JP2011186310A - Proximity exposure device, gap control method thereof, and method for manufacturing display panel substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To control a gap between a mask and a substrate in a short time by preventing a mask holder from falling after gap adjustment, when the gap between the mask and the substrate is controlled by moving and tilting the mask holder in a Z direction, while supporting the mask holder by air pressure. <P>SOLUTION: Compressed air is supplied from a pneumatic circuit to a pneumatic support device 23, and a mask holder 20 is supported by air pressure of the pneumatic support device 23. A gap between a mask 2 and a substrate 1 is adjusted, by moving and tilting the mask holder 20 with a plurality of Z-tilt mechanisms 30 in the Z direction, while sealing air in the pneumatic support device 23 by cutting off the pneumatic support device 23 from the pneumatic circuit. Since the air does not flow out from the pneumatic support device 23 after gap adjustment, the mask holder 20 does not fall. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a proximity exposure apparatus that exposes a substrate using a proximity method in the manufacture of a display panel substrate such as a liquid crystal display device, a gap control method for the proximity exposure apparatus, and a display panel using the same. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate manufacturing method, and more particularly, a proximity exposure apparatus and a proximity exposure apparatus that perform gap alignment between a mask and a substrate by moving and tilting the mask holder in the Z direction while supporting a mask holder holding a mask with air pressure. The present invention relates to a gap control method for an exposure apparatus and a method for manufacturing a display panel substrate using the same.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. As an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There is a proximity method. The proximity method is inferior in pattern resolution performance to the projection method, but the configuration of the irradiation optical system is simple, the processing capability is high, and it is suitable for mass production.

  In recent years, in the manufacture of various substrates for display panels, a relatively large substrate is prepared in order to cope with an increase in size and a variety of sizes, and one or a plurality of substrates can be selected from one substrate depending on the size of the display panel. Manufactures display panel substrates. In this case, in the proximity method, if one surface of the substrate is to be exposed all at once, a mask having the same size as the substrate is required, which further increases the cost of the expensive mask. Therefore, a method in which a mask that is relatively smaller than the substrate is used, the substrate is stepped in the X and Y directions by a stage, and one surface of the substrate is divided into a plurality of shots for exposure.

  In order to improve the exposure accuracy in the proximity exposure apparatus, it is necessary to accurately control the gap between the mask and the substrate. In a conventional proximity exposure apparatus, a plurality of Z-tilt mechanisms provided on a stage are used, and a chuck for supporting a substrate is moved up and down and tilted to control a gap between the mask and the substrate. However, when exposing one side of a substrate in a plurality of shots, there is a problem that the center position of the gap control (the center of the substrate) is shifted from the center of the gap (the center of the mask) and the accuracy of the gap control is lowered. .

  On the other hand, Patent Document 1 discloses a technique in which a plurality of Z-tilt mechanisms are provided in a mask holder that holds a mask, and the mask holder is moved and tilted up and down to control the gap between the mask and the substrate. ing. Since the mask holder is moved up and down and tilted to control the gap between the mask and the substrate, the center position of the gap control always coincides with the center of the gap (the center of the mask), and one surface of the substrate is divided into a plurality of shots. Even in the case of exposure, the accuracy of gap control does not decrease.

JP 2006-235019 A

  In the technique described in Patent Document 1, the load of the mask holder is supported by air pressure by a load support mechanism such as an air cushion. By supporting the load of the mask holder with a load support mechanism provided separately from the Z-tilt mechanism, the Z-tilt mechanism can move and tilt the mask holder up and down with a small force, improving the accuracy of gap control. be able to.

  A pneumatic support device such as an air cushion is used while constantly supplying compressed air having a predetermined pressure from a pneumatic circuit to keep the internal air pressure constant. However, when the substrate becomes larger and the mask becomes larger, the weight of the mask holder also increases. When the gap between the mask and the substrate is narrowed during gap control, the air pressure in the pneumatic support device temporarily increases and the pneumatic support is increased. Air flows from the device to the pneumatic circuit. Therefore, after the gap alignment, the mask holder slowly descends, the gap between the mask and the substrate becomes narrower than the target gap, and it is necessary to perform the gap alignment again.

