JP2012023120A5 - - Google Patents

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Publication number
JP2012023120A5
JP2012023120A5 JP2010158502A JP2010158502A JP2012023120A5 JP 2012023120 A5 JP2012023120 A5 JP 2012023120A5 JP 2010158502 A JP2010158502 A JP 2010158502A JP 2010158502 A JP2010158502 A JP 2010158502A JP 2012023120 A5 JP2012023120 A5 JP 2012023120A5
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JP
Japan
Prior art keywords
probe card
probe
holding
chuck
wafer
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Application number
JP2010158502A
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English (en)
Japanese (ja)
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JP5564347B2 (ja
JP2012023120A (ja
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Priority to JP2010158502A priority Critical patent/JP5564347B2/ja
Priority claimed from JP2010158502A external-priority patent/JP5564347B2/ja
Publication of JP2012023120A publication Critical patent/JP2012023120A/ja
Publication of JP2012023120A5 publication Critical patent/JP2012023120A5/ja
Application granted granted Critical
Publication of JP5564347B2 publication Critical patent/JP5564347B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010158502A 2010-07-13 2010-07-13 プローブ装置 Expired - Fee Related JP5564347B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010158502A JP5564347B2 (ja) 2010-07-13 2010-07-13 プローブ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010158502A JP5564347B2 (ja) 2010-07-13 2010-07-13 プローブ装置

Publications (3)

Publication Number Publication Date
JP2012023120A JP2012023120A (ja) 2012-02-02
JP2012023120A5 true JP2012023120A5 (https=) 2013-07-25
JP5564347B2 JP5564347B2 (ja) 2014-07-30

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ID=45777164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010158502A Expired - Fee Related JP5564347B2 (ja) 2010-07-13 2010-07-13 プローブ装置

Country Status (1)

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JP (1) JP5564347B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6418118B2 (ja) 2015-09-24 2018-11-07 三菱電機株式会社 半導体装置の評価装置及び評価方法
JP6406221B2 (ja) 2015-11-17 2018-10-17 三菱電機株式会社 半導体装置の評価装置及び評価方法
CN114441805B (zh) * 2020-11-06 2025-11-18 华邦电子股份有限公司 晶片检测装置
JP7426157B1 (ja) 2023-06-06 2024-02-01 ハイソル株式会社 加熱ステージおよび温度特性計測システム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000138268A (ja) * 1998-11-04 2000-05-16 Hitachi Chem Co Ltd 半導体回路の検査方法及び検査装置
JP2004266206A (ja) * 2003-03-04 2004-09-24 Nec Yamagata Ltd プローバ装置、プローブカードのプリヒート方法およびそのプログラム
JP2006278414A (ja) * 2005-03-28 2006-10-12 Seiko Epson Corp 半導体検査装置、半導体装置の検査方法、及び半導体装置の製造方法
JP2008300655A (ja) * 2007-05-31 2008-12-11 Fujitsu Microelectronics Ltd ウエハの試験装置及び試験方法
JP2009070874A (ja) * 2007-09-11 2009-04-02 Tokyo Electron Ltd 検査装置
JP5074878B2 (ja) * 2007-10-15 2012-11-14 東京エレクトロン株式会社 検査装置

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