JP2011516694A - 一液型エポキシ系構造用接着剤 - Google Patents

一液型エポキシ系構造用接着剤 Download PDF

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Publication number
JP2011516694A
JP2011516694A JP2011504193A JP2011504193A JP2011516694A JP 2011516694 A JP2011516694 A JP 2011516694A JP 2011504193 A JP2011504193 A JP 2011504193A JP 2011504193 A JP2011504193 A JP 2011504193A JP 2011516694 A JP2011516694 A JP 2011516694A
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Japan
Prior art keywords
adhesive
weight
minutes
grams
substrates
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JP2011504193A
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English (en)
Japanese (ja)
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JP2011516694A5 (enExample
Inventor
ジェイ． キャンベル，クリストファー
ブイ． ポシウス，アルフォンサス
ゴロディシャー，イルヤ
エヌ． ガッダム，バブ
エス． マホニー，ウェイン
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3M Innovative Properties Co
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3M Innovative Properties Co
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Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2011516694A publication Critical patent/JP2011516694A/ja
Publication of JP2011516694A5 publication Critical patent/JP2011516694A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086—Triazines; Melamines; Guanamines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2011504193A 2008-04-11 2009-04-10 一液型エポキシ系構造用接着剤 Withdrawn JP2011516694A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12392708P 2008-04-11 2008-04-11
US61/123,927 2008-04-11
PCT/US2009/040164 WO2009126862A1 (en) 2008-04-11 2009-04-10 One-part epoxy-based structural adhesive

Publications (2)

Publication Number Publication Date
JP2011516694A true JP2011516694A (ja) 2011-05-26
JP2011516694A5 JP2011516694A5 (enExample) 2012-05-31

Family

ID=41162260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011504193A Withdrawn JP2011516694A (ja) 2008-04-11 2009-04-10 一液型エポキシ系構造用接着剤

Country Status (6)

Country Link
US (1) US20110024039A1 (enExample)
EP (1) EP2268759A1 (enExample)
JP (1) JP2011516694A (enExample)
KR (1) KR20110005256A (enExample)
CN (1) CN102057010A (enExample)
WO (1) WO2009126862A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011127054A (ja) * 2009-12-21 2011-06-30 Dnp Fine Chemicals Co Ltd 接着組成物および硬化性接着シートの製造方法
KR20150085770A (ko) * 2014-01-16 2015-07-24 더 보잉 컴파니 복합재 구조물의 무결성을 결정하기 위한 방법 및 장치

