JP2011159705A - Method of manufacturing element mounting member wafer, and method of manufacturing element mounting member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an element mounting member wafer, capable of inspecting electrical characteristics of a part serving as each element mounting member even in a state of an element mounting member wafer, capable of forming a recessed space for an component element at a predetermined position, and accordingly achieving improved productivity, and to provide a method of manufacturing an element mounting member. <P>SOLUTION: The method of manufacturing the element mounting member wafer includes a connection film cutting and groove forming step. In the step, a connection film electrically connecting an external terminal of predetermined one element mounting member and an external terminal of predetermined one other adjacent element mounting member is cut while a groove is formed along an edge of a part serving as each element mounting member of an element mounting member wafer, using a laser beam. In the element mounting member wafer, the element mounting members including a recessed space formed on one main surface, the space being for an component element, and an external terminal formed on the other main surface are formed in a matrix. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an element mounting member wafer used for an electronic component in which component elements are hermetically sealed and a method for manufacturing the element mounting member.

  An electronic component in which the component element mounted on the element mounting member is hermetically sealed by joining the lid member and the element mounting member is, for example, a piezoelectric device in which the component element is a piezoelectric vibration element.

Here, a piezoelectric vibrator as an example of a piezoelectric device will be described.
The piezoelectric vibrator is mainly composed of, for example, a piezoelectric vibration element that is a component element, a lid member, and an element mounting member.

The lid member is made of, for example, metal and has a rectangular flat plate shape.
Further, since the lid member is joined to the element mounting member, for example, an annular lid member joining film is provided along the edge of one main surface.

The piezoelectric vibration element as a component element is mainly composed of, for example, a piezoelectric piece, an excitation electrode, and a routing electrode.
The piezoelectric piece is made of, for example, a piezoelectric material and is provided in a rectangular flat plate shape.
For example, two excitation electrodes are paired.
The excitation electrode has one excitation electrode provided on one main surface of the piezoelectric piece, and the other excitation electrode provided on the other main surface of the piezoelectric piece and facing one excitation electrode. ing.
For example, two routing electrodes are paired.
The routing electrode has one end connected to a predetermined excitation electrode, and the other end is a main surface facing the main surface of the piezoelectric piece provided with the predetermined excitation electrode. It is provided so that it may be located in one edge part.

  The element mounting member is made of ceramics, for example, and is mainly composed of a substrate portion and a frame portion.

The board portion is provided in, for example, a rectangular flat plate shape, and mounting terminals are provided on one main surface, and a plurality of external terminals are provided on the other main surface.
For example, two mounting terminals are provided, and two mounting terminals are provided side by side along one short side of the substrate portion.
The mounting terminal is fixed by, for example, a lead electrode provided in the piezoelectric vibration element and a conductive adhesive.
For example, four external terminals are provided, one at each of the four corners of the other main surface of the substrate portion.
The predetermined external terminal is electrically connected to the predetermined mounting terminal.

The frame portion has a frame-like flat plate shape with a penetrating hole provided in the center portion.
The frame portion is provided on one main surface of the substrate portion, and the component element recessed space is provided in the element mounting member.
The frame portion is provided with an annular element mounting member bonding film along the edge of the surface facing the surface where the frame portion and the substrate portion are in contact.
Here, the element mounting member bonding film plays a role of bonding the element mounting member and the lid member.

The element mounting member is provided with a frame-shaped frame portion on one main surface of the substrate portion, and a component element recessed space is provided.
Further, the element mounting member is provided with a mounting terminal on the bottom surface of the component element concave space, and an annular element mounting member bonding film is provided along the edge of one main surface.
Here, one main surface of the element mounting member is a surface of the frame portion facing the surface where the frame portion and the substrate portion are in contact, that is, the main surface on which the component element concave space is provided. .
The other main surface of the element mounting member is the surface of the substrate portion facing the surface where the frame portion and the substrate portion are in contact, that is, the other main surface of the substrate portion where the external terminals are provided. Yes.

For example, in a piezoelectric vibrator that is an electronic component, a mounting terminal of an element mounting member and a lead electrode of the piezoelectric vibration element are fixed by a conductive adhesive, and the piezoelectric vibration element that is a component element is mounted on the element mounting member. Yes.
In addition, the piezoelectric vibrator, which is an electronic component, is melted in a state where the element mounting member bonding film and the lid member bonding film are overlapped, and the element mounting member and the lid member are bonded together and mounted on the element mounting member. The piezoelectric vibration element is hermetically sealed (see, for example, Patent Document 1).

Such an element mounting member is manufactured, for example, by dividing into individual pieces after an element mounting member wafer in which portions serving as a plurality of element mounting members are provided in a matrix is manufactured.
The element mounting member wafer manufacturing method mainly includes, for example, a shape punching process, an embedding process, a screen printing process, a stacking process, a split groove forming process, a sintering process, a plating process, and an individualizing process.

(Shape punching process)
In the shape punching process, a substrate part green sheet provided with a part to be a plurality of substrate parts and a frame part green sheet provided with a part to be a plurality of frame parts are provided, and a part to be the substrate part and a part to be the frame part are predetermined. This is a process of punching out the shape so as to be the shape of.
In the shape punching process, for example, a punching machine is used.
The substrate green sheet and the frame green sheet are composed of, for example, a powder composed mainly of alumina, a sintering aid composed of magnesia, a plasticizer composed of an acrylic resin, a solvent composed of toluene, xylene, and alcohols. It is mainly composed.
Also, the substrate part green sheet and the frame part green sheet are formed in a rectangular shape so that the slurry formed by defoaming in a state where the constituent materials are sufficiently kneaded is made into a predetermined size by, for example, a doctor blade method. It is provided in the shape of a flat plate.

In the green sheet for a substrate portion, portions to be the substrate portion are provided in a matrix.
In addition, the substrate part green sheet is provided with two through-holes arranged along one short side of the part to be the substrate part.

The green sheet for frame part is provided in a matrix corresponding to the part that becomes the substrate part provided in the green sheet for substrate part.
In addition, the frame portion green sheet is provided with a rectangular hole at a predetermined position of a portion serving as a frame portion.

(Embedding process)
The embedding step is a step in which a conductive material made of a refractory metal such as tungsten or molybdenum is embedded in a through hole provided in each substrate portion of the substrate portion green sheet.

