JP2011193175A - Crystal vibration plate and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make a crystal vibration plate perform thickness sliding vibration while confining vibration energy and suppressing oscillation of contour vibration. <P>SOLUTION: There is provided the crystal vibration plate 10 in which at least a part of side surfaces 11 along an X-axis direction of a quartz crystal is a first inclined surface 11a having an angle formed between itself and front and rear surfaces 10a which exceeds an angle formed by an m-plane of the quartz crystal and falls within an angle range of <180°, wherein the first inclined surface is formed by wet etching utilizing an etching liquid prepared by blending a hydrofluoric acid with an additive for increasing a viscosity of the hydrofluoric acid or an additive made of alcohols. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a quartz crystal plate manufactured by etching a quartz plate cut out from quartz and a method for manufacturing the quartz plate.

Various materials are known as materials that can be expected to have a piezoelectric effect. Conventionally, quartz that can obtain a stable and accurate frequency is preferably used. A crystal resonator is known as one of devices using this crystal.
This crystal unit is mainly composed of a crystal resonator element in which an electrode film is formed on a crystal diaphragm processed into a predetermined shape, and a holder for packaging the crystal resonator element in an airtight state. Built in various electronic devices. In recent years, these electronic devices are required to be reduced in size and size, and accordingly, further reduction in the size of crystal units is also required.

  Therefore, it is required to further reduce the size of the quartz crystal plate itself that can determine the size of the quartz crystal resonator. Conventionally, when producing a quartz diaphragm, it is common to form a quartz diaphragm by forming an outer shape by machining on a quartz plate cut out from a quartz crystal at a predetermined cutting angle. However, machining has a limit in machining accuracy, and it is becoming difficult to produce a finer and smaller quartz crystal plate. Therefore, at present, the processing method of the crystal diaphragm is changing from mechanical processing to a method using photolithography technology and etching processing technology.

Incidentally, quartz has various vibration modes depending on its crystallinity and piezoelectricity, and parameters for determining the frequency differ depending on the vibration mode. Among these, an AT vibrating piece that performs thickness-slip vibration is known as a quartz crystal vibrating piece whose thickness is a parameter.
This AT vibrating piece is formed into a predetermined thickness and rectangular shape after AT is cut (cut so that the main surfaces of the front and back surfaces are at an angle of about 35 degrees 15 minutes from the Z axis in the counterclockwise direction around the X axis). It is a vibration piece composed of an externally formed AT diaphragm (quartz crystal diaphragm) and an electrode film formed on the main surface of the AT diaphragm. When a voltage is applied to the electrode film, the AT diaphragm Oscillates in thickness and thickness.

  In such an AT diaphragm, if the thickness is gradually reduced from the center to the end, the attenuation of vibration displacement at the end increases, and the effect of confining vibration energy in the center can be expected. It has been known. This effect leads to improvement of frequency characteristics such as CI value and Q value. Therefore, it is preferable to make such a shape when manufacturing the AT diaphragm. Specifically, a convex shape in which the main surface of the AT diaphragm is a convex curved surface, a bevel shape in which a central portion and an end portion of the main surface are connected by an inclined surface, and the like.

  However, when the AT diaphragm is manufactured by machining, the convex shape and the bevel shape can be easily formed. However, the convex shape and the bevel shape are formed by using a photolithography technique and an etching process. Is difficult and practically nearly impossible. Therefore, it is important to take measures to change the convex shape or the bevel shape when shifting the processing method of the quartz crystal plate from mechanical processing to photolithography technology and etching processing technology.

Therefore, the first crystal surface is formed in a rectangular shape having a long side in the X-axis direction of the crystal crystal, and the side surface in the long side direction is the m-plane which is a natural surface of the crystal, and a crystal plane other than the m-plane There is known an AT diaphragm formed by two surfaces, ie, a second surface (see Patent Document 1).
This AT diaphragm is manufactured by performing an etching process (wet etching process) after disposing the mask on the substrate surface side with respect to the mask on the back side of the substrate in the Z′-axis direction of the crystal crystal. . By shifting the mask in this way, the first surface and the second surface having different inclination angles can be formed on the side surfaces by the etching anisotropy peculiar to quartz.
Thus, by forming a side surface with the first surface and the second surface, it is possible to improve the confinement effect of vibration energy, which is adopted as a countermeasure to change to a convex shape or a bevel shape.

  It is also possible to form a third surface and a fourth surface having different inclination angles on the side surface along the Z′-axis direction of the crystal crystal by applying a technique of performing etching while shifting the mask. It is said that. Also in this case, the etching anisotropy peculiar to quartz is utilized. In this case as well, it is possible to improve the confinement effect of vibration energy, which is adopted as a countermeasure to change to a convex shape or a bevel shape.