  An object of the present invention is to prevent the mask holder from descending after gap alignment when performing the gap control between the mask and the substrate by moving and tilting the mask holder in the Z direction while supporting the mask holder with air pressure. Thus, the gap control between the mask and the substrate is performed in a short time. Another object of the present invention is to manufacture a display panel substrate with high throughput.

  A proximity exposure apparatus of the present invention includes a chuck that supports a substrate, a mask holder that holds the mask, and a stage that moves the chuck, and a mask pattern is provided by providing a minute gap between the mask and the substrate. In a proximity exposure apparatus for transferring a substrate to a substrate, a pneumatic support device that supports the mask holder with air pressure, a pneumatic circuit that supplies compressed air to the pneumatic support device, and a plurality of Z-tilts that move and tilt the mask holder in the Z direction When the mask holder is moved and tilted in the Z direction by the mechanism and a plurality of Z-tilt mechanisms to adjust the gap between the mask and the substrate, the pneumatic support device is disconnected from the pneumatic circuit, And a control means for sealing air.

  Further, the gap control method of the proximity exposure apparatus of the present invention includes a chuck that supports the substrate, a mask holder that holds the mask, and a stage that moves the chuck, and a minute gap is formed between the mask and the substrate. A gap exposure method for a proximity exposure apparatus that transfers a mask pattern to a substrate, the compressed air is supplied from a pneumatic circuit to a pneumatic support device, and the mask holder is supported pneumatically by the pneumatic support device. The mask holder is moved and tilted in the Z direction by a plurality of Z-tilt mechanisms while the air in the pneumatic support device is sealed off from the pneumatic circuit, and the gap between the mask and the substrate is adjusted. .

  Compressed air is supplied from the pneumatic circuit to the pneumatic support device, and the mask holder is supported pneumatically by the pneumatic support device. Therefore, a plurality of Z-tilt mechanisms can move and tilt the mask holder in the Z direction with a small force. The accuracy of gap control is improved. Then, while shutting off the pneumatic support device from the pneumatic circuit and sealing the air in the pneumatic support device, the mask holder is moved and tilted in the Z direction by a plurality of Z-tilt mechanisms to adjust the gap between the mask and the substrate. Therefore, even if the air pressure in the pneumatic support device temporarily increases greatly during gap alignment, air does not flow out from the pneumatic support device, and the mask holder does not descend after gap alignment. Therefore, it is not necessary to perform the gap alignment again, and the gap control between the mask and the substrate can be performed in a short time.

  Furthermore, the proximity exposure apparatus of the present invention has a regulator for adjusting the pressure of compressed air supplied to the pneumatic support device by the pneumatic circuit, and an electromagnetic valve connected between the regulator and the pneumatic support device. The control means closes the electromagnetic valve to seal the air in the pneumatic support device. According to the gap control method of the proximity exposure apparatus of the present invention, a regulator for adjusting the pressure of compressed air supplied to the pneumatic support device is provided in the pneumatic circuit, and an electromagnetic valve is connected between the regulator and the pneumatic support device. The solenoid valve is closed to seal the air in the pneumatic support device. The pneumatic circuit is equipped with a regulator that adjusts the pressure of the compressed air supplied to the pneumatic support device. By connecting the solenoid valve between the regulator and the pneumatic support device, the pneumatic valve can be closed with a simple process. The air inside can be sealed.

  Further, in the proximity exposure apparatus of the present invention, when exposing one side of a substrate in a plurality of shots, the stage moves the chuck and performs step movement of the substrate in the XY directions, and the control means includes a plurality of control means. Before starting the first shot gap alignment by the Z-tilt mechanism, the pneumatic support device is disconnected from the pneumatic circuit to seal the air in the pneumatic support device, and the last shot is completed, The pneumatic circuit is connected to the pneumatic support device after the gap between the mask and the substrate is widened by the tilt mechanism.

  In the proximity control method of the proximity exposure apparatus according to the present invention, the chuck is moved by the stage, the substrate is moved stepwise in the XY direction, the one surface of the substrate is divided into a plurality of shots, and the plurality of Z is exposed. -Before starting the gap alignment of the first shot by the tilt mechanism, the pneumatic support device is disconnected from the pneumatic circuit, the air in the pneumatic support device is sealed, the last shot is finished, and multiple Z-tilts After the gap between the mask and the substrate is widened by the mechanism, the pneumatic circuit is connected to the pneumatic support device.

