JP5564347B2 - プローブ装置 - Google Patents

プローブ装置 Download PDF

Info

Publication number
JP5564347B2
JP5564347B2 JP2010158502A JP2010158502A JP5564347B2 JP 5564347 B2 JP5564347 B2 JP 5564347B2 JP 2010158502 A JP2010158502 A JP 2010158502A JP 2010158502 A JP2010158502 A JP 2010158502A JP 5564347 B2 JP5564347 B2 JP 5564347B2
Authority
JP
Japan
Prior art keywords
probe card
probe
semiconductor wafer
light source
halogen lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010158502A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012023120A5 (https=
JP2012023120A (ja
Inventor
親臣 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Electronic Materials Corp
Original Assignee
Japan Electronic Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Electronic Materials Corp filed Critical Japan Electronic Materials Corp
Priority to JP2010158502A priority Critical patent/JP5564347B2/ja
Publication of JP2012023120A publication Critical patent/JP2012023120A/ja
Publication of JP2012023120A5 publication Critical patent/JP2012023120A5/ja
Application granted granted Critical
Publication of JP5564347B2 publication Critical patent/JP5564347B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
JP2010158502A 2010-07-13 2010-07-13 プローブ装置 Expired - Fee Related JP5564347B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010158502A JP5564347B2 (ja) 2010-07-13 2010-07-13 プローブ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010158502A JP5564347B2 (ja) 2010-07-13 2010-07-13 プローブ装置

Publications (3)

Publication Number Publication Date
JP2012023120A JP2012023120A (ja) 2012-02-02
JP2012023120A5 JP2012023120A5 (https=) 2013-07-25
JP5564347B2 true JP5564347B2 (ja) 2014-07-30

Family

ID=45777164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010158502A Expired - Fee Related JP5564347B2 (ja) 2010-07-13 2010-07-13 プローブ装置

Country Status (1)

Country Link
JP (1) JP5564347B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6418118B2 (ja) 2015-09-24 2018-11-07 三菱電機株式会社 半導体装置の評価装置及び評価方法
JP6406221B2 (ja) 2015-11-17 2018-10-17 三菱電機株式会社 半導体装置の評価装置及び評価方法
CN114441805B (zh) * 2020-11-06 2025-11-18 华邦电子股份有限公司 晶片检测装置
JP7426157B1 (ja) 2023-06-06 2024-02-01 ハイソル株式会社 加熱ステージおよび温度特性計測システム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000138268A (ja) * 1998-11-04 2000-05-16 Hitachi Chem Co Ltd 半導体回路の検査方法及び検査装置
JP2004266206A (ja) * 2003-03-04 2004-09-24 Nec Yamagata Ltd プローバ装置、プローブカードのプリヒート方法およびそのプログラム
JP2006278414A (ja) * 2005-03-28 2006-10-12 Seiko Epson Corp 半導体検査装置、半導体装置の検査方法、及び半導体装置の製造方法
JP2008300655A (ja) * 2007-05-31 2008-12-11 Fujitsu Microelectronics Ltd ウエハの試験装置及び試験方法
JP2009070874A (ja) * 2007-09-11 2009-04-02 Tokyo Electron Ltd 検査装置
JP5074878B2 (ja) * 2007-10-15 2012-11-14 東京エレクトロン株式会社 検査装置

Also Published As

Publication number Publication date
JP2012023120A (ja) 2012-02-02

Similar Documents

Publication Publication Date Title
KR102387504B1 (ko) 검사 장치
EP3550313B1 (en) Electronic device inspecting apparatus
US8680880B2 (en) Method and apparatus for testing integrated circuit
US7492176B2 (en) Prober and probe contact method
JP5564347B2 (ja) プローブ装置
US8278965B2 (en) Inspection apparatus
US11525856B2 (en) Inspection apparatus and inspection method
JP5294954B2 (ja) プローブカードの製造方法
JP5552452B2 (ja) 加熱冷却試験方法および加熱冷却試験装置
WO2019225332A1 (ja) 検査装置及び温度制御方法
KR20090027179A (ko) 본딩 장치
KR20210072820A (ko) 검사 장치 및 검사 방법
JP2019075434A (ja) プローバ装置およびウェハチャック
JP5600520B2 (ja) プローブカード
JP2016099300A (ja) プローブカード、プローバー装置、及び、半導体装置の試験方法
KR102709683B1 (ko) 검사 장치 및 검사 방법
KR102858990B1 (ko) Led 척
JP4999775B2 (ja) プローバ
US20250076215A1 (en) Testing Apparatus and Testing Method
EP3940402B1 (en) Inspection apparatus
TW202120907A (zh) 具有加熱功能之光學檢測設備
JP2011007671A (ja) 試験装置
JP2014107483A (ja) Ｏｂｉｒｃｈ検査方法及びｏｂｉｒｃｈ装置
JP4474405B2 (ja) 試料検査装置及び試料検査方法
TW202318004A (zh) 電性檢測裝置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130606

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130606

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140117

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140121

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140317

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140610

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140616

R150 Certificate of patent or registration of utility model

Ref document number: 5564347

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees