JP2011135069A - Led実装用基板 - Google Patents
Led実装用基板 Download PDFInfo
- Publication number
- JP2011135069A JP2011135069A JP2010263957A JP2010263957A JP2011135069A JP 2011135069 A JP2011135069 A JP 2011135069A JP 2010263957 A JP2010263957 A JP 2010263957A JP 2010263957 A JP2010263957 A JP 2010263957A JP 2011135069 A JP2011135069 A JP 2011135069A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heat conductive
- led
- sheet
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 54
- 239000000203 mixture Substances 0.000 claims abstract description 50
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229910052582 BN Inorganic materials 0.000 claims abstract description 37
- 239000000843 powder Substances 0.000 claims abstract description 34
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 21
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 21
- -1 polytetrafluoroethylene Polymers 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims description 17
- 239000002245 particle Substances 0.000 claims description 15
- 229920001774 Perfluoroether Polymers 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 3
- 229920005989 resin Polymers 0.000 abstract description 10
- 239000011347 resin Substances 0.000 abstract description 10
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract 2
- 229910052731 fluorine Inorganic materials 0.000 abstract 2
- 239000011737 fluorine Substances 0.000 abstract 2
- 230000000052 comparative effect Effects 0.000 description 27
- 238000000034 method Methods 0.000 description 21
- 239000002612 dispersion medium Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 6
- 239000011256 inorganic filler Substances 0.000 description 6
- 229910003475 inorganic filler Inorganic materials 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000009832 plasma treatment Methods 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229920005575 poly(amic acid) Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229920000995 Spectralon Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000012053 enzymatic serum creatinine assay Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08L27/18—Homopolymers or copolymers or tetrafluoroethene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
【解決手段】本発明のLED実装用基板は、窒化ホウ素の粉末とフッ素樹脂とを含む組成物からなる熱伝導層(熱伝導シート10)を含み、当該フッ素樹脂は、ポリテトラフルオロエチレンを含む。熱伝導層の熱伝導率は、2W/(m・K)以上である。波長380nm、470nmおよび650nmにおける熱伝導層の反射率は、0.80以上である。
【選択図】図1
Description
本発明の基板は、発光ダイオード(LED)を実装するための基板である。この基板は、窒化ホウ素(BN)の粉末とフッ素樹脂とを含む組成物からなる層を含む。その層を、以下では「熱伝導層」という場合がある。また、熱伝導層を構成する組成物を「組成物(A)」という場合がある。組成物(A)に含まれるフッ素樹脂は、ポリテトラフルオロエチレン(以下、「PTFE」という場合がある)を含む。