  When exposing one side of the substrate in multiple shots, the air pressure in the pneumatic support device is extended from the start of the first shot gap alignment until the last shot ends and the gap between the mask and the substrate widens. Even if the temperature rises temporarily, air does not flow out from the pneumatic support device, and the mask holder does not descend. Therefore, in each shot, the gap control between the mask and the substrate is performed in a short time.

  The method for manufacturing a display panel substrate according to the present invention includes exposing the substrate using any one of the above-described proximity exposure apparatuses, or using the gap control method of any one of the above-described proximity exposure apparatuses and a mask. The substrate is exposed by adjusting the gap with the substrate. The gap control between the mask and the substrate is performed in a short time, and the display panel substrate is manufactured with high throughput.

  According to the proximity exposure apparatus and proximity exposure apparatus gap control method of the present invention, compressed air is supplied from the pneumatic circuit to the pneumatic support apparatus, the mask holder is supported by the pneumatic support apparatus, and the pneumatic support apparatus is pneumatic circuit. After the gap is adjusted, the mask holder is moved and tilted in the Z direction by a plurality of Z-tilt mechanisms while the air in the pneumatic support device is sealed off and the gap between the mask and the substrate is adjusted. Further, it is possible to prevent the air from flowing out from the pneumatic support device and the mask holder from being lowered, and the gap control between the mask and the substrate can be performed in a short time.

  Furthermore, according to the proximity exposure apparatus and the proximity exposure apparatus gap control method of the present invention, the pneumatic circuit is provided with a regulator for adjusting the pressure of the compressed air supplied to the pneumatic support apparatus. By connecting the solenoid valve between them, the air in the pneumatic support device can be sealed with a simple process of closing the solenoid valve.

  Furthermore, according to the proximity exposure apparatus and proximity exposure apparatus gap control method of the present invention, the chuck is moved by the stage, the substrate is moved stepwise in the XY directions, and one surface of the substrate is divided into a plurality of shots. Before starting the gap alignment of the first shot with multiple Z-tilt mechanisms, disconnect the pneumatic support device from the pneumatic circuit, seal the air in the pneumatic support device, and finish the last shot Then, after widening the gap between the mask and the substrate by a plurality of Z-tilt mechanisms, the gap between the mask and the substrate can be controlled in a short time in each shot by connecting the pneumatic circuit to the pneumatic support device. it can.

  According to the method for manufacturing a display panel substrate of the present invention, since the gap control between the mask and the substrate can be performed in a short time, the display panel substrate can be manufactured with high throughput.

It is a figure which shows schematic structure of the proximity exposure apparatus by one embodiment of this invention. It is a top view of a mask holder. It is a figure which shows the state which moved the chuck | zipper to the load / unload position. It is a figure which shows an example of the pneumatic circuit which supplies compressed air to a pneumatic support apparatus. FIG. 5A is a front view of the Z-tilt mechanism, and FIG. 5B is a side view of the Z-tilt mechanism. It is a figure which shows schematic structure of a gap sensor. It is a figure which shows an example of the area | region of a shot. It is a flowchart which shows the operation | movement of the exposure process using the gap control method of the proximity exposure apparatus by one Embodiment of this invention. It is a figure which shows the state which performed gap alignment. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1 is a diagram showing a schematic configuration of a proximity exposure apparatus according to an embodiment of the present invention. The present embodiment shows an example of a proximity exposure apparatus that performs step movement of the substrate in the XY directions and exposes one surface of the substrate in a plurality of shots. The proximity exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck support base 9, a chuck 10, a mask holder 20, a holder frame 21, a top frame 22, and air pressure. Support device 23, pneumatic circuit for supplying compressed air to pneumatic support device 23, Z-tilt mechanism 30, gap sensor 40, main controller 50, X stage drive circuit 61, Y stage drive circuit 62, θ stage drive circuit 63, And a Z-tilt mechanism drive circuit 64. In FIG. 1, a pneumatic circuit for supplying compressed air to the pneumatic support device 23 is omitted. In addition to these, the proximity exposure apparatus carries a substrate 1 into the chuck 10 and also carries a substrate transport robot that unloads the substrate 1 from the chuck 10, an irradiation optical system that irradiates exposure light, and a temperature at which temperature management in the apparatus is performed. A control unit is provided.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  In FIG. 1, the chuck 10 is at an exposure position where the substrate 1 is exposed. A top frame 22 is installed above the exposure position. A holder frame 21 is attached to the top frame 22 via a pneumatic support device 23. A mask holder 20 that holds the mask 2 is attached to the holder frame 21. The pneumatic support device 23 is constituted by, for example, an air cushion, and supports the loads of the mask holder 20 and the holder frame 21 by the internal air pressure.