(Screen printing process)
The screen printing step is a step of providing a wiring pattern and a connection pattern at predetermined positions of the portion that becomes the substrate portion of the substrate portion green sheet and the portion that becomes the frame portion of the frame portion green sheet.
In the screen printing process, for example, screen printing is used.

  The wiring pattern mainly includes, for example, a mounting terminal wiring pattern, an external terminal wiring pattern, and an element mounting member bonding film wiring pattern.

  The element mounting member bonding film wiring pattern is provided at a position where the element mounting member bonding film is provided. That is, the element mounting member bonding film wiring pattern is provided in an annular shape along the edge of one main surface of the portion of the frame portion green sheet that becomes the frame portion.

The mounting terminal wiring pattern is provided at a position where the mounting terminal is provided. That is, the mounting terminal wiring pattern is a pair of two, which is one main surface of the portion that becomes the substrate portion of the substrate portion green sheet and along one short side of the portion that becomes the substrate portion. Are provided side by side.
Further, the mounting terminal wiring pattern is provided at a position that overlaps the opening on one main surface side of the portion that becomes the substrate portion of the pair of through holes provided in the portion that becomes the substrate portion.

The external terminal wiring pattern is provided at a position where the external terminal is provided. That is, four external terminal wiring patterns are provided in the portion to be the substrate portion, and are provided one by one at the four corners of the other main surface of the portion to be the substrate portion of the substrate portion green sheet.
Further, the two predetermined external wiring patterns are provided at a position overlapping with the opening portion on the other main surface side of the portion serving as the substrate portion of the pair of through holes provided in the portion serving as the substrate portion.
Accordingly, two predetermined external terminal wiring patterns are electrically provided via the mounting terminal wiring pattern and the conductive material embedded in the through hole.

The connection pattern electrically connects external terminals provided at portions serving as element mounting members in order to facilitate work in a plating process described later.
Moreover, the connection pattern is provided in the other part of the part used as the board | substrate part of a board | substrate part green sheet.
For example, the connection pattern is obtained by electrically connecting an external terminal wiring pattern provided in a portion serving as a predetermined one element mounting member and an external terminal wiring pattern provided in a portion adjacent to a predetermined other one element mounting member. It is provided in the position which will be in a connected state.

  Therefore, when the substrate part green sheet pays attention to the other main surface of the part which becomes each board part, the external wiring pattern is not connected, and a part which becomes a plurality of board parts is provided. When attention is paid to the other main surface of the substrate portion green sheet, the external wiring pattern provided in the portion to be the substrate portion is electrically connected by the connection pattern.

That is, in the screen printing process, two pairs of mounting terminal wiring patterns are provided on one main surface of each portion of the substrate portion green sheet, and four external terminal wiring patterns are provided on the other main surface. It is done. In the screen printing process, a connection pattern is provided in a portion that is not a portion of each substrate portion of the substrate portion green sheet, and the external terminal wiring pattern is electrically connected.
Further, in the screen printing process, an annular element mounting member bonding film wiring pattern is provided on the edge of one main surface of the portion of the frame portion green sheet that becomes the frame portion.

(Lamination process)
A lamination process is a process of carrying out lamination molding in the state where the part used as the substrate part of a substrate part green sheet and the part used as the frame part of a frame part green sheet were piled up.
In the laminating process, the parts to be the element mounting member that is formed by laminating by pressing while heating the substrate part green sheet and the frame part green sheet are provided in a matrix. The obtained element mounting member wafer is provided.
Here, one main surface of the element mounting member wafer is a surface of a portion that becomes a frame portion that faces a surface where a portion that becomes a frame portion and a portion that becomes a substrate portion are in contact, that is, a plurality of component element recess spaces. Is the main surface provided.
The other main surface of the element mounting member wafer is the surface of the portion that becomes the substrate portion opposite to the surface where the portion that becomes the frame portion and the portion that becomes the substrate portion is in contact, that is, the substrate on which the external terminal wiring pattern is provided. It is the other main surface of the part used as a part.
That is, the element mounting member wafer is composed of a substrate part green sheet and a frame part green sheet, and a concave part space for component elements is provided on one main surface.

(Groove formation process)
The groove forming step is a step of providing a groove by pressing the cutter blade to a predetermined position of the element mounting member wafer.
In the groove forming step, for example, a cutter blade in which the cutting edge is missing at a predetermined interval is used.
Accordingly, the grooves are alternately provided with dotted lines, that is, locations where the grooves are provided and locations where the grooves are not provided.
The grooves are provided on both principal surfaces of the element mounting member wafer along the edge of the portion serving as the element mounting member of the element mounting member wafer. That is, the groove is the other main surface of the substrate part green sheet where the external terminal wiring pattern is provided, and has a depth shallower than the thickness of the substrate part green sheet along the edge of the part to be the substrate part. Provided.
The groove is one main surface on which the element mounting member bonding film wiring pattern of the frame green sheet is provided, and is shallower than the thickness of the frame green sheet along the edge of the portion to be the frame Provided to be deep.

(Sintering process)
The sintering step is a step of sintering the element mounting member wafer provided by laminating the substrate portion green sheet and the frame portion green sheet.
The element mounting member wafer shrinks and becomes harder than before sintering.

(Plating process)
A plating process is a process of supplying an electric current to the connection pattern provided in the other main surface of the sintered element mounting member wafer, for example, using electrolytic plating, and providing a plating metal film in a wiring pattern.
The wiring pattern is mainly composed of a mounting terminal wiring pattern, an external terminal wiring pattern, and an element mounting member bonding film wiring pattern.
The plated metal film is provided on the mounting terminal wiring pattern, and is provided in a portion where the mounting terminal becomes an element mounting member.
Further, the plated metal film is provided on a portion where the external terminal is to be an element mounting member provided on the external terminal wiring pattern.
Further, the plated metal film is provided on the element mounting member bonding film wiring pattern, and the element mounting member bonding film is provided on a portion that becomes the element mounting member.
In the plating step, a plating metal film is provided on a connection pattern provided on the other main surface of the element mounting member wafer to provide a connection film.

(Individualization process)
The singulation process is a process of providing a plurality of element mounting members by dividing the element mounting member wafer manufactured in this way into individual parts to be element mounting members.
In the singulation process, the element mounting member wafer provided with a portion to be a plurality of element mounting members is divided into pieces by dividing the so-called chocolate break method by applying force in the direction of expanding the groove, for example. The
Here, the state after the plating process, that is, the parts that become a plurality of element mounting members are separated into individual pieces, but the component elements are mounted on the parts that become the element mounting members. Then, there is a case where the singulation process is performed after the component elements are sealed, that is, in a state where a plurality of electronic components are provided.

