JP2011166112A5 - - Google Patents
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- Publication number
- JP2011166112A5 JP2011166112A5 JP2010227766A JP2010227766A JP2011166112A5 JP 2011166112 A5 JP2011166112 A5 JP 2011166112A5 JP 2010227766 A JP2010227766 A JP 2010227766A JP 2010227766 A JP2010227766 A JP 2010227766A JP 2011166112 A5 JP2011166112 A5 JP 2011166112A5
- Authority
- JP
- Japan
- Prior art keywords
- lid
- motor
- processing tube
- substrate
- boat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 13
- 238000007789 sealing Methods 0.000 claims 11
- 230000003028 elevating effect Effects 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 4
- 238000011084 recovery Methods 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010227766A JP5711930B2 (ja) | 2010-01-12 | 2010-10-07 | 基板処理装置及び半導体装置の製造方法 |
| KR1020100129772A KR101219587B1 (ko) | 2010-01-12 | 2010-12-17 | 기판 처리 장치 및 반도체 장치의 제조 방법 |
| TW100100797A TWI447839B (zh) | 2010-01-12 | 2011-01-10 | 基板處理裝置及半導體裝置之製造方法 |
| US13/004,495 US8876453B2 (en) | 2010-01-12 | 2011-01-11 | Substrate processing apparatus and method of manufacturing semiconductor device |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010003884 | 2010-01-12 | ||
| JP2010003884 | 2010-01-12 | ||
| JP2010227766A JP5711930B2 (ja) | 2010-01-12 | 2010-10-07 | 基板処理装置及び半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011166112A JP2011166112A (ja) | 2011-08-25 |
| JP2011166112A5 true JP2011166112A5 (cg-RX-API-DMAC7.html) | 2013-11-14 |
| JP5711930B2 JP5711930B2 (ja) | 2015-05-07 |
Family
ID=44596384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010227766A Active JP5711930B2 (ja) | 2010-01-12 | 2010-10-07 | 基板処理装置及び半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5711930B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6208588B2 (ja) * | 2014-01-28 | 2017-10-04 | 東京エレクトロン株式会社 | 支持機構及び基板処理装置 |
| WO2016052023A1 (ja) | 2014-09-30 | 2016-04-07 | 株式会社日立国際電気 | 半導体製造装置、半導体装置の製造方法および記録媒体 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3065438B2 (ja) * | 1992-07-22 | 2000-07-17 | キヤノン株式会社 | 位置決め制御装置 |
| JPH07230320A (ja) * | 1994-02-18 | 1995-08-29 | Canon Inc | サーボ制御装置 |
| JP2004104011A (ja) * | 2002-09-12 | 2004-04-02 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| JP2005056905A (ja) * | 2003-08-05 | 2005-03-03 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| JP2008277354A (ja) * | 2007-04-25 | 2008-11-13 | Tekkusu Iijii:Kk | 把持装置 |
| JP5221118B2 (ja) * | 2007-12-14 | 2013-06-26 | 東京エレクトロン株式会社 | 検査装置 |
| JP5635270B2 (ja) * | 2009-02-13 | 2014-12-03 | 株式会社日立国際電気 | 基板処理装置及び基板処理システム及び基板処理装置の表示方法及び基板処理装置のパラメータ設定方法及び記録媒体 |
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2010
- 2010-10-07 JP JP2010227766A patent/JP5711930B2/ja active Active