  FIG. 2 is a top view of the mask holder. In FIG. 2, the mask holder 20 is provided with an opening 20a through which exposure light passes, and the mask 2 is mounted below the opening 20a. A suction groove is provided around the opening 20a on the lower surface of the mask holder 20, and the mask holder 20 holds the peripheral portion of the mask 2 by vacuum suction using the suction groove. An irradiation optical system (not shown) is disposed above the mask 2 held by the mask holder 20. At the time of exposure, exposure light from the irradiation optical system passes through the mask 2 and is irradiated onto the substrate 1, whereby the pattern of the mask 2 is transferred to the surface of the substrate 1 and a pattern is formed on the substrate 1.

  FIG. 3 is a diagram illustrating a state in which the chuck is moved to the load / unload position. At the load / unload position, the substrate 1 is carried into the chuck 10 and the substrate 1 is carried out of the chuck 10 by a substrate transfer robot (not shown). The loading of the substrate 1 onto the chuck 10 and the unloading of the substrate 1 from the chuck 10 are performed using a plurality of push-up pins provided on the chuck 10. The push-up pin is housed inside the chuck 10 and is lifted from the inside of the chuck 10 to receive the substrate 1 from the substrate transfer robot and unload the substrate 1 from the chuck 10 when loading the substrate 1 onto the chuck 10. In doing so, the substrate 1 is delivered to the substrate transfer robot.

  1 and 3, the chuck 10 is mounted on the θ stage 8 via the chuck support 9, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves along the X guide 4 in the X direction (the horizontal direction in FIGS. 1 and 3). The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5 and moves in the Y direction (the depth direction in FIGS. 1 and 3) along the Y guide 6. The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The chuck support 9 is mounted on the θ stage 8 and supports the chuck 10 at a plurality of locations.

  The chuck 10 is moved between the load / unload position and the exposure position by the movement of the X stage 5 in the X direction and the movement of the Y stage 7 in the Y direction. At the load / unload position, the substrate 1 mounted on the chuck 10 is pre-aligned by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. Is done. At the exposure position, the X stage 5 is moved in the X direction and the Y stage 7 is moved in the Y direction, whereby the substrate 1 mounted on the chuck 10 is stepped in the XY direction. Then, the substrate 1 is aligned by the movement of the X stage 5 in the X direction, the movement of the Y stage 7 in the Y direction, and the rotation of the θ stage 8 in the θ direction. In addition, the mask holder 20 is moved and tilted in the Z direction (the vertical direction in FIG. 1) by the Z-tilt mechanism 30 provided on the side surface of the top frame 22 to adjust the gap between the mask 2 and the substrate 1. Is called.

  The X stage 5, Y stage 7, and θ stage 8 are provided with drive mechanisms (not shown) such as ball screws and motors, linear motors and the like. In FIG. 1, the X stage drive circuit 61 drives the X stage 5 under the control of the main controller 50. The Y stage drive circuit 62 drives the Y stage 7 under the control of the main controller 50. The θ stage drive circuit 63 drives the θ stage 8 under the control of the main controller 50. The Z-tilt mechanism drive circuit 64 drives each Z-tilt mechanism 30 under the control of the main controller 50.

  FIG. 4 is a diagram illustrating an example of a pneumatic circuit that supplies compressed air to the pneumatic support device. The pneumatic circuit includes a regulator 26 and a solenoid valve 27. The regulator 26 adjusts the pressure of the compressed air supplied from the air source 25 to the pneumatic support device 23. The electromagnetic valve 27 connected between the regulator 26 and the pneumatic support device 23 is a normally open direction control valve, for example, and is controlled by the main controller 50. When the solenoid valve 27 is in an operating state, the supply port (P) is connected to the regulator 26, the outlet (A) is connected to the pneumatic support device 23, and compressed air whose pressure is adjusted by the regulator 26 is supplied to the pneumatic support device. 23. The compressed air supplied from the regulator 26 via the electromagnetic valve 27 keeps the air pressure inside the air pressure support device 23 constant.

