JP2011518104A5 - - Google Patents
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- Publication number
- JP2011518104A5 JP2011518104A5 JP2011505228A JP2011505228A JP2011518104A5 JP 2011518104 A5 JP2011518104 A5 JP 2011518104A5 JP 2011505228 A JP2011505228 A JP 2011505228A JP 2011505228 A JP2011505228 A JP 2011505228A JP 2011518104 A5 JP2011518104 A5 JP 2011518104A5
- Authority
- JP
- Japan
- Prior art keywords
- oxide
- combinations
- composition
- borosilicate glass
- glass composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 claims description 71
- 239000005388 borosilicate glass Substances 0.000 claims description 33
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 13
- 229910018068 Li 2 O Inorganic materials 0.000 claims description 12
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 7
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000002243 precursor Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
- 229910006501 ZrSiO Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US4628208P | 2008-04-18 | 2008-04-18 | |
| US61/046,282 | 2008-04-18 | ||
| US12/425,048 | 2009-04-16 | ||
| US12/425,048 US8257619B2 (en) | 2008-04-18 | 2009-04-16 | Lead-free resistive composition |
| PCT/US2009/040960 WO2009129463A1 (en) | 2008-04-18 | 2009-04-17 | Lead-free resistive compositions having ruthenium oxide |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014039076A Division JP2014144910A (ja) | 2008-04-18 | 2014-02-28 | ルテニウム酸化物を有する、鉛を含有しない抵抗組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011518104A JP2011518104A (ja) | 2011-06-23 |
| JP2011518104A5 true JP2011518104A5 (cg-RX-API-DMAC7.html) | 2012-06-07 |
Family
ID=40823428
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011505228A Pending JP2011518104A (ja) | 2008-04-18 | 2009-04-17 | ルテニウム酸化物を有する、鉛を含有しない抵抗組成物 |
| JP2014039076A Withdrawn JP2014144910A (ja) | 2008-04-18 | 2014-02-28 | ルテニウム酸化物を有する、鉛を含有しない抵抗組成物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014039076A Withdrawn JP2014144910A (ja) | 2008-04-18 | 2014-02-28 | ルテニウム酸化物を有する、鉛を含有しない抵抗組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8257619B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2274249A1 (cg-RX-API-DMAC7.html) |
| JP (2) | JP2011518104A (cg-RX-API-DMAC7.html) |
| KR (1) | KR101258328B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN101990522B (cg-RX-API-DMAC7.html) |
| TW (1) | TW201000424A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2009129463A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012127468A2 (en) * | 2011-03-24 | 2012-09-27 | Ben-Gurion University Of The Negev Research And Development Authority | Coatings for solar applications |
| EP2751044B1 (en) * | 2011-09-13 | 2020-04-22 | Ferro Corporation | Induction sealing of inorganic substrates |
| KR101351916B1 (ko) * | 2011-11-01 | 2014-02-17 | 중원대학교 산학협력단 | 루테늄산염수용액을 이용한 이산화루테늄 제조 방법 |
| US9236155B2 (en) * | 2013-02-04 | 2016-01-12 | E I Du Pont De Nemours And Company | Copper paste composition and its use in a method for forming copper conductors on substrates |
| JP6108563B2 (ja) * | 2013-02-04 | 2017-04-05 | 国立研究開発法人産業技術総合研究所 | 抵抗体、誘電体等の電子部品用無機材料ペースト及び該無機材料ペーストの製造方法 |
| MY180840A (en) * | 2014-09-12 | 2020-12-10 | Shoei Chemical Ind Co | Thick film resistor and production method for same |
| MY183351A (en) | 2014-09-12 | 2021-02-18 | Shoei Chemical Ind Co | Resistive composition |
| DE102015110607A1 (de) * | 2015-07-01 | 2017-01-05 | Epcos Ag | Verfahren zur Herstellung eines elektrischen Bauelements |
