JP2011522769A5 - - Google Patents

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Publication number
JP2011522769A5
JP2011522769A5 JP2011511598A JP2011511598A JP2011522769A5 JP 2011522769 A5 JP2011522769 A5 JP 2011522769A5 JP 2011511598 A JP2011511598 A JP 2011511598A JP 2011511598 A JP2011511598 A JP 2011511598A JP 2011522769 A5 JP2011522769 A5 JP 2011522769A5
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JP
Japan
Prior art keywords
laser beam
laser
optical head
focus
waist
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JP2011511598A
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English (en)
Japanese (ja)
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JP5563562B2 (ja
JP2011522769A (ja
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Priority claimed from US12/220,948 external-priority patent/US8053704B2/en
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Publication of JP2011522769A publication Critical patent/JP2011522769A/ja
Publication of JP2011522769A5 publication Critical patent/JP2011522769A5/ja
Application granted granted Critical
Publication of JP5563562B2 publication Critical patent/JP5563562B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011511598A 2008-05-27 2009-05-14 非平坦材料の罫書き Expired - Fee Related JP5563562B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US12894908P 2008-05-27 2008-05-27
US61/128,949 2008-05-27
US12/220,948 US8053704B2 (en) 2008-05-27 2008-07-30 Scoring of non-flat materials
US12/220,948 2008-07-30
PCT/US2009/002988 WO2009151527A2 (en) 2008-05-27 2009-05-14 Scoring of non-flat materials

Publications (3)

Publication Number Publication Date
JP2011522769A JP2011522769A (ja) 2011-08-04
JP2011522769A5 true JP2011522769A5 (https=) 2012-06-07
JP5563562B2 JP5563562B2 (ja) 2014-07-30

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ID=41378489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011511598A Expired - Fee Related JP5563562B2 (ja) 2008-05-27 2009-05-14 非平坦材料の罫書き

Country Status (6)

Country Link
US (1) US8053704B2 (https=)
JP (1) JP5563562B2 (https=)
KR (1) KR101428141B1 (https=)
CN (1) CN102046545B (https=)
TW (1) TWI404683B (https=)
WO (1) WO2009151527A2 (https=)

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EP3452418B1 (en) 2016-05-06 2022-03-02 Corning Incorporated Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
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JP2019532908A (ja) 2016-08-30 2019-11-14 コーニング インコーポレイテッド 強度マッピング光学システムによる材料のレーザー切断
JP6923284B2 (ja) 2016-09-30 2021-08-18 コーニング インコーポレイテッド 非軸対称ビームスポットを用いて透明被加工物をレーザ加工するための装置及び方法
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