  FIG. 5A is a front view of the Z-tilt mechanism, and FIG. 5B is a side view of the Z-tilt mechanism. The Z-tilt mechanism 30 includes a casing 31, a linear motion guide 32, a movable block 33, a motor 34, a shaft coupling 35, a ball screw 36a, a nut 36b, and a ball 37. As shown in FIG. 5B, the casing 31 is attached to the side surface of the top frame 22. As shown in FIG. 5A, a linear motion guide 32 is provided inside the casing 31, and a movable block 33 is mounted on the linear motion guide 32. A motor 34 is installed above the casing 31, and a ball screw 36 a is connected to the rotating shaft of the motor 34 via a shaft coupling 35. A nut 36 b that is moved by a ball screw 36 a is attached to the movable block 33, and the movable block 33 moves up and down along the linear guide 32 by the rotation of the motor 34.

  As shown in FIG. 5B, a tilt arm 24 is provided on the lower surface of the holder frame 21. A ball 37 is attached to the lower surface of the movable block 33, and the ball 37 is pressed against the tilt arm 24 by the movable block 33. In FIG. 2, the Z-tilt mechanism 30 is installed at three locations near the side surface of the holder frame 21. The three Z-tilt mechanisms 30 move the movable block 33 up and down to change the height of the ball 37 that pushes the tilt arm 24, thereby changing the height of the holder frame 21 supported by the pneumatic support device 23. The height is changed at three locations, and the mask holder 20 is moved and tilted in the Z direction.

  In FIG. 2, four gap sensors 40 are provided above the mask 2 held by the mask holder 20. When the gap between the mask 2 and the substrate 1 is aligned, each gap sensor 40 is moved above the four corners of the opening 20a of the mask holder 20 by a moving mechanism (not shown), and the gap between the mask 2 and the substrate 1 is changed to the mask. Measure at the four corners. After the gap alignment between the mask 2 and the substrate 1 is completed, each gap sensor 40 is moved outside the opening 20a of the mask holder 20 by a moving mechanism (not shown).

  FIG. 6 is a diagram illustrating a schematic configuration of the gap sensor. The gap sensor 40 includes a laser light source 41, a collimation lens group 42, a projection lens 43, mirrors 44 and 45, an imaging lens 46, and a CCD line sensor 47. Laser light generated from the laser light source 41 passes through the collimation lens group 42 and the projection lens 43 and is irradiated obliquely from the mirror 44 to the mask 2. A part of the laser light applied to the mask 2 is reflected by the upper surface of the mask 2, and a part of the laser light is transmitted into the mask 2. A part of the laser light transmitted to the inside of the mask 2 is reflected by the lower surface of the mask 2, and a part of the laser light is irradiated to the surface of the substrate 1 from the lower surface of the mask 2. A part of the laser light applied to the surface of the substrate 1 is reflected by the surface of the substrate 1 and a part of the laser light is transmitted to the inside of the substrate 1. The laser light reflected by the lower surface of the mask 2 and the laser light reflected by the surface of the substrate 1 are emitted from the upper surface of the mask, then reflected by the mirror 45, pass through the imaging lens 46, and pass through the CCD line sensor 47. An image is formed on the light receiving surface. The CCD line sensor 47 outputs a detection signal corresponding to the intensity of light received by the light receiving surface. The gap G between the mask 2 and the substrate 1 is determined from the position of the detection signal of the laser beam reflected from the lower surface of the mask 2 of the CCD line sensor 47 and the position of the detection signal of the laser beam reflected from the surface of the substrate 1. Measured.

  Hereinafter, a gap control method for a proximity exposure apparatus according to an embodiment of the present invention will be described. The proximity exposure apparatus of this embodiment moves the substrate 1 stepwise in the XY directions at the exposure position, and exposes one surface of the substrate 1 by dividing it into a plurality of shots. FIG. 7 is a diagram illustrating an example of a shot area. FIG. 7 shows an example in which one surface of the substrate 1 is exposed in six shots. The region 1a of the substrate 1 is exposed by the first shot, the region 1b of the substrate 1 is exposed by the second shot, the region 1c of the substrate 1 is exposed by the third shot, and the region 1c of the substrate 1 is exposed by the fourth shot. The region 1d is exposed, the region 1e of the substrate 1 is exposed by the fifth shot, and the region 1f of the substrate 1 is exposed by the sixth shot.

