JP2012001780A - Copper alloy material for electric/electronic component, and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a copper alloy material for an electric/electronic component having high strength and high conductivity and capable of securing a uniform etching property even in half etching, and to provide a method of manufacturing the same.SOLUTION: There is provided the copper alloy material including a copper alloy containing either Fe or Co, or both of Fe and Co of 0.1-1.0 mass% in total, and containing 0.02-0.3 mass% of P, wherein a mass ratio (Fe+Co)/P of the total of Fe and Co to P is 3-10, and having a residual part constituted of Cu and unavoidable impurities, wherein the ratio of the number of crystallized products and deposits each having a particle size of ≥100 nm among crystallized products and deposits each having a particle size of ≥10 nm in the copper alloy is ≤1.0%.

Description

  The present invention relates to a copper alloy material suitably used as a material for electrical and electronic parts such as lead frames, connectors and terminals, and a method for producing the same, and in particular, has high strength and high conductivity, and excellent etching. The present invention relates to a copper alloy material for electric / electronic parts having a property and a method for producing the same.

  In recent years, semiconductor packages have been reduced in size and weight. A thin material is used for the lead frame, and accordingly, a material having high strength is required. In order to further reduce the thickness of the semiconductor package, a half etching technique for partially reducing the thickness of the lead frame by etching is widely used. When forming a lead frame by using this half-etching technique, it is important to use a material whose etching surface is easily dissolved uniformly.

  A Cu alloy material is used for the lead frame of the semiconductor package. As this copper alloy material, it is common to use a Cu-Fe-P alloy containing Fe and P (for example, refer to Patent Document 1).

  As an example of this Cu-Fe-P type alloy, for example, Fe: 2.1-2.6 mass%, P: 0.015-0.15 mass%, Zn: 0.05-0.2 mass% contained The copper alloy (C19400) is widely known as a standard alloy. This alloy has the advantage that the heat treatment causes precipitation of Fe or Fe-P compounds in the copper matrix, thereby simultaneously improving the conductivity, thermal conductivity and strength.

JP-A-3-29459

  As a general Cu—Fe—P alloy, the tensile strength is about 400 to 500 MPa. However, with the progress of thinning of the lead frame of the semiconductor package, it is considered that a material with higher strength is required for the lead frame. In order to reduce the thickness of the semiconductor package, when the lead frame is partially thinned by half-etching, if the lead frame material contains coarse crystals and precipitates, the etching surface will not dissolve. There was a problem of uniformity. Among conventional Cu—Fe—P alloys, those having a high Fe content are liable to produce coarse crystallized precipitates and precipitates of Fe, which is problematic in ensuring uniform etching properties.

  Accordingly, an object of the present invention is to provide a copper alloy material for electric / electronic parts that has high strength and high conductivity, and that can ensure uniform etching properties even during half-etching, and a method for producing the same. It is to provide.

  As a result of enthusiastic investigations to solve the above problems, the inventors of the present invention have found that the copper alloy material for electric / electronic parts according to claims 1 and 2 and the electric / electronic of invention according to claim 3 It has been found that it can be effectively achieved by a method for producing a copper alloy material for parts.

[1] The invention according to claim 1 contains either Fe or Co or both Fe and Co in a total amount of 0.1 to 1.0% by mass, and 0.02 to 0.3% by mass. A copper alloy comprising a total amount of Fe and Co and a mass ratio of P to Fe (Co + Co) / P of 3 to 10 and the balance of Cu and inevitable impurities, the grains contained in the copper alloy The ratio of the number of crystallized substances and precipitates having a particle diameter of 100 nm or more out of crystallized substances and precipitates having a diameter of 10 nm or more is 1.0% or less Providing copper alloy materials.

[2] The invention according to claim 2 contains either Fe or Co or both Fe and Co in a total amount of 0.1 to 1.0% by mass, and 0.02 to 0.3% by mass. The total mass of Fe and Co and the mass ratio of P to Fe (Fe + Co) / P is 3 to 10, and one or more components selected from Sn, Zn, Zr, Cr, and Ti are added. Is a copper alloy containing 0.03 to 1.0% by mass with the balance being Cu and inevitable impurities, and among the crystallized product and the precipitate having a particle size of 10 nm or more contained in the copper alloy, Provided is a copper alloy material for electric / electronic parts, wherein the ratio of the number of crystallized substances and precipitates having a particle diameter of 100 nm or more is 1.0% or less.