本発明の基板に含まれる熱伝導層の製造方法の一例について、以下に説明する。この製造方法は、以下の工程(i)〜(iii)を含む。なお、本発明の基板について説明した事項については、重複する説明を省略する場合がある。
実施例1では、以下の方法で熱伝導シート(熱伝導層)を形成した。まず、窒化ホウ素の粉末(昭和電工株式会社製、品番UHP−1)と、PTFE粉末(ダイキン工業株式会社製、品番F104U)と、PFA(三井・デュポン株式会社製、品番MP−10)とを、80:10:10(質量比)の割合で混合した。この混合物100質量部に対してデカン60質量部をさらに加えて混練することによって、ペースト状の混合物を得た。材料の混合には、V型ミキサーを用い、回転数が10rpmで温度が約25℃の条件で1分間混合を行った。なお、窒化ホウ素の粉末(UHP−1)を走査型電子顕微鏡(SEM)で観察したところ、窒化ホウ素の粉末は、鱗片状の粒子で構成されているタイプであることが分かった。また、窒化ホウ素の粉末(UHP−1)の粒度分布を、レーザ−回折・散乱法(マイクロトラック法)によって測定し、算術平均粒径を求めた。測定には、レーザ回折・散乱式マイクロトラック粒度分析計SRA200(日機装株式会社製)を用いた。このようにして求められた算術平均粒径は、13μmであった。
窒化ホウ素の粉末を水島合金鉄株式会社製の窒化ホウ素の粉末(HP−40)に代えたことを除いて実施例1と同様にして、実施例2の熱伝導シート(熱伝導層)を形成した。実施例2で用いた窒化ホウ素(HP−40)は、鱗片状の粒子が凝集した形状を有する。実施例2の熱伝導シートについて、実施例1と同様に熱伝導率、体積抵抗率および反射率を測定した。なお、窒化ホウ素の粉末(HP−40)を走査型電子顕微鏡(SEM)で観察したところ、窒化ホウ素の粉末は、鱗片状の粒子が凝集しているタイプであることが分かった。また、窒化ホウ素の粉末(HP−40)について、実施例1と同様の方法で算術平均粒径を求めたところ、算術平均粒径は20μmであった。
比較例1では、熱伝導シート10の代わりに利昌工業株式会社製の白色基板(CS−3965)を用いた。この白色基板は、主に、酸化チタン粉末およびアルミナ粉末が充填されたガラスエポキシからなる基板である。この白色基板について、実施例1と同様に熱伝導率、体積抵抗率および反射率を測定した。また、実施例1の熱伝導シート10の代わりに当該白色基板を用いることを除いて実施例1と同様にして、比較例1のLEDモジュールを作製した。比較例1のLEDモジュールについて、実施例1と同様の方法でLED発光後の最高温度を求めた。
比較例2では、窒化ホウ素の粉末とポリイミドとを用いて熱伝導シートを作製した。具体的には、まず、熱硬化性ポリイミドの前駆体であるポリアミド酸のN−メチル−2−ピロリドン溶液(ポリアミド酸濃度:20質量%)を準備した。この溶液に、窒化ホウ素の粉末(昭和電工株式会社製、品番UHP−1)を添加することによって、混合液を調製した。このとき、最終の熱伝導シートにおける窒化ホウ素の含有率が45体積%となるように、窒化ホウ素の粉末を添加した。
比較例3では、熱伝導シート10の代わりに、PTFEからなるシート(日東電工株式会社のニトフロンNo.900UL、厚さ250μm)を用いた。このシートについて、実施例1と同様に熱伝導率、体積抵抗率および反射率を測定した。また、実施例1の熱伝導シート10の代わりに当該シートを用いることを除いて実施例1と同様にして、比較例3のLEDモジュールを作製した。比較例3のLEDモジュールについて、実施例1と同様の条件でLEDを発光させた。しかし、LED点灯後にLEDがすぐに消灯した。そのLEDは壊れて使用できなくなった。
11 配線パターン
12 LEDチップ
13 ワイヤ
14 封止樹脂
15 シート
16 ヒートシンク(放熱器)
100 LEDモジュール
Claims (8)
- LED実装用基板であって、
窒化ホウ素の粉末とフッ素樹脂とを含む組成物からなる層を含み、
前記フッ素樹脂がポリテトラフルオロエチレンを含み、
前記層の熱伝導率が2W/(m・K)以上であり、
波長380nm、470nmおよび650nmにおける前記層の反射率が0.80以上である、LED実装用基板。 - 前記フッ素樹脂が、ペルフルオロアルコキシフッ素樹脂および四フッ化エチレン・六フッ化プロピレン共重合体からなる群より選ばれる少なくとも1つをさらに含む、請求項1に記載のLED実装用基板。
- 前記組成物における前記窒化ホウ素の粉末の含有率が70〜90質量%の範囲にあり、
前記組成物における前記フッ素樹脂の含有率が10〜30質量%の範囲にある、請求項1または2に記載のLED実装用基板。 - 前記層の表面に形成された配線パターンをさらに備える、請求項1〜3のいずれか1項に記載のLED実装用基板。
- 放熱器上に配置される、請求項1〜4のいずれか1項に記載のLED実装用基板。
- 前記層の気孔率が5〜30体積%の範囲にある、請求項1〜5のいずれか1項に記載のLED実装用基板。
- 200℃で72時間加熱した後の波長380nm、470nmおよび650nmにおける前記層の反射率、および、120℃で360時間加熱した後の波長380nm、470nmおよび650nmにおける前記層の反射率が、それぞれ0.80以上である、請求項1〜6のいずれか1項に記載のLED実装用基板。
- 前記窒化ホウ素の粉末は、鱗片状の窒化ホウ素の粒子の凝集体を含む、請求項1〜7のいずれか1項に記載のLED実装用基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010263957A JP5475625B2 (ja) | 2009-11-26 | 2010-11-26 | Led実装用基板 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009268723 | 2009-11-26 | ||