  FIG. 8 is a flowchart showing the operation of the exposure process using the gap control method of the proximity exposure apparatus according to one embodiment of the present invention. First, the substrate 1 is loaded onto the chuck 10 at the load / unload position (step 301). The main controller 50 drives the X stage 5 by the X stage drive circuit 61, drives the Y stage 7 by the Y stage drive circuit 62, drives the θ stage 8 by the θ stage drive circuit 63, and loads / unloads. At the position, the chuck 10 is moved in the XY direction and rotated in the θ direction to perform pre-alignment of the substrate 1 (step 302). Next, main controller 50 drives X stage 5 by X stage drive circuit 61, drives Y stage 7 by Y stage drive circuit 62, moves chuck 10 to the exposure position, and moves substrate 1 to the exposure position. To the position where the first shot is performed (step 303).

  Next, the main controller 50 closes the solenoid valve 27 of the pneumatic circuit that supplies compressed air to the pneumatic support device 23 (step 304). By closing the solenoid valve 27, the pneumatic support device 23 is disconnected from the pneumatic circuit, and the air in the pneumatic support device 23 is sealed. Subsequently, the main controller 50 drives each Z-tilt mechanism 30 by the Z-tilt mechanism driving circuit 64 based on the measurement results of the four gap sensors 40 to perform gap alignment between the mask 2 and the substrate 1. (Step 305).

  FIG. 9 is a diagram illustrating a state in which gap alignment is performed. In the gap alignment, when the mask holder 20 is lowered and the gap between the mask 2 and the substrate 1 is narrowed, the air pressure in the pneumatic support device 23 temporarily increases. At this time, as shown in FIG. 4, if the electromagnetic valve 27 of the pneumatic circuit remains in an activated state, the air pressure in the pneumatic support device 23 is temporarily increased when the weight of the mask holder 20 and the holder frame 21 is heavy. Ascending, air flows out from the pneumatic support device 23 to the pneumatic circuit. For this reason, the mask holder 20 slowly descends after the gap alignment, the gap between the mask 2 and the substrate 1 becomes narrower than the target gap, and the gap alignment needs to be performed again.

  In the present embodiment, as shown in FIG. 9, the plurality of Z-tilt mechanisms 30 are closed while closing the solenoid valve 27 and shutting off the pneumatic support device 23 from the pneumatic circuit to seal the air in the pneumatic support device 23. Since the mask holder 20 is moved and tilted in the Z direction by this to adjust the gap between the mask 2 and the substrate 1, even if the air pressure in the air pressure support device 23 rises temporarily during the gap adjustment, the air pressure support device The air does not flow out from 23, and the mask holder 20 does not descend after the gap alignment. Therefore, it is not necessary to perform the gap alignment again, and the gap control between the mask 2 and the substrate 1 is performed in a short time.

  Further, a regulator 26 for adjusting the pressure of the compressed air supplied to the pneumatic support device 23 is provided in the pneumatic circuit, and the electromagnetic valve 27 is closed by connecting the electromagnetic valve 27 between the regulator 26 and the pneumatic support device 23. The air in the pneumatic support device 23 can be sealed with a simple process.

  In FIG. 8, after performing the gap alignment (step 305) between the mask 2 and the substrate 1, the main controller 50 drives the X stage 5 by the X stage driving circuit 61 and the Y stage 7 by the Y stage driving circuit 62. And the θ stage 8 is driven by the θ stage driving circuit 63 to move the chuck 10 in the XY direction and rotate it in the θ direction, thereby aligning the substrate 1 (step 306).

  The alignment of the substrate 1 (step 306) is the distance that the alignment sensor can detect the alignment marks provided on the substrate 1 and the mask 2 during the gap alignment between the mask 2 and the substrate 1 (step 305). Alternatively, the process may be started when the mask 2 and the substrate 1 approach each other. In that case, the gap alignment between the mask 2 and the substrate 1 (step 305) and the alignment of the substrate 1 (step 306) can be partially performed in parallel, thereby reducing the tact time.