[3] The copper alloy material according to the above [1] or [2] is hot-rolled, cold-rolled with a workability of 20% or more in the steps after hot rolling, and 10 to 10 seconds at 400 to 470 ° C. Provided is a method for producing a copper alloy material for electric / electronic parts, wherein the combination with a heat treatment for heating for minutes is performed at least twice.

  The copper alloy material of the present invention has excellent strength as compared with conventional Cu-Fe-P alloys, and maintains good characteristics in terms of conductivity. In addition, a uniform etching surface can be obtained by not including coarse crystals and precipitates in the material.

It is a graph which shows the composition prescription | regulation of the copper alloy material for electrical / electronic components which concerns on the 1st Embodiment of this invention.

  Preferred embodiments of the present invention will be specifically described below with reference to the accompanying drawings.

[First Embodiment]
The copper alloy material for electric / electronic parts according to the first embodiment is suitably used as a material for a lead frame of a thin semiconductor package, for example.

(Main component of copper alloy)
The copper alloy according to the first embodiment contains 0.1 to 1.0% by mass of either Fe or Co, or both Fe and Co in total, and 0.02 to 0.02% of P. The base material is 0.3% by mass, the total ratio of Fe and Co to the mass ratio of P (Fe + Co) / P is 3 to 10, and the balance is Cu and inevitable impurities. With such a composition of the copper alloy, it becomes possible to promote the precipitation of the P compound efficiently with the addition amount of the alloy element smaller than that of the conventional C19400 alloy or the like.

  Fe and Co are added together with P to form a P compound and disperse and precipitate in the material, and have the function of improving strength while maintaining good electrical conductivity of the material. By defining the composition ratio of Fe, Co, and P in a specific range, the strength improvement by dispersion of precipitates can be effectively utilized while suppressing the amount of solid solution elements in Cu that lower the conductivity. In addition, a material having a favorable balance of conductivity and strength can be obtained.

  If the addition amount of P is less than 0.02% by mass, a sufficient amount of P compound cannot be formed, and satisfactory strength cannot be obtained. On the other hand, when P is added exceeding 0.3% by mass, cracking due to segregation of the P compound is likely to occur during casting or hot working. Therefore, the composition range of P is preferably specified to 0.02 to 0.3% by mass.

  In order to effectively form a compound with respect to the composition range of P and balance both high strength and high conductivity in a balanced manner, the composition range of Fe or Co is 0.1 to 1.0 mass in total. It is prescribed to be%. And it is necessary to prescribe | regulate so that the mass ratio (Fe + Co) / P of the sum total of Fe and Co and P may be 3-10.

  When the content of Fe and Co is below the lower limit of the composition range, the amount of P compound formed becomes insufficient and the strength is insufficient. On the other hand, when the content of Fe and Co exceeds the upper limit of the composition range, excess Fe and Co are dissolved in Cu to lower the conductivity, which is not preferable.

  When the total content of Fe and Co is less than three times the amount of P added, P becomes excessive during compound formation. When the total content of Fe and Co exceeds 10 times the addition amount of P, Fe and Co become excessive. Since such an excess component exists in the solid solution state in Cu, it will result in inhibiting electrical conductivity. Therefore, in order to reduce excess components, it is more desirable to select a range in which the total ratio of Fe and Co to the mass ratio of P (Fe + Co) / P is 3-6.

  Here, the numerical values of the main components of the copper alloy according to the first embodiment are summarized in Table 1 below.

  This copper alloy contains Fe and / or Co: 0.1 to 1.0 mass%, P: 0.02 to 0.3 mass%, and has a relationship of (Fe + Co) = (3 to 10) × P. . Here, referring to FIG. 1, a graph summarizing Table 1 is shown. In this graph, the content of P is set on the horizontal (X) axis, and the total content of Fe and Co is set on the vertical (Y) axis.

