JP2011504134A5 - - Google Patents

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Publication number
JP2011504134A5
JP2011504134A5 JP2010533253A JP2010533253A JP2011504134A5 JP 2011504134 A5 JP2011504134 A5 JP 2011504134A5 JP 2010533253 A JP2010533253 A JP 2010533253A JP 2010533253 A JP2010533253 A JP 2010533253A JP 2011504134 A5 JP2011504134 A5 JP 2011504134A5
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JP
Japan
Prior art keywords
pillar
composite assembly
electrode
pillars
width
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JP2010533253A
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English (en)
Japanese (ja)
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JP5422847B2 (ja
JP2011504134A (ja
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Priority claimed from PCT/US2008/082701 external-priority patent/WO2009061970A1/en
Publication of JP2011504134A publication Critical patent/JP2011504134A/ja
Publication of JP2011504134A5 publication Critical patent/JP2011504134A5/ja
Application granted granted Critical
Publication of JP5422847B2 publication Critical patent/JP5422847B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010533253A 2007-11-06 2008-11-06 基板を処理するための複合トランスデューサー装置及びシステム、及びそれを造る方法 Expired - Fee Related JP5422847B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US98594707P 2007-11-06 2007-11-06
US60/985,947 2007-11-06
US3414208P 2008-03-05 2008-03-05
US61/034,142 2008-03-05
PCT/US2008/082701 WO2009061970A1 (en) 2007-11-06 2008-11-06 Composite transducer apparatus and system for processing a substrate and method of constructing the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013231278A Division JP2014112829A (ja) 2007-11-06 2013-11-07 基板を処理するための装置及び方法

Publications (3)

Publication Number Publication Date
JP2011504134A JP2011504134A (ja) 2011-02-03
JP2011504134A5 true JP2011504134A5 (https=) 2011-03-31
JP5422847B2 JP5422847B2 (ja) 2014-02-19

Family

ID=40626179

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010533253A Expired - Fee Related JP5422847B2 (ja) 2007-11-06 2008-11-06 基板を処理するための複合トランスデューサー装置及びシステム、及びそれを造る方法
JP2013231278A Pending JP2014112829A (ja) 2007-11-06 2013-11-07 基板を処理するための装置及び方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013231278A Pending JP2014112829A (ja) 2007-11-06 2013-11-07 基板を処理するための装置及び方法

Country Status (5)

Country Link
US (2) US8279712B2 (https=)
JP (2) JP5422847B2 (https=)
KR (1) KR101226071B1 (https=)
CN (2) CN102974524B (https=)
WO (1) WO2009061970A1 (https=)

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US8551251B2 (en) 2011-04-28 2013-10-08 Lam Research Ag Ultrasonic treatment method and apparatus
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KR102339058B1 (ko) 2016-03-11 2021-12-16 한국전자통신연구원 유연 압전 콤포지트 및 이를 포함하는 압전 장치
JP6907539B2 (ja) * 2017-01-06 2021-07-21 セイコーエプソン株式会社 超音波デバイス、超音波プローブ、及び超音波装置
KR101919454B1 (ko) 2017-07-31 2018-11-16 엘지디스플레이 주식회사 디스플레이 장치 및 이를 이용한 컴퓨팅 장치
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KR102683447B1 (ko) * 2019-03-29 2024-07-08 엘지디스플레이 주식회사 표시 장치
KR102721452B1 (ko) 2019-03-29 2024-10-23 엘지디스플레이 주식회사 플렉서블 진동 모듈 및 이를 포함하는 표시 장치
KR102662671B1 (ko) * 2019-03-29 2024-04-30 엘지디스플레이 주식회사 표시 장치
KR102679871B1 (ko) * 2019-04-03 2024-06-28 엘지디스플레이 주식회사 표시장치
CN110572756A (zh) * 2019-09-11 2019-12-13 京东方科技集团股份有限公司 定向薄膜换能器及其制备方法、扬声器
KR102759031B1 (ko) 2019-12-09 2025-01-22 엘지디스플레이 주식회사 표시장치
KR102763470B1 (ko) 2019-12-16 2025-02-05 엘지디스플레이 주식회사 표시장치
CN111085942B (zh) * 2019-12-31 2021-10-15 中国计量大学 一种基于相控空化效应的磨粒微射流抛光方法及抛光装置
KR102743312B1 (ko) * 2020-03-04 2024-12-13 엘지디스플레이 주식회사 표시장치
US12114117B2 (en) * 2020-12-09 2024-10-08 Lg Display Co., Ltd. Apparatus including vibration member to generate sound and vibration for enhancing sound characteristic and sound pressure level characteristic
KR102867807B1 (ko) * 2020-12-09 2025-10-01 엘지디스플레이 주식회사 장치
KR102904853B1 (ko) * 2020-12-22 2025-12-24 엘지디스플레이 주식회사 진동 장치 및 이를 포함하는 장치
CN113058767B (zh) * 2021-03-05 2022-05-31 Tcl华星光电技术有限公司 支撑柱及对位机构
KR20230084941A (ko) * 2021-12-06 2023-06-13 엘지디스플레이 주식회사 장치
KR20230096545A (ko) * 2021-12-23 2023-06-30 엘지디스플레이 주식회사 장치
KR20230103751A (ko) * 2021-12-31 2023-07-07 엘지디스플레이 주식회사 장치 및 이를 포함하는 운송 장치
CN116159730A (zh) * 2022-12-23 2023-05-26 东莞市西喆电子有限公司 一种超声波兆声清洗振板

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