  In such a method for manufacturing an element mounting member, an element mounting member wafer is provided by laminating a substrate part green sheet and a frame part green sheet, and grooves are provided on both main surfaces of the element mounting member wafer to burn the element mounting member wafer. (For example, refer to Patent Document 2).

In addition, in the element mounting member manufacturing method, for example, the element mounting member wafer laminated and provided in the laminating process is sintered in a state where no grooves are formed in the groove forming process, and a plating process is performed. In some cases, a groove is provided on the formed element mounting member wafer using a laser.
At this time, the element mounting member wafer is irradiated with laser along the edge of the portion serving as the element mounting member, and a groove is formed along the edge of the portion serving as the element mounting member on one main surface or the other main surface. Provided.
In addition, the element mounting member is singulated for each part to be the element mounting member by pressing the element mounting member wafer having a groove provided on one main surface by the laser from the other main surface side (for example, (See Patent Document 3).

JP 2006-261684 A Japanese Patent No. 3916136 Japanese Patent Laid-Open No. 04-241401

However, in the conventional method for manufacturing an element mounting member wafer, the element mounting member wafer is sintered after the grooves are provided.
Therefore, the conventional method for manufacturing an element mounting member wafer differs depending on how the heat is applied when the element mounting member wafer is sintered. There is a risk of being provided at different positions.
For this reason, in the conventional method for manufacturing an element mounting member wafer, the size of a portion serving as an element mounting member may vary, and the productivity may decrease.

Further, in the conventional method for manufacturing an element mounting member, the element mounting member wafer that has been sintered after the grooves are provided is separated into parts for each element mounting member.
That is, the conventional method for manufacturing an element mounting member divides the element mounting member wafer, which may have a large variation in the size of the element mounting member, and the size of the element mounting member may vary. As a result, productivity may be reduced.

In the conventional method for manufacturing an element mounting member wafer, a laser is used on one main surface of the element mounting member wafer or the other main surface along the edge of the element mounting member of the element mounting member wafer. A groove is provided.
When a groove is provided on one main surface of an element mounting member wafer provided with a concave portion space for component elements, a conventional method for manufacturing an element mounting member wafer is that an external terminal provided on a portion serving as an element mounting member is There is a risk of being electrically connected by the connection film. Therefore, the conventional method for manufacturing an element mounting member wafer is to perform an electrical characteristic inspection for each part to be an element mounting member in the state of the element mounting member wafer, for example, electrical resistance between a predetermined external terminal and a predetermined mounting terminal, etc. Inspection, may not be able to measure. In addition, the conventional method for manufacturing a device mounting member wafer has a predetermined other adjacent to an external terminal provided in a predetermined portion of the device mounting member in order to inspect the electrical characteristics of each device mounting member. There is a risk that productivity may be reduced due to the necessity of a step of cutting from a connection film that electrically connects an external terminal provided in a portion to be one element mounting member, or a step of singulation. is there.
When a groove is provided on the other main surface of the element mounting member wafer provided with the concave portion space for component elements, the conventional method for manufacturing the element mounting member wafer is to be contracted by the heating method during sintering. There is a possibility that the edge of the portion that becomes the substrate portion and the edge of the portion that becomes the frame portion do not correspond. For this reason, when viewed from the one main surface side of the element mounting member wafer provided with the component element recess space, the conventional element mounting member wafer manufacturing method uses the side of the frame portion on the component element recess space side. However, the gap between the outer edges of the frame portion where the component element recess space is not provided between them is not a constant distance, and the component element recess space is provided at a predetermined position. There is a fear that it is not. That is, when the element mounting member and the lid member are joined and the component elements mounted on the element mounting member are hermetically sealed, the conventional element mounting member wafer manufacturing method becomes a frame portion of the element mounting member. Since there is a possibility that the portion which becomes the frame portion is not applied with force evenly on the portion and the portion serving as the frame portion may be damaged, it is necessary to measure the position of the concave portion space for component elements, which may reduce productivity.

In the conventional method for manufacturing an element mounting member, an element mounting in which a groove is provided along one edge of the portion serving as the element mounting member and / or the edge of the portion serving as the element mounting member on the other main surface. A member wafer is used. In addition, since the conventional element mounting member manufacturing method uses an element mounting member wafer that may be contracted differently depending on how it is heated when sintered, the edge and frame of the portion that becomes the substrate portion are used. There is a possibility that the edges of the parts that become the parts do not correspond to each other and are separated.
Therefore, when using an element mounting member wafer in which a groove is provided along the edge of the other main surface of the portion serving as the element mounting member, that is, the edge of the portion serving as the substrate portion, a conventional method of manufacturing a lid member Is a position where the side of the frame element recess space side faces the side when viewed from the opening side of the component element recess space, that is, from one main surface side of the element mounting member. There is a possibility that the component element recess space is not provided at a predetermined position of the element mounting member because the distance between the outer edge of the frame portion where the component element recess space is not provided is not constant.
That is, when the element mounting member and the lid member are joined and the component element mounted on the element mounting member is hermetically sealed, the conventional method for manufacturing the element mounting member has a force applied to the frame portion of the element mounting member. Since the frame portion may be damaged without being uniformly applied, it is necessary to measure the position where the concave portion space for component elements is provided, and the productivity may be reduced.

  Therefore, the present invention is capable of inspecting the electrical characteristics of the portion serving as the element mounting member even in the state of the element mounting member wafer, and producing the component element recessed space at a predetermined position. It is an object to provide a method for manufacturing an element mounting member wafer and a method for manufacturing an element mounting member.

  In order to solve the above-mentioned problem, a laser is used to lay out the element mounting members in which the component element recessed spaces are provided on one main surface and the external terminals are provided on the other main surface in a matrix. A predetermined one other element adjacent to an external terminal of a predetermined one of the element mounting members, while providing a groove along an edge of each element mounting member of the element mounting member wafer formed of a combined body It includes a connection film cutting groove forming step of cutting a connection film that is electrically connected to an external terminal of the mounting member.

