JP2011251345A5 - - Google Patents

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Publication number
JP2011251345A5
JP2011251345A5 JP2011204016A JP2011204016A JP2011251345A5 JP 2011251345 A5 JP2011251345 A5 JP 2011251345A5 JP 2011204016 A JP2011204016 A JP 2011204016A JP 2011204016 A JP2011204016 A JP 2011204016A JP 2011251345 A5 JP2011251345 A5 JP 2011251345A5
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JP
Japan
Prior art keywords
beam irradiation
protective sheet
laser beam
assist gas
processing
Prior art date
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Application number
JP2011204016A
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English (en)
Japanese (ja)
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JP2011251345A (ja
JP5360177B2 (ja
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Priority to JP2011204016A priority Critical patent/JP5360177B2/ja
Priority claimed from JP2011204016A external-priority patent/JP5360177B2/ja
Publication of JP2011251345A publication Critical patent/JP2011251345A/ja
Publication of JP2011251345A5 publication Critical patent/JP2011251345A5/ja
Application granted granted Critical
Publication of JP5360177B2 publication Critical patent/JP5360177B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011204016A 2005-06-27 2011-09-20 レーザ加工方法およびレーザ加工ヘッド Expired - Fee Related JP5360177B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011204016A JP5360177B2 (ja) 2005-06-27 2011-09-20 レーザ加工方法およびレーザ加工ヘッド

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005186047 2005-06-27
JP2005186047 2005-06-27
JP2011204016A JP5360177B2 (ja) 2005-06-27 2011-09-20 レーザ加工方法およびレーザ加工ヘッド

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2006551667A Division JP4978195B2 (ja) 2005-06-27 2006-06-20 レーザ加工方法およびレーザ加工ヘッド

Publications (3)

Publication Number Publication Date
JP2011251345A JP2011251345A (ja) 2011-12-15
JP2011251345A5 true JP2011251345A5 (enExample) 2012-07-12
JP5360177B2 JP5360177B2 (ja) 2013-12-04

Family

ID=37595169

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2006551667A Expired - Fee Related JP4978195B2 (ja) 2005-06-27 2006-06-20 レーザ加工方法およびレーザ加工ヘッド
JP2011204016A Expired - Fee Related JP5360177B2 (ja) 2005-06-27 2011-09-20 レーザ加工方法およびレーザ加工ヘッド
JP2011204015A Expired - Fee Related JP5360176B2 (ja) 2005-06-27 2011-09-20 レーザ加工方法およびレーザ加工ヘッド

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2006551667A Expired - Fee Related JP4978195B2 (ja) 2005-06-27 2006-06-20 レーザ加工方法およびレーザ加工ヘッド

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011204015A Expired - Fee Related JP5360176B2 (ja) 2005-06-27 2011-09-20 レーザ加工方法およびレーザ加工ヘッド

Country Status (5)

Country Link
JP (3) JP4978195B2 (enExample)
KR (1) KR100853073B1 (enExample)
CN (3) CN102151992B (enExample)
TW (1) TWI295206B (enExample)
WO (1) WO2007000915A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100078418A1 (en) * 2008-09-26 2010-04-01 Electro Scientific Industries, Inc. Method of laser micro-machining stainless steel with high cosmetic quality
WO2011158617A1 (ja) 2010-06-14 2011-12-22 三菱電機株式会社 レーザ加工装置、及びレーザ加工方法
GB2482190A (en) * 2010-07-23 2012-01-25 New Transducers Ltd Methods of generating a desired haptic sensation in a touch sensitive device
JP6260136B2 (ja) * 2013-08-07 2018-01-17 株式会社Ｇｓユアサ 蓄電素子の製造方法および蓄電素子
CN103978312A (zh) * 2014-04-16 2014-08-13 苏州萃田精密机械有限公司 一种铝板表面凹槽加工装置
CN104043904A (zh) * 2014-06-09 2014-09-17 江苏大学 一种背面侧吹气体辅助激光切割的方法及装置
DE102015215316A1 (de) * 2015-08-11 2016-06-30 Schuler Automation Gmbh & Co. Kg Verfahren zur Herstellung einer Blechplatine mittels Laserschneiden und Verwendung einer Kunststofffolie
JP6315634B2 (ja) 2016-05-18 2018-04-25 株式会社アマダホールディングス 複合加工システム及びレーザ切断加工方法
CN109759728B (zh) * 2019-01-23 2020-08-14 西安交通大学 一种利用增加保护层改善微孔形貌的方法
CN109877448A (zh) * 2019-03-20 2019-06-14 大族激光科技产业集团股份有限公司 一种柔性膜材的加工系统及加工方法
CN114888454A (zh) * 2022-05-25 2022-08-12 深圳市杰普特光电股份有限公司 一种电池极片的切割方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0543994Y2 (enExample) * 1985-07-19 1993-11-08
JPH02286327A (ja) * 1989-04-28 1990-11-26 Amada Co Ltd レーザ加工用の金属板
CN1040514C (zh) * 1993-10-21 1998-11-04 三菱电机株式会社 加工头及激光加工装置
JP3405799B2 (ja) * 1994-03-04 2003-05-12 ファナック株式会社 レーザ加工方法
JP3512634B2 (ja) * 1998-05-11 2004-03-31 三菱電機株式会社 レーザ加工方法、被レーザ加工物の生産方法、およびレーザ加工装置、並びに、レーザ加工または被レーザ加工物の生産方法をコンピュータに実行させるプログラムを格納したコンピュータが読取可能な記録媒体
JP4366534B2 (ja) * 2000-02-01 2009-11-18 澁谷工業株式会社 レーザ加工方法
JP4304808B2 (ja) * 2000-02-04 2009-07-29 澁谷工業株式会社 レーザ加工方法
JP4221540B2 (ja) * 2000-06-27 2009-02-12 澁谷工業株式会社 レーザ加工方法およびその装置
JP3425425B2 (ja) * 2000-07-07 2003-07-14 日本車輌製造株式会社 極薄金属板のレーザ切断加工装置
US6423928B1 (en) * 2000-10-12 2002-07-23 Ase Americas, Inc. Gas assisted laser cutting of thin and fragile materials
JP2002283088A (ja) * 2001-03-23 2002-10-02 Sumitomo Heavy Ind Ltd レーザ加工の裏面傷防止方法及びレーザ加工装置
TW524726B (en) * 2001-04-23 2003-03-21 Furukawa Electric Co Ltd Adhesive tape for laser dicing
JP2004322157A (ja) * 2003-04-25 2004-11-18 Nitto Denko Corp 被加工物の加工方法、及びこれに用いる粘着シート
CN1579697A (zh) * 2003-08-07 2005-02-16 鸿富锦精密工业（深圳）有限公司 一种激光加工方法
CN1704213A (zh) * 2004-05-28 2005-12-07 宝丽科技集团有限公司 具双喷嘴的脆性工件切割设备
JP4873863B2 (ja) * 2005-01-14 2012-02-08 日東電工株式会社 レーザー加工品の製造方法及びレーザー加工用粘着シート
JP2006255728A (ja) * 2005-03-15 2006-09-28 Amada Co Ltd レーザ加工装置及びレーザ加工方法

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