| JP2017048061A (ja) * | 2015-08-31 | 2017-03-09 | 日本電気硝子株式会社 | ガラスペースト組成物及び被膜形成ガラス部材の製造方法 |
| JP6708093B2 (ja) * | 2016-10-20 | 2020-06-10 | 住友金属鉱山株式会社 | 抵抗ペースト及びその焼成により作製される抵抗体 |
| CN106601331A (zh) * | 2016-10-25 | 2017-04-26 | 东莞珂洛赫慕电子材料科技有限公司 | 一种具有低tcr值的高温无铅钌浆及其制备方法 |
| JP6931455B2 (ja) * | 2017-02-17 | 2021-09-08 | 住友金属鉱山株式会社 | 抵抗体用組成物及びこれを含んだ抵抗体ペーストとそれを用いた厚膜抵抗体 |
| US10115505B2 (en) | 2017-02-23 | 2018-10-30 | E I Du Pont De Nemours And Company | Chip resistor |
| WO2021145269A1 (ja) * | 2020-01-16 | 2021-07-22 | ナミックス株式会社 | 導電性ペースト、電極及びチップ抵抗器 |
| CN114831350A (zh) * | 2021-02-02 | 2022-08-02 | 深圳麦克韦尔科技有限公司 | 发热组件及电子雾化装置 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4051074A (en) * | 1975-10-29 | 1977-09-27 | Shoei Kagaku Kogyo Kabushiki Kaisha | Resistor composition and method for its manufacture |
| US4312770A (en) * | 1979-07-09 | 1982-01-26 | General Motors Corporation | Thick film resistor paste and resistors therefrom |
| EP0132810A1 (en) | 1983-07-25 | 1985-02-13 | E.I. Du Pont De Nemours And Company | Borosilicate glass composition |
| US4651126A (en) * | 1985-05-02 | 1987-03-17 | Shailendra Kumar | Electrical resistor material, resistor made therefrom and method of making the same |
| JPH05335110A (ja) | 1992-05-11 | 1993-12-17 | Du Pont Japan Ltd | 厚膜抵抗体組成物 |
| US5534194A (en) | 1993-03-30 | 1996-07-09 | E. I. Du Pont De Nemours And Company | Thick film resistor composition containing pyrochlore and silver-containing binder |
| US5474711A (en) | 1993-05-07 | 1995-12-12 | E. I. Du Pont De Nemours And Company | Thick film resistor compositions |
| US5491118A (en) | 1994-12-20 | 1996-02-13 | E. I. Du Pont De Nemours And Company | Cadmium-free and lead-free thick film paste composition |
| WO1999063553A1 (en) | 1998-05-29 | 1999-12-09 | E.I. Du Pont De Nemours And Company | Thick film resistor compositions for making heat-transfer tapes and use thereof |
| JP3731803B2 (ja) * | 1999-10-28 | 2006-01-05 | 株式会社村田製作所 | 厚膜抵抗体 |
| EP1096512B1 (en) * | 1999-10-28 | 2005-08-10 | Murata Manufacturing Co., Ltd. | Thick-film resistor and ceramic circuit board |
| CN100538921C (zh) * | 2002-11-21 | 2009-09-09 | Tdk株式会社 | 电阻器糊料、电阻器及电子部件 |
| JP2005244115A (ja) | 2004-02-27 | 2005-09-08 | Tdk Corp | 抵抗体ペースト、抵抗体及び電子部品 |
| JP3800614B1 (ja) * | 2004-09-01 | 2006-07-26 | Ｔｄｋ株式会社 | 厚膜抵抗体ペーストおよび厚膜抵抗体 |
| US7481953B2 (en) * | 2004-09-01 | 2009-01-27 | Tdk Corporation | Thick-film resistor paste and thick-film resistor |
| CN100511496C (zh) * | 2004-09-01 | 2009-07-08 | Tdk株式会社 | 厚膜电阻浆料和厚膜电阻 |
| JP2007103594A (ja) * | 2005-10-03 | 2007-04-19 | Shoei Chem Ind Co | 抵抗体組成物並びに厚膜抵抗体 |
| JP5406277B2 (ja) * | 2008-04-18 | 2014-02-05 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Ｃｕ含有ガラスフリットを使用する抵抗体組成物 |
-
2009
- 2009-04-16 US US12/425,048 patent/US8257619B2/en active Active
- 2009-04-17 JP JP2011505228A patent/JP2011518104A/ja active Pending
- 2009-04-17 CN CN200980112902.1A patent/CN101990522B/zh not_active Ceased
- 2009-04-17 EP EP09732822A patent/EP2274249A1/en not_active Withdrawn
- 2009-04-17 KR KR1020107025882A patent/KR101258328B1/ko not_active Expired - Fee Related
- 2009-04-17 WO PCT/US2009/040960 patent/WO2009129463A1/en not_active Ceased
- 2009-04-20 TW TW098113100A patent/TW201000424A/zh unknown
-
2014
- 2014-02-28 JP JP2014039076A patent/JP2014144910A/ja not_active Withdrawn
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