  After completing the gap alignment between the mask 2 and the substrate 1 and performing a shot (step 307), the main controller 50 determines whether or not all shots have been completed (step 308). If all shots have not been completed, main controller 50 drives each Z-tilt mechanism 30 by Z-tilt mechanism drive circuit 64 to widen the gap between mask 2 and substrate 1 (step 309). Subsequently, the main controller 50 drives the X stage 5 by the X stage drive circuit 61 and drives the Y stage 7 by the Y stage drive circuit 62 to perform step movement of the substrate 1 in the XY directions (Step 310). ), The substrate 1 is moved to the position where the next shot is performed. Then, the process returns to step 305, and steps 305 to 310 are repeated until all shots are completed.

  When all shots are completed, the main controller 50 drives each Z-tilt mechanism 30 by the Z-tilt mechanism driving circuit 64 to widen the gap between the mask 2 and the substrate 1 (step 311), and then the air pressure is increased. The circuit solenoid valve 27 is opened (step 312), and the pneumatic circuit is connected to the pneumatic support device 23 as shown in FIG. When exposing one surface of the substrate 1 by dividing it into a plurality of shots, the pneumatic support device is used until the gap between the mask 2 and the substrate 1 is widened after starting the gap alignment of the first shot and ending the last shot. Even if the air pressure in 23 increases temporarily, air does not flow out from the air pressure support device 23, and the mask holder 20 does not descend. Therefore, in each shot, the gap control between the mask 2 and the substrate 1 is performed in a short time.

  Subsequently, the main controller 50 drives the X stage 5 by the X stage drive circuit 61 and drives the Y stage 7 by the Y stage drive circuit 62 to move the chuck 10 to the load / unload position (step 313). ). Then, the substrate 1 is unloaded from the chuck 10 at the load / unload position (step 314).

  According to the embodiment described above, compressed air is supplied from the pneumatic circuit to the pneumatic support device 23, the mask holder 20 is supported by the pneumatic pressure by the pneumatic support device 23, and the pneumatic support device 23 is shut off from the pneumatic circuit, While sealing the air in the support device 23, the mask holder 20 is moved and tilted in the Z direction by a plurality of Z-tilt mechanisms 30 to perform the gap alignment between the mask 2 and the substrate 1, so that after the gap alignment, It is possible to prevent the air from flowing out from the pneumatic support device 23 and the mask holder 20 from being lowered, and the gap control between the mask 2 and the substrate 1 can be performed in a short time.

  Further, a regulator 26 for adjusting the pressure of compressed air supplied to the pneumatic support device 23 is provided in the pneumatic circuit, and the electromagnetic valve 27 is closed by connecting the electromagnetic valve 27 between the regulator 26 and the pneumatic support device 23. The air in the pneumatic support device 23 can be sealed with a simple process.

  Further, the chuck 10 is moved by the X stage 5 and the Y stage 7, the step movement of the substrate 1 in the XY direction is performed, and one surface of the substrate 1 is exposed in a plurality of shots, and a plurality of Z-tilt mechanisms 30 are exposed. Before starting the gap alignment of the first shot, the pneumatic support device 23 is disconnected from the pneumatic circuit, the air in the pneumatic support device 23 is sealed, the last shot is finished, and a plurality of Z-tilt mechanisms After widening the gap between the mask 2 and the substrate 1 by 30 and connecting the pneumatic circuit to the pneumatic support device 23, the gap control between the mask 2 and the substrate 1 can be performed in a short time in each shot.

  The present invention is not limited to the case where one surface of the substrate is divided into a plurality of shots for exposure, but is also applied to the case where one surface of the substrate is exposed at a time.

  By exposing the substrate using the proximity exposure apparatus of the present invention, or by aligning the gap between the mask and the substrate using the gap control method of the proximity exposure apparatus of the present invention. Since the gap control between the mask and the substrate can be performed in a short time, the display panel substrate can be manufactured with high throughput.

