WO2017012347A1

WO2017012347A1 - Piezoelectric quartz wafer with single convex structure

Info

Publication number: WO2017012347A1
Application number: PCT/CN2016/074953
Authority: WO
Inventors: 叶竹之; 陆旺; 雷晗
Original assignee: 成都泰美克晶体技术有限公司
Priority date: 2015-07-22
Filing date: 2016-02-29
Publication date: 2017-01-26
Also published as: CN105007056A; KR101892651B1; TWI652839B; TW201709572A; JP2017528012A; KR20170035833A

Abstract

A piezoelectric quartz wafer with a single convex structure comprises a central component (1), a protection frame (2), and a connection portion (3). A cavity is provided in the protecting frame (2), the central component (1) is disposed in the cavity, and a boss (4) is provided on the top surface of the central component (1). Through grooves A (5) are formed between the two long sides of the protecting frame (2) and the two long sides of the central component (1), and through grooves B (6) are formed between the two short sides of the protecting frame (2) and the two short sides of the central component (1). The through grooves A (5) are communicated with the through grooves B (6). The connection portion (3) is provided in any one of the through grooves B (6). The piezoelectric quartz wafer has the following beneficial effects: the piezoelectric quartz wafer can be used for batch production of small-sized quartz wafers and weaken parasitic vibration generated by the edge; meanwhile, the piezoelectric quartz wafer can strengthen the energy trapping effect of the centre of the quartz crystal wafer, improve working accuracy , and greatly improve product consistency.

Description

Description: A piezoelectric quartz wafer with a single convex structure

[0001] The present invention relates to the technical field of piezoelectric quartz wafer construction, and more particularly to a piezoelectric quartz wafer having a single convex structure.

Background technique

[0002] At present, a quartz crystal resonator is generally composed of a piezoelectric quartz wafer and a package outer casing, wherein the piezoelectric quartz crystal wafer is rectangular or circular, and the outer casing material is ceramic, glass or the like. The electrodes on the upper and lower sides of the piezoelectric quartz wafer are vapor-deposited, and the electrodes are connected to the pedestal pins in the package casing through the leads of the sealed package. The AC voltage can be connected to the upper and lower electrodes of the quartz wafer through the pins, causing the quartz wafer to have an inverse piezoelectric effect, which causes oscillation. Quartz crystal resonators are widely used in the electronics industry such as mobile electronic devices, mobile phones, and mobile communication devices due to their frequency accuracy and stability.

[0003] With the rapid development of mobile communication electronics, the demand for miniaturization of devices is increasing, and the miniaturization of quartz crystal resonators is also imperative. In the process of miniaturization of quartz crystal resonators, the conventional design structure has been difficult to produce and the cost is high. Conventional cutting, etching and other processes are difficult to process ultra-small quartz wafers, which cannot meet the requirements of miniaturization.

[0004] Quartz crystal resonators have a lower resonance frequency. In order to improve the trapping effect, the edge effect of the quartz wafer is weakened, and the shape of the quartz wafer needs to be changed. Normally, the barrel grinding method is used to change the shape of the quartz wafer, that is, the biconvex surface structure. However, due to the poor stability and low repeatability of the barreling process, the cost has always been high. Therefore, the technology of quartz wafers needs to be improved.

technical problem

[0005] The object of the present invention is to overcome the shortcomings of the prior art, to provide a low cost, can be used for miniaturizing the mass production of quartz wafers, reducing the parasitic vibration generated by the edges, and enhancing the trapping effect of the center of the quartz wafer, Piezoelectric quartz wafer with a single convex structure for increasing the uniformity of the product.

Problem solution

Technical solution

[0006] The object of the present invention is achieved by the following technical solutions: A piezoelectric quartz having a single convex structure a wafer comprising a central member, a protective frame and a connecting portion, wherein the central member and the protective frame are both rectangular, the cavity is provided in the protective frame, and the central member is disposed in the cavity, and the central member is disposed in the cavity The top surface is provided with a boss which can reduce the parasitic vibration generated by the edge and can enhance the trapping effect at the center of the quartz wafer. The two long sides of the protective frame form a through groove A between the two long sides of the central member, and the protection is provided. A through groove B is formed between the two short sides of the frame and the two short sides of the central member, and the through groove A communicates with the through groove B, and any short side of the protective frame and the central member pass through the connecting portion Connected, the connecting portion is disposed in any one of the through slots B.