  Based on the graph shown in FIG. 1, the Fe and Co derived from the total minimum content of Fe and Co relative to the P content (hereinafter referred to as “Y (Fe + Co) 3 derived”), the Fe and Co derived from the P content. Derived from the total maximum content (hereinafter referred to as “Y (Fe + Co) 10 derived”), the total maximum content of Fe and Co (hereinafter referred to as “Y (Fe + Co) Max”), the total minimum content of Fe and Co. By plotting each of the amounts (hereinafter referred to as “Y (Fe + Co) Min”) on a graph, the Fe content, the Co content, the P content, and the (Fe + Co) / P mass of the copper alloy A numerical limited range of the ratio was determined.

  The hatched portion shown in the figure is the region surrounded by the minimum content of P (0.02% by mass) and the maximum content of P (0.3% by mass), derived from Y (Fe + Co) 3, and The region surrounded by Y (Fe + Co) 10 and the region surrounded by Y (Fe + Co) Max and Y (Fe + Co) Min overlap each other, and the copper alloy according to the first embodiment It is a numerical limitation range of the Fe content, the Co content, the P content, and the mass ratio of (Fe + Co) / P.

  Here, in view of the description in Table 1 and FIG. 1, all of the copper alloys satisfying the numerical range of the Fe content, the Co content, the P content, and the total content of (Fe + Co) are It should be noted that the relationship {(Fe + Co) / P} = 3-10 is not satisfied.

  As an example, the following copper alloy composition may be mentioned. In a copper alloy containing Fe: 0.4 mass%, Ni: 0.4 mass%, and P: 0.04 mass%, the contents of Fe, Ni, and P satisfy the numerical specifications in Table 1 above. . However, the composition of this copper alloy is mass ratio {(Fe + Ni) / P} = 20, which does not satisfy all the numerical values defined in Table 1 above. Therefore, it is important to determine the contents of Fe, Co, and P so as to satisfy the relationship of mass ratio {(Fe + Co) / P} = 3-10.

(Subcomponent of copper alloy)
The copper alloy according to the first embodiment further includes at least one component selected from Sn, Zn, Zr, Cr, and Ti in a range of 0.03 to 1.0 mass% in total. May be. Elements of Sn, Zn, Zr, Cr, and Ti effectively work to improve strength, and have the effect of improving heat resistance and preventing strength reduction at high temperatures. Good properties can also be expected in terms of properties.

  Sn is an additive element having an effect of greatly improving the strength even when added in a small amount, and has a large effect of improving the heat resistance. However, when Sn content increases, the bad influence which reduces electroconductivity becomes large.

  Zn is a secondary component that has an effect of improving strength and has a great effect on improving solder wettability and Sn plating adhesion. However, when Zn content increases, the bad influence which reduces electroconductivity becomes large like Sn.

  Zr and Cr are subcomponents that have a function of improving strength and heat resistance and have relatively few adverse effects on conductivity. When there is too much Zr content and Cr content, bad influences, such as deterioration of castability, will arise. Ti is also a subcomponent excellent in the effect of improving strength and heat resistance.

  By adding these elements alone or in combination, high strength and high conductivity can be expected, but if the total content exceeds 1.0% by mass, adverse effects such as a decrease in conductivity and a deterioration in castability. Is not preferable. Therefore, the total composition range of Sn, Zn, Zr, Cr, and Ti is preferably specified to be 1.0% by mass or less.

(Ratio of the number of crystallized substances and precipitates in the copper alloy material)
In the copper alloy material according to the first embodiment, attention is paid to the size of crystallized substances and precipitates contained in the copper alloy material in order to ensure uniform etching. Here, crystallization refers to a phenomenon in which a solid is formed from a liquid, and precipitation refers to a phenomenon in which a solid second phase is formed in what is already solid. In the present embodiment, for example, a crystallized product is generated when the molten copper is solidified in the casting process, and a precipitate is generated by heat treatment in the already solid copper. In the present application, “crystallized substance and precipitate” are used as an expression comprehensively including a second phase composed of alloy elements / compounds formed in copper as a parent phase. It is important to control the generation of crystallized substances and precipitates having a particle size of 100 nm or more that may adversely affect etching as much as possible.