  In order to solve the above-described problem, the center point of the bottom surface of the component element recess space is determined from the image data of the bottom surface of the component element recess space captured using the recognition means in the previous step of the connection film cutting groove forming step. A cutting point determination step for determining, as a cutting point, a center position of a predetermined one central point and another predetermined one adjacent central point; and a predetermined one cutting point and a predetermined other one cutting A groove position determining step, wherein the groove is provided at a position overlapping a straight line connecting the predetermined one cutting point and the predetermined other cutting point. Features.

  An element mounting member is characterized in that it includes a singulation process in which pressure is applied from one main surface side of the element mounting member wafer to separate each element mounting member.

  In such a method for manufacturing an element mounting member wafer, since a groove is provided in the sintered element mounting member wafer using a laser, the element mounting member is compared with the conventional method for manufacturing an element mounting member wafer. The variation in the position of the groove provided along the edge of the portion to be can be suppressed. Therefore, the manufacturing method of such an element mounting member wafer can improve productivity compared with the conventional manufacturing method of an element mounting member wafer.

In addition, such a method of manufacturing an element mounting member wafer uses a laser to provide an element mounting member in which a recess space for component elements is provided on one main surface and an external terminal is provided on the other main surface. A predetermined element adjacent to an external terminal of a predetermined one of the element mounting members, while providing a groove along the edge of each element mounting member of the sintered element mounting member wafer provided in a matrix A connection film that electrically connects an external terminal of another one of the element mounting members is cut.
That is, in such a method for manufacturing an element mounting member wafer, a connecting film is cut simultaneously with providing a groove using a laser.
Therefore, such a method for manufacturing an element mounting member wafer can facilitate the inspection of the electrical characteristics of each portion that becomes the element mounting member in the state of the element mounting member wafer.
For this reason, such a method for manufacturing an element mounting member wafer eliminates the need for the step of cutting the connection film or the step of dividing into pieces, unlike the conventional method for manufacturing an element mounting member wafer, thereby improving productivity. be able to.

In addition, in such a method of manufacturing an element mounting member wafer, the center point of the bottom surface of the component element recess space is obtained from the image data of the bottom surface of the component element recess space, and a predetermined other point adjacent to the predetermined one center point is obtained. A predetermined cutting point and a predetermined other cutting point, including a predetermined one cutting point and a predetermined other cutting point. A groove is provided at a position overlapping the straight line connecting the cut points.
That is, in such a method for manufacturing an element mounting member wafer, the edge of a portion to be an element mounting member is determined with reference to the bottom surface of the component element recess space, and a groove is provided.
When viewed from the opening side of the component element recess space, that is, from one main surface side of the element mounting member wafer, the element mounting member wafer manufacturing method is such that the side of the frame element on the component element recess space side is the side. The component element recess space is located at a predetermined position in the portion serving as the element mounting member so as to be at a certain distance from the edge of the outer edge of the frame portion where the component element recess space is not provided. Can be provided.
Therefore, in this method for manufacturing an element mounting member wafer, a concave portion space for component elements can be provided at a predetermined position of a portion serving as an element mounting member. Productivity can be improved.

In such a method for manufacturing an element mounting member, an element mounting member wafer in which a groove is provided along the edge of a portion that is sintered by a laser to become an element mounting member is used.
For this reason, since such a device mounting member manufacturing method uses an element mounting member wafer in which variations in the positions of grooves provided along the edge of the portion to be the element mounting member are suppressed, Compared with the mounting member manufacturing method, variation in the size of the portion serving as the element mounting member can be suppressed, and the productivity can be improved.

In addition, such a method for manufacturing an element mounting member obtains the center point of the bottom surface of the component element recess space from the image data of the bottom surface of the component element recess space, and obtains a predetermined other one adjacent to the predetermined one center point. A predetermined cutting point and a predetermined other cutting point, including a predetermined cutting point and a predetermined other cutting point; An element mounting member wafer in which a groove is provided at a position overlapping a straight line connecting points is used.
In other words, such a method for manufacturing an element mounting member uses an element mounting member wafer in which the edge of a portion to be an element mounting member is determined with reference to the bottom surface of the component element concave space as a reference and a groove is provided.
Therefore, when viewed from one main surface side of the element mounting member provided with the component element recess space, the side of the frame element on the component element recess space side of the manufacturing method of the element mounting member is: The recessed part space for component elements is placed at a predetermined position on the element mounting member so as to be at a certain distance from the side of the outer edge of the frame part where the recessed part space for component elements is not provided in between. Can be provided.
For this reason, in such a method for manufacturing an element mounting member, since the component element recessed space can be provided at a predetermined position of the element mounting member, it is necessary to measure the position where the component element recessed space is provided. Therefore, productivity can be improved.

It is a conceptual diagram which shows an example of the electronic component using the element mounting member which concerns on embodiment of this invention. (A) is a conceptual diagram which shows an example of the state of the board | substrate part green sheet in a punching process, (b) is a conceptual diagram which shows an example of the state of the frame part green sheet in a punching process. It is a conceptual diagram which shows an example of the state of the board | substrate part green sheet in an embedding process. (A) is a conceptual diagram which shows an example of the state of the board | substrate part green sheet in a wiring pattern formation process, (b) is a conceptual diagram which shows an example of the state of the frame part green sheet in a wiring pattern formation process. It is a conceptual diagram which shows an example of the state of the board | substrate part green sheet after a wiring pattern formation process. It is a conceptual diagram which shows an example of the state of the element mounting member wafer in a lamination process. It is a conceptual diagram which shows an example of the state of the element mounting member wafer in a plating formation process. It is a conceptual diagram which shows an example of the state of the element mounting member wafer in a groove position determination process. It is a conceptual diagram which shows an example of the state of the element mounting member wafer in a connection film cutting groove formation process.

  Next, the best mode for carrying out the present invention will be described. In each drawing, the state of each component is exaggerated for easy understanding.

  The element mounting member manufactured by the method for manufacturing the lid member according to the embodiment of the present invention will be described.

The element mounting member is used for an electronic component in which the component element is hermetically sealed by being joined to the lid member in a state where the component element is mounted.
Here, the case where the electronic component is a piezoelectric vibrator 100 as shown in FIG. 1 will be described.

  As shown in FIG. 1, the piezoelectric vibrator 100 mainly includes a piezoelectric vibration element 130 that is a component element, an element mounting member 110, and a lid member 120.

