JP2011195814A5 - - Google Patents

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Publication number
JP2011195814A5
JP2011195814A5 JP2011025619A JP2011025619A JP2011195814A5 JP 2011195814 A5 JP2011195814 A5 JP 2011195814A5 JP 2011025619 A JP2011025619 A JP 2011025619A JP 2011025619 A JP2011025619 A JP 2011025619A JP 2011195814 A5 JP2011195814 A5 JP 2011195814A5
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JP
Japan
Prior art keywords
unit
polyamide resin
aromatic
weight
parts
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Application number
JP2011025619A
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English (en)
Japanese (ja)
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JP5790005B2 (ja
JP2011195814A (ja
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Priority to JP2011025619A priority Critical patent/JP5790005B2/ja
Priority claimed from JP2011025619A external-priority patent/JP5790005B2/ja
Publication of JP2011195814A publication Critical patent/JP2011195814A/ja
Publication of JP2011195814A5 publication Critical patent/JP2011195814A5/ja
Application granted granted Critical
Publication of JP5790005B2 publication Critical patent/JP5790005B2/ja
Expired - Fee Related legal-status Critical Current
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JP2011025619A 2010-02-26 2011-02-09 ポリアミド樹脂組成物およびその製造方法 Expired - Fee Related JP5790005B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011025619A JP5790005B2 (ja) 2010-02-26 2011-02-09 ポリアミド樹脂組成物およびその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010041479 2010-02-26
JP2010041479 2010-02-26
JP2011025619A JP5790005B2 (ja) 2010-02-26 2011-02-09 ポリアミド樹脂組成物およびその製造方法

Publications (3)

Publication Number Publication Date
JP2011195814A JP2011195814A (ja) 2011-10-06
JP2011195814A5 true JP2011195814A5 (OSRAM) 2013-05-09
JP5790005B2 JP5790005B2 (ja) 2015-10-07

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Family Applications (1)

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JP2011025619A Expired - Fee Related JP5790005B2 (ja) 2010-02-26 2011-02-09 ポリアミド樹脂組成物およびその製造方法

Country Status (1)

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JP (1) JP5790005B2 (OSRAM)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103703080B (zh) 2011-07-25 2016-09-21 东丽株式会社 冲击吸收部件用热塑性树脂组合物及其制造方法
EP2896656B1 (en) * 2012-09-14 2019-05-08 Toray Industries, Inc. Polyamide resin composition and molded article
JP6354379B2 (ja) * 2013-06-28 2018-07-11 東レ株式会社 ポリアミド樹脂組成物
CN105492537B (zh) * 2013-10-11 2018-01-16 东丽株式会社 碳纤维强化树脂组合物、粒料、成型品以及电子设备壳体
JP6733154B2 (ja) * 2015-11-19 2020-07-29 東レ株式会社 ウエルドを有する成形品
CN111138850B (zh) * 2019-12-12 2021-08-13 金发科技股份有限公司 一种聚酰胺复合材料及其制备方法
CN112961000B (zh) * 2021-02-07 2022-07-26 汝南禾尔丰流体肥业有限公司 一种含氨甲环酸的水溶性钛肥及其施用方法
CN116410587B (zh) * 2021-12-30 2024-06-14 合肥杰事杰新材料股份有限公司 一种耐摩擦pa6复合材料及其制备方法
CN114381116B (zh) * 2022-02-17 2024-03-19 上海金发科技发展有限公司 一种无卤阻燃聚酰胺复合材料及其制备方法与应用
CN114874603B (zh) * 2022-05-31 2024-07-09 扬州市天宇鞋业有限公司 一种基于聚酰亚胺纳米纤维的复合材料及其制备方法
KR20250052286A (ko) * 2023-10-10 2025-04-18 주식회사 삼양사 폐어망으로부터 분리된 재활용 폴리아미드 수지 조성물 및 이를 포함하는 성형품

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000034404A (ja) * 1998-05-12 2000-02-02 Toray Ind Inc ポリアミド樹脂組成物および成形品
JP4600016B2 (ja) * 2004-08-27 2010-12-15 東レ株式会社 熱可塑性樹脂組成物およびその製造方法
JP5182914B2 (ja) * 2006-03-30 2013-04-17 東レ株式会社 樹状ポリエステル、その製造方法および熱可塑性樹脂組成物
JP5098461B2 (ja) * 2006-06-27 2012-12-12 東レ株式会社 熱可塑性樹脂組成物およびその成形品
JP2008156618A (ja) * 2006-11-30 2008-07-10 Toray Ind Inc ポリアミド樹脂組成物およびその成形品

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