JP2011245858A5 - - Google Patents

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Publication number
JP2011245858A5
JP2011245858A5 JP2011111715A JP2011111715A JP2011245858A5 JP 2011245858 A5 JP2011245858 A5 JP 2011245858A5 JP 2011111715 A JP2011111715 A JP 2011111715A JP 2011111715 A JP2011111715 A JP 2011111715A JP 2011245858 A5 JP2011245858 A5 JP 2011245858A5
Authority
JP
Japan
Prior art keywords
die
print head
nozzle
cavity
nozzle plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011111715A
Other languages
English (en)
Japanese (ja)
Other versions
JP5639009B2 (ja
JP2011245858A (ja
Filing date
Publication date
Priority claimed from US12/789,444 external-priority patent/US8342652B2/en
Application filed filed Critical
Publication of JP2011245858A publication Critical patent/JP2011245858A/ja
Publication of JP2011245858A5 publication Critical patent/JP2011245858A5/ja
Application granted granted Critical
Publication of JP5639009B2 publication Critical patent/JP5639009B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011111715A 2010-05-27 2011-05-18 インクジェット印刷ヘッド Expired - Fee Related JP5639009B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/789,444 US8342652B2 (en) 2010-05-27 2010-05-27 Molded nozzle plate with alignment features for simplified assembly
US12/789,444 2010-05-27

Publications (3)

Publication Number Publication Date
JP2011245858A JP2011245858A (ja) 2011-12-08
JP2011245858A5 true JP2011245858A5 (https=) 2014-06-19
JP5639009B2 JP5639009B2 (ja) 2014-12-10

Family

ID=45006411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011111715A Expired - Fee Related JP5639009B2 (ja) 2010-05-27 2011-05-18 インクジェット印刷ヘッド

Country Status (3)

Country Link
US (1) US8342652B2 (https=)
JP (1) JP5639009B2 (https=)
CN (1) CN102259494B (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10632752B2 (en) 2013-02-28 2020-04-28 Hewlett-Packard Development Company, L.P. Printed circuit board fluid flow structure and method for making a printed circuit board fluid flow structure
US9446587B2 (en) 2013-02-28 2016-09-20 Hewlett-Packard Development Company, L.P. Molded printhead
BR112015020862B1 (pt) * 2013-02-28 2021-05-25 Hewlett-Packard Development Company, L.P. barra de impressão moldada
US9539814B2 (en) 2013-02-28 2017-01-10 Hewlett-Packard Development Company, L.P. Molded printhead
US10029467B2 (en) 2013-02-28 2018-07-24 Hewlett-Packard Development Company, L.P. Molded printhead
EP2961612B1 (en) 2013-02-28 2019-08-07 Hewlett-Packard Development Company, L.P. Molding a fluid flow structure
US9656469B2 (en) 2013-02-28 2017-05-23 Hewlett-Packard Development Company, L.P. Molded fluid flow structure with saw cut channel
EP3330087A1 (en) 2013-02-28 2018-06-06 Hewlett-Packard Development Company, L.P. Molded fluid flow structure
US10821729B2 (en) 2013-02-28 2020-11-03 Hewlett-Packard Development Company, L.P. Transfer molded fluid flow structure
US9724920B2 (en) 2013-03-20 2017-08-08 Hewlett-Packard Development Company, L.P. Molded die slivers with exposed front and back surfaces
US9895888B2 (en) * 2014-04-22 2018-02-20 Hewlett-Packard Development Company, L.P. Fluid flow structure
KR101492396B1 (ko) 2014-09-11 2015-02-13 주식회사 우심시스템 어레이형 잉크 카트리지
EP3212411B1 (en) * 2014-10-28 2019-11-27 Hewlett-Packard Development Company, L.P. Printhead with microelectromechanical die and application specific integrated circuit
CN110431017B (zh) * 2017-06-13 2022-02-15 惠普发展公司，有限责任合伙企业 液体分配器
JP6893251B2 (ja) * 2017-06-13 2021-06-23 ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． ワイパーブレードの位置
JP6887558B2 (ja) 2017-07-28 2021-06-16 ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． 成形本体と互いに噛み合わされた流体吐出ダイ
EP3717260B1 (en) 2019-02-06 2024-04-10 Hewlett-Packard Development Company, L.P. Movable mold insert adjuster

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60219060A (ja) * 1984-04-17 1985-11-01 Canon Inc 液体噴射記録装置
EP0659573B1 (en) * 1993-12-22 2000-03-22 Canon Kabushiki Kaisha Liquid jet head, liquid jet head cartridge and liquid jet apparatus
US5563641A (en) * 1994-09-23 1996-10-08 Compaq Computer Corporation Removable orifice plate for ink jet printhead and securing apparatus
JPH10157139A (ja) * 1996-12-04 1998-06-16 Canon Inc 液体噴射記録ヘッドの製造方法
JP2001071512A (ja) * 1999-02-10 2001-03-21 Canon Inc 液体吐出ヘッドの製造方法、液体吐出ヘッド、及び吐出口プレートの製造方法
JP2000334955A (ja) * 1999-05-27 2000-12-05 Canon Inc 液体吐出ヘッド、該液体吐出ヘッドの製造方法及び前記液体吐出ヘッドを用いた液体吐出記録装置
JP2001199073A (ja) * 2000-01-18 2001-07-24 Canon Inc 液体吐出ヘッド
JP2001347659A (ja) * 2000-06-07 2001-12-18 Seiko Epson Corp インクジェット記録ヘッド
AUPR399501A0 (en) * 2001-03-27 2001-04-26 Silverbrook Research Pty. Ltd. An apparatus and method(ART107)
JP4682552B2 (ja) * 2004-07-22 2011-05-11 ブラザー工業株式会社 インクジェットヘッド
JP4973840B2 (ja) * 2005-08-31 2012-07-11 セイコーエプソン株式会社 液体噴射ヘッド及び液体噴射装置及び液体噴射ヘッドの製造方法

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