JP2011519805A5 - - Google Patents
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- Publication number
- JP2011519805A5 JP2011519805A5 JP2011502205A JP2011502205A JP2011519805A5 JP 2011519805 A5 JP2011519805 A5 JP 2011519805A5 JP 2011502205 A JP2011502205 A JP 2011502205A JP 2011502205 A JP2011502205 A JP 2011502205A JP 2011519805 A5 JP2011519805 A5 JP 2011519805A5
- Authority
- JP
- Japan
- Prior art keywords
- components
- tin alloy
- connection region
- solder bridge
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims 10
- 238000000034 method Methods 0.000 claims 6
- 229910052782 aluminium Inorganic materials 0.000 claims 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 4
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims 3
- 229910052790 beryllium Inorganic materials 0.000 claims 3
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims 3
- 239000011521 glass Substances 0.000 claims 3
- 239000007788 liquid Substances 0.000 claims 3
- 229910052744 lithium Inorganic materials 0.000 claims 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 2
- 229910052733 gallium Inorganic materials 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 229910052738 indium Inorganic materials 0.000 claims 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 2
- 238000005304 joining Methods 0.000 claims 2
- 229910052749 magnesium Inorganic materials 0.000 claims 2
- 239000011777 magnesium Substances 0.000 claims 2
- 229910052708 sodium Inorganic materials 0.000 claims 2
- 239000011734 sodium Substances 0.000 claims 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052791 calcium Inorganic materials 0.000 claims 1
- 239000011575 calcium Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 229910052732 germanium Inorganic materials 0.000 claims 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 1
- 238000005247 gettering Methods 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 238000004377 microelectronic Methods 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 229910052700 potassium Inorganic materials 0.000 claims 1
- 239000011591 potassium Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
- 238000009736 wetting Methods 0.000 claims 1
- 238000010276 construction Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH498/08 | 2008-04-02 | ||
| CH4982008 | 2008-04-02 | ||
| PCT/CH2009/000107 WO2009121196A1 (de) | 2008-04-02 | 2009-03-30 | Verbundobjekt und verfahren zu dessen herstellung |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011519805A JP2011519805A (ja) | 2011-07-14 |
| JP2011519805A5 true JP2011519805A5 (enExample) | 2013-08-29 |
| JP5518833B2 JP5518833B2 (ja) | 2014-06-11 |
Family
ID=40792665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011502205A Expired - Fee Related JP5518833B2 (ja) | 2008-04-02 | 2009-03-30 | 複合体および該複合体を製造する方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20110151157A1 (enExample) |
| EP (1) | EP2260168A1 (enExample) |
| JP (1) | JP5518833B2 (enExample) |
| CN (1) | CN102046909B (enExample) |
| WO (1) | WO2009121196A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120145308A1 (en) * | 2010-12-08 | 2012-06-14 | Jiangwei Feng | Methods for anodic bonding material layers to one another and resultant apparatus |
| CN102332486A (zh) * | 2011-04-13 | 2012-01-25 | 东旭集团有限公司 | 一种太阳能电池组件中基板玻璃与背板玻璃的封装工艺 |
| CN103130180B (zh) * | 2011-12-02 | 2015-10-28 | 中国科学院微电子研究所 | 一种晶圆级阳极键合方法 |
| JP5870735B2 (ja) * | 2012-02-16 | 2016-03-01 | 日本電気硝子株式会社 | ガラス材接合体の製造方法及び金属膜付ガラス材の製造方法 |
| JP6518264B2 (ja) * | 2014-01-07 | 2019-05-22 | カルティエ インターナショナル アクチェンゲゼルシャフト | 時計ケースにガラスを取り付けるための方法 |