[0007] The boss is a circular boss, a rectangular boss or a trapezoidal boss.

[0008] The connecting portion has a shape of a rectangle or a trapezoid.

[0009] The piezoelectric quartz wafer has a length of 0.8 to 3.2 mm.

[0010] The piezoelectric quartz wafer has a width of 0.6 to 2.5 mm.

[0011] The material of the central member, the protective frame and the connecting portion are all quartz.

Advantageous effects of the invention

Beneficial effect

The present invention has the following advantages: (1) The top surface of the center member of the present invention is provided with a boss which can attenuate the spurious vibration generated by the edge and can enhance the trapping effect at the center of the quartz wafer. (2) The present invention can be used for mass production of miniaturized quartz wafers, greatly improving the manufacturing efficiency of wafers and crystals, and improving the consistency. (3) When the protective frame is subjected to external forces, the force is not transmitted to the central member, thus protecting the central member well.

Brief description of the drawing

DRAWINGS

1 is a schematic structural view of Embodiment 1 of the present invention;

Figure 2 is a plan view of Figure 1;

Figure 3 is a cross-sectional view taken along line A-A of Figure 2;

Figure 4 is a bottom view of Figure 1;

5 is a top view of a product based on a quartz substrate processed by a manufacturing process according to an embodiment of the present invention;

Figure 6 is a bottom view of Figure 5;

7 is a schematic structural view of a second embodiment of the present invention; Figure 8 is a plan view of Figure 7;

Figure 9 is a bottom view of Figure 7;

10 is a top view of a product based on a quartz substrate processed by a manufacturing process according to Embodiment 2 of the present invention;

Figure 11 is a bottom view of Figure 10;

[0024] In the drawings, 1-center member, 2-protective frame, 3-connecting portion, 4-bump, 5-way groove A, 6-through groove B, 7-quartz substrate, 8-cut positioning hole.

Embodiments of the invention

[0025] The present invention will be further described below in conjunction with the accompanying drawings, and the scope of protection of the present invention is not limited to the following: [0026] Embodiment 1

[0027] As shown in FIGS. 1 to 4, a piezoelectric quartz wafer having a single convex structure, the quartz wafer adopting an AT cut type, which is generally applied to a quartz crystal resonator, wherein a long side of the wafer is parallel to The X axis, the X axis is the electric axis of the quartz crystal, the short side is parallel to the Z' axis, and the thickness direction is parallel to the Y' axis. It is not excluded that the long side of the quartz wafer is parallel to the Z' axis, the width is parallel to the X axis, and the thickness direction is parallel to the Y' axis. The piezoelectric quartz wafer includes a central member 1, a protective frame 2 and a connecting portion 3. The central member 1, the protective frame 2 and the connecting portion 3 are made of quartz, and the central member 1 and the protective frame 2 are both rectangular. The protective frame 2 functions as a support and a package. The protective frame 2 is provided with a cavity. The central component 1 is disposed in the cavity, and the top surface of the central component 1 is provided with a weakened edge. a parasitic vibration, and a boss 4 capable of enhancing the trapping effect at the center of the quartz wafer. The two long sides of the protective frame 2 and the two long sides of the central member 1 are formed with a through groove A5, and the two short sides of the protective frame 2 A through groove B6 is formed between the edge and the two short sides of the central member 1, and the through groove A5 communicates with the through groove B6, and the through groove A5 and the through groove B6 are formed by chemically etching or physically dividing the quartz crystal material. As shown in Figs. 1 to 4, any one of the short sides of the protective frame 2 is connected to the central member 1 via a connecting portion 3, and the connecting portion 3 is disposed in any one of the through grooves B6.

[0028] The boss 4 is a circular boss, a rectangular boss or a trapezoidal boss. The boss in this embodiment is a rectangular boss. The shape of the connecting portion 3 is rectangular or trapezoidal, and the connecting portion 3 in the present embodiment has a rectangular shape.

[0029] The piezoelectric quartz wafer has a length of 0.8 to 3.2 mm, and the length in the embodiment is 1.6 mm, and the piezoelectric quartz wafer has a width of 0.6 to 2.5 mm, and the width in the present example is 1.2. Mm, the quartz wafer The resonant frequency is _{t =} 1664/F, t represents the thickness of the quartz wafer, and the unit is μηι; F represents the resonant frequency, and the unit is ΜΗζ. The resonant frequency of the quartz wafer in this example is between 8 MHz and 70 MHz.

