package part 18a only by repeating the vertical movement by the delegation hand 28. The resin 18d can be efficiently separated, and the molded product 18 can be digged at the same position without moving, so the digging portion G can be installed compactly.

  In addition, the first unnecessary resin 18d can be reliably separated while the molded product 18 is positioned on the delegate pallet 27 supported in the horizontal direction. Further, by simply removing the support of each delegate pallet 27 by the support cylinder 33 and simply rotating it so that the free end side of the delegate pallet 27 is lowered, stress is applied to the connection portion between the package portion 18a and the second unnecessary resin 18c. The second unnecessary resin 18c can be separated by concentrating. In consideration of the positioning accuracy of the molded product 18, it is preferable to first remove the first unnecessary resin 18d that does not involve the rotating operation of the delegate pallet 27 and then remove the second unnecessary resin 18c that involves the rotating operation.

  Further, the pressing plate 43 slides relative to the fulcrum plate 42 by detecting the difference between the rotation amount of the delegate pallet 27 around the rotation shaft 31 and the rotation amount of the fulcrum plate 42 rotating around the fulcrum shaft 42a. Therefore, the first and second pressing blocks 44b and 44a that have pressed the molded product 18 by the sliding of the pressing plate 43 with respect to the fulcrum plate 42 following the rotational movement of the delegate pallet 27 are displaced. This prevents the molded product 18 from being damaged.

  Moreover, in the resin mold apparatus provided with the above-mentioned degate apparatus, a degate apparatus can be installed compactly and the molding quality of a molded product can be maintained.

In addition, although the resin mold apparatus mentioned above illustrated about the apparatus which can recombine the supply part A, the thickness measurement part B, the press part C, and the storage part D which shared the conveyance mechanism E, these are well-known that these were assembled | attached integrally. It is also possible to apply to the resin molding apparatus.
The resin molding apparatus is not limited to the transfer molding apparatus, and may be a compression molding apparatus.

A supply section B thickness measurement section C press section D storage section E transport mechanism F preheating section G delegation section Q delivery position R preheating position 1 product 2 supply magazine 3 supply stocker 4 pusher 5 turntable 6 supply stage 7 resin tablet DESCRIPTION OF SYMBOLS 8 Resin tablet supply part 9 Conveyance plate 11 Measuring apparatus 12 Transfer part 13 Heater block 14 Tunnel cover 15 Press apparatus 16 Mold drive mechanism 17 Film supply mechanism 18 Molded product 18a Package part 18b Molded product cal 18c 2nd unnecessary resin 18d 1st 1 Unnecessary resin 18e Substrate 19 Unloading unit 20 Degate device 21 Product 22 Storage magazine 23 Storage stocker 24 Loader 25 Unloader 26 Guide rail 27 Digate pallet 27a Pallet stopper adjusting screw 28 Digger Toe 29 Frame 29a Short side portion 29b Long side portion 30 Cull receiving portion 31 Rotating shaft 32 Pallet stopper 33 Support cylinder 34 Support plate 35 Support base 36 Pallet support spring 37 Support spring 38 Support mechanism 39 Vertical motion cylinder 40 Cull presser 40a, 41a Suspension rod 40b Stopper 40c Spacer 41 Substrate pressing part 41b Substrate pressing part main body 41c Hanging spring 42 Support point plate 42a Support point shaft 42b Direct acting guide 42c Restriction spring 43 Pressing plate 43a Guide rail 44a Second pressing block 44b First Holding block 44c Pressing spring 44d Cutting blade 50 Control unit

Claims (5)

A degate device for separating the first and second unnecessary resins connected to both sides of a package part of a molded part molded with a resin,
A pair of delegate pallets provided on both sides of the cull receiving portion for receiving the molded product cull and pivotally supported around the rotation axis while the molded product is placed;
Pallet support means for maintaining a horizontal posture by supporting the free end side of the delegate pallet;
A cull pressing portion that presses a molded product cull supported by the cull receiving portion on a delegate hand body that is provided to be movable up and down facing the pair of delegate pallets, and the molding is performed on both sides of the cull pressing portion. A detent hand comprising: a substrate pressing portion that holds the substrate portion of the product into the delegation pallet; and a cutting means for cutting the first unnecessary resin connected to the opposite side of the molded portion of the package portion. A degate device characterized by that.   The delegate hand holds the molded product cull against the cull receiving portion by the cull holding portion and is supported in the horizontal direction by the pallet supporting means that comes into contact with the free end side of each delegate pallet from the back side. 2. The degate device according to claim 1, wherein the first unnecessary resin is cut down by the cutting means.   After separating the first unnecessary resin, the delegate hand is moved up and down to press the molded product cull against the cull receiving portion by the cull holding portion, and the substrate is pressed to the delegate pallet by the pair of substrate holding portions. The second unnecessary resin connected to the molded product cull is separated by rotating the delegate pallet so that the free end descends about the rotation axis by removing the support of each delegate pallet by the pallet support means. The degate device according to claim 1 or 2, wherein:   The substrate pressing portion includes a supporting plate that is pivotally supported about the fulcrum shaft with respect to the delegate hand body, and a pressing plate that includes a pressing block that presses the substrate portion against the delegate pallet. Each holding plate is slidably supported, and each presser plate slides relative to the fulcrum plate following the rotation operation in which the fulcrum plate rotates about the fulcrum shaft as the delegation pallet rotates. The degate device according to any one of claims 1 to 3. A supply unit for arranging a molding object on which a semiconductor element is mounted on a substrate to face the pot;
A press part in which the molding product supplied to the supply stage is carried by a loader and resin molded,
5. A degate part in which first and second unnecessary resins connected to both sides of the package part are separated from the molded product taken out from the press part by an unloader by the degate device according to any one of claims 1 to 4. ,
A resin molding apparatus comprising: a storage unit that stores only a product from which the first and second unnecessary resins are separated by the degate unit.

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