JP2003303914A - Method for manufacturing stacked electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a stacked electronic component having a mother laminate which is not easily distorted and with the surroundings of through-holes which are not to easily cracked or chipped during the punching process. <P>SOLUTION: A punching metal (pin) 21 lands on holes 7, from above the upper surface of a mother laminate 5 with a distortion inhibiting film 11 bonded thereto. Through-holes 10 are formed, penetrating through the mother laminate 5, each corresponding to the position of a hole 7, along virtual lines of division 8. The diameter of the through-hole 10 is longer than the shorter sides, but shorter than the longer sides, of the exposed part of the hole 7, and, as the result, the hole 7 and a conductor 9 filling up the hole 7 are separated electrically into two along the direction of the thickness of the mother laminate 5. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a laminated electronic component,
In particular, the present invention relates to a method for manufacturing a laminated electronic component such as a high frequency module built in an electronic device.

[0002]

2. Description of the Related Art As an example of a conventional method for manufacturing a laminated electronic component, which is of interest to the present invention, JP-A-8-3725
The method described in Japanese Patent No. 1 is known. This method divides the conductor by forming a hole filled with the conductor on the virtual dividing line of the mother laminated body and forming a hole in the hole. After that, the mother laminated body is cut along the virtual dividing line into each predetermined size. As a result, a laminated electronic component having the conductor of the hole as an external electrode on the side surface can be obtained.

[0003]

By the way, as a method for forming a hole filled with a conductor, there are generally a punching method, a drilling method, a laser processing method and the like. . Among them, the method of punching by punching is short in processing time and the finished state of the processed surface is good,
This method is suitable for mass production.

However, the punching process has a problem in that the mother laminate locally expands or contracts due to a large stress locally generated during punching, resulting in distortion. Further, on the punching start side and the punching end side (particularly, the punching end side) of the punching, cracks and chips are likely to occur around the through hole due to stress.

Therefore, an object of the present invention is to provide a method of manufacturing a laminated electronic component in which a mother laminated body is less likely to be distorted and cracks or chips are less likely to occur in the peripheral portion of a through hole during punching. is there.

[0006]

In order to achieve the above object, the method of manufacturing a laminated electronic component according to the present invention is (a) a mother having a hole filled with a conductor so as to straddle a virtual dividing line. A step of forming a laminated body, and (b) a strain suppressing film is attached to at least one of the front surface and the back surface of the mother laminated body, and the virtual dividing line is applied from the surface side to which the strain suppressing film is attached. Along with the step of punching so as to electrically divide the holes filled with the conductor, and (c) dividing the mother laminated body into predetermined sizes along the virtual dividing line. Is characterized by.

The mother laminated body is formed by laminating a plurality of insulating sheets having holes filled with conductors. Alternatively, the mother laminate is formed by laminating a plurality of insulating sheets and then collectively forming holes, and filling the holes with a conductor.

By the above method, the local stretch or shrinkage of the mother laminate, which occurs during punching by punching, is suppressed by the strain suppressing film, and strain is less likely to occur.

Further, by using the light-transmissive resin film as the distortion suppressing film, it becomes easy to position the punching process aiming at the holes.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a method of manufacturing a laminated electronic component according to the present invention will be described below with reference to the accompanying drawings.

As shown in FIG. 1, the mother laminated body 5 is constructed by stacking a plurality of insulating green sheets 6 made of, for example, dielectric or magnetic ceramics. In each insulating green sheet 6, a plurality of rectangular holes 7 formed by laser processing, punching processing, or the like are formed on the virtual dividing line 8. These plurality of holes 7 include
Each of the conductors 9 made of a conductive paste is filled.
Then, by connecting the plurality of holes 7 filled with the conductor 9 in the stacking direction of the insulating green sheets 6,
A conductor 9 to be an external electrode is formed. A rectangular conductor 9 is exposed on the front and back surfaces 5a of the mother laminated body 5, and the exposed portion is the land (wraparound portion) 4a of the external electrode.
Will be configured.

In addition, a conductive film or a resistance film is printed on a specific insulating green sheet 6 of each insulating green sheet 6, or a hole different from the above-mentioned hole 7 is formed to form a conductive paste. The inner conductor (internal circuit element such as a capacitor or inductor) of each laminated electronic component partitioned by the virtual dividing line 8 is formed by filling the conductor. This inner conductor and the conductor 9 that should be the outer electrode
Are electrically connected.