The lid member 120 is made of, for example, metal and has a rectangular flat plate shape.
Further, the lid member 120 is provided with, for example, an annular lid member bonding film 121 along the edge of one main surface.
The lid member bonding film 121 has a role of bonding the lid member 120 and the element mounting member 110 by being melted in a state of being superimposed on an element mounting member bonding film 112 provided on the element mounting member 110 described later. Fulfill.

  As shown in FIG. 1, the piezoelectric vibration element 130 that is a component element mainly includes, for example, a piezoelectric piece 131, an excitation electrode 132, and a lead-out electrode 133.

  The piezoelectric piece 131 is made of, for example, a piezoelectric material and is provided in a rectangular flat plate shape.

For example, two excitation electrodes 132 are paired.
In addition, the excitation electrode 132 has one excitation electrode 132 provided on one main surface of the piezoelectric piece 131, and the other excitation electrode 132 is the other main surface of the piezoelectric piece 131. It is provided at an opposing position.

The routing electrodes 133 are, for example, a pair of two.
The routing electrode 133 has one end connected to the predetermined excitation electrode 132 and the other end facing the main surface of the piezoelectric piece 131 provided with the predetermined excitation electrode 132. Thus, the piezoelectric piece 131 is provided so as to be positioned at one end.

  The element mounting member 110 is made of, for example, ceramic that is a sintered body, and mainly includes a substrate portion 110a and a frame portion 110b as shown in FIG.

The substrate part 110a is provided in a rectangular flat plate shape, for example.
The board part 110a has a mounting terminal P on one main surface and a plurality of external terminals G on the other main surface.

For example, two mounting terminals P are provided, and two mounting terminals P are provided side by side along one short side of the substrate portion 110a.
The mounting terminal P includes a mounting terminal wiring pattern P1 and a plated metal film P2, and is fixed by, for example, the lead-out electrode 133 of the piezoelectric vibration element 130 and the conductive adhesive D1.

For example, four external terminals G are provided, one at each of the four corners of the other main surface of the substrate portion.
The external terminal G includes a mounting terminal wiring pattern G1 and a plated metal film G2.
The predetermined external terminal G is in a state of being electrically connected to the predetermined mounting terminal P via the conductive material D2 embedded in the through hole B.

The frame part 110b is provided, for example, in a frame-shaped flat plate shape having a hole penetrating in the center part.
The frame portion 110b is provided on one main surface of the substrate portion 110a, and a component element recessed space 111 is provided on one main surface of the element mounting member 110.
The frame part 110b is provided with an annular element mounting member bonding film 112 at the edge of the surface facing the surface where the substrate part 110a and the frame part 110b are in contact.

  The element mounting member bonding film 112 includes an element mounting member bonding film wiring pattern 112a and a plated metal film 112b, and plays a role of bonding the element mounting member 110 and the lid member 120 together.

Here, one main surface of the element mounting member 110 is a surface of the frame portion 110b facing the surface where the frame portion 110b and the substrate portion 110a are in contact, that is, a surface on which the component element recess space 111 is provided. It has become.
Further, the other main surface to be the element mounting member 110 is a surface of the substrate portion 110a facing the surface where the frame portion 110b and the substrate portion 110a are in contact, that is, the substrate portion 110a on which the external terminal G is provided. The other main surface.

In the element mounting member 110, a frame-shaped frame portion 110b is provided on one main surface of the substrate portion 110a, and a component element recessed space 111 is provided.
The element mounting member 110 is provided with a mounting terminal P on the bottom surface of the component element concave space 111.
In addition, the element mounting member 110 includes, for example, a piezoelectric vibration that is a component element in which a mounting terminal P provided on the bottom surface of the concave portion 111 for component elements and a lead electrode 133 of the piezoelectric vibration element 130 are fixed by a conductive adhesive D1. The element 130 is mounted.
The element mounting member 110 is provided with an annular element mounting member bonding film 112 along the edge of one main surface, and the element mounting member bonding film 112 and the lid member 120 provided on the lid member 120 are bonded. The film 121 is melted in a superposed state to be joined to the lid member 120, and the piezoelectric vibration element 130 is hermetically sealed.

Next, a method for manufacturing an element mounting member wafer according to an embodiment of the present invention will be described.
The method for manufacturing an element mounting member wafer according to an embodiment of the present invention includes a cutting point determining step, a groove position forming step, and a connecting film cutting groove forming step.
The element mounting member wafer manufacturing method according to the embodiment of the present invention includes, for example, a shape punching process, an embedding process, a screen printing process, a laminating process, a sintering process, a plating process, a cutting point determining process, a groove position determining process, and a connection. A film cutting groove forming step is included.

(Shape punching process)
In the shape punching step, a substrate portion green sheet W110a provided with a portion to be a plurality of substrate portions 110a and a frame portion green sheet W110b provided with a portion to be a plurality of frame portions 110b are provided, and a portion and a frame portion to be the substrate portions 110a This is a step of punching the shape so that the portion to be 110b has a predetermined shape.
In the shape punching process, for example, a punching machine is used.
The substrate part green sheet W110a and the frame part green sheet W110b are made of, for example, a powder composed mainly of alumina or the like, a sintering aid made of magnesia or the like, a plasticizer made of acrylic resin, or the like, toluene, xylene or alcohols. It is mainly composed of solvent.
In addition, the substrate part green sheet W110a and the frame part green sheet W110b are formed so that the slurry formed by defoaming in a state where the constituent materials are sufficiently kneaded is made to have a predetermined size by, for example, a doctor blade method. Are provided in a rectangular flat plate shape.

In the substrate part green sheet W110a, the portions to be the substrate part 110a are provided in a matrix.
Further, as shown in FIG. 2A, the substrate part green sheet W110a is provided with two through-holes B arranged along one short side of each part to be the substrate part 110a.

The frame portion green sheet W110b is provided in a matrix corresponding to a portion where the frame portion 110b becomes the substrate portion 110a provided on the substrate portion green sheet W110a.
As shown in FIG. 2B, the frame-portion green sheet W110b is provided with a rectangular hole 111 at a predetermined position in a portion to be the frame portion 110b.

(Embedding process)
In the embedding process, as shown in FIG. 3, for example, a conductive material D2 made of a refractory metal such as tungsten or molybdenum is inserted into the through-hole B provided in each portion of the substrate portion green sheet W110a that becomes the substrate portion 110a. It is an embedded process.

