JP2011507273A5 - - Google Patents
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- Publication number
- JP2011507273A5 JP2011507273A5 JP2010538014A JP2010538014A JP2011507273A5 JP 2011507273 A5 JP2011507273 A5 JP 2011507273A5 JP 2010538014 A JP2010538014 A JP 2010538014A JP 2010538014 A JP2010538014 A JP 2010538014A JP 2011507273 A5 JP2011507273 A5 JP 2011507273A5
- Authority
- JP
- Japan
- Prior art keywords
- light
- etch stop
- photon energy
- semiconductor structure
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 7
- 150000001875 compounds Chemical class 0.000 claims 4
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 claims 1
- 230000007704 transition Effects 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US1260807P | 2007-12-10 | 2007-12-10 | |
| PCT/US2008/082778 WO2009075973A2 (en) | 2007-12-10 | 2008-11-07 | Semiconductor light emitting device and method of making same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011507273A JP2011507273A (ja) | 2011-03-03 |
| JP2011507273A5 true JP2011507273A5 (enExample) | 2011-12-22 |
Family
ID=40756058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010538014A Pending JP2011507273A (ja) | 2007-12-10 | 2008-11-07 | 半導体発光デバイス及びその作製方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20110121319A1 (enExample) |
| EP (1) | EP2232590A4 (enExample) |
| JP (1) | JP2011507273A (enExample) |
| KR (1) | KR20100099254A (enExample) |
| CN (1) | CN101939855B (enExample) |
| WO (1) | WO2009075973A2 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2332223A1 (en) * | 2008-09-04 | 2011-06-15 | 3M Innovative Properties Company | I i-vi mqw vcsel on a heat sink optically pumped by a gan ld |
| WO2010027580A2 (en) * | 2008-09-04 | 2010-03-11 | 3M Innovative Properties Company | Light source having light blocking components |
| WO2010027581A1 (en) * | 2008-09-04 | 2010-03-11 | 3M Innovative Properties Company | Monochromatic light source |
| EP2380217A2 (en) | 2008-12-24 | 2011-10-26 | 3M Innovative Properties Company | Method of making double-sided wavelength converter and light generating device using same |
| WO2010074987A2 (en) | 2008-12-24 | 2010-07-01 | 3M Innovative Properties Company | Light generating device having double-sided wavelength converter |
| CN102668044A (zh) * | 2009-11-18 | 2012-09-12 | 3M创新有限公司 | 用于ii-vi族半导体的新型湿蚀刻剂及方法 |
| EP2521189A3 (en) * | 2011-04-29 | 2013-05-01 | Institute of Nuclear Energy Research Atomic Energy Council | Lift-off structure for substrate of a photoelectric device and the method thereof |
| US9331252B2 (en) | 2011-08-23 | 2016-05-03 | Micron Technology, Inc. | Wavelength converters, including polarization-enhanced carrier capture converters, for solid state lighting devices, and associated systems and methods |
| US8975614B2 (en) * | 2011-08-23 | 2015-03-10 | Micron Technology, Inc. | Wavelength converters for solid state lighting devices, and associated systems and methods |
| KR20140111876A (ko) | 2013-03-12 | 2014-09-22 | 삼성디스플레이 주식회사 | 표시 장치 |
| CN103579503A (zh) * | 2013-11-14 | 2014-02-12 | 吉林大学 | 一种利用光交联聚合物对有机电子器件进行薄膜封装的方法 |
| CN105849915B (zh) * | 2014-01-06 | 2019-04-02 | 亮锐控股有限公司 | 具有成形衬底的半导体发光器件和制造所述器件的方法 |
| FR3019380B1 (fr) * | 2014-04-01 | 2017-09-01 | Centre Nat Rech Scient | Pixel semiconducteur, matrice de tels pixels, structure semiconductrice pour la realisation de tels pixels et leurs procedes de fabrication |
| CN104810444B (zh) * | 2015-03-04 | 2018-01-09 | 华灿光电(苏州)有限公司 | 发光二极管外延片及其制备方法、发光二极管芯片制备及衬底回收方法 |
| US9847454B2 (en) * | 2015-10-02 | 2017-12-19 | Epistar Corporation | Light-emitting device |
| KR102574122B1 (ko) * | 2016-05-13 | 2023-09-01 | 꼼미사리아 아 레네르지 아토미끄 에뜨 옥스 에너지스 앨터네이티브즈 | 복수의 질화갈륨 다이오드를 포함하는 광전자 장치를 제조하기 위한 방법 |
| JP6760141B2 (ja) * | 2017-03-07 | 2020-09-23 | 信越半導体株式会社 | 発光素子及びその製造方法 |
