JP2011526418A5 - - Google Patents

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Publication number
JP2011526418A5
JP2011526418A5 JP2011515089A JP2011515089A JP2011526418A5 JP 2011526418 A5 JP2011526418 A5 JP 2011526418A5 JP 2011515089 A JP2011515089 A JP 2011515089A JP 2011515089 A JP2011515089 A JP 2011515089A JP 2011526418 A5 JP2011526418 A5 JP 2011526418A5
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JP
Japan
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semiconductor body
semiconductor
body support
forming
optoelectronic elements
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JP2011515089A
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English (en)
Japanese (ja)
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JP5693450B2 (ja
JP2011526418A (ja
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Priority claimed from DE102008030815A external-priority patent/DE102008030815A1/de
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Publication of JP2011526418A5 publication Critical patent/JP2011526418A5/ja
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Publication of JP5693450B2 publication Critical patent/JP5693450B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011515089A 2008-06-30 2009-06-18 複数のオプトエレクトロニクス素子の製造方法 Expired - Fee Related JP5693450B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008030815A DE102008030815A1 (de) 2008-06-30 2008-06-30 Verfahren zur Herstellung einer Vielzahl von optoelektronischen Bauelementen
DE102008030815.3 2008-06-30
PCT/DE2009/000857 WO2010000224A2 (de) 2008-06-30 2009-06-18 Verfahren zur herstellung einer vielzahl von optoelektronischen bauelementen

Publications (3)

Publication Number Publication Date
JP2011526418A JP2011526418A (ja) 2011-10-06
JP2011526418A5 true JP2011526418A5 (https=) 2012-08-02
JP5693450B2 JP5693450B2 (ja) 2015-04-01

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ID=41228784

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Application Number Title Priority Date Filing Date
JP2011515089A Expired - Fee Related JP5693450B2 (ja) 2008-06-30 2009-06-18 複数のオプトエレクトロニクス素子の製造方法

Country Status (7)

Country Link
US (1) US8431422B2 (https=)
EP (1) EP2294614B1 (https=)
JP (1) JP5693450B2 (https=)
KR (1) KR101587299B1 (https=)
CN (1) CN101983428B (https=)
DE (1) DE102008030815A1 (https=)
WO (1) WO2010000224A2 (https=)

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DE102012217776A1 (de) 2012-09-28 2014-06-12 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelements
DE102013107862A1 (de) * 2013-07-23 2015-01-29 Osram Opto Semiconductors Gmbh Oberflächenmontierbares optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung zumindest eines oberflächenmontierbaren optoelektronischen Halbleiterbauteils
DE102014114188B4 (de) * 2014-09-30 2022-01-20 Osram Gmbh Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
DE102015103835A1 (de) * 2015-03-16 2016-09-22 Osram Opto Semiconductors Gmbh Lichtemittierendes Bauelement und Verfahren zur Herstellung eines lichtemittierenden Bauelements
JP6217711B2 (ja) * 2015-08-21 2017-10-25 日亜化学工業株式会社 発光装置の製造方法
TWI688121B (zh) 2018-08-24 2020-03-11 隆達電子股份有限公司 發光二極體結構
US11038088B2 (en) 2019-10-14 2021-06-15 Lextar Electronics Corporation Light emitting diode package
CN111883552B (zh) * 2020-08-04 2023-09-05 厦门乾照光电股份有限公司 一种集成式led芯片模组及其制作、测试、切割方法
CN118472152B (zh) * 2024-07-12 2024-09-17 诺视科技(浙江)有限公司 集成反射穹顶的微显示器件及其制备方法

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DE102007030129A1 (de) * 2007-06-29 2009-01-02 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Mehrzahl optoelektronischer Bauelemente und optoelektronisches Bauelement
DE102008013030A1 (de) 2007-12-14 2009-06-25 Osram Opto Semiconductors Gmbh Strahlungsemittierende Vorrichtung
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