JP 2008-67345 A

However, the following problems still remain in the conventional AT diaphragm described above.
That is, the first surface and the second surface having different inclination angles are formed on the side surfaces by using etching anisotropy, and the first surface is an m-plane which is a natural crystal plane. Therefore, the angle formed by the first surface and the main surface is expected to be approximately 150 degrees. On the other hand, the second surface is a surface inclined by about 3 degrees with respect to the normal direction of the main surface. Therefore, the angle formed by the second surface and the main surface is expected to be approximately 93 degrees.

By the way, when the AT diaphragm undergoes thickness shear vibration, it is preferable that the vibration displacement is large at the center of the main surface and the vibration displacement is attenuated at the end of the main surface along the Z′-axis direction. Along with the ridgeline created between the first surface and the main surface, and the ridgeline created between the second surface and the main surface when formed by the first surface and the second surface, There was a problem that contour vibration oscillated.
In particular, the angle formed between the second surface and the main surface is approximately 93 degrees, and the ridge line between the second surface and the main surface is a ridge line with a corner. Therefore, the contour vibration is strongly oscillated. In addition, since the angle formed between the first surface and the main surface is approximately 150 degrees, the ridge line between the first surface and the main surface is slightly angled, but the contour vibration still remains. It was easy to oscillate.
Therefore, the contour vibration oscillated at the ridgeline has an influence on the original thickness-slip vibration, and the vibration characteristics are deteriorated.

The above problem is also considered to be the same when the third surface and the fourth surface are formed on the side surface along the Z′-axis direction of the quartz crystal. That is, in consideration of the etching rate in a general etching solution in this case, the angle formed between the third surface and the main surface is about 140 degrees, and the angle formed between the fourth surface and the main surface is approximately 130 degrees. It is considered to be a degree.
Therefore, the contour vibration is easily oscillated at the ridge line between the third surface and the main surface and the ridge line between the fourth surface and the main surface, which leads to a decrease in vibration characteristics.

  The present invention has been made in view of such circumstances, and the object thereof is a crystal diaphragm capable of causing thickness-shear vibration while confining vibration energy and suppressing oscillation of contour vibration, and It is to provide a manufacturing method thereof.

The present invention provides the following means in order to solve the above problems.
(1) The quartz crystal plate according to the present invention is a quartz plate in which an AT-cut quartz plate is formed in a rectangular shape in plan view, and at least a part of the side surface along the X-axis direction of the quartz crystal is The angle formed by the front and back main surfaces exceeds the angle created by the m-plane of the quartz crystal and falls within an angle range of less than 180 degrees, and the first inclined surface is added to the hydrofluoric acid. It is formed by the wet etching process using the etching liquid which added the additive which raises the viscosity of an acid, or the additive which consists of alcohol.

The crystal diaphragm according to the present invention is formed in a rectangular shape in plan view by wet-etching a crystal plate obtained by AT-cutting the crystal. In particular, the outer shape is formed by wet etching to create side surfaces. At this time, at least a part of the side surfaces along the X-axis direction of the crystal crystal is formed on the front and back main surfaces by utilizing the etching anisotropy peculiar to crystal. It can be set as the 1st inclined surface inclined with respect to.
At this time, as an etchant used for wet etching, an etchant obtained by adding an additive for increasing the viscosity of hydrofluoric acid or an additive made of alcohol to hydrofluoric acid is used. Can be suppressed lower than in the conventional case. Accordingly, it is possible to prolong the time until a new etching solution reaches the region where etching has progressed, and it is possible to perform processing while suppressing the progress of etching.

Therefore, the inclination angle of the first inclined surface can be made gentler than before, and the angle formed with the front and back main surfaces exceeds the angle created by the m-plane of the crystal crystal and falls within an angle range of less than 180 degrees. Can be an angle. That is, in the present invention, an inclination angle of approximately 150 degrees is a moderately inclined surface having an inclination angle of greater than approximately 150 degrees and less than 180 degrees in the present invention. be able to.
Therefore, the first inclined surface with a gentle inclination can be expected to have the same effect as the bevel shape performed by the conventional machining, that is, the effect of confining vibration energy. In addition to this, the ridgeline created between the first inclined surface and the front and back main surfaces can be a ridgeline that is less angled (unrecognizable) than the conventional one, so that contour vibration is oscillated on this ridgeline. Can be difficult. Therefore, the influence on the thickness shear vibration can be reduced, and the vibration characteristics can be improved.

(2) The quartz crystal plate according to the present invention is a quartz plate in which an AT-cut quartz plate is formed in a rectangular shape in plan view, and at least a part of a side surface along the Z′-axis direction of the quartz crystal is The angle between the front and back main surfaces exceeds 140 degrees and falls within an angle range of less than 180 degrees, and the second inclined surfaces increase the viscosity of hydrofluoric acid to hydrofluoric acid. It is formed by wet etching using an etching solution to which an additive or an additive made of alcohol is added.

