TWI652839B - Piezoelectric quartz wafer with single convex structure - Google Patents

Abstract

The invention discloses a piezoelectric quartz wafer with a single convex structure, which comprises a central member (1), a protective frame (2) and a connecting portion (3). The protective frame (2) is provided with a cavity, and the cavity is arranged. There is a central member (1), the top surface of the central member (1) is provided with a boss (4), and the two long sides of the protective frame (2) form a first space between the two long sides of the central member (1) The through groove (5), the two short sides of the protective frame (2) and the two short sides of the central member (1) are formed with a second through groove (6), the first through groove (5) and the second pass The slot (6) is in communication, and the connecting portion (3) is disposed in any one of the second through slots (6). The invention has the beneficial effects that it can be used for miniaturizing the mass production of quartz wafers, reducing the parasitic vibration generated by the edges, and enhancing the energy trapping effect at the center of the quartz wafer, improving the processing precision, and greatly improving the consistency of the product.

Description

Piezoelectric quartz wafer with single convex structure

The present invention relates to the technical field of piezoelectric quartz wafer construction, and more particularly to a piezoelectric quartz wafer having a single convex structure.

At present, a quartz crystal resonator is generally composed of a piezoelectric quartz wafer and a package casing, wherein the piezoelectric quartz wafer is rectangular or circular, and the package casing material is ceramic, glass, or the like. The electrodes on the upper and lower sides of the piezoelectric quartz wafer are vapor-deposited, and the electrodes are connected to the pedestal pins in the package casing through the leads of the sealed package. The AC voltage can be connected to the upper and lower electrodes of the quartz wafer through the pins, causing the quartz wafer to have an inverse piezoelectric effect, thereby generating oscillation. Quartz crystal resonators are widely used in electronic industries such as mobile electronic devices, mobile phones, and mobile communication devices due to their frequency accuracy and stability.

With the rapid development of mobile communication electronics, the demand for miniaturization of devices is increasing, and the miniaturization of quartz crystal resonators is also imperative. In the process of miniaturization of quartz crystal resonators, the conventional design structure has been difficult to produce and the cost is high. Conventional cutting, etching and other processes are difficult to process ultra-small quartz wafers, which cannot meet the requirements of miniaturization.

When the resonant frequency of the quartz crystal resonator is low, in order to improve the trapping effect and weaken the edge effect of the quartz wafer, it is necessary to change the shape of the quartz wafer. Usually, the barrel grinding method is adopted to change the shape of the quartz wafer, that is, the biconvex surface structure. However, due to the poor stability and low repeatability of the barreling process, the cost has always been high. Therefore, the quartz wafer technology needs to be improved.

In view of this, our inventors have devote themselves to further research and have initiated research and development and improvement, with a preferred invention to solve the above problems, and have been continually tested and modified to have the present invention.

Therefore, the object of the present invention is to overcome the shortcomings of the prior art, to provide a low cost, can be used for miniaturizing the mass production of quartz wafers, reducing the parasitic vibration generated by the edges, and enhancing the trapping effect of the center of the quartz wafer, and greatly improving A consistent piezoelectric quartz wafer with a single convex structure.

The object of the present invention is achieved by the following technical solution: a piezoelectric quartz wafer having a single convex structure, comprising a central member, a protective frame and a connecting portion, wherein the central member and the protective frame are both rectangular, and the protective frame is arranged There is a cavity in which a central member is disposed, and the top surface of the central member is provided with a boss which can attenuate the parasitic vibration generated by the edge and can enhance the trapping effect at the center of the quartz wafer, and the two long sides and the center of the protective frame A first through slot is formed between the two long sides of the member, and a second through slot is formed between the two short sides of the protection frame and the two short sides of the central member, and the first through slot communicates with the second through slot. Any one of the short sides of the protective frame and the central member are connected by a connecting portion, and the connecting portion is disposed in any one of the second through grooves.

The boss is a circular boss, a rectangular boss or a trapezoidal boss.

The connecting portion has a rectangular or trapezoidal shape.

The piezoelectric quartz wafer has a length of 0.8 to 3.2 mm.

