JP2011149893A - 微小部x線計測装置 - Google Patents
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- 239000001307 helium Substances 0.000 claims abstract description 8
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- 239000010931 gold Substances 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
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- 229910052737 gold Inorganic materials 0.000 claims description 3
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- 239000000460 chlorine Substances 0.000 description 3
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- 238000004519 manufacturing process Methods 0.000 description 2
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- 229910052708 sodium Inorganic materials 0.000 description 2
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- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
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- RUZPULZCSKJFAT-UHFFFAOYSA-N OC(C[AlH]C(O)=O)=O Chemical compound OC(C[AlH]C(O)=O)=O RUZPULZCSKJFAT-UHFFFAOYSA-N 0.000 description 1
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- 238000001069 Raman spectroscopy Methods 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 238000012423 maintenance Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004930 micro-infrared spectroscopy Methods 0.000 description 1
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- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
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- 239000011593 sulfur Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/223—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material by irradiating the sample with X-rays or gamma-rays and by measuring X-ray fluorescence
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
- G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
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- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
- G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
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- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K5/00—Irradiation devices
- G21K5/02—Irradiation devices having no beam-forming means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/07—Investigating materials by wave or particle radiation secondary emission
- G01N2223/076—X-ray fluorescence
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- General Physics & Mathematics (AREA)
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- Analysing Materials By The Use Of Radiation (AREA)
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Abstract
【解決手段】X線発生装置と、放出されるX線を50μm径以下の断面積に収束照射するX線光学素子と、蛍光X線を検出するX線検出器と、光学像を撮像可能な光学顕微鏡と画像認識機能を備え、試料を二次元で移動して位置決めが可能で、かつ、高さ方向にその位置調整が可能な試料相対移動機構とを備え、試料の特定位置における蛍光X線計測が可能であり、かつ、基材の上に置かれた測定試料からの蛍光X線も計測可能な微小部X線計測装置では、X線の照射位置と前記X線検出器との間の蛍光X線の光路を蛍光X線の減衰を抑制する構造(真空又はヘリウム置換)とし、かつ、基材上の測定試料が基材と同一の金属元素を含んでも、測定試料の同一の金属元素の含有が判定可能なデータ処理機能を備えたデータ処理部を備えている。
【選択図】図2
Description
n=(N1−N0)/(√N1+√N0)・・・(1)
Claims (7)
- X線発生装置と;
当該X線発生装置から放出されるX線を測定試料上で50μm径以下の断面積に収束照射するX線光学素子と;
前記測定試料から放出される蛍光X線を検出するX線検出器と;
X線照射位置の光学像を撮像可能な光学顕微鏡と;そして、
前記試料を二次元で走査し、位置決めが可能であり、かつ、高さ方向にその位置調整が可能な試料相対移動機構とを備え、かつ、基材の上に置かれた測定試料からの蛍光X線を計測することが可能な微小部X線計測装置において、
前記X線光学素子と前記X線検出器が真空又はヘリウム(He)中に保持され、前記ヘリウム又は真空のX線を透過する隔壁と、50μm径以下の断面積に収束照射されたX線の照射位置が前記光学顕微鏡による画像認識機能により特定位置に移動可能であるとともに、前記隔壁と前記X線の照射位置の間隔を5mm以下に設定可能であり、更に、