The crystal diaphragm according to the present invention is formed in a rectangular shape in plan view by wet-etching a crystal plate obtained by AT-cutting the crystal. In particular, the outer shape is formed by wet etching to create side surfaces. At this time, at least a part of the side surfaces along the Z′-axis direction of the quartz crystal is used as the front and back sides by utilizing the etching anisotropy peculiar to quartz. It can be set as the 2nd inclined surface inclined with respect to the surface.
At this time, as an etchant used for wet etching, an etchant obtained by adding an additive for increasing the viscosity of hydrofluoric acid or an additive made of alcohol to hydrofluoric acid is used. Can be suppressed lower than in the conventional case. Accordingly, it is possible to prolong the time until a new etching solution reaches the region where etching has progressed, and it is possible to perform processing while suppressing the progress of etching.

Therefore, the inclination angle of the second inclined surface can be made gentler than before, and the angle formed with the front and back main surfaces can be an angle that exceeds 140 degrees and falls within an angle range of less than 180 degrees. . That is, in the present invention, an inclination angle of approximately 140 degrees is a moderately inclined surface having an inclination angle (greater than 140 degrees and less than 180 degrees) with the front and back main surfaces in the present invention. Can do.
Therefore, the second inclined surface having a gentle inclination can be expected to have the same effect as the bevel shape performed by the conventional machining, that is, the effect of confining vibration energy. In addition to this, the ridgeline created between the second inclined surface and the front and back main surfaces can be a ridgeline that is less angled (unrecognizable) than the conventional one, so that contour vibration is oscillated on this ridgeline. Can be difficult. Therefore, the influence on the thickness shear vibration can be reduced, and the vibration characteristics can be improved.

(3) The quartz diaphragm according to the present invention is the quartz diaphragm according to the present invention, wherein an angle range between a part of the side surface and the front and back main surfaces is more than 130 degrees and less than 180 degrees. The second inclined surface and the third inclined surface are formed so as to face the Y′-axis direction of the quartz crystal.

In the quartz diaphragm according to the present invention, a part of the side surface along the Z′-axis direction of the quartz crystal is further set to the third inclined surface by wet etching. With respect to the third inclined surface, the angle of inclination can be made more gradual than before, and the angle formed with the front and back main surfaces can be more than 130 degrees and within an angle range of less than 180 degrees. it can. That is, in the present invention, an inclination angle of approximately 130 degrees is a moderately inclined surface having an inclination angle (greater than 130 degrees and less than 180 degrees) formed with the front and back main surfaces in the present invention. Can do.
In particular, since the second inclined surface and the third inclined surface having a gentle inclination angle can be made to face each other in the Y′-axis direction of the crystal crystal, a confinement effect of vibration energy can be expected and contour vibration can be reduced. The vibration characteristics can be improved by making the oscillation more difficult. Furthermore, since the quartz diaphragm can be formed into a highly symmetrical chip shape, it is easy to obtain good vibration characteristics in this respect.

(4) A method of manufacturing a quartz crystal plate according to the present invention is a method of manufacturing a quartz crystal plate having a rectangular shape in a plan view by wet etching, and the front and back main surfaces of the crystal plate obtained by AT-cutting the crystal A mask setting step of forming a mask on the substrate, wet etching the crystal plate, selectively etching a region where the mask is not formed to form a rectangular shape in plan view, and And an etching step of forming an inclined surface inclined with respect to the front and back main surfaces on at least a part of the side surface along the Z′-axis direction, and the hydrofluoric acid has a viscosity of the hydrofluoric acid during the etching step. It is characterized by using an etching solution to which an additive for increasing the viscosity or an additive comprising an alcohol is added.

In the method for manufacturing a crystal diaphragm according to the present invention, first, a mask setting process is performed in which a mask is formed on the front and back main surfaces of the crystal plate obtained by AT-cutting the crystal. After this process, a wet etching process is performed on the quartz plate, and an etching process is performed in which a region not masked is selectively etched to form a rectangular shape in plan view.
In particular, at the time of this etching step, the side surface is made by wet etching, and at the same time, by utilizing the etching anisotropy peculiar to quartz crystal, An inclined surface inclined with respect to the front and back main surfaces can be formed in part.
In addition, as an etchant used for wet etching, an etchant obtained by adding an additive for increasing the viscosity of hydrofluoric acid or an additive made of alcohol to hydrofluoric acid is used. It can be suppressed lower than in the prior art. Accordingly, it is possible to prolong the time until a new etching solution reaches the region where etching has progressed, and it is possible to perform processing while suppressing the progress of etching.