Next, the front and back surfaces 5a of this mother laminated body 5
Then, the strain suppressing film 11 is attached by thermocompression bonding, heating, or an adhesive. Examples of the strain suppressing film 11 include PET (polyethylene terephthalate),
PP (polypropylene), PEN (polyethylene naphthalate), PC (polycarbonate), PEEK (polyether ether ketone), PSF (polysulfone),
It is preferable to use a material having a light transmissive resin film as a base film, such as PES (polyether sulfone) and PEI (polyetherimide). In the subsequent process, hole 7
This is because it becomes easy to position the punching process aiming at. In the case of the first embodiment, as the strain suppressing film 11, an adhesive film having a 25 μm-thick PET film (film having scooping property) as a base film was used.

Next, as shown in FIG. 2, punching is performed by a punching die (pin) 21 having a circular cross section aiming at the hole 7 from the upper surface side to which the strain suppressing film 11 is attached. Do in order. As a result, the through hole 10 penetrating the mother laminated body 5 is formed along the virtual dividing line 8 in correspondence with the position of the hole 7. The diameter of the through hole 10 is larger than the short side dimension of the exposed portion of the hole 7 and smaller than the long side dimension of the exposed portion, and along the thickness direction of the mother laminated body 5, the hole 7 and the conductor 9 filled in the hole 7 are formed. Is electrically divided into two. During punching, a stripper (not shown) provided around the punching die (pin) presses around the portion to be punched.

Here, the mother laminated body 5 made of ceramic is a viscoelastic body which is distorted when stress is applied and the residual stress is relaxed in a predetermined relaxation time even after the stress is released. Therefore, at the time of punching by punching, the strain suppressing film 11 suppresses local elongation and shrinkage occurring in the mother laminated body 5, and after the relaxation time for releasing the residual stress, the strain suppressing film is passed. Peel off 11. This makes it difficult for the mother laminated body 5 to be distorted. Furthermore, the cracks and chips that have occurred in the peripheral portion of the through hole 10 can be reduced by the stress at the punching start and punching end of punching the conductor.

Further, by the strain suppressing film 11,
It is possible to prevent dust and cutting chips from adhering to the mother laminated body 5. Furthermore, since the tip of the punching die (pin) 21 does not directly contact the hard surface of the mother laminated body 5 but first contacts the strain suppressing film 11 having a soft surface, it is hard to wear. Further, by handling the strain suppressing film 11 in the attached state, the mother laminated body 5 can be used for transportation between steps.

As shown in FIG. 3, the strain suppressing film 1
After peeling off 1, the virtual dividing line 8 is sensed by a marker (not shown) formed on the surface of the mother laminated body 5, and the dividing groove is formed along the virtual dividing line 8 by dicing (cutting). Other than this, the dividing groove may be formed by half cutting using a cutting blade, a laser, a scribe, or the like. Laser and scribe are used for mother laminated body 5
Is preferred after firing. Further, slits may be formed at positions corresponding to the dividing grooves on the back surface of the mother laminated body 5 by using a cutting blade, a laser, a scribe, or the like.

Further, the mother laminated body 5 is fired. In this way, the through holes 10 are formed, and the conductors 9 are electrically divided, so that the portions that become the individual laminated electronic components 1 defined by the virtual dividing lines 8 are different from each other. It is electrically (functionally) independent.

Thereafter, another electronic component (not shown) electrically connected to the internal circuit element is mounted on the back surface of the mother laminated body 5, and the mother laminated body 5 is formed in a predetermined shape by utilizing the dividing groove. Dividing (breaking) for each size, individual laminated electronic components 1 are obtained as shown in FIG. At this time, the through hole 10 divided into two forms the concave portion 3 in the multilayer electronic component 1, and the central portion of the inner peripheral surface of the concave portion 3 extends along the thickness direction of the multilayer body. The external electrode 4 is exposed in a strip shape so as to extend from the front surface to the back surface.