The piezoelectric quartz wafer has a width of 0.6 to 2.5 mm.

The material of the central member, the protective frame and the connecting portion is quartz.

It is obvious from the above description and setting that the present invention has the following several advantages and effects, which are detailed as follows:

1. The top surface of the central member of the present invention is provided with a boss which can attenuate the parasitic vibration generated by the edge and can enhance the trapping effect at the center of the quartz wafer. (2) The present invention can be used for mass production of miniaturized quartz wafers, greatly improving the manufacturing efficiency of wafers and crystals, and at the same time improving consistency. (3) When the protective frame is subjected to external force, the force is not transmitted to the central member, thereby protecting the central member well.

The invention will be described in detail below with reference to the drawings.

The present invention will be further described below in conjunction with the accompanying drawings, and the scope of protection of the present invention is not limited to the following:

Embodiment 1:

As shown in FIGS. 1 to 4, a piezoelectric quartz wafer having a single convex structure using an AT cut type is generally applied to a quartz crystal resonator in which a long side of the wafer is parallel to the X axis, X. The axis is the electrical axis of the quartz crystal, the short side is parallel to the Z' axis, and the thickness direction is parallel to the Y' axis. It is not excluded that the long side of the quartz wafer is parallel to the Z' axis, the width is parallel to the X axis, and the thickness direction is parallel to the Y' axis. The piezoelectric quartz wafer includes a central member 1, a protective frame 2 and a connecting portion 3. The central member 1, the protective frame 2 and the connecting portion 3 are made of quartz, and the central member 1 and the protective frame 2 are both rectangular. The protective frame 2 functions as a support and a package. The protective frame 2 is provided with a cavity, and the central member 1 is disposed in the cavity. The top surface of the central member 1 is provided with a parasitic vibration capable of weakening the edge and capable of A boss 4 for enhancing the trapping effect of the center of the quartz wafer, a first through groove 5 is formed between the two long sides of the protective frame 2 and the two long sides of the central member 1, and the two short sides and the center of the protective frame 2 A second through groove 6 is formed between the two short sides of the member 1. The first through groove 5 communicates with the second through groove 6. The first through groove 5 and the second through groove 6 chemically etch or physically divide the quartz crystal material. Made. As shown in FIGS. 1 to 4, any one of the short sides of the protective frame 2 and the central member 1 are connected by a connecting portion 3, and the connecting portion 3 is disposed in any one of the second through grooves 6.

The boss 4 is a circular boss, a rectangular boss or a trapezoidal boss. The boss in this embodiment is a rectangular boss. The shape of the connecting portion 3 is rectangular or trapezoidal, and the connecting portion 3 in the present embodiment has a rectangular shape.

The piezoelectric quartz wafer has a length of 0.8 to 3.2 mm, a length of 1.6 mm in the embodiment, a width of the piezoelectric quartz wafer of 0.6 to 2.5 mm, and a width of 1.2 mm in the present example. The resonant frequency of the quartz wafer is t=1664/F, t represents the thickness of the quartz wafer in μm; F represents the resonant frequency in MHz, and the resonant frequency of the quartz wafer in this example is between 8 MHz and 70 MHz.

As shown in FIG. 5 and FIG. 6, a piezoelectric quartz wafer having a single convex structure is processed as follows:

S1, taking out a quartz substrate 7 of a certain specification, and grinding and polishing the upper and lower surfaces of the quartz substrate 7;

S2, forming a uniform thickness lithographic anti-etching protective layer ER on the surface of the quartz substrate 7 by spin coating or spraying, and then using lithographic exposure on the lithographic anti-etching protective layer ER to form a pattern to be etched on the surface ;

S3, etching the surface of the quartz substrate 7 by wet etching or dry etching, thereby forming a bump 4 on the surface of the quartz substrate 7. The etching depth of the bump 4 is controlled by wet etching or dry etching. The eclipse reaction time is determined;

S4, removing the lithographic anti-etching protective layer ER in step S3 and cleaning the surface of the quartz substrate 7;

S5. After the cleaning is completed, a lithographic anti-etching protective layer ER having a uniform thickness is formed on the surface of the quartz substrate 7 by spin coating or spraying, and then formed on the upper surface of the lithographic anti-etching protective layer ER by photolithography exposure. Etching the pattern;

S6, the surface of the quartz substrate 7 is etched by wet etching, dry etching, laser etching, physical blasting, etc., thereby forming a first through groove 5 and a second through groove 6;

S7. The lithographic anti-etching protective layer ER is removed and the surface of the quartz substrate 7 is cleaned, thereby producing a piezoelectric quartz wafer having a single convex structure.