  For this reason, the inclination angle of the inclined surface can be made to be a moderate angle of inclination, which has been difficult with conventional etching. Therefore, an effect similar to that of a bevel shape performed by conventional machining, that is, a confinement effect of vibration energy can be expected by the inclined surface having a gentle inclination. In addition to this, the ridgeline created between the inclined surface and the front and back main surfaces can be a ridgeline that is less angled (unrecognizable) than the conventional one, so that it is difficult to oscillate contour vibration on this ridgeline. Can be made. Therefore, the influence on the thickness shear vibration can be reduced, and the vibration characteristics can be improved.

  According to the quartz crystal plate and the manufacturing method thereof according to the present invention, it is possible to cause thickness-shear vibration while confining vibration energy, and to suppress oscillation of contour vibration. Therefore, the influence on the thickness shear vibration can be reduced, and the vibration characteristics can be improved.

It is a figure for demonstrating embodiment which concerns on this invention, Comprising: It is a disassembled perspective view of the surface mount-type crystal resonator which has a thickness shear vibration piece. It is a perspective view of a rough lumbard stone for explaining a cutting angle of a quartz plate and a coordinate axis of a quartz crystal. FIG. 2 is a top view of a crystal diaphragm that constitutes the thickness-shear vibration piece shown in FIG. 1. FIG. 4 is a cross-sectional view of the crystal diaphragm taken along line AA shown in FIG. 3. FIG. 4 is a process diagram for explaining a method of manufacturing the quartz crystal vibrating plate shown in FIG. It is sectional drawing which shows the state of the initial stage which carried out the wet etching process of both surfaces of the quartz plate after the state shown in FIG. FIG. 7 is a cross-sectional view illustrating a state in which wet etching has progressed after the state illustrated in FIG. 6. FIG. 8 is a cross-sectional view illustrating a state in which wet etching has further progressed after the state illustrated in FIG. 7. It is a figure which shows the relationship of "depth D-length L" when actually experimenting how the inclination angle changes with the difference in etching liquid when forming an inclined surface in a quartz plate by wet etching process. . It is a figure which shows the state of an inclined surface at the time of performing a wet etching process using the conventional etching liquid. It is a figure which shows the state of the inclined surface at the time of performing a wet etching process using the etching liquid which concerns on this invention. It is a top view which shows the modification of the crystal diaphragm which concerns on this invention. FIG. 13 is a cross-sectional view of the crystal diaphragm taken along line BB shown in FIG. 12. It is sectional drawing which shows another modification of the crystal diaphragm which concerns on this invention.

  Hereinafter, embodiments according to the present invention will be described with reference to FIGS. 1 to 14. In the present embodiment, a surface-mounted crystal resonator having a thickness-shear resonator element (crystal resonator element) will be described as an example.

As shown in FIG. 1, the crystal resonator 1 according to the present embodiment is formed in a box shape in which a base substrate 2 and a lid substrate 3 are laminated in two layers. 4 is mounted. FIG. 1 is an exploded perspective view of the crystal unit 1.
The thickness-sliding vibration piece 4 is mainly composed of a quartz crystal plate 10 and an excitation electrode 15, an extraction electrode 16 and a mount electrode 17 formed on the outer surface of the quartz plate 10.

As shown in FIG. 2, the quartz diaphragm 10 is formed by AT-cutting the quartz lambard ore 6 in which the coordinate axes of the quartz crystal are defined by the X axis, the Y axis, and the Z axis (the front and back main surfaces are rotated from the Z axis around the X axis). The quartz crystal plate 7 obtained by being cut at an angle of about 35 degrees and 15 minutes in the counterclockwise direction was then formed into a rectangular shape in plan view by wet etching as shown in FIG. Is.
FIG. 2 is a perspective view of the lumbar raw stone 6 for explaining the cutting angle of the quartz plate 7 and the coordinate axes of the quartz crystal. FIG. 3 is a top view of the crystal diaphragm 10 shown in FIG. Further, in the present embodiment, the Z ′ axis is a crystal axis in a direction orthogonal to the X axis on the front and back main surfaces 10a and 10b of the crystal diaphragm 10 as shown in FIG. 3, and the Y ′ axis is the X axis. And the crystal axis perpendicular to the Z ′ axis.

The crystal diaphragm 10 will be described in detail.
As shown in FIG. 3, the quartz diaphragm 10 of the present embodiment is formed by wet etching so that the long side extends along the X-axis direction and the short side extends along the Z′-axis direction. It is a diaphragm formed in a planar view rectangular shape.
The front and back main surfaces 10a and 10b (the front-side main surface 10a and the back-side main surface 10b) of the crystal diaphragm 10 are both flat as shown in FIG. 4 is a cross-sectional view of the quartz crystal plate 10 taken along line AA shown in FIG.