JP2009268723 | 2009-11-26 | ||
JP2010263957A JP5475625B2 (ja) | 2009-11-26 | 2010-11-26 | Led実装用基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011135069A true JP2011135069A (ja) | 2011-07-07 |
JP5475625B2 JP5475625B2 (ja) | 2014-04-16 |
Family
ID=44066121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010263957A Expired - Fee Related JP5475625B2 (ja) | 2009-11-26 | 2010-11-26 | Led実装用基板 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8985818B2 (ja) |
EP (1) | EP2506320A4 (ja) |
JP (1) | JP5475625B2 (ja) |
CN (1) | CN102640311A (ja) |
WO (1) | WO2011065016A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015014590A (ja) * | 2013-06-07 | 2015-01-22 | 本田技研工業株式会社 | 積分球 |
JP2015076585A (ja) * | 2013-10-11 | 2015-04-20 | 住友電工プリントサーキット株式会社 | Ledモジュール及びled照明器具 |
WO2016002846A1 (ja) * | 2014-07-02 | 2016-01-07 | 住友ベークライト株式会社 | 半導体装置 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201214809A (en) * | 2010-01-29 | 2012-04-01 | Nitto Denko Corp | Light-emitting diode device |
JP5759191B2 (ja) | 2010-01-29 | 2015-08-05 | 日東電工株式会社 | パワーモジュール |
CN102260378B (zh) * | 2011-05-06 | 2013-03-20 | 广东生益科技股份有限公司 | 复合材料、用其制作的高频电路基板及其制作方法 |
JP5788760B2 (ja) * | 2011-10-19 | 2015-10-07 | 日東電工株式会社 | 熱伝導性シート、led実装用基板およびledモジュール |
JP5757347B2 (ja) * | 2013-01-24 | 2015-07-29 | ダイキン工業株式会社 | 組成物、並びに、発泡成形体及び電線の製造方法 |
US10557006B2 (en) | 2013-01-24 | 2020-02-11 | Daikin Industries, Ltd. | Composition, and method for producing foam molded material and electric wire |
WO2015050164A1 (ja) * | 2013-10-03 | 2015-04-09 | シャープ株式会社 | 発光装置用基板、発光装置、および、発光装置用基板の製造方法 |
US10718474B1 (en) | 2014-11-20 | 2020-07-21 | The Light Source, Inc. | Lighting fixture with closely-packed LED components |
CN104832895A (zh) * | 2015-04-11 | 2015-08-12 | 安徽中威光电材料有限公司 | 一种led光源用聚四氟乙烯基掺杂二茂铁的散热材料及其制备方法 |
CN104832894A (zh) * | 2015-04-11 | 2015-08-12 | 安徽中威光电材料有限公司 | 一种led光源用聚四氟乙烯基掺杂纳米锡散热材料及其制备方法 |
DE102015118245A1 (de) * | 2015-10-26 | 2017-04-27 | Infineon Technologies Austria Ag | Thermisches Schnittstellenmaterial mit definierten thermischen, mechanischen und elektrischen Eigenschaften |
EP3945624A1 (en) | 2020-07-30 | 2022-02-02 | 3M Innovative Properties Company | Composite material comprising polytetrafluoroethylene and hexagonal boron nitride particles |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62283694A (ja) * | 1986-06-02 | 1987-12-09 | ジヤパンゴアテツクス株式会社 | プリント配線基板の製造法 |
JPH09183187A (ja) * | 1995-12-28 | 1997-07-15 | Du Pont Teijin Advanced Paper Kk | 複合体シートおよびその製造方法 |
JP2001247736A (ja) * | 2000-03-02 | 2001-09-11 | Daikin Ind Ltd | フッ素樹脂組成物 |