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102159534B (zh) 2008-07-23 2014-05-07 3M创新有限公司 反应性液体改性剂
US8491749B2 (en) 2008-07-23 2013-07-23 3M Innovative Properties Company Two-part epoxy-based structural adhesives
KR20110034673A (ko) 2008-07-23 2011-04-05 쓰리엠 이노베이티브 프로퍼티즈 컴파니 이액형 에폭시계 구조용 접착제
JP5752126B2 (ja) 2009-09-11 2015-07-22 スリーエム イノベイティブ プロパティズ カンパニー 硬化性及び硬化済み接着剤組成物
US9139756B2 (en) 2009-09-11 2015-09-22 3M Innovative Properties Company Curable and cured adhesive compositions
EP2603568B1 (en) * 2010-08-10 2015-06-03 3M Innovative Properties Company Epoxy structural adhesive
US9051497B2 (en) 2010-11-12 2015-06-09 3M Innovative Properties Company Curable compositions
CN103189411B (zh) 2010-11-12 2015-11-25 3M创新有限公司 可固化组合物和已固化组合物
US20130267136A1 (en) 2010-12-29 2013-10-10 3M Innovative Properties Company Structural hybrid adhesives
CN102191002B (zh) * 2011-04-02 2014-04-09 烟台德邦科技有限公司 一种耐高湿高热单组分环氧胶粘剂及其制备方法
BR112014018129B1 (pt) * 2012-03-23 2021-07-20 Dow Global Technologies Llc Adesivo estrutural termocurável e método para unir um membro de alumínio a um segundo membro metálico
KR101324481B1 (ko) * 2012-06-21 2013-11-01 김정태 방열 접착제 조성물, 이를 이용하여 제조된 발광체 방열회로기판, 및 이의 제조방법
JP6105063B2 (ja) * 2012-08-03 2017-03-29 エルジー・ケム・リミテッド 接着フィルム及びこれを利用した有機電子装置の封止製品
KR101481263B1 (ko) * 2013-04-29 2015-01-13 전북대학교산학협력단 강인화 에폭시 수지 조성물, 이의 제조방법 및 강인화 에폭시 수지
JP6067828B2 (ja) * 2014-11-28 2017-01-25 大日本印刷株式会社 粘着剤組成物及びそれを用いた粘着シート
US10882971B2 (en) * 2015-02-03 2021-01-05 Zephyros, Inc. One part epoxy-based composition
US20180258329A1 (en) * 2015-09-10 2018-09-13 Dow Global Technologies Llc High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillers
DE102015220311A1 (de) * 2015-10-19 2017-04-20 Tesa Se Tangentiales Fügeverfahren
CN105368010B (zh) * 2015-11-13 2020-04-28 中航复合材料有限责任公司 一种室温长贮存期环氧树脂及其制备方法
WO2017151898A1 (en) * 2016-03-02 2017-09-08 3M Innovative Properties Company Composition including epoxy adhesive and aluminum flakes and method for making the same
US11739241B2 (en) 2017-06-23 2023-08-29 Ddp Specialty Electronic Material Us, Llc High temperature epoxy adhesive formulations
FR3068977B1 (fr) 2017-07-12 2020-09-04 Arkema France Composition comprenant un polymere a phases multiples et un polymere (meth)acrylique, son procede de preparation et son utilisation
FR3068979B1 (fr) 2017-07-12 2020-07-31 Arkema France Composition d'adhesif (meth)acrylique, son procede de preparation et son utilisation
FR3068980B1 (fr) 2017-07-12 2020-10-02 Arkema France Composition d'adhesif epoxy comprenant un polymere a etapes multiples et un polymere (meth)acrylique, son procede de preparation et son utilisation
WO2019124713A1 (ko) * 2017-12-21 2019-06-27 주식회사 동성화학 1액형 에폭시계 접착제 조성물 및 이를 이용한 물품
EP3781635A1 (en) 2018-04-20 2021-02-24 3M Innovative Properties Company Method of applying an hvof-resistant tape
JP2021522361A (ja) 2018-04-20 2021-08-30 スリーエム イノベイティブ プロパティズ カンパニー エラストマーバッキング層を有するテープ
CN109054665B (zh) * 2018-06-25 2020-12-01 湖北工业大学 一种高粘接强度耐热水浸泡的金属/塑料复合带制备方法
CN114341289A (zh) 2019-09-25 2022-04-12 3M创新有限公司 多相粘合剂制品及其方法
JP7444048B2 (ja) * 2020-12-22 2024-03-06 株式会社村田製作所 積層セラミックコンデンサ及び積層セラミックコンデンサの製造方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1164124A (en) * 1980-07-15 1984-03-20 Kurt Munk Pourable solid mixture
JPS62501299A (ja) * 1985-06-26 1987-05-21 ザ　ダウ　ケミカル　カンパニ− ゴム改質エポキシ化合物