| US20190123035A1 (en) * | 2017-10-19 | 2019-04-25 | Samsung Electronics Co., Ltd. | Method of performing die-based heterogeneous integration and devices including integrated dies |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4584428A (en) * | 1984-09-12 | 1986-04-22 | Hughes Aircraft Company | Solar energy converter employing a fluorescent wavelength shifter |
| US5055894A (en) * | 1988-09-29 | 1991-10-08 | The Boeing Company | Monolithic interleaved LED/PIN photodetector array |
| JPH02267529A (ja) * | 1989-04-07 | 1990-11-01 | Fuji Photo Film Co Ltd | 光波長変換素子およびその製造方法 |
| US5300788A (en) * | 1991-01-18 | 1994-04-05 | Kopin Corporation | Light emitting diode bars and arrays and method of making same |
| JP3215297B2 (ja) * | 1995-07-18 | 2001-10-02 | 沖電気工業株式会社 | 半導体発光素子の製造方法 |
| DE19542241C2 (de) * | 1995-11-13 | 2003-01-09 | Siemens Ag | Optoelektronisches Bauelement in II-VI-Halbleitermaterial |
| JP3768302B2 (ja) * | 1996-09-13 | 2006-04-19 | 同和鉱業株式会社 | 化合物半導体素子の製造方法 |
| JPH11154774A (ja) * | 1997-08-05 | 1999-06-08 | Canon Inc | 面発光半導体デバイスの製造方法、この方法によって製造された面発光半導体デバイス及びこのデバイスを用いた表示装置 |
| JP3334598B2 (ja) * | 1998-03-25 | 2002-10-15 | 日本電気株式会社 | InP基板上II−VI族化合物半導体薄膜 |
| JP2000012981A (ja) * | 1998-06-19 | 2000-01-14 | Canon Inc | 面型半導体光デバイスおよびその作製方法 |
| JP2002118327A (ja) * | 2000-10-06 | 2002-04-19 | Furukawa Electric Co Ltd:The | 化合物半導体装置の製造方法 |
| TW493286B (en) * | 2001-02-06 | 2002-07-01 | United Epitaxy Co Ltd | Light-emitting diode and the manufacturing method thereof |
| US20050167684A1 (en) * | 2004-01-21 | 2005-08-04 | Chua Janet B.Y. | Device and method for emitting output light using group IIB element selenide-based phosphor material |
| WO2005071039A1 (ja) * | 2004-01-26 | 2005-08-04 | Kyocera Corporation | 波長変換器、発光装置、波長変換器の製造方法および発光装置の製造方法 |
| US7208768B2 (en) * | 2004-04-30 | 2007-04-24 | Sharp Laboratories Of America, Inc. | Electroluminescent device |
| US7973747B2 (en) * | 2004-10-28 | 2011-07-05 | Panasonic Corporation | Display and display driving method |
| US7402831B2 (en) * | 2004-12-09 | 2008-07-22 | 3M Innovative Properties Company | Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission |
| US7745814B2 (en) * | 2004-12-09 | 2010-06-29 | 3M Innovative Properties Company | Polychromatic LED's and related semiconductor devices |
| JP4837295B2 (ja) * | 2005-03-02 | 2011-12-14 | 株式会社沖データ | 半導体装置、led装置、ledヘッド、及び画像形成装置 |
| DE102005047152A1 (de) * | 2005-09-30 | 2007-04-12 | Osram Opto Semiconductors Gmbh | Epitaxiesubstrat, Verfahren zu seiner Herstellung und Verfahren zur Herstellung eines Halbleiterchips |
| JP2007157940A (ja) * | 2005-12-02 | 2007-06-21 | Nichia Chem Ind Ltd | 発光装置および発光装置の製造方法 |
| KR100730072B1 (ko) * | 2005-12-06 | 2007-06-20 | 삼성전기주식회사 | 수직구조 질화갈륨계 발광 다이오드 소자 및 그 제조방법 |
| JP2007250629A (ja) * | 2006-03-14 | 2007-09-27 | Toshiba Corp | 発光装置及びその製造方法、並びに蛍光パターン形成物 |
| US20090115328A1 (en) * | 2006-05-26 | 2009-05-07 | Seiji Yamashita | Surface emitting-type electroluminescent device |
| US7952110B2 (en) * | 2006-06-12 | 2011-05-31 | 3M Innovative Properties Company | LED device with re-emitting semiconductor construction and converging optical element |
| US8188494B2 (en) * | 2006-06-28 | 2012-05-29 | Hewlett-Packard Development Company, L.P. | Utilizing nanowire for generating white light |
| US9018619B2 (en) * | 2006-10-09 | 2015-04-28 | Cree, Inc. | Quantum wells for light conversion |
| US8578427B2 (en) * | 2008-03-04 | 2013-11-05 | The Directv Group, Inc. | Method for swapping channel assignments in a broadcast system |
-
2008
- 2008-11-07 CN CN2008801265426A patent/CN101939855B/zh not_active Expired - Fee Related
- 2008-11-07 KR KR1020107014831A patent/KR20100099254A/ko not_active Withdrawn
- 2008-11-07 WO PCT/US2008/082778 patent/WO2009075973A2/en not_active Ceased
- 2008-11-07 EP EP08858438.8A patent/EP2232590A4/en not_active Withdrawn
- 2008-11-07 JP JP2010538014A patent/JP2011507273A/ja active Pending
- 2008-11-07 US US12/744,553 patent/US20110121319A1/en not_active Abandoned
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