  About the copper alloy which concerns on this 1st Embodiment, the ratio of the number of the particle | grains whose particle size is 100 nm or more is 1 among the crystallized substances and the precipitates whose particle size is 10 nm or more contained in the material. Control to be 0% or less.

  In general, the size of the precipitate is often determined based on observation results with a transmission electron microscope (TEM). However, it is usually difficult to observe precipitates having a particle size of 10 nm or less by observation of about 10,000 times. In the first embodiment, for particles having a size of 10 nm or more that can be confirmed by observation of about 10,000 times, the number of particles having a size of 100 nm or more is suppressed to 1.0% or less. Good etching properties are ensured. When the number of particles having a size exceeding 100 nm exceeds 1.0%, it is not preferable because uneven portions such as protrusions may be formed on the etched surface.

  When the thickness of the material is reduced by half-etching, if there are coarse crystals and precipitates in the copper alloy material, the etching rate becomes uneven at the periphery, and protrusions are formed on the etched surface. Inconvenience occurs. The particles that cause such a problem are those having a size exceeding 100 nm. If the particles are 100 nm or less, no practical problem occurs.

(Effects of the first embodiment)
The copper alloy which concerns on the said 1st Embodiment maintains the intensity | strength and electroconductivity more excellent compared with the conventional Cu-Fe-P type alloy. Since the copper alloy material does not contain coarse crystals and precipitates, a uniform etching surface can be obtained by half etching. Such a material is optimal as a lead frame, and has high reliability especially for thinning of a semiconductor package. Therefore, the progress of the thinning of the semiconductor package can be supported from the material side and can greatly contribute to the development.

[Second Embodiment]
(Manufacturing method of copper alloy material)
Next, an example of a suitable manufacturing method for obtaining the copper alloy material formed as described above will be described. In the manufacturing method according to the second embodiment, work hardening by cold rolling and precipitation by heat treatment are not carried out rapidly at once, but by carrying out several times little by little, It has a feature to maximize the balance of work hardening by cold rolling and precipitation by heat treatment in a balanced manner.

  In this second embodiment, after hot rolling a copper alloy material having the above composition, cold rolling with a workability of 20% or more, and 400 to 470 ° C. for 10 seconds in the steps after hot rolling. It is suitable to carry out the combination with the heat treatment of heating for 10 minutes at least 2 times, preferably 3 times or more. Thereby, it is possible to produce a copper alloy having good strength and excellent conductivity while preventing generation of particles such as coarse crystals and precipitates.

  In the typical manufacturing method according to the second embodiment, first, a copper alloy material having a predetermined composition is processed by hot rolling. The heating during the hot rolling has the effect of forming a solution in which the crystallized product and precipitate generated in the casting process are once dissolved in the matrix. In order to obtain a more preferable solution state, it is desirable to set the heating temperature to 900 ° C. or higher. The temperature immediately after the hot rolling is desirably maintained at 700 ° C. or higher, and it is desirable to cool as quickly as possible after the hot rolling.

  In the conventional Cu-Fe-P-based alloy, aging of the alloy material at 400 to 600 ° C. for a long time is performed to improve strength and conductivity. However, heating for a long time promotes the growth of precipitates and causes coarse precipitates to be generated.

  In the processes after the hot rolling according to the second embodiment, as described above, the characteristics of strength and conductivity are improved by combining work hardening by cold rolling and precipitation by heat treatment. . In order to improve the strength and conductivity while suppressing the growth of precipitates, cold rolling and short-time heat treatment are repeated. The cold rolling is performed in a range where the degree of processing becomes 20% or more. When the cold rolling degree is less than 20%, the work hardening of the copper alloy material is not sufficient, so that the strength of the finally obtained copper alloy tends to be low.

