JP2012007057A5 - - Google Patents
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- Publication number
- JP2012007057A5 JP2012007057A5 JP2010143357A JP2010143357A JP2012007057A5 JP 2012007057 A5 JP2012007057 A5 JP 2012007057A5 JP 2010143357 A JP2010143357 A JP 2010143357A JP 2010143357 A JP2010143357 A JP 2010143357A JP 2012007057 A5 JP2012007057 A5 JP 2012007057A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- formula
- mass
- component
- monovalent hydrocarbon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 16
- 229920001296 polysiloxane Polymers 0.000 claims description 15
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 11
- 125000000962 organic group Chemical group 0.000 claims description 9
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 125000002947 alkylene group Chemical group 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 125000005641 methacryl group Chemical group 0.000 claims description 3
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 3
- 239000011231 conductive filler Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 239000007859 condensation product Substances 0.000 claims 1
- 150000004756 silanes Chemical class 0.000 claims 1
- -1 trimethylsiloxy Chemical group 0.000 description 27
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 239000004205 dimethyl polysiloxane Substances 0.000 description 5
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 125000005370 alkoxysilyl group Chemical group 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- ZQXCQTAELHSNAT-UHFFFAOYSA-N 1-chloro-3-nitro-5-(trifluoromethyl)benzene Chemical compound [O-][N+](=O)C1=CC(Cl)=CC(C(F)(F)F)=C1 ZQXCQTAELHSNAT-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 239000006187 pill Substances 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 229920006163 vinyl copolymer Polymers 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010143357A JP5619487B2 (ja) | 2010-06-24 | 2010-06-24 | 熱伝導性シリコーングリース組成物 |
| PCT/JP2011/064336 WO2011162312A1 (en) | 2010-06-24 | 2011-06-16 | Thermally conductive silicone grease composition |
| CN2011800290988A CN102947430A (zh) | 2010-06-24 | 2011-06-16 | 导热性硅脂组合物 |
| US13/806,195 US8912132B2 (en) | 2010-06-24 | 2011-06-16 | Thermally conductive silicone grease composition |
| KR1020127032838A KR20130122524A (ko) | 2010-06-24 | 2011-06-16 | 열전도성 실리콘 그리스 조성물 |
| EP11730454.3A EP2585565A1 (en) | 2010-06-24 | 2011-06-16 | Thermally conductive silicone grease composition |
| TW100121704A TW201209099A (en) | 2010-06-24 | 2011-06-21 | Thermally conductive silicone grease composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010143357A JP5619487B2 (ja) | 2010-06-24 | 2010-06-24 | 熱伝導性シリコーングリース組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012007057A JP2012007057A (ja) | 2012-01-12 |
| JP2012007057A5 true JP2012007057A5 (https=) | 2013-08-01 |
| JP5619487B2 JP5619487B2 (ja) | 2014-11-05 |
Family
ID=44583600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010143357A Expired - Fee Related JP5619487B2 (ja) | 2010-06-24 | 2010-06-24 | 熱伝導性シリコーングリース組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8912132B2 (https=) |
| EP (1) | EP2585565A1 (https=) |
| JP (1) | JP5619487B2 (https=) |
| KR (1) | KR20130122524A (https=) |
| CN (1) | CN102947430A (https=) |
| TW (1) | TW201209099A (https=) |
| WO (1) | WO2011162312A1 (https=) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102034228B1 (ko) * | 2012-12-14 | 2019-10-18 | 엘지이노텍 주식회사 | 에폭시 수지 조성물, 이를 이용한 프리프레그 및 인쇄 회로 기판 |
| DE112014007281B4 (de) * | 2014-12-25 | 2022-07-07 | Sekisui Polymatech Co., Ltd. | Silikonzusammensetzung |
| KR102544343B1 (ko) * | 2015-05-22 | 2023-06-19 | 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 | 열전도성 조성물 |
| CN110088206B (zh) * | 2016-09-01 | 2021-08-20 | 陶氏东丽株式会社 | 固化性有机聚硅氧烷组合物以及电气电子零部件的保护剂或粘合剂组合物 |
| KR101864505B1 (ko) * | 2016-11-21 | 2018-06-29 | 주식회사 케이씨씨 | 방열성이 우수한 실리콘 조성물 |
| JP6841547B2 (ja) * | 2017-01-18 | 2021-03-10 | 出光興産株式会社 | グリース組成物及びその製造方法 |