(Screen printing process)
The screen printing process is a process of providing the wiring patterns P1, G1, 112a and the connection pattern S1 at predetermined positions on the substrate part green sheet W110a and the frame part green sheet W110b.
In the screen printing process, for example, screen printing is used.

  The wiring patterns P1, G1, and 112a mainly include, for example, a mounting terminal wiring pattern P1, an external terminal wiring pattern G1, and an element mounting member bonding film wiring pattern 112a.

The element mounting member bonding film wiring pattern 112a is provided at a position where the element mounting member bonding film 112 is provided.
That is, as shown in FIG. 4B, the element mounting member bonding film wiring pattern 112a is formed on the frame part green sheet W110b in which the hole 111 penetrating the center part of the part to be the frame part 110b is provided. It is provided in an annular shape along the edge of one main surface of the portion that becomes each frame portion 110b.

The mounting terminal wiring pattern P1 is provided at a position where the mounting terminal P is provided.
That is, the mounting terminal wiring pattern P1 is a pair of two, and is one main surface of the portion that becomes the substrate portion 110a of the substrate portion green sheet W110a and one short portion of the portion that becomes the substrate portion 110a. Two are provided side by side along the side.
Further, the mounting terminal wiring pattern P1 is, as shown in FIG. 4A, one main surface side of the portion to be the substrate portion 110a of the two pairs of through holes B provided in the portion to be the substrate portion 110a. It is provided in the position which overlaps with the opening part.

The external terminal wiring pattern G1 is provided at a position where the external terminal G is provided.
In other words, four external terminal wiring patterns G1 are provided in the portions that become the substrate portions 110a of the substrate portion green sheet W110a, and are formed at the four corners of the other main surface of the portion that becomes the substrate portion 110a of the substrate portion green sheet W110a. One by one.
In addition, as shown in FIG. 4A, the predetermined two external wiring patterns G1 are the other of the portions that become the substrate portions 110a of the two pairs of through holes B provided in the portions that become the substrate portions 110a. It is provided at a position overlapping the opening on the main surface side.

The connection pattern S1 is electrically connected to the external terminal wiring pattern G1 provided in a portion that becomes each substrate portion 110a in order to facilitate work in a plating process described later.
Further, the connection pattern S1 is provided in another portion of the portion that becomes the substrate portion 110a of the substrate portion green sheet W110a.
The connection pattern S1 is, for example, an external terminal wiring provided in a portion to be a predetermined other one of the element mounting members 110 adjacent to the external terminal wiring pattern G1 provided in a portion to be the predetermined one of the device mounting members 110. It is provided at a position where the pattern G1 is electrically connected.

Therefore, as shown in FIG. 5, when attention is paid to the other main surface of the portion to be the respective substrate portions 110a, the respective external terminal wiring patterns G1 are not electrically connected.
When attention is paid to the other main surface of the substrate green sheet W110a provided with the portions to be the plurality of substrate portions 110a, as shown in FIG. 5, the respective portions provided to the portions to be the respective substrate portions 110a are provided. The external terminal wiring pattern G1 is electrically connected by the connection pattern S1.

That is, in the screen printing process, two pairs of mounting terminal wiring patterns P1 are provided on one main surface of the portion of the substrate portion green sheet W110a that becomes the substrate portion 110a, and four external terminal wirings are provided on the other main surface. A pattern G1 is provided. Further, in the screen printing process, the connection pattern S1 is provided in the portion of the substrate portion green sheet W110a that is not the portion that becomes the substrate portion 110a, and the external terminal wiring pattern G1 is electrically connected.
Further, in the screen printing process, an annular element mounting member bonding film wiring 112a pattern is provided on the edge portion of one main surface of the portion that becomes the frame portion 110b of the frame portion green sheet W110b.

(Lamination process)
As shown in FIG. 6, the stacking step is a step of stacking and forming the portion that becomes the substrate portion 110a of the substrate portion green sheet W110a and the portion that becomes the frame portion 110b of the frame portion green sheet W110b.
In the laminating step, pressure is applied while heating in a state where one main surface of the substrate portion green sheet W110a and the other main surface of the frame portion green sheet W110b on which the element mounting member bonding film wiring pattern 112a is not provided are overlapped. In this way, the element mounting member wafer W110 is provided in which the portions to be the element mounting member 110 formed by lamination molding and provided with the component element recess space 111 are provided in a matrix.
Here, one main surface of the element mounting member wafer W110 is the surface of the portion that becomes the frame portion 110b opposite to the surface where the portion that becomes the frame portion 110b and the portion that becomes the substrate portion 110a are in contact, that is, a plurality of components. This is the main surface provided with the element recess space 111. The other main surface of the element mounting member wafer W110 is the surface of the portion that becomes the substrate portion 110a opposite to the surface where the portion that becomes the frame portion 110b and the portion that becomes the substrate portion 110a are in contact, that is, the external terminal wiring pattern G1. It is the other main surface of the part used as the board | substrate part 110a provided.
In other words, the element mounting member wafer W110 includes the substrate part green sheet W110a and the frame part green sheet W110b, and the component element recess space 111 is provided on one main surface.

(Sintering process)
The sintering step is a step of sintering the element mounting member wafer W110 provided by laminating the substrate portion green sheet W110a and the frame portion green sheet W110b.
The element mounting member wafer W110 is shrunk by being sintered and becomes harder than before sintering.

(Plating process)
In the plating process, for example, by using electrolytic plating, a current is passed through the connection pattern S1 provided on the other main surface of the sintered element mounting member wafer W110, and as shown in FIG. This is a step of providing plated metal films P2, G2, 112b on G1, 112a.
The wiring patterns P1, G1, and 112a are mainly composed of the mounting terminal wiring pattern P1, the external terminal wiring pattern G1, and the element mounting member bonding film wiring pattern 112a.
The plated metal film P <b> 2 is provided on the mounting terminal wiring pattern P <b> 1 so that the mounting terminal P becomes the element mounting member 110.
The plated metal film G <b> 2 is provided on the external terminal wiring pattern G <b> 1, and the external terminal G is provided on a portion that becomes the element mounting member 110.
The plated metal film 112 b is provided on the element mounting member bonding film wiring pattern 112 a, and the element mounting member bonding film 112 is provided on a portion where the element mounting member 110 is formed.
In the plating step, the plating metal film S2 is provided on the connection pattern S1 provided on the other main surface of the element mounting member wafer 110a, and the connection film S is provided.

