JP2011530422A5 - - Google Patents
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- Publication number
- JP2011530422A5 JP2011530422A5 JP2011523002A JP2011523002A JP2011530422A5 JP 2011530422 A5 JP2011530422 A5 JP 2011530422A5 JP 2011523002 A JP2011523002 A JP 2011523002A JP 2011523002 A JP2011523002 A JP 2011523002A JP 2011530422 A5 JP2011530422 A5 JP 2011530422A5
- Authority
- JP
- Japan
- Prior art keywords
- slurry
- polishing
- arm
- substrate
- dispenser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims description 252
- 239000002002 slurry Substances 0.000 claims description 216
- 239000000758 substrate Substances 0.000 claims description 149
- 239000012530 fluid Substances 0.000 claims description 67
- 239000000969 carrier Substances 0.000 claims description 60
- 239000000126 substance Substances 0.000 claims description 36
- 238000005296 abrasive Methods 0.000 claims description 21
- 230000001808 coupling Effects 0.000 claims description 18
- 238000010168 coupling process Methods 0.000 claims description 18
- 238000005859 coupling reaction Methods 0.000 claims description 18
- 238000009826 distribution Methods 0.000 claims description 17
- 210000001503 Joints Anatomy 0.000 claims description 16
- 230000000875 corresponding Effects 0.000 claims description 6
- 239000000725 suspension Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 239000007921 spray Substances 0.000 description 11
- 239000000203 mixture Substances 0.000 description 9
- 230000001276 controlling effect Effects 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 241000403254 Turkey hepatitis virus Species 0.000 description 6
- 238000005452 bending Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000009825 accumulation Methods 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 230000003472 neutralizing Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N al2o3 Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000003750 conditioning Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000003628 erosive Effects 0.000 description 2
- 238000011068 load Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000009827 uniform distribution Methods 0.000 description 2
- 235000002754 Acer pseudoplatanus Nutrition 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 210000000078 Claw Anatomy 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 235000006485 Platanus occidentalis Nutrition 0.000 description 1
- 240000004092 Platanus occidentalis Species 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N Silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 210000000707 Wrist Anatomy 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 230000001360 synchronised Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8899308P | 2008-08-14 | 2008-08-14 | |
| US61/088,993 | 2008-08-14 | ||
| US12/196,860 US8414357B2 (en) | 2008-08-22 | 2008-08-22 | Chemical mechanical polisher having movable slurry dispensers and method |
| US12/196,860 | 2008-08-22 | ||
| PCT/US2009/004667 WO2010019264A2 (en) | 2008-08-14 | 2009-08-14 | Chemical mechanical polisher having movable slurry dispensers and method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011530422A JP2011530422A (ja) | 2011-12-22 |
| JP2011530422A5 true JP2011530422A5 (zh) | 2012-09-27 |
| JP5542818B2 JP5542818B2 (ja) | 2014-07-09 |
Family
ID=41669537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011523002A Expired - Fee Related JP5542818B2 (ja) | 2008-08-14 | 2009-08-14 | 可動スラリーディスペンサーを有する化学的機械的研磨機および方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5542818B2 (zh) |
| KR (1) | KR20110065464A (zh) |