  In this cold rolling, as the repetition is repeated, the copper alloy material is work-hardened and its strength is improved. In addition, a large number of lattice defects are introduced into the copper alloy material, which acts as a starting point for the formation of new precipitates in the next heat treatment step, and thus has an effect of promoting uniformly dispersed precipitation. Thereby, it can suppress that the precipitate produced | generated by the initial heat processing coarsens, and can form a new fine precipitate.

  Subsequent to the cold rolling, heat treatment is performed by heating at 400 to 470 ° C. for 10 seconds to 10 minutes. In this heat treatment, while the ductility lowered by the immediately preceding cold rolling is recovered, a large number of precipitates are formed each time the repetition is repeated, and the conductivity is improved. Thereby, precipitation of P compound can be accelerated | stimulated and the characteristic of electrical conductivity and intensity | strength can be improved. In the case where the heat treatment condition is 400 to 470 ° C. and a temperature lower than the range of 10 seconds to 10 minutes and a short time, since precipitation does not occur sufficiently, sufficient conductivity and strength cannot be obtained. When the heat treatment conditions are 400 to 470 ° C. and a temperature higher than 10 seconds to 10 minutes and a long time, precipitation may progress at once in one heat treatment and the precipitate may be coarsened.

(Effect of the second embodiment)
According to the method for producing a copper alloy material according to the second embodiment, coarse crystallized substances and precipitates contained in the material while maintaining good strength and conductivity as compared with conventional alloy materials. It becomes possible to suppress the occurrence of this, and the etching property can be improved. Since the material does not contain large crystals and precipitates, it can be stably processed to a thin plate thickness.

  Hereinafter, as more specific embodiments of the present invention with reference to Tables 2 to 6, Examples 1 to 12 (Sample Nos. 1 to 12) and Comparative Examples 1 to 19 (Sample Nos. 1 to 19) ) Will be described in detail. In addition, in this Example, the typical example of the said embodiment is given and, of course, this invention is not limited to these Examples and Comparative Examples.

  Table 2 below shows the compositions of the samples used as Examples 1 to 12 and Comparative Examples 1 to 14, Table 3 below shows the characteristic values after the first to third heat treatments of Example 1, and the following table. 4 shows the characteristic values of Examples 1 to 12 and Comparative Examples 1 to 14, Table 5 below shows the heat treatment conditions of Comparative Examples 15 to 19, and Table 6 below shows the characteristic values of Comparative Examples 15 to 19, respectively. Show.

Example 1
Using oxygen-free copper as a base material, a copper alloy material containing Fe: 0.2 mass%, Co: 0.2 mass%, P: 0.1 mass% was melted in a high-frequency melting furnace, and the thickness was 25 mm. Cast into an ingot having a width of 30 mm and a length of 150 mm. This was heated to 950 ° C. and hot-rolled to a thickness of 8 mm, then cold-rolled to a thickness of 2 mm (working degree 75%) and annealed at 450 ° C. for 1 minute. Further, this was cold-rolled to a thickness of 0.7 mm (working degree 65%) and annealed at 450 ° C. for 1 minute. Further, this was cold-rolled to a thickness of 0.25 mm (working degree: 64%) and annealed at 450 ° C. for 1 minute. 1 (Example 1) was produced. In the middle of this production, an intermediate sample was taken after each of the first to third heat treatments at 450 ° C., and its conductivity, tensile strength, and elongation characteristics were confirmed.

  About the copper alloy of Example 1 manufactured as mentioned above, the electrical conductivity, the tensile strength, and the characteristic result of elongation after the 1st-3rd 450 degreeC heat processing are put together in Table 3, and are shown. As is apparent from Table 3, each time the combination of cold rolling and heat treatment is repeated, the conductivity increases and the tensile strength also increases.

  After the completion of the second heat treatment, a copper alloy having a good conductivity greatly exceeding 60% IACS and a high strength exceeding 560 MPa was obtained, and the conductivity and strength were further improved after the completion of the third heat treatment. A copper alloy was obtained. In addition, the amount of decrease in elongation accompanying the increase in strength is slight, and 10% elongation is ensured even after the third heat treatment, so that a copper alloy having good bending workability was obtained.