(Cutting point determination process)
In the cutting point determination step, the center point of the bottom surface of the component element recess spaces H11, H12, H21, and H22 is obtained from the image data of the bottom surfaces of the component element recess spaces H11, H12, H21, and H22 captured using the recognition means. In this step, C11, C12, C21, and C22 are obtained, and the position of the center between one predetermined center point and one other adjacent center point is determined as a cutting point.

Here, as shown in FIG. 8, for example, the component mounting member wafer W110 is provided with component element recess spaces H11, H12, H21, and H22 in a matrix of 2 rows × 2 columns.
First, in the cutting point determination step, for example, a recognition unit such as a camera is used, and the bottom surfaces of the component element concave spaces H11, H12, H21, and H22 are recognized as image data.
Next, in the cutting point determination step, for example, control means such as a computer is used, and the component element recess space H11, H12, H21, H22 is detected from the image data of the bottom surfaces of the component element recess spaces H11, H12, H21, H22. Center points C11, C12, C21, and C22 of the bottom surface are obtained.
That is, the cutting point CR11 determined in the cutting point determining step is located at the center between the center point C11 of the bottom surface of the component element recess space H11 and the center point C12 of the bottom surface of the component element recess space H12. . The cutting point CR21 determined in the cutting point determining step is located at the center between the center point C21 of the bottom surface of the component element recess space H21 and the center point C22 of the bottom surface of the component element recess space H22. . Further, the cutting point CG11 determined in the cutting point determination step is located at the center between the center point C11 of the bottom surface of the component element recess space H11 and the center point C21 of the bottom surface of the component element recess space H21. . Further, the cutting point CG12 determined in the cutting point determination step is located at the center between the center point C12 of the bottom surface of the component element recess space H12 and the center point C22 of the bottom surface of the component element recess space H22. .

  That is, in the cutting point determination step, the respective center points C11, C12, C21, C22 of the bottom surfaces of the component element concave spaces H11, H12, H21, H22 are obtained and the cutting points CG11, CG12, CR11, CR21 to be cut. Has been determined.

(Groove position determination process)
The groove position determining step includes a predetermined one cutting point and a predetermined other cutting point, and a position overlapping with a straight line connecting the predetermined one cutting point and the predetermined other cutting point. In the process, the groove is provided.
The groove is, for example, the same as the interval between the portions to be the element mounting members 110.
The grooves parallel to the row direction are provided, for example, at a position overlapping a straight line LR including a predetermined one cutting point CR11 determined in the cutting point determination step and a predetermined other one cutting point CR21.
The groove parallel to the row direction is provided, for example, at a position overlapping a straight line LG including one predetermined cutting point CG11 determined in the cutting point determination step and one other predetermined cutting point CG12.

That is, in the groove position determination step, the center point C11 of the bottom surface of the component element recess spaces H11 and H12 in which the position of the groove parallel to the column direction is adjacent in the predetermined row determined in the cutting point determination step. , C12 and the cutting point CR11 located at the center of the bottom surface of the component element recess spaces H21 and H22 adjacent to each other in the predetermined other row determined in the cutting point determination step. The position is determined so as to overlap with the straight line LR including CR21.
Further, in the groove position determining step, the central store C11 on the bottom surface of the component element recess spaces H11 and H21 in which the positions of the grooves parallel to the row direction are adjacent to each other in the predetermined column determined in the cutting point determining step. , C21 located at the center of C21 and the center point C12, C22 of the bottom surface of the component element recess space H12, H22 adjacent in the predetermined other row determined in the cutting point determination step. The position is determined so as to overlap with the straight line LG including the cutting point CG12 positioned.

(Connecting film cutting groove forming process)
In the connecting film cutting groove forming step, element mounting members 110 in which the component element recess space 111 is provided on one main surface and the external terminals G are provided on the other main surface are provided in a matrix using a laser. The element mounting member wafer W110 made of a sintered body is provided with a groove along the edge of the portion to be the element mounting member 110, and is adjacent to the external terminal G of one predetermined element mounting member 110. This is a step of cutting the connection film S that is electrically connected to the external terminal G of the other element mounting member 110.
Further, in the connecting film cutting groove forming step, by providing the groove, an external terminal G provided on one predetermined element mounting member 110 and an external terminal G provided on another predetermined element mounting member 110 The connection film S that is electrically connected is cut off.
Therefore, in the connection film cutting groove forming step, as shown in FIG. 9, the connection film S is cut and one other predetermined element adjacent to the external terminal G provided on the predetermined one element mounting member 110 is formed. The external terminal G provided on the mounting member 110 is not electrically connected.

  In the method of manufacturing the element mounting member wafer according to the embodiment of the present invention, since the groove is provided by using a laser in the sintered element mounting member wafer W110, the conventional method of manufacturing the element mounting member wafer W110. Compared to the case, variation in the position of the groove provided along the edge of the portion 110 serving as the element mounting member can be suppressed. Therefore, the manufacturing method of such an element mounting member wafer can improve productivity compared with the conventional manufacturing method of an element mounting member wafer.

In addition, the method for manufacturing an element mounting member wafer according to the embodiment of the present invention uses a laser to external component G on the other main surface in which the component element recess space 111 is provided on one main surface. The element mounting member 110 provided with the element mounting member 110 is provided in a matrix, and a groove is provided along the edge of each portion of the sintered element mounting member wafer W110 to be the element mounting member 110, and a predetermined one is provided. The connection film S that electrically connects the external terminal G of the element mounting member 110 and the external terminal G of another predetermined one of the element mounting members 110 is cut off.
That is, in such a method for manufacturing an element mounting member wafer according to an embodiment of the present invention, the connecting film S is cut at the same time as providing the groove using a laser.
Therefore, the method for manufacturing an element mounting member wafer according to the embodiment of the present invention can facilitate the inspection of the electrical characteristics of each part that becomes the element mounting member 110 in the state of the element mounting member wafer W110. .
For this reason, the method for manufacturing an element mounting member wafer according to the embodiment of the present invention does not require a step of cutting the connection film or a step of dividing into pieces, unlike the conventional method of manufacturing an element mounting member wafer. Therefore, productivity can be improved.