Further, since the crystal diaphragm 10 is formed in a rectangular shape in plan view, it has four side surfaces 11 and 12. That is, it has two side surfaces 11 on the long side along the X-axis direction and two side surfaces 12 on the short side along the Z′-axis direction.
Among these, the side surface 11 along the X-axis direction is a first side surface (first inclined surface) 11a which is a crystal surface inclined with respect to the front and back main surfaces 10a and 10b, and is provided continuously to the first side surface 11a. And the second side surface 11b which is a crystal surface inclined so as to be perpendicular or obtuse with respect to the front and back main surfaces 10a and 10b.

Specifically, the first side surface 11a and the second side surface 11b on one side are provided on the + side in the Z′-axis direction on the main surface 10a on the front side, and the first side surface 11a and the second side surface on the other side. 11b is provided on the negative side in the Z′-axis direction on the main surface 10b on the back side.
In particular, the first side surface 11a is inclined at an angle θ1 formed by the front and back main surfaces 10a and 10b exceeds the angle created by the m-plane which is the natural surface of the quartz crystal and falls within an angle range of less than 180 degrees. is doing.

As shown in FIG. 1, the excitation electrode 15 is formed so as to face each other with the quartz crystal plate 10 sandwiched between the front and back main surfaces 10 a and 10 b of the quartz plate 10 thus formed. Further, mount electrodes 17 are formed on the end portions (the negative side in the X-axis direction) of the front and back main surfaces 10a, 10b of the quartz crystal plate 10 with a gap along the short side.
At this time, the mount electrode 17 formed on the main surface 10a on the front side and the mount electrode 17 formed on the main surface 10b on the back side are connected via a side electrode (not shown) formed on the side surface 12 on the short side. Electrically connected.
Of the mount electrodes 17, one mount electrode 17 is electrically connected to one excitation electrode 15 formed on the main surface 10 a on the front side via an extraction electrode 16, and the other mount electrode 17 is an extraction electrode. 16 is electrically connected to the other excitation electrode 15 formed on the main surface 10b on the back side.

  In FIG. 1, illustration of each electrode formed on the main surface 10 b on the back side of the crystal diaphragm 10 is omitted. Each electrode is formed of a single layer film such as gold or a laminated film in which a metal layer such as gold is laminated on a metal such as chromium as a base layer.

As shown in FIG. 1, the thickness-shear vibrating piece 4 configured in this manner is mounted (held) on the upper surface of the base substrate 2 using a mounting member (not shown) such as a bump or a conductive adhesive. . More specifically, the pair of mount electrodes 17 formed on the main surface 10b on the back side of the quartz crystal plate 10 are in contact with the inner electrode 20 formed on the upper surface of the base substrate 2 via the mounting member. Mounted in a state.
As a result, the thickness shear vibrating piece 4 is mechanically held on the upper surface of the base substrate 2 and the inner electrode 20 and the mount electrode 17 are electrically connected to each other.

The base substrate 2 is a transparent substrate made of, for example, soda lime glass, and is formed in a plate shape having a rectangular shape in plan view. Similar to the base substrate 2, the lid substrate 3 is a transparent substrate made of, for example, soda lime glass, and is formed in a plate shape with a size that can be superimposed on the base substrate 2.
In addition, a rectangular recess 2 a in which the thickness shear vibration piece 4 is accommodated is formed on the side of the base substrate 2 where the lid substrate 3 is joined (surface to which the lid substrate 3 is joined). The recess 2 a is a cavity recess that becomes a cavity C that accommodates the thickness-shear vibration piece 4 when the substrates 2 and 3 are overlapped.
The base substrate 2 is anodically bonded to the lid substrate 3 with the concave portion 2a facing the lid substrate 3 side. Note that a bonding film 21 for anodic bonding is formed on the bonding surface side of the base substrate 2 so as to surround the recess 2a.

  The inner electrode 20 described above is electrically connected to a pair of external electrodes (not shown) formed on the lower surface of the base substrate 2 using a through hole (not shown) penetrating the base substrate 2. As a result, one external electrode is electrically connected to one mount electrode 17 of the thickness-shear vibration piece 4 via one inner electrode 20. The other external electrode is electrically connected to the other mount electrode 17 of the thickness-shear vibrating piece 4 via the other inner electrode 20.

  When the crystal resonator 1 configured as described above is operated, a predetermined drive voltage is applied to the external electrode formed on the base substrate 2. Thereby, a voltage can be applied to the excitation electrode 15 of the thickness-shear vibration piece 4 via the mount electrode 17, and thickness-shear vibration can be caused. The thickness shear vibration can be suitably used as, for example, a control having an oscillation frequency in the MHz band, a vibration source for a communication device, or the like.