(Examples 2 to 12)
Sample No. having the composition shown in Table 2 was used. Copper alloys of 2 to 12 (Examples 2 to 12) were melt-cast and subjected to thermomechanical processing in the same process as in Example 1 to prepare a sample having a thickness of 0.25 mm. The characteristics of the copper alloys in Examples 2 to 12 are summarized in Table 4. As is apparent from Table 4, in all of Examples 2 to 12, a copper alloy having both high conductivity exceeding 60% IACS and high strength exceeding 550 MPa was obtained. Moreover, 10% elongation was ensured, and a copper alloy having good bending workability was obtained.

  About the copper alloy of the said Examples 1-12, the crystallization thing and the precipitate were observed using the transmission electron microscope. Crystallized substances and precipitates having a particle diameter of 10 nm or more and a particle diameter of 100 nm or more were counted, and the ratio of the number of particles having a particle diameter of 100 nm or more was determined.

  As a result, as shown in Table 4, the ratio of the number of crystallized substances and precipitates having a particle diameter of 100 nm or more contained in the copper alloy materials of Examples 1 to 12 was 1.0% or less, and the etching property It turned out to be a good material. It has been found that the copper alloys of Examples 1 to 12 can obtain sufficient conductivity and strength as a lead frame of a thin semiconductor package, for example.

[Comparative example]
Next, the reason for limiting the composition of the copper alloy according to the above embodiment will be described with reference to a comparative example.

  The copper alloys of Comparative Examples 1 to 14 having the compositions shown in Table 2 were melt cast and subjected to a heat treatment in the same process as in Example 1 above. 1-14 (Comparative Examples 1-14) were manufactured. The characteristics of the copper alloys in Comparative Examples 1 to 14 are summarized in Table 4.

(Comparative Examples 1-3)
As shown in Table 2, in the copper alloys of Comparative Examples 1 to 3, the contents of Fe, Co, and P deviate from the specified range of the copper alloy according to the above embodiment. The copper alloys of Comparative Examples 1 to 3 are examples in which the contents of Fe, Co, and P are too low. As shown in Table 4, the tensile strength is lower than that of the above example, and sufficient strength is obtained. The result was not possible.

(Comparative Examples 4-6)
As shown in Table 2, the copper alloys of Comparative Examples 4 to 6 are examples in which the contents of Fe, Co, and P are too large. In particular, as shown in Table 4, the copper alloys of Comparative Examples 4 to 6 have a low elongation value and are liable to be cracked during bending, so that the initial object of the present invention is satisfied. I can't.

(Comparative Examples 7-12)
As shown in Table 2, the copper alloys of Comparative Examples 7 to 12 are examples in which the mass ratio of the total of Fe and Co and P deviates from the specified range. As is apparent from Table 4, the conductivity of the copper alloys of Comparative Examples 7 to 12 is reduced even when the addition amount of Fe and Co is excessive or when the addition amount of P is excessive. I understand that. It can be seen that the tensile strengths of the copper alloys of Comparative Examples 7 to 12 are also lower than those of the above Examples.

(Comparative Examples 13 and 14)
As shown in Table 2, the copper alloys of Comparative Examples 13 and 14 are examples in which the contents of Sn, Zn, and the like added as subcomponents are excessive. Although the tensile strength of the copper alloys of Comparative Examples 13 and 14 is good as shown in Table 4, it can be seen that the conductivity is greatly reduced.

(Comparative Examples 15-19)
Next, the comparative reasons 15-19 are given and the reason for limitation of the thermomechanical processing conditions in the manufacturing method suitable for the copper alloy which concerns on the said embodiment is demonstrated.

  After hot-rolling a copper alloy having the same composition as in Example 1, the combination of cold-rolling and heat treatment was repeated under the conditions shown in Table 5. Copper alloys of 15 to 19 (Comparative Examples 15 to 19) were manufactured. Table 6 summarizes the characteristics of the copper alloys and the observation results of the precipitates in Comparative Examples 15 to 19.