The element mounting member wafer manufacturing method according to the embodiment of the present invention obtains the center point of the bottom surface of the component element recess space from the image data of the bottom surface of the component element recess space, and obtains one predetermined center. A predetermined one cutting point, including a predetermined one cutting point and a predetermined other cutting point, determining a cutting point that is a central position and a predetermined other cutting point adjacent to the point; A groove is provided at a position overlapping with a straight line connecting the other predetermined cutting point.
That is, in such a method for manufacturing an element mounting member wafer, the edge of a portion to be an element mounting member is determined with reference to the bottom surface of the component element recess space, and a groove is provided.
When viewed from the opening side of the component element recess space, that is, from one main surface side of the element mounting member wafer, the element mounting member wafer manufacturing method is such that the side of the frame element on the component element recess space side is the side. The component element recess space is located at a predetermined position in the portion serving as the element mounting member so as to be at a certain distance from the edge of the outer edge of the frame portion where the component element recess space is not provided. Can be provided.
Therefore, in this method for manufacturing an element mounting member wafer, a concave portion space for component elements can be provided at a predetermined position of a portion serving as an element mounting member. Productivity can be improved.

Next, the manufacturing method of the element mounting member which concerns on embodiment of this invention is demonstrated.
The element mounting member manufacturing method according to the embodiment of the present invention uses the element mounting member wafer W110 to perform the singulation process.

(Individualization process)
The singulation step is a step of applying pressure from one main surface side of the element mounting member wafer W <b> 110 to divide each part to become the element mounting member 110.
In the singulation process, the pressure is applied from one main surface side of the element mounting member wafer W110 that is not provided with a groove, so that it is divided into individual parts that become the element mounting member 110 by the so-called chocolate break method. It is separated.

The element mounting member manufacturing method according to the embodiment of the present invention uses the element mounting member wafer W110 in which grooves are provided along the edge of the portion that is sintered by the laser to become the element mounting member 110. It has been.
For this reason, such a method for manufacturing an element mounting member uses the element mounting member wafer W110 in which the variation in the position of the groove provided along the edge of the portion serving as the element mounting member 110 is suppressed. Compared with the manufacturing method of the element mounting member, variation in the size of the portion to be the element mounting member 110 can be suppressed, and the productivity can be improved.

The element mounting member manufacturing method according to the embodiment of the present invention obtains the center point of the bottom surface of the component element recess space from the image data of the bottom surface of the component element recess space, and obtains one predetermined center point. Determining a cutting point located at the center of one adjacent other predetermined center point, including a predetermined one cutting point and a predetermined other one cutting point, and a predetermined one cutting point; An element mounting member wafer in which a groove is provided at a position overlapping a straight line connecting one other predetermined cutting point is used.
That is, in such a method for manufacturing an element mounting member according to an embodiment of the present invention, the element mounting in which the edge of the portion serving as the element mounting member is determined on the basis of the bottom surface of the recess space for component elements is provided. A member wafer is used.
Therefore, when viewed from one main surface side of the element mounting member provided with the component element recess space, the side of the frame element on the component element recess space side of the manufacturing method of the element mounting member is: The recessed part space for component elements is placed at a predetermined position on the element mounting member so as to be at a certain distance from the side of the outer edge of the frame part where the recessed part space for component elements is not provided in between. Can be provided.
For this reason, since the component mounting member manufacturing method according to the embodiment of the present invention can provide the component element recess space at a predetermined position of the component mounting member, the component element recess space is provided. Productivity can be improved because it is not necessary to measure the position where the sensor is present.

  Although the case where the element mounting member is used for the piezoelectric vibrator whose component element is a piezoelectric vibration element has been described, the piezoelectric vibration element mounted on the element mounting member by joining the lid member and the element mounting member For example, a piezoelectric oscillator in which a piezoelectric vibrating element and an integrated circuit element are mounted on an element mounting member may be used.

  Although the case where the element mounting member is used for a piezoelectric device in which the component element is a piezoelectric vibration element has been described, the component element mounted on the element mounting member can be carefully identified by joining the lid member and the element mounting member. For example, an electronic component in which the component element is a chip capacitor may be used as long as it can be hermetically sealed.

  In addition, the external terminal of the part which becomes a predetermined one element mounting member, and the external terminal of the part provided in the part which becomes a predetermined other one element mounting member adjacent to the predetermined one element mounting member Are electrically connected to the other main surface of the element mounting member wafer, but by providing a groove, the external terminals of the portion that becomes the element mounting member are electrically independent. If possible, the main surface of the element mounting member wafer may be electrically connected.

DESCRIPTION OF SYMBOLS 100 Piezoelectric vibrator 110 Element mounting member 110a Substrate part 110b Frame part 111, H11, H12, H21, H22 Component element recessed space 112 Element mounting member bonding film 120 Lid member 121 Lid member bonding film 130 Piezoelectric vibration element 131 Piezoelectric piece 132 Excitation electrode 133 Leading electrode P Mounting terminal G External terminal B Through hole D1 Conductive adhesive D2 Conductive material W110 Element mounting member wafer W110a Substrate green sheet W110b Frame green sheet P1, G1, 112a Wiring pattern P2, G2, 112b Plated metal film C11, C21, C12, C22 Center point CG11, CG12, CR11, CR21 Cutting point S Connection film S1 Connection pattern

Claims (3)

  An element mounting member made of a sintered body in which element mounting members are provided in a matrix in which a component element recess space is provided on one main surface while external terminals are provided on the other main surface using a laser. While providing a groove along the edge of each portion of the wafer to be an element mounting member, an external terminal of a predetermined one of the element mounting members and an external terminal of a predetermined other one of the element mounting members A method for manufacturing an element mounting member wafer, comprising a connection film cutting groove forming step of cutting a connection film electrically connected. It is a manufacturing method of the element mounting member wafer according to claim 1,
In the previous step of the connection film cutting groove forming step,
The center point of the bottom surface of the concave part space for component elements is obtained from the image data of the bottom surface of the concave part space for component elements captured using the recognition means, and one predetermined central point adjacent to the predetermined central point is obtained. A cutting point determination step for determining the position of the center as a cutting point;
The groove is provided at a position including a predetermined one cutting point and a predetermined other one cutting point and overlapping with a straight line connecting the predetermined one cutting point and the predetermined other cutting point. A groove position determining step characterized by:
The element mounting member wafer manufacturing method characterized by including these.   A singulation process for separating each element mounting member by applying pressure from one main surface side of the element mounting member wafer manufactured by the element mounting member wafer manufacturing method according to claim 1 or 2. A method for producing an element mounting member, comprising:

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