S8, processing a cutting positioning hole 8 on the quartz substrate 7;

S9. Cutting and separating the quartz substrate 7 along the cutting positioning hole 8 by using laser cutting or blade cutting, thereby realizing processing of the quartz wafer.

Embodiment 2:

As shown in FIG. 7 to FIG. 9 , the difference between the second embodiment and the first embodiment is that two short connecting portions 3 and two connecting portions 3 are connected between the short side of the protective frame 2 and the central member 1 . The mechanical strength between the central member 1 and the protective frame 2 is increased.

In summary, the technical means disclosed by the present invention can effectively solve the problems of the prior knowledge, achieve the intended purpose and efficacy, and are not found in the publication before publication, have not been publicly used, and have long-term progress, The invention referred to in the Patent Law is correct, and the application is filed according to law, and the company is invited to give a detailed examination and grant a patent for invention.

The above is only the preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, that is, the equivalent changes and modifications made by the scope of the invention and the contents of the invention are all It should remain within the scope of this invention.

1‧‧‧Central components

2‧‧‧protection frame

3‧‧‧Connecting Department

4‧‧‧Boss

5‧‧‧ first slot

6‧‧‧Second pass

7‧‧‧Quartz substrate

8‧‧‧ cutting positioning hole

FIG. 1 is a schematic structural view of Embodiment 1 of the present invention. Figure 2 is a plan view of Figure 1. Figure 3 is a cross-sectional view taken along line A-A of Figure 2; Figure 4 is a bottom view of Figure 1. FIG. 5 is a top view of a product based on a quartz substrate processed by a manufacturing process according to Embodiment 1 of the present invention. Figure 6 is a bottom view of Figure 5. FIG. 7 is a schematic structural view of Embodiment 2 of the present invention. Figure 8 is a plan view of Figure 7. Figure 9 is a bottom view of Figure 7. FIG. 10 is a top view of the product according to the second embodiment of the present invention after the quartz substrate is processed by the manufacturing process. Figure 11 is a bottom view of Figure 10.

Claims (5)

A piezoelectric quartz wafer having a single convex structure, comprising: a central member (1), a protective frame (2) and a connecting portion (3), the central member (1) and the protective frame (2) And the material of the connecting portion (3) is quartz, the central member (1) and the protective frame (2) are both rectangular, the cavity is disposed in the protective frame (2), and the central member is disposed in the cavity (1) The top surface of the central member (1) is provided with a boss (4) capable of attenuating the parasitic vibration generated by the edge and capable of enhancing the trapping effect at the center of the quartz wafer, and the two long sides of the protective frame (2) A first through groove (5) is formed between the two long sides of the central member (1), and a second pass is formed between the two short sides of the protective frame (2) and the two short sides of the central member (1) a slot (6), the first through slot (5) is in communication with the second through slot (6), and any one of the short sides of the protective frame (2) and the central member (1) pass through the connecting portion (3) The connection portion (3) is disposed in any one of the second through grooves (6). A piezoelectric quartz wafer having a single convex structure according to claim 1, wherein the boss (4) is a circular boss, a rectangular boss or a trapezoidal boss. A piezoelectric quartz wafer having a single convex structure according to claim 1, wherein the connecting portion (3) has a rectangular or trapezoidal shape. A piezoelectric quartz wafer having a single convex structure according to claim 1, wherein the piezoelectric quartz wafer has a length of 0.8 to 3.2 mm. A piezoelectric quartz wafer having a single convex structure according to claim 1 or 4, wherein the piezoelectric quartz wafer has a width of 0.6 to 2.5 mm.