Next, a method for manufacturing the above-described thickness shear vibrating piece 4 will be described below.
First, after preparing a lumbard raw stone 6 shown in FIG. 2 which is a raw crystal of quartz, an angle measurement for performing AT cut is performed by an X-ray diffraction method or the like. Next, the quartz plate 7 is produced by AT-cutting the lumbar raw stone 6 at the measured cutting angle. Next, the quartz plate 7 is appropriately lapped and adjusted to a desired thickness.

Next, as shown in FIG. 5, a mask setting step for forming a mask M for performing wet etching on the front and back main surfaces 7a and 7b of the crystal plate 7 is performed.
Specifically, first, chromium is formed on the front and back main surfaces 7a and 7b of the crystal plate 7 to form a Cr film, and then gold is formed on the Cr film to overlap the Au film. Then, the Cr film and the Au film are etched by the photolithography technique to form a mask M as shown in FIG.
At this time, in the present embodiment, the mask M formed on the front main surface 7a is shifted by a predetermined amount (several μm) H in the Z′-axis direction with respect to the mask M formed on the back main surface 7b. Form.

Next, a wet etching process is performed on the quartz plate 7 to selectively etch a region where the mask M is not formed to form a rectangular shape in plan view, thereby performing an etching process for producing the quartz vibrating plate 10.
First, an etchant is prepared for performing this process. In this embodiment, an etching solution is prepared by adding polyvinyl alcohol, which is an additive for increasing the viscosity of hydrofluoric acid, to hydrofluoric acid. Then, the crystal plate 7 is wet-etched from both sides using this etching solution.

Then, the first side surface 11a and the second side surface 11b begin to appear on the exposed surface of the unmasked crystal plate 7 due to the etching anisotropy peculiar to crystal as shown in FIG. That is, on the front side of the quartz plate 7, the first side surface 11a appears on the + side in the Z′-axis direction, and the second side surface 11b begins to appear on the − side in the Z′-axis direction. On the other hand, on the back side of the quartz plate 7, the second side surface 11 b appears on the + side in the Z′-axis direction and the first side surface 11 a begins to appear on the − side in the Z′-axis direction, symmetrically with the front side.
Then, as time passes, the etching proceeds as shown in FIG. 7, and finally the unmasked portion of the quartz plate 7 is completely removed as shown in FIG. The side surface 11a and the second side surface 11b are connected to each other.

Thereby, the crystal plate 7 can be formed in a rectangular shape in plan view, and the crystal diaphragm 10 shown in FIGS. 3 and 4 can be obtained. In particular, the side surface 11 on the long side along the X-axis direction can be composed of the first side surface 11a and the second side surface 11b.
Finally, each electrode of the excitation electrode 15, the extraction electrode 16, and the mount electrode 17 is formed on the outer surface of the manufactured crystal diaphragm 10 by using a photolithography technique or the like.
Thereby, the thickness shear vibration piece 4 shown in FIG. 1 can be obtained.

  In particular, in the present embodiment, an etchant obtained by adding polyvinyl alcohol to hydrofluoric acid is used as an etchant used for wet etching, so that the viscosity is higher than that conventionally used and the flow rate of the etchant is increased. It can be suppressed lower than in the prior art. Therefore, it is possible to prolong the time until a new etching solution reaches the region where the etching has progressed, and it is possible to perform the etching process while suppressing the progress of the etching.

  Therefore, the inclination angle of the first side surface 11a can be made gentler than before, and the angle θ1 formed with the front and back main surfaces 10a, 10b exceeds the angle created by the m-plane of the crystal crystal and is less than 180 degrees. In this embodiment, the angle θ1 formed by the front and back main surfaces 10a and 10b is larger than about 150 degrees. For example, it can be a gently inclined surface with an inclination of about 160 degrees.

  Therefore, the first side surface 11a having a moderate inclination can be expected to have the same effect as the bevel shape performed by conventional machining, that is, the effect of confining vibration energy. In addition to this, the ridgeline E created between the first side surface 11a and the front and back main surfaces 10a and 10b can be a ridgeline E that is less conspicuous than the conventional one (less conspicuous), so this ridgeline It is possible to make E hard to oscillate contour vibration. Therefore, the influence on the thickness shear vibration can be reduced, and the vibration characteristics can be improved.

  As described above, according to the crystal resonator 1 having the thickness-shear vibration piece 4 of the present embodiment, it is possible to vibrate while confining vibration energy, and to suppress the oscillation of the contour vibration. Therefore, the influence on the thickness shear vibration can be reduced, and the vibration characteristics can be improved.