  For example, FIG. 10 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photosensitive resin material (photoresist) is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), the mask pattern is transferred to the photoresist film using a proximity exposure apparatus, a projection exposure apparatus, or the like. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 11 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, a printing method, an electrodeposition method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 10, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 11, in the black matrix forming process (step 201) and the colored pattern forming process (step 202). In this exposure process, the proximity exposure apparatus of the present invention or the gap control method of the proximity exposure apparatus of the present invention can be applied.

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Mask 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 9 Chuck support stand 10 Chuck 20 Mask holder 21 Holder frame 22 Top frame 23 Pneumatic support device 24 Tilt arm 25 Air source 26 Regulator 27 Electromagnetic valve 30 Z-tilt mechanism 31 Casing 32 Linear motion guide 33 Movable block 34 Motor 35 Shaft coupling 36a Ball screw 36b Nut 37 Ball 40 Gap sensor 41 Laser light source 42 Collimation lens group 43 Projection lenses 44, 45 Mirror 46 Imaging lens 47 CCD line sensor 50 Main controller 61 X stage drive circuit 62 Y stage drive circuit 63 θ stage drive circuit 64 Z-tilt mechanism drive circuit

Claims (8)

Proximity exposure that includes a chuck that supports the substrate, a mask holder that holds the mask, and a stage that moves the chuck, and provides a minute gap between the mask and the substrate to transfer the mask pattern to the substrate. In the device
A pneumatic support device for supporting the mask holder with air pressure;
A pneumatic circuit for supplying compressed air to the pneumatic support device;
A plurality of Z-tilt mechanisms for moving and tilting the mask holder in the Z direction;
When the gap between the mask and the substrate is adjusted by moving and tilting the mask holder in the Z direction by the plurality of Z-tilt mechanisms, the pneumatic support device is disconnected from the pneumatic circuit, and the pneumatic support device Proximity exposure apparatus comprising control means for sealing air inside. The pneumatic circuit has a regulator for adjusting the pressure of compressed air supplied to the pneumatic support device, and an electromagnetic valve connected between the regulator and the pneumatic support device,
The proximity exposure apparatus according to claim 1, wherein the control unit closes the electromagnetic valve to seal air in the pneumatic support device. When exposing one side of a substrate in multiple shots,
The stage moves the chuck to perform step movement of the substrate in the XY directions,
The control means shuts off the pneumatic support device from the pneumatic circuit and seals the air in the pneumatic support device before starting the gap alignment of the first shot by the plurality of Z-tilt mechanisms. 3. The pneumatic circuit is connected to the pneumatic support device after the shot is completed and the gap between the mask and the substrate is widened by the plurality of Z-tilt mechanisms. The proximity exposure apparatus described. A proximity exposure apparatus that includes a chuck that supports a substrate, a mask holder that holds the mask, and a stage that moves the chuck, and that provides a minute gap between the mask and the substrate to transfer the mask pattern to the substrate. The gap control method of
Supply compressed air from the pneumatic circuit to the pneumatic support device,
The mask holder is supported pneumatically by a pneumatic support device,
While the pneumatic support device is cut off from the pneumatic circuit and the air in the pneumatic support device is sealed, the mask holder is moved and tilted in the Z direction by a plurality of Z-tilt mechanisms to adjust the gap between the mask and the substrate. A gap control method for a proximity exposure apparatus. A regulator that adjusts the pressure of compressed air supplied to the pneumatic support device is provided in the pneumatic circuit, and a solenoid valve is connected between the regulator and the pneumatic support device.
5. The gap control method for a proximity exposure apparatus according to claim 4, wherein the electromagnetic valve is closed to seal the air in the pneumatic support device. Move the chuck with the stage, perform step movement of the substrate in the XY direction, divide and expose one side of the substrate into multiple shots,
Before starting the gap alignment of the first shot by multiple Z-tilt mechanisms, the pneumatic support device is disconnected from the pneumatic circuit to seal the air in the pneumatic support device, the last shot is completed, 6. The proximity exposure apparatus gap control method according to claim 4, wherein the pneumatic circuit is connected to the pneumatic support device after the gap between the mask and the substrate is widened by the Z-tilt mechanism.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the proximity exposure apparatus according to any one of claims 1 to 3.   7. A display panel, wherein the gap is adjusted between the mask and the substrate by using the gap control method of the proximity exposure apparatus according to claim 4, and the substrate is exposed. A method for manufacturing a substrate.

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