JP2011502459A5 - - Google Patents
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- Publication number
- JP2011502459A5 JP2011502459A5 JP2009546586A JP2009546586A JP2011502459A5 JP 2011502459 A5 JP2011502459 A5 JP 2011502459A5 JP 2009546586 A JP2009546586 A JP 2009546586A JP 2009546586 A JP2009546586 A JP 2009546586A JP 2011502459 A5 JP2011502459 A5 JP 2011502459A5
- Authority
- JP
- Japan
- Prior art keywords
- power assembly
- cooling device
- assembly according
- attached
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 32
- 239000004033 plastic Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims description 8
- 239000000789 fastener Substances 0.000 claims description 7
- 239000003990 capacitor Substances 0.000 claims description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 3
- 239000003507 refrigerant Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 229920001721 Polyimide Polymers 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- 230000000712 assembly Effects 0.000 claims description 2
- -1 polybutylene terephthalate Polymers 0.000 claims description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 2
- 229920001955 polyphenylene ether Polymers 0.000 claims description 2
- 239000002470 thermal conductor Substances 0.000 description 3
- SYJPAKDNFZLSMV-HYXAFXHYSA-N (Z)-2-methylpropanal oxime Chemical compound CC(C)\C=N/O SYJPAKDNFZLSMV-HYXAFXHYSA-N 0.000 description 2
- 239000004727 Noryl Substances 0.000 description 2
- 229920001207 Noryl Polymers 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006011 modification reaction Methods 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/932,479 US7876561B2 (en) | 2007-01-22 | 2007-10-31 | Cooling systems for variable speed drives and inductors |
| PCT/US2008/052215 WO2008092158A1 (en) | 2007-01-22 | 2008-01-28 | Cooling system for variable speed drives and inductors |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014087182A Division JP6055437B2 (ja) | 2007-10-31 | 2014-04-21 | 可変速ドライブシステム用パワーアセンブリ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011502459A JP2011502459A (ja) | 2011-01-20 |
| JP2011502459A5 true JP2011502459A5 (zh) | 2012-12-20 |
Family
ID=43597704
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009546586A Pending JP2011502459A (ja) | 2007-10-31 | 2008-01-28 | 可変速ドライブ及びインダクタ用の冷却システム |
| JP2014087182A Active JP6055437B2 (ja) | 2007-10-31 | 2014-04-21 | 可変速ドライブシステム用パワーアセンブリ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014087182A Active JP6055437B2 (ja) | 2007-10-31 | 2014-04-21 | 可変速ドライブシステム用パワーアセンブリ |
Country Status (2)
| Country | Link |
|---|---|
| JP (2) | JP2011502459A (zh) |
| KR (2) | KR101762201B1 (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106104996B (zh) | 2014-02-03 | 2019-07-05 | 约翰逊控制技术公司 | 用于冷却器应用中的变速传动装置的多脉冲恒压变压器 |
| DE102016219309B4 (de) | 2016-10-05 | 2024-05-02 | Vitesco Technologies GmbH | Vibrationsfeste Schaltungsanordnung zum elektrischen Verbinden zweier Anschlussbereiche sowie Kraftfahrzeug und Verfahren zum Herstellen der Schaltungsanordnung |
| KR102407729B1 (ko) * | 2020-04-10 | 2022-06-13 | 주식회사 엘지유플러스 | 3차원 입체 콘텐츠 서비스 제공 시스템 및 방법 |
| JP7388319B2 (ja) * | 2020-09-02 | 2023-11-29 | 株式会社デンソー | 電力変換装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3203475B2 (ja) * | 1996-06-28 | 2001-08-27 | 株式会社日立製作所 | 半導体装置 |
| US6434003B1 (en) * | 2001-04-24 | 2002-08-13 | York International Corporation | Liquid-cooled power semiconductor device heatsink |
| JP4464806B2 (ja) * | 2004-12-08 | 2010-05-19 | 三菱電機株式会社 | 電力変換装置 |
| JP4708951B2 (ja) * | 2005-10-21 | 2011-06-22 | ニチコン株式会社 | インバータモジュールおよびそれを用いたインバータ一体型交流モータ |
-
2008
- 2008-01-28 JP JP2009546586A patent/JP2011502459A/ja active Pending
- 2008-01-28 KR KR1020167002400A patent/KR101762201B1/ko active IP Right Grant
- 2008-01-28 KR KR1020147034214A patent/KR20150014950A/ko not_active Application Discontinuation
-
2014
- 2014-04-21 JP JP2014087182A patent/JP6055437B2/ja active Active
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