US4906722A (en) * 1987-12-02 1990-03-06 Ciba-Geigy Corporation Thermosetting reactive systems
EP0511162A1 (de) * 1991-04-24 1992-10-28 Ciba-Geigy Ag Wärmeleitende Klebfilme, Laminate mit wärmeleitenden Klebschichten und deren Verwendung
CA2112410C (en) * 1991-06-26 2003-12-09 Norman E. Blank Reactive hot-melt adhesive
WO1994024212A1 (fr) * 1993-04-20 1994-10-27 Dainippon Ink And Chemicals, Inc. Composition durcissable et procede pour produire un film a partir de cette composition
US5629380A (en) * 1994-09-19 1997-05-13 Minnesota Mining And Manufacturing Company Epoxy adhesive composition comprising a calcium salt and mannich base
US20040181013A1 (en) * 1998-10-06 2004-09-16 Henkel Teroson Gmbh Impact resistant epoxide resin compositions
DE19858921A1 (de) * 1998-12-19 2000-06-21 Henkel Teroson Gmbh Schlagfeste Epoxidharz-Zusammensetzungen
JP2000290348A (ja) * 1999-04-12 2000-10-17 Toagosei Co Ltd 硬化性樹脂組成物
US6554936B1 (en) * 1999-09-08 2003-04-29 Alliant Techsystems Inc. Method of constructing insulated metal dome structure for a rocket motor
US6664318B1 (en) * 1999-12-20 2003-12-16 3M Innovative Properties Company Encapsulant compositions with thermal shock resistance
DE10006592A1 (de) * 2000-02-09 2001-08-23 Schill & Seilacher Latente Kombinationsverbindungen und latente Ammoniumsalze aus Epoxidharzhärter und Flammschutzmittel sowie daraus hergestellte Epoxidharz-Systeme und -Produkte
ES2221909T3 (es) * 2000-04-10 2005-01-16 Henkel Kommanditgesellschaft Auf Aktien Composiciones de resina epoxi resilientes.
US6872762B2 (en) * 2000-07-13 2005-03-29 Loctite (R&D) Limited Epoxy resin composition with solid organic acid
DE10138127A1 (de) * 2001-08-03 2003-02-27 Henkel Kgaa Bindemittelkomponente für Oberflächenbeschichtungsmittel mit verbesserten Hafteigenschaften
US6849589B2 (en) * 2001-10-10 2005-02-01 3M Innovative Properties Company Cleaning composition
EP1431325A1 (de) * 2002-12-17 2004-06-23 Sika Technology AG Hitze-härtbare Epoxidharzzusammensetzung mit verbesserter Tieftemperatur-Schlagzähigkeit
JP2004256781A (ja) * 2003-02-28 2004-09-16 Toshiba Corp コーティング用エポキシ樹脂組成物およびそれを用いた電子機器
US20040191523A1 (en) * 2003-03-24 2004-09-30 Jihong Kye Reactive hot melt adhesive formulation for joining stamped metal and plastic parts
KR101544954B1 (ko) * 2005-05-12 2015-08-18 헴펠 에이/에스 내크랙성 에폭시 도막의 형성 방법 및 상기 방법에 적절한 페인트 조성물
DE602005020260D1 (de) * 2005-06-02 2010-05-12 Dow Global Technologies Inc Schlagzähmodifizierter Strukturklebstoff auf Epoxid Basis
ES2375498T3 (es) * 2005-08-24 2012-03-01 Henkel Ag & Co. Kgaa Resinas epoxi que tienen una resistencia al impacto mejorada.
KR101587666B1 (ko) * 2007-12-18 2016-01-21 다우 글로벌 테크놀로지스 엘엘씨 유리 결합용 접착제에 대한 접착성이 개선된 창 유리용 보호 코팅

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011127054A (ja) * 2009-12-21 2011-06-30 Dnp Fine Chemicals Co Ltd 接着組成物および硬化性接着シートの製造方法
KR20150085770A (ko) * 2014-01-16 2015-07-24 더 보잉 컴파니 복합재 구조물의 무결성을 결정하기 위한 방법 및 장치
JP2015148603A (ja) * 2014-01-16 2015-08-20 ザ・ボーイング・カンパニーＴｈｅＢｏｅｉｎｇ Ｃｏｍｐａｎｙ 複合材構造の統合性を決定するための方法及び装置
KR102201552B1 (ko) 2014-01-16 2021-01-12 더 보잉 컴파니 복합재 구조물의 무결성을 결정하기 위한 방법 및 장치

Also Published As

Publication number Publication date
US20110024039A1 (en) 2011-02-03
KR20110005256A (ko) 2011-01-17
WO2009126862A1 (en) 2009-10-15
CN102057010A (zh) 2011-05-11
EP2268759A1 (en) 2011-01-05

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