According to the above method, the local extension or contraction of the mother laminated body 5 which occurs during punching by punching is suppressed by the strain suppressing film 11 and the distortion of the mother laminated body 5 is reduced. be able to. The graph shown in FIG. 5A has a size of 135 mm × 1.
It is a graph which measured the amount of strain of a predetermined portion after attaching the distortion control film 11 to the front and back surfaces 5a of the 35 mm mother laminated body 5 and forming the through holes 10. The position of each portion before the through hole 10 is formed is indicated by a chain line.
The maximum strain amount was ± 21 μm. On the other hand, a graph obtained by measuring the amount of strain after forming the through hole 10 without attaching the strain suppressing film 11 is shown in FIG. The maximum strain amount was ± 66 μm.

For the strain suppressing film 11, it is preferable to use a film with an adhesive having a tensile strength of 3 (kgf / 15 mm width) or more under the evaluation conditions of JIS C-2318. This is because, as shown in FIG. 6, when the tensile strength is 3 (kgf / 15 mm width) or less, the strain suppressing effect is significantly reduced, and the strain of the mother laminated body 5 cannot be suppressed.

The method for manufacturing a laminated electronic component according to the present invention is not limited to the above embodiment, but can be variously modified within the scope of the gist thereof. For example, the holes 7 on the virtual dividing line 8 of the mother laminated body 5 are not only filled with a conductor inside thereof, but also only the inner wall surface of the holes 7 is formed by plating or coating. The conductor may be formed.

The strain suppressing film 11 does not need to be attached to both front and back surfaces of the mother laminated body 5, and is attached only to one of the surfaces, and then the holes 7 are punched from the attached surface side. The through hole 10 may be formed.

Further, in the above embodiment, the external electrodes are formed so as to extend to the front and back surfaces of the mother laminated body. However, in order to secure a larger mounting surface for other parts mounted on the laminated body, No holes may be formed in the back surface and in the insulating green sheet near the back surface so that the electrodes do not reach the back surface.

Further, in the above-mentioned embodiment, the rectangular holes are formed for each one of the insulating green sheets. However, after forming the mother laminated body, the rectangular holes are collectively laser-processed in the stacking direction. The holes may be formed by punching and the holes may be filled with a conductive paste. Then, another hole having a diameter smaller than that of the hole filled with the conductive paste may be punched and electrically separated as in the embodiment. The strain suppressing film may be attached from the time of processing the first hole, or may be attached from the time of dividing the conductor for the second time. Further, the shapes of the first hole and the second hole are such that the second hole is smaller than the first hole in either the short side or the long side, and the conductor is electrically divided. It is not particularly limited as long as it is.

[0026]

As is apparent from the above description, according to the present invention, the local elongation and shrinkage of the mother laminate, which occurs during punching by punching, is suppressed by the strain suppressing film. Body strain can be reduced.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a method for manufacturing a multilayer electronic component according to the present invention.

FIG. 2 is a perspective view showing the manufacturing process following FIG.

FIG. 3 is an enlarged perspective view of essential parts showing the manufacturing process following FIG. 2;

FIG. 4 is a perspective view showing a manufacturing process that follows FIG. 3;

FIG. 5 is a graph showing the amount of strain of the mother laminated body after forming the through holes.

FIG. 6 is a graph showing the relationship between the tensile strength of the strain suppressing film and the strain amount of the mother laminate.

[Explanation of symbols]

1 ... Multilayer electronic component 4 ... External electrode 5: Mother laminate 7 ... hole 8 ... Virtual dividing line 9 ... conductor 10 ... Through hole 11 ... Distortion suppressing film 12 ... conductor

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Claims (4)

[Claims] 1. A step of forming a mother laminate having a hole filled with a conductor so as to straddle a virtual dividing line, and a strain suppressing film on at least one of a front surface and a back surface of the mother laminate. A step of sticking and punching so as to electrically divide the hole filled with the conductor along the virtual dividing line from the surface side to which the strain suppressing film is stuck, and the mother laminate is virtually divided A method of manufacturing a multilayer electronic component, comprising: dividing into predetermined sizes along a line. 2. The laminated electronic component according to claim 1, wherein the mother laminated body is formed by laminating a plurality of insulating sheets having holes filled with conductors. Method. 3. The mother laminate is formed by laminating a plurality of insulating sheets and then collectively forming holes, and filling the holes with a conductor. A method for manufacturing a multilayer electronic component according to item 1. 4. The method for manufacturing a laminated electronic component according to claim 1, wherein the strain suppressing film is a light transmissive resin film.