JP2007266606A (ja) * | 2006-03-28 | 2007-10-11 | Endicott Interconnect Technologies Inc | 回路基板用のフルオロポリマー絶縁性組成物およびこれから成る回路基板 |
JP2008270709A (ja) * | 2006-10-31 | 2008-11-06 | Techno Polymer Co Ltd | 放熱性樹脂組成物、led実装用基板、リフレクター、及び、リフレクター部を備えるled実装用基板 |
JP2009032943A (ja) * | 2007-07-27 | 2009-02-12 | Japan Gore Tex Inc | 発光素子用プリント配線基板 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3785487T2 (de) | 1986-06-02 | 1993-07-29 | Japan Gore Tex Inc | Verfahren zur herstellung von traegern fuer gedruckte schaltungen. |
US5922453A (en) * | 1997-02-06 | 1999-07-13 | Rogers Corporation | Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates |
JP2003060134A (ja) * | 2001-08-17 | 2003-02-28 | Polymatech Co Ltd | 熱伝導性シート |
JP3948941B2 (ja) | 2001-11-19 | 2007-07-25 | 利昌工業株式会社 | プリント配線基板用白色積層板 |
JP2004335853A (ja) | 2003-05-09 | 2004-11-25 | Nichia Chem Ind Ltd | フレキシブル半導体発光装置 |
US7429789B2 (en) * | 2004-03-31 | 2008-09-30 | Endicott Interconnect Technologies, Inc. | Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same |
JP2006270002A (ja) | 2005-03-25 | 2006-10-05 | Nippon Rika Kogyosho:Kk | 発光ダイオード実装用金属基板及び発光装置 |
JP5029359B2 (ja) | 2005-05-02 | 2012-09-19 | ダイキン工業株式会社 | 架橋性ポリテトラフルオロエチレン組成物、ポリテトラフルオロエチレン架橋体粉末、ポリテトラフルオロエチレン成形体、樹脂ブレンド組成物、および樹脂ブレンド成形体 |
US7638754B2 (en) * | 2005-10-07 | 2009-12-29 | Sharp Kabushiki Kaisha | Backlight device, display apparatus including backlight device, method for driving backlight device, and method for adjusting backlight device |
WO2007088930A1 (ja) * | 2006-02-02 | 2007-08-09 | Mitsubishi Plastics, Inc. | 遮熱シート |
TWI302372B (en) * | 2006-08-30 | 2008-10-21 | Polytronics Technology Corp | Heat dissipation substrate for electronic device |
JP2008071895A (ja) | 2006-09-13 | 2008-03-27 | Toshiba Lighting & Technology Corp | 照明装置 |
US7521905B2 (en) * | 2006-09-13 | 2009-04-21 | Gm Global Technology Operations, Inc. | High power permanent magnet alternator with improved controlled output |
TW200845877A (en) | 2007-05-07 | 2008-11-16 | Tysun Inc | Heat-dissipating substrates of composite structure |
TWI339088B (en) * | 2007-05-23 | 2011-03-11 | Polytronics Technology Corp | Heat dissipation substrate and heat dissipation material thereof |
JP5056372B2 (ja) * | 2007-11-22 | 2012-10-24 | ソニー株式会社 | バックライト装置及び液晶表示装置 |
US7717591B2 (en) * | 2007-12-27 | 2010-05-18 | Lumination Llc | Incorporating reflective layers into LED systems and/or components |
KR20100112213A (ko) * | 2009-04-06 | 2010-10-19 | 삼성전기주식회사 | 하이브리드층을 갖는 방열기판 및 조명용 모듈 기판 |
-
2010