| CN (1) | CN102124545B (zh) |
| WO (1) | WO2010019264A2 (zh) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103223638B (zh) * | 2013-04-28 | 2016-04-13 | 上海华力微电子有限公司 | 化学机械研磨设备 |
| CN103286693A (zh) * | 2013-05-31 | 2013-09-11 | 上海集成电路研发中心有限公司 | 研磨液分配臂 |
| US20150059808A1 (en) * | 2013-08-30 | 2015-03-05 | Semes Co., Ltd. | Apparatus for processing substrate and method of cleaning same |
| CN104625941B (zh) * | 2013-11-14 | 2018-09-04 | 盛美半导体设备（上海）有限公司 | 晶圆加工装置 |
| CN104637836B (zh) * | 2013-11-14 | 2019-06-25 | 盛美半导体设备（上海）有限公司 | 晶圆加工装置 |
| KR101637537B1 (ko) * | 2014-07-01 | 2016-07-08 | 주식회사 케이씨텍 | 화학 기계적 연마 장치 및 그 방법 |
| CN104308744A (zh) * | 2014-08-26 | 2015-01-28 | 上海华力微电子有限公司 | 化学机械研磨之研磨液供给装置 |
| CN112091809B (zh) * | 2014-10-03 | 2022-11-29 | 株式会社荏原制作所 | 处理组件及处理方法 |
| KR102447790B1 (ko) * | 2014-12-12 | 2022-09-27 | 어플라이드 머티어리얼스, 인코포레이티드 | Cmp 동안의 인 시튜 부산물 제거 및 플래튼 냉각을 위한 시스템 및 프로세스 |
| KR101587894B1 (ko) * | 2015-02-17 | 2016-01-25 | 주식회사 티에스시 | 슬러리공급장치 |
| KR101707450B1 (ko) * | 2015-12-04 | 2017-02-16 | 주식회사 포스코 | 시편 가공 장치 |
| KR101681679B1 (ko) * | 2016-03-31 | 2016-12-01 | 에이프로테크주식회사 | 웨이퍼 연마 장치용 슬러리 공급 장치 |
| JP6717691B2 (ja) | 2016-07-06 | 2020-07-01 | 株式会社荏原製作所 | 基板処理装置 |
| CN110709980A (zh) * | 2017-04-26 | 2020-01-17 | 崇硕科技公司 | 具有提高的生产量和加工灵活性的cmp机器 |
| KR101966952B1 (ko) * | 2017-07-06 | 2019-04-18 | 주식회사 케이씨텍 | 슬러리 공급 유닛 및 이를 구비하는 기판 연마 장치 |
| US11251047B2 (en) * | 2017-11-13 | 2022-02-15 | Applied Materials, Inc. | Clog detection in a multi-port fluid delivery system |
| KR102037750B1 (ko) * | 2018-02-09 | 2019-10-29 | 에스케이실트론 주식회사 | 슬러리 공급 유닛 및 이를 포함하는 웨이퍼의 연마 장치 |
| CN108857904B (zh) * | 2018-06-25 | 2020-04-10 | 深圳市冠华珠宝有限公司 | 一种带有辅助剂喷孔的研磨机 |
| JP7152279B2 (ja) * | 2018-11-30 | 2022-10-12 | 株式会社荏原製作所 | 研磨装置 |
| CN110977622B (zh) * | 2019-12-13 | 2021-04-02 | 大连理工大学 | 一种抛光液多点可变位自动滴液的控制方法 |
| KR20210081898A (ko) * | 2019-12-24 | 2021-07-02 | 에스케이하이닉스 주식회사 | 화학적 기계적 연마 장비 및 그 구동 방법 |
| CN111633498B (zh) * | 2020-06-09 | 2022-03-29 | 南京鲲途机电科技有限公司 | 陶瓷自动打磨机床 |
| CN113245986B (zh) * | 2021-06-01 | 2021-10-01 | 湖南工业职业技术学院 | 一种连续式混凝土搅拌机圆盘表面磨削装置 |
| CN115734841A (zh) | 2021-06-11 | 2023-03-03 | 株式会社荏原制作所 | 研磨装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000006010A (ja) * | 1998-06-26 | 2000-01-11 | Ebara Corp | Ｃｍｐ装置及びその砥液供給方法 |
| EP1190455A2 (en) * | 1999-04-01 | 2002-03-27 | Koninklijke Philips Electronics N.V. | Dual cmp pad conditioner |
| US6390902B1 (en) * | 2001-06-06 | 2002-05-21 | United Microelectronics Corp. | Multi-conditioner arrangement of a CMP system |
| US6482290B1 (en) * | 2001-08-10 | 2002-11-19 | Taiwan Semiconductor Manufacturing Co., Ltd | Sweeping slurry dispenser for chemical mechanical polishing |
| US6722943B2 (en) * | 2001-08-24 | 2004-04-20 | Micron Technology, Inc. | Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces |
| US7229339B2 (en) * | 2004-07-02 | 2007-06-12 | Novellus Systems, Inc. | CMP apparatus and method |
| JP2006147773A (ja) * | 2004-11-18 | 2006-06-08 | Ebara Corp | 研磨装置および研磨方法 |
| US7052374B1 (en) * | 2005-03-01 | 2006-05-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multipurpose slurry delivery arm for chemical mechanical polishing |
-
2009
- 2009-08-14 WO PCT/US2009/004667 patent/WO2010019264A2/en active Application Filing
- 2009-08-14 JP JP2011523002A patent/JP5542818B2/ja not_active Expired - Fee Related
- 2009-08-14 KR KR1020117005938A patent/KR20110065464A/ko not_active Application Discontinuation
- 2009-08-14 CN CN200980131752.9A patent/CN102124545B/zh not_active Expired - Fee Related
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