| EP3691891B1 (de) * | 2017-10-04 | 2024-01-24 | Saint-Gobain Glass France | Verfahren zur herstelung einer verbundscheibe mit elektrisch steuerbaren optischen eigenschaften |
| WO2019093324A1 (ja) * | 2017-11-10 | 2019-05-16 | 日本板硝子株式会社 | ガラスパネルの製造方法、及び、ガラスパネル |
| US10490682B2 (en) | 2018-03-14 | 2019-11-26 | National Mechanical Group Corp. | Frame-less encapsulated photo-voltaic solar panel supporting solar cell modules encapsulated within multiple layers of optically-transparent epoxy-resin materials |
| CN108298822B (zh) * | 2018-04-08 | 2020-08-04 | 武汉理工大学 | 一种真空玻璃封接用低熔点玻璃粉及其阳极键合增强封装方法 |
| CN108328912B (zh) * | 2018-04-08 | 2020-01-31 | 武汉理工大学 | 一种用于真空玻璃封接的阳极键合方法及装置 |
| CN110864193B (zh) * | 2018-08-27 | 2021-02-12 | 广州力及热管理科技有限公司 | 薄型真空隔热片的制作方法 |
| CN109437601A (zh) * | 2018-12-21 | 2019-03-08 | 厦门祐尼三的新材料科技有限公司 | 一种具有夹层电路的3d玻璃及其制备方法和应用 |
| CN110204223A (zh) * | 2019-04-25 | 2019-09-06 | 厦门祐尼三的新材料科技有限公司 | 一种夹层玻璃及其制备方法 |
| CN110685556B (zh) * | 2019-10-08 | 2020-08-21 | 杭州丽博家居有限公司 | 一种可通电变色门板的制作方法 |
| CN110642534A (zh) * | 2019-11-06 | 2020-01-03 | 武汉理工大学 | 一种复合层封接结构的真空玻璃及其阳极键合封装方法 |
| CN114855004A (zh) * | 2022-03-24 | 2022-08-05 | 北京理工大学 | 一种高屈服强度Sn二元合金的制备方法 |
| CN114436207B (zh) * | 2022-04-01 | 2022-07-29 | 杭州海康微影传感科技有限公司 | 一种mems传感器及其制造方法、晶圆模组 |
| CN115415624B (zh) * | 2022-08-23 | 2024-05-28 | 中车青岛四方机车车辆股份有限公司 | 钎焊密封方法、点焊结构和轨道车辆 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3470348A (en) * | 1966-04-18 | 1969-09-30 | Mallory & Co Inc P R | Anodic bonding of liquid metals to insulators |
| JPS54129022A (en) * | 1978-03-31 | 1979-10-06 | Hitachi Ltd | Production of container from plate glass |
| US4393105A (en) * | 1981-04-20 | 1983-07-12 | Spire Corporation | Method of fabricating a thermal pane window and product |
| DE69434461T2 (de) * | 1993-06-30 | 2006-04-20 | The University Of Sydney, Sydney | Herstellungsverfahren für evakuierte Verglasung |
| AUPM888994A0 (en) * | 1994-10-19 | 1994-11-10 | University Of Sydney, The | Design improvement to vacuum glazing |
| JP4503856B2 (ja) * | 1999-03-25 | 2010-07-14 | 日本板硝子株式会社 | ガラスパネルおよびその製造方法 |
| US6444281B1 (en) * | 1999-10-13 | 2002-09-03 | Guardian Industries Corp. | Vacuum IG window unit with spacers between first and second edge seals |
| JP2002167249A (ja) * | 2000-11-30 | 2002-06-11 | Nippon Sheet Glass Co Ltd | ガラスパネル |
| EP1221526A1 (de) * | 2001-01-09 | 2002-07-10 | Emil BÄCHLI | Verfahren zur Herstellung von wärmeisolierenden Bau- und/oder Lichtelementen sowie Einrichtung zur Durchführung desselben |
| US6939778B2 (en) * | 2002-04-18 | 2005-09-06 | The Regents Of The University Of Michigan | Method of joining an insulator element to a substrate |
| EP1883940A2 (en) * | 2005-05-06 | 2008-02-06 | David H. Stark | Insulated glazing units and methods |
| US20070034676A1 (en) * | 2005-08-11 | 2007-02-15 | Honeywell International Inc. | Electric field assisted solder bonding |
| US20070166554A1 (en) * | 2006-01-18 | 2007-07-19 | Ruchert Brian D | Thermal interconnect and interface systems, methods of production and uses thereof |
| US20080023665A1 (en) * | 2006-07-25 | 2008-01-31 | Weiser Martin W | Thermal interconnect and interface materials, methods of production and uses thereof |
-
2009
- 2009-03-30 EP EP09727813A patent/EP2260168A1/de not_active Withdrawn
- 2009-03-30 CN CN2009801205504A patent/CN102046909B/zh not_active Expired - Fee Related
- 2009-03-30 JP JP2011502205A patent/JP5518833B2/ja not_active Expired - Fee Related
- 2009-03-30 WO PCT/CH2009/000107 patent/WO2009121196A1/de not_active Ceased
- 2009-03-30 US US12/935,732 patent/US20110151157A1/en not_active Abandoned
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