In the above embodiment, polyvinyl alcohol is used as an additive for increasing the viscosity of hydrofluoric acid. However, the present invention is not limited to this. For example, a gelling agent or a polysaccharide may be used. Even in this case, the same effects can be achieved.
Furthermore, instead of the additive for increasing the viscosity of hydrofluoric acid, an additive made of alcohols added to hydrofluoric acid may be used as the etching solution. Even in this case, the same effect can be obtained. Examples of additives made of alcohols include lower alcohols and polyhydric alcohols (isopropyl alcohol, ethylene glycol, propylene glycol, glycerin, etc.).
Moreover, not only the additive mentioned above but surfactant (for example, sodium lauryl sulfate) can be used as an additive similarly to alcohols. Furthermore, acidic ammonium fluoride or the like may be appropriately mixed for the purpose of adjusting the quality of the etching solution.

(Example)
Here, an example in which how the inclination angle of the first side surface 11a varies depending on the etching solution will be described with reference to FIGS.
First, as an etchant, the following four types are used: A: only hydrofluoric acid.
B: What added polyvinyl alcohol (additive which raises a viscosity) to hydrofluoric acid.
C: A product obtained by adding isopropyl alcohol (an additive composed of alcohols) to hydrofluoric acid.
D: A product obtained by adding glycerin (an additive comprising alcohols) to hydrofluoric acid.

The concentration of each of the etching solutions was adjusted as follows.
A: The concentration of hydrofluoric acid is 1% to 40%.
B: The concentration of hydrofluoric acid is 1% to 40% and the concentration of polyvinyl alcohol is 0.1% to 20%.
C: The concentration of hydrofluoric acid is 1% to 40% and the concentration of isopropyl alcohol is 1% to 60%.
D: The concentration of hydrofluoric acid is 1% to 40% and the concentration of glycerin is 1% to 60%.

  The etching time was set to 2 hours, and the temperature was set within the range of room temperature to 70 ° C. This temperature range is set in order to obtain an effective etching rate and suppress the change in the concentration of the etching solution as much as possible. In addition, a preferable temperature range is 55 to 60 degreeC.

The results of the wet etching process under the above conditions are shown in FIGS.
First, when the etching solution A was used, as shown in FIGS. 9 and 11, an inclined surface S inclined with a depth D of about 60 μm and a length L of about 70 μm to 80 μm was obtained.

On the other hand, when the etching solution B is used, as shown in FIGS. 9 and 10, the inclined surface S is inclined with a depth D of about 40 to 43 μm and a length L of about 170 μm to 180 μm. was gotten.
Thus, it was confirmed that the inclination angle was obviously gentler in the case of using the etching solution B than in the case of using the etching solution A. This is presumably because the addition of polyvinyl alcohol to hydrofluoric acid increased the viscosity of the etching solution, thereby suppressing the progress of the etching and etching. Therefore, the action and effect according to the present invention were actually confirmed.

  Further, even when the etching liquids C and D were used, an inclined surface inclined to the same extent as when the etching liquid B was used was obtained. From this, even when an additive composed of alcohols was added to hydrofluoric acid, the same action and effect as when an additive for increasing the viscosity was added could be actually confirmed.

In addition, when supplementing the concentration range of the additive added to each etching solution, it is difficult to achieve the effect of gradual inclination when the concentration falls below the lower limit of the concentration range, and the etching rate exceeds when the concentration range exceeds the upper limit. Becomes slow, and it becomes difficult to handle the etching solution. Therefore, it is preferable to set the optimum concentration as appropriate according to the additive used.
In the case of the etching solution B, it is more preferable that the concentration of polyvinyl alcohol is set in the range of 1% to 10%. In the case of the above etching solution C, it is more preferable that the concentration of isopropyl alcohol is set in the range of 5% to 40%. In the case of the etching solution of D, it is more preferable that the concentration of glycerin is set in the range of 5% to 40%.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

For example, in the above-described embodiment, the surface mount type has been described as an example of the crystal resonator 1, but a cylinder package type may be used.
Moreover, in the said embodiment, although the case where the side surface 11 along the X-axis direction was comprised with the 1st side surface 11a and the 2nd side surface 11b as an example of the quartz-crystal diaphragm 10, it is Z 'axis | shaft. A part of the side surface 12 along the direction may be an inclined surface.

For example, the quartz diaphragm 30 shown in FIGS. 12 and 13 may be used.
The quartz diaphragm 30 includes a third side surface (second inclined surface) 12a in which the side surface 12 along the Z′-axis direction is a crystal surface inclined with respect to the front and back main surfaces 30a and 30b, and the third side surface 12a. The fourth side face 12b is a crystal face that is connected to the side face 12a and is inclined so as to be perpendicular or obtuse to the front and back main faces 30a, 30b.
One third side surface 12a and fourth side surface 12b are provided on the + side in the X-axis direction on the main surface 30a on the front side, and the other third side surface 12a and fourth side surface 12b are on the back side. The main surface 30b is provided on the negative side in the X-axis direction.