(Comparative Example 15)
As shown in Table 5, Comparative Example 15 is an example in which the degree of cold rolling work is lower than the specified condition. In the copper alloy of Comparative Example 15, as shown in Table 6, it can be seen that as the tensile strength is lowered, the conductivity is also lower than that of the copper alloy of the above Example.

(Comparative Example 16)
As shown in Table 5, Comparative Example 16 is an example in which the degree of cold rolling work is lower than the prescribed condition, and the number of repeated cold rolling and heat treatments is increased. As shown in Table 6, the copper alloy of Comparative Example 16 is improved in both tensile strength and electrical conductivity as compared with the copper alloy of Comparative Example 15, but the tensile strength compared to the copper alloy of the above Example. It turns out that the result became inferior.

  Increasing the number of repeated cold rolling and heat treatments can be expected to improve the properties of the copper alloy. However, since the increase in the number of repeated executions directly leads to an increase in manufacturing cost, the cold rolling and heat treatment repeated processing exceeding 5 times are not preferable.

(Comparative Example 17)
As shown in Table 5, Comparative Example 17 is an example in which the heat treatment conditions are outside the specified range and the heat treatment temperature is low. As shown in Table 6, it can be seen that the copper alloy of Comparative Example 17 cannot obtain sufficient electrical conductivity.

(Comparative Example 18)
Comparative Example 18 is an example in which the heat treatment temperature is high as shown in Table 5. As shown in Table 6, the copper alloy of Comparative Example 18 has good tensile strength and electrical conductivity equivalent to those of the above examples. However, from the observation results of the precipitates, it can be seen that a larger amount of large precipitates having a particle size of 100 nm or more is generated, and it is not possible to maintain uniform etching properties as in the copper alloys of the above examples.

(Comparative Example 19)
As shown in Table 5, Comparative Example 19 is an example in which the heating time of the heat treatment is too short. In the copper alloy of Comparative Example 19, as shown in Table 6, good conductivity could not be obtained.

  As described above, it can be understood that any of the copper alloys of the comparative examples that deviate from the condition range defined in the above embodiment can obtain only insufficient characteristics as compared with the copper alloys of the above examples.

  The copper alloy which concerns on the said embodiment becomes possible [manufacture of the rolled copper foil with higher intensity | strength than before]. Not only is it used as a material for electrical and electronic parts such as semiconductor package lead frames, connectors, relays and switches, but it is also effective as a material for rolled copper foil used in applications such as printed wiring boards and battery current collectors. Can be used for

Claims (3)

It contains either Fe or Co, or both Fe and Co in a total amount of 0.1 to 1.0% by mass, and also contains 0.02 to 0.3% by mass of P, and the total of Fe and Co. And the mass ratio of Fe and P (Fe + Co) / P is 3 to 10, and the balance is a copper alloy consisting of Cu and inevitable impurities,
The ratio of the number of crystallized substances and precipitates having a particle diameter of 100 nm or more among the crystallized substances and precipitates having a particle diameter of 10 nm or more contained in the copper alloy is 1.0% or less. A copper alloy material for electrical and electronic parts. It contains either Fe or Co, or both Fe and Co in a total amount of 0.1 to 1.0% by mass, and also contains 0.02 to 0.3% by mass of P, and the total of Fe and Co. The mass ratio of Fe to P (Fe + Co) / P is 3 to 10, and further contains at least one component selected from Sn, Zn, Zr, Cr and Ti in a total amount of 0.03 to 1.0% by mass. And the balance is a copper alloy consisting of Cu and inevitable impurities,
The ratio of the number of crystallized substances and precipitates having a particle diameter of 100 nm or more among the crystallized substances and precipitates having a particle diameter of 10 nm or more contained in the copper alloy is 1.0% or less. A copper alloy material for electrical and electronic parts.   The copper alloy material according to claim 1 or 2 is hot-rolled, cold-rolled with a workability of 20% or more in the steps after hot-rolling, and heat treatment heated at 400 to 470 ° C for 10 seconds to 10 minutes, A method for producing a copper alloy material for electric / electronic parts, wherein the combination of the above is carried out at least twice.

Images