前記基材上に置かれた前記測定試料が当該基材と同一の金属元素を含んでいても、前記測定試料の当該同一の金属元素の含有を判定可能にするデータ処理機能を備えたデータ処理部を備えていることを特徴とする微小部X線計測装置。 - 前記請求項1に記載した微小部X線計測装置において、X線光学素子とX線光子のエネルギー弁別機能をもつ1又は複数の半導体X線検出素子を真空排気またはヘリウム(He)置換した同一のチャンバ内に備え、前記X線発生装置から前記X線光学素子の中間及び大気中に設置された試料に対向するチャンバの面の全部又は一部がX線を透過する隔壁であることを特徴とする請求項1の微小部X線計測装置。
- 前記請求項1又は2に記載した微小部X線計測装置において、前記X線発生装置においてX線を発生する金属は、原子番号24のクロミウム(Cr)、原子番号42のモリブデン(Mo)から47の銀(Ag)まで、又は、74のタングステン(W)から79の金(Au)までの各元素の単体、又は、複数の元素を含む合金又は積層膜であることを特徴とする微小部X線計測装置。
- 前記請求項1又は2に記載した微小部X線計測装置において、前記X線検出器を、別個のチャンバに1個又は複数個のX線光子のエネルギー弁別機能をもつ半導体X線検出素子により構成し、当該X線検出器を1個又は複数個用いたことを特徴とする微小部X線計測装置。
- 前記請求項4に記載した微小部X線計測装置において、前記光学顕微鏡は、当該光学顕微鏡の中心軸に、前記X線検出素子を挿入可能な孔を備えており、かつ、当該光学顕微鏡の光軸を照射X線ビームの中心軸と同軸にしたことを特徴とする微小部X線計測装置。
- 前記請求項5に記載した微小部X線計測装置において、前記光学顕微鏡にカセグレン型の反射光学顕微鏡を用い、前記試料に対向する副鏡面裏面の照射X線ビームと前記光学顕微鏡の光軸の同軸中心軸の周囲に、単数又は複数のX線検出素子を備えたことを特徴とする微小部X線計測装置。
- 前記請求項5に記載した微小部X線計測装置において、更に、前記試料から発散・放出される蛍光X線の発散角を受光光学素子により抑制する手段を備えたことを特徴とする微小部X線計測装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010012908A JP5292323B2 (ja) | 2010-01-25 | 2010-01-25 | 微小部x線計測装置 |
TW100100931A TWI444614B (zh) | 2010-01-25 | 2011-01-11 | Micro X-ray measuring device |
KR1020110007286A KR101412375B1 (ko) | 2010-01-25 | 2011-01-25 | 미소부 x선 계측 장치 |
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JP2010012908A JP5292323B2 (ja) | 2010-01-25 | 2010-01-25 | 微小部x線計測装置 |
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JP2011149893A true JP2011149893A (ja) | 2011-08-04 |
JP5292323B2 JP5292323B2 (ja) | 2013-09-18 |
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KR (1) | KR101412375B1 (ja) |
TW (1) | TWI444614B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018109548A (ja) * | 2016-12-28 | 2018-07-12 | 富士通株式会社 | 微粒子の分析装置及び微粒子の分析方法 |
CN110261419A (zh) * | 2019-05-28 | 2019-09-20 | 广东产品质量监督检验研究院 | 自动在线检测重金属的设备及方法、纺织品生产设备 |
WO2019240011A1 (ja) * | 2018-06-15 | 2019-12-19 | 株式会社堀場製作所 | 放射線検出装置、コンピュータプログラム及び位置決め方法 |
US12241848B2 (en) | 2022-01-31 | 2025-03-04 | Canon Anelva Corporation | Inspection apparatus and inspection method |
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JPH0815187A (ja) * | 1994-07-02 | 1996-01-19 | Horiba Ltd | 蛍光x線分析装置 |
JPH09329557A (ja) * | 1996-06-11 | 1997-12-22 | Seiko Instr Inc | マイクロ蛍光x線分析装置 |
JP2001153826A (ja) * | 1999-11-26 | 2001-06-08 | Matsushita Electronics Industry Corp | X線光電子分光装置およびx線光電子分光方法 |
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JP2008032433A (ja) | 2006-07-26 | 2008-02-14 | Olympus Corp | 基板検査装置 |
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2010
- 2010-01-25 JP JP2010012908A patent/JP5292323B2/ja not_active Expired - Fee Related
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2011
- 2011-01-11 TW TW100100931A patent/TWI444614B/zh not_active IP Right Cessation
- 2011-01-25 KR KR1020110007286A patent/KR101412375B1/ko not_active Expired - Fee Related
Patent Citations (6)
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JPH0815187A (ja) * | 1994-07-02 | 1996-01-19 | Horiba Ltd | 蛍光x線分析装置 |
JPH09329557A (ja) * | 1996-06-11 | 1997-12-22 | Seiko Instr Inc | マイクロ蛍光x線分析装置 |
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TW201142275A (en) | 2011-12-01 |
KR101412375B1 (ko) | 2014-06-25 |
KR20110087236A (ko) | 2011-08-02 |
JP5292323B2 (ja) | 2013-09-18 |
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