In the case of manufacturing the crystal diaphragm 30, the formation position of the mask M may be shifted along the X-axis direction. Even in this case, the inclination angle of the third side surface 12a can be adjusted by using an etching solution in which an additive for increasing the viscosity of the hydrofluoric acid or an additive made of alcohols is added to the hydrofluoric acid. The angle θ2 formed by the surfaces 30a and 30b can be formed at an angle (for example, about 150 degrees) that exceeds 140 degrees and falls within an angle range of less than 180 degrees.
In other words, the angle θ2 formed by the front and back main surfaces 30a and 30b, which has been an inclination angle of about 140 degrees in the past, is set to be greater than about 140 degrees and less than 180 degrees, for example, an inclination of about 150 degrees. It can be made a gentle inclined surface.

  Therefore, even in the quartz diaphragm 30, it is possible to expect a confinement effect of vibration energy by the third side surface 12a having a moderate inclination, and the third side surface 12a and the front and back main surfaces 30a, 30b It is possible to make it difficult to oscillate contour vibration in the ridgeline E created between them. Therefore, the influence on the thickness shear vibration can be reduced, and the vibration characteristics can be improved.

Further, in the crystal diaphragm 30, as shown in FIG. 14, the side surface 12 along the Z′-axis direction is divided into a third side surface 12a, a fourth side surface 12b, and a fifth side surface (third inclined surface) 12c. You may comprise.
The fifth side surface 12c is an inclined surface in which an angle θ3 formed by the front and back main surfaces 30a and 30b is more than 130 degrees and falls within an angle range of less than 180 degrees (for example, 140 degrees). It is formed so as to face the side surface 12a in the Y′-axis direction.
In this case, since the third side surface 12a and the fifth side surface 12c having a gentle inclination angle can face each other in the Y′-axis direction, the effect of confining vibration energy can be further expected, and the contour The vibration characteristics can be improved by making it difficult to oscillate the vibration. Further, since the quartz diaphragm 30 can be formed into a highly symmetrical chip shape, it is easy to obtain good vibration characteristics also in this respect.

M ... Mask 7 ... Quartz plate 10, 30 ... Quartz diaphragm 10a, 10b, 30a, 30b ... Front and back main surfaces of quartz plate 11 ... Side surface along X-axis direction 11a ... First side surface (first inclined surface)
12 ... Side surface along the Z'-axis direction 12a ... Third side surface (second inclined surface)
12c ... Fifth side surface (third inclined surface)

Claims (4)

A crystal plate in which an AT-cut crystal plate is formed in a rectangular shape in plan view,
At least a part of the side surface along the X-axis direction of the crystal crystal is a first inclined surface in which an angle between the front and back main surfaces exceeds an angle created by the m-plane of the crystal crystal and falls within an angle range of less than 180 degrees And
The first inclined surface is formed by wet etching using an etchant obtained by adding an additive for increasing the viscosity of hydrofluoric acid or an additive made of alcohol to hydrofluoric acid. Crystal diaphragm. A crystal plate in which an AT-cut crystal plate is formed in a rectangular shape in plan view,
At least a part of the side surface along the Z′-axis direction of the quartz crystal is a second inclined surface that has an angle with the front and back main surfaces of more than 140 degrees and within an angle range of less than 180 degrees,
The second inclined surface is formed by wet etching using an etchant obtained by adding an additive for increasing the viscosity of hydrofluoric acid or an additive made of alcohols to hydrofluoric acid. Crystal diaphragm. The crystal diaphragm according to claim 2,
A part of the side surface is a third inclined surface that has an angle with the front and back main surfaces of more than 130 degrees and falls within an angle range of less than 180 degrees,
The quartz crystal diaphragm, wherein the second inclined surface and the third inclined surface are formed so as to face each other in the Y′-axis direction of the quartz crystal. A method of manufacturing a quartz crystal plate having a rectangular shape in plan view by wet etching,
A mask setting step of forming a mask on the front and back main surfaces of the crystal plate obtained by AT-cutting the crystal;
The crystal plate is wet-etched, and the region not masked is selectively etched to form a rectangular shape in plan view, and at least a side surface along the X-axis direction or the Z′-axis direction of the crystal crystal In part, an etching step of forming an inclined surface inclined with respect to the front and back main surfaces,
In the etching process, a quartz vibrating plate manufacturing method using an etching solution in which an additive for increasing the viscosity of hydrofluoric acid or an additive made of alcohol is added to hydrofluoric acid.

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