| US20200181334A1 (en) * | 2017-08-10 | 2020-06-11 | Shin-Etsu Chemical Co., Ltd. | Organic silicon compound and curable thermal conductive silicone composition |
| CN111315825B (zh) * | 2017-11-09 | 2021-12-14 | 信越化学工业株式会社 | 导热性硅脂组合物 |
| JP7248217B2 (ja) | 2017-12-04 | 2023-03-29 | 積水ポリマテック株式会社 | 熱伝導性組成物 |
| US11781052B2 (en) | 2018-01-31 | 2023-10-10 | Sekisui Polymatech Co., Ltd. | Thermally conductive composition and thermally conductive molded body |
| US10968351B2 (en) * | 2018-03-22 | 2021-04-06 | Momentive Performance Materials Inc. | Thermal conducting silicone polymer composition |
| US10941251B2 (en) * | 2018-03-22 | 2021-03-09 | Momentive Performance Materials Inc. | Silicone polymer and composition comprising the same |
| JP6866877B2 (ja) * | 2018-05-31 | 2021-04-28 | 信越化学工業株式会社 | 低熱抵抗シリコーン組成物 |
| JP7073939B2 (ja) * | 2018-06-26 | 2022-05-24 | 住友金属鉱山株式会社 | 熱伝導性グリース |
| KR102693604B1 (ko) * | 2018-12-29 | 2024-08-12 | 다우 글로벌 테크놀로지스 엘엘씨 | MgO 충전제를 함유하는 열전도성 조성물 및 상기 조성물이 사용되는 방법 및 장치 |
| CN109909494B (zh) * | 2019-03-14 | 2021-05-04 | 昆山市中迪新材料技术有限公司 | 一种高导热粉体及其制备方法和应用 |
| EP4050070A4 (en) | 2019-10-24 | 2023-11-29 | Sekisui Chemical Co., Ltd. | Resin composition and heat dissipation member |
| CN115135710A (zh) * | 2020-03-26 | 2022-09-30 | Ddp特种电子材料美国有限责任公司 | 包含多模态分布的球形填料的热界面材料 |
| CN111334045A (zh) * | 2020-04-26 | 2020-06-26 | 苏州矽美科导热科技有限公司 | 一种单组分快速室温固化导热凝胶及其制作工艺 |
| KR20230029829A (ko) * | 2020-06-29 | 2023-03-03 | 다우 글로벌 테크놀로지스 엘엘씨 | 열 전도성 폴리우레탄 조성물 |
| CN114539780A (zh) * | 2020-11-24 | 2022-05-27 | 深圳先进电子材料国际创新研究院 | 一种单组份热界面材料及其制备方法 |
| JP7594419B2 (ja) * | 2020-12-01 | 2024-12-04 | イビデン株式会社 | 熱伝導性樹脂組成物、放熱構造体及び熱伝導性樹脂組成物の製造方法 |
| JP7047199B1 (ja) * | 2021-04-08 | 2022-04-04 | 富士高分子工業株式会社 | 熱伝導性グリース組成物 |
| TW202307187A (zh) * | 2021-07-08 | 2023-02-16 | 日商捷恩智股份有限公司 | 矽酮樹脂組成物 |
| US20250277112A1 (en) | 2021-11-05 | 2025-09-04 | Sekisui Polymatech Co., Ltd. | Thermally conductive composition and thermally conductive member |
| JP7621993B2 (ja) * | 2022-01-18 | 2025-01-27 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物および半導体装置 |
| JP7694417B2 (ja) * | 2022-02-10 | 2025-06-18 | 信越化学工業株式会社 | 熱伝導性組成物およびその硬化物 |
| JPWO2024089957A1 (https=) * | 2022-10-28 | 2024-05-02 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002092693A1 (en) * | 2001-05-14 | 2002-11-21 | Dow Corning Toray Silicone Co., Ltd. | Heat-conductive silicone composition |
| JP4646496B2 (ja) | 2003-02-13 | 2011-03-09 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーン組成物 |
| JP4112396B2 (ja) * | 2003-02-13 | 2008-07-02 | 電気化学工業株式会社 | 樹脂用充填材および用途 |
| JP4634891B2 (ja) | 2005-08-18 | 2011-02-16 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物およびその硬化物 |
| JP4933094B2 (ja) * | 2005-12-27 | 2012-05-16 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物 |
| TWI419931B (zh) | 2006-06-16 | 2013-12-21 | 信越化學工業股份有限公司 | 導熱聚矽氧潤滑脂組成物 |
| JP4495749B2 (ja) | 2006-06-16 | 2010-07-07 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物 |
| JP4514058B2 (ja) * | 2006-08-30 | 2010-07-28 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその硬化物 |
| JP2009138036A (ja) | 2007-12-04 | 2009-06-25 | Momentive Performance Materials Japan Kk | 熱伝導性シリコーングリース組成物 |
| JP5372388B2 (ja) | 2008-01-30 | 2013-12-18 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーングリース組成物 |
| JP5507059B2 (ja) * | 2008-05-27 | 2014-05-28 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーン組成物および電子装置 |
| CN101294067B (zh) * | 2008-06-20 | 2011-09-14 | 清华大学 | 一种导热硅脂组合物 |
| JP2010143357A (ja) | 2008-12-18 | 2010-07-01 | Yazaki Corp | ルーフコンソールの照明構造 |
-
2010
- 2010-06-24 JP JP2010143357A patent/JP5619487B2/ja not_active Expired - Fee Related
-
2011
- 2011-06-16 WO PCT/JP2011/064336 patent/WO2011162312A1/en not_active Ceased
- 2011-06-16 KR KR1020127032838A patent/KR20130122524A/ko not_active Withdrawn
- 2011-06-16 EP EP11730454.3A patent/EP2585565A1/en not_active Withdrawn
- 2011-06-16 US US13/806,195 patent/US8912132B2/en not_active Expired - Fee Related
- 2011-06-16 CN CN2011800290988A patent/CN102947430A/zh active Pending
- 2011-06-21 TW TW100121704A patent/TW201209099A/zh unknown
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