[0030] As shown in FIG. 5 and FIG. 6, a piezoelectric quartz wafer having a single convex structure is processed as follows:

[0031] Sl, taking out a quartz substrate 7 of a certain specification, and grinding and polishing the upper and lower surfaces of the quartz substrate 7;

[0032] S2, forming a uniform thickness lithographic anti-etching protective layer ER on the surface of the quartz substrate 7 by spin coating or spraying, and then using lithographic exposure on the lithographic anti-etching protective layer ER, forming on the surface Etching the pattern;

[0033] S3, etching the surface of the quartz substrate 7 by wet etching or dry etching, thereby forming a bump 4 on the surface of the quartz substrate 7, and the etching depth of the bump 4 is controlled by wet etching or Dry etching reaction

[0034] S4, removing the lithographic anti-etching protective layer ER in step S3 and cleaning the surface of the quartz substrate 7;

[0035] S5. After the cleaning is completed, a lithographic anti-etching protective layer ER having a uniform thickness is formed on the surface of the quartz substrate 7 by spin coating or spraying, and then lithographically exposed on the lithographic anti-etching protective layer ER. Forming a surface to be etched;

[0036] S6, surface etching on the quartz substrate 7 by wet etching, dry etching, laser etching, physical blasting, etc., thereby forming a through groove A5 and a through groove B6;

[0037] S7. The lithographic anti-etching protective layer ER is removed and the surface of the quartz substrate 7 is cleaned to obtain a piezoelectric quartz wafer having a single convex structure.

[0038] S8, processing a cutting positioning hole 8 on the quartz substrate 7;

[0039] S9, cutting and separating the quartz substrate 7 along the cutting positioning hole 8 by using laser cutting or blade cutting, thereby realizing processing of the quartz wafer.

[0040] Embodiment 2:

[0041] As shown in FIG. 7 to FIG. 9 , the second embodiment is different from the first embodiment in that: two short connecting sides of the protective frame 2 and the central member 1 are connected with two connecting portions 3, two The connecting portion 3 increases the mechanical strength between the center member 1 and the frame 2 .

The above is only a preferred embodiment of the present invention, and it should be understood that the present invention is not limited to the forms disclosed herein, and should not be construed as being excluded from the other embodiments, but may be used in various other combinations, modifications, and Environment, and within the scope of the concepts described herein, through the above teachings or related fields of technology or knowledge Make changes. All changes and modifications made by those skilled in the art are intended to be within the scope of the appended claims.

Claims

Claims a piezoelectric quartz wafer with a single convex structure, characterized in that: it includes a central component (1), a protective frame (2) and a connecting part (3), the central component (1) and the protective frame (2) are all rectangular in shape, the protective frame (2) is provided with a cavity, and the cavity is provided with a central component

(1) Set in the cavity, the top surface of the central component (1) is provided with a boss (4) that can weaken the parasitic vibration generated at the edge and enhance the energy sinking effect in the center of the quartz wafer, and the protective frame (2) A slot A (5) is formed between the two long sides and the two long sides of the central member (1), and a slot A (5) is formed between the two short sides of the protective frame (2) and the two short sides of the central member (1). There is a through slot B (6), the through slot A (5) is connected with the through slot B (6), and the protective frame

Any short side of (2) is connected to the central component (1) through a connecting part (3), and the connecting part (3) is arranged in any one of the through slots B (6).

A piezoelectric quartz wafer with a single convex structure according to claim 1, characterized in that: the boss (4) is a circular boss, a rectangular boss or a trapezoidal boss.

A piezoelectric quartz wafer with a single convex structure according to claim 1, characterized in that: the shape of the connecting part (3) is rectangular or trapezoidal.

A piezoelectric quartz wafer with a single convex structure according to claim 1, characterized in that: the length of the piezoelectric quartz wafer is 0.8~3.2mm.

A piezoelectric quartz wafer with a single convex structure according to claim 1 or 4, characterized in that: the width of the piezoelectric quartz wafer is 0.6~2.5mm.

A piezoelectric quartz wafer with a single convex structure according to claim 1, characterized in that: the central component (1), the protective frame (2) and the connecting portion (3) are all made of quartz.