- 2010-11-26 JP JP2010263957A patent/JP5475625B2/ja not_active Expired - Fee Related
- 2010-11-26 CN CN201080053303XA patent/CN102640311A/zh active Pending
- 2010-11-26 US US13/508,676 patent/US8985818B2/en not_active Expired - Fee Related
- 2010-11-26 EP EP10832865.9A patent/EP2506320A4/en not_active Withdrawn
- 2010-11-26 WO PCT/JP2010/006922 patent/WO2011065016A1/ja active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62283694A (ja) * | 1986-06-02 | 1987-12-09 | ジヤパンゴアテツクス株式会社 | プリント配線基板の製造法 |
JPH09183187A (ja) * | 1995-12-28 | 1997-07-15 | Du Pont Teijin Advanced Paper Kk | 複合体シートおよびその製造方法 |
JP2001247736A (ja) * | 2000-03-02 | 2001-09-11 | Daikin Ind Ltd | フッ素樹脂組成物 |
JP2007266606A (ja) * | 2006-03-28 | 2007-10-11 | Endicott Interconnect Technologies Inc | 回路基板用のフルオロポリマー絶縁性組成物およびこれから成る回路基板 |
JP2008270709A (ja) * | 2006-10-31 | 2008-11-06 | Techno Polymer Co Ltd | 放熱性樹脂組成物、led実装用基板、リフレクター、及び、リフレクター部を備えるled実装用基板 |
JP2009032943A (ja) * | 2007-07-27 | 2009-02-12 | Japan Gore Tex Inc | 発光素子用プリント配線基板 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015014590A (ja) * | 2013-06-07 | 2015-01-22 | 本田技研工業株式会社 | 積分球 |
JP2015076585A (ja) * | 2013-10-11 | 2015-04-20 | 住友電工プリントサーキット株式会社 | Ledモジュール及びled照明器具 |
WO2016002846A1 (ja) * | 2014-07-02 | 2016-01-07 | 住友ベークライト株式会社 | 半導体装置 |
JPWO2016002846A1 (ja) * | 2014-07-02 | 2017-04-27 | 住友ベークライト株式会社 | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
EP2506320A1 (en) | 2012-10-03 |
EP2506320A4 (en) | 2017-12-06 |
WO2011065016A1 (ja) | 2011-06-03 |
JP5475625B2 (ja) | 2014-04-16 |
US20120230043A1 (en) | 2012-09-13 |
US8985818B2 (en) | 2015-03-24 |
CN102640311A (zh) | 2012-08-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5475625B2 (ja) | Led実装用基板 | |
Hamidnia et al. | Application of micro/nano technology for thermal management of high power LED packaging–A review | |
JP5177319B2 (ja) | 金属基板及び光源装置 | |
JP6023474B2 (ja) | 熱伝導性絶縁シート、金属ベース基板及び回路基板、及びその製造方法 | |
JP2008060535A (ja) | 電子装置用放熱基板 | |
WO2018181606A1 (ja) | 伝熱部材及びこれを含む放熱構造体 | |
JP2012253167A (ja) | 熱伝導性絶縁シート、金属ベース基板及び回路基板 | |
TW201526181A (zh) | 散熱器 | |
JP5175435B2 (ja) | 放熱基板および発光ダイオード用基板 | |
WO2019164002A1 (ja) | 絶縁放熱シート | |
JP2008042120A (ja) | 熱伝導基板とその製造方法及びこれを用いた電子機器 | |
JP2019131669A (ja) | 樹脂組成物および絶縁熱伝導性シート | |
JP2011157428A (ja) | 熱伝導性ペーストおよび放熱材 | |
WO2003088315A2 (en) | Thermally conductive coating compositions, methods of production and uses thereof | |
Lee et al. | Laser-sintered silver nanoparticles as a die adhesive layer for high-power light-emitting diodes | |
JP2017092322A (ja) | 高熱伝導性、高絶縁性放熱シート | |
JP6426095B2 (ja) | 発光部品実装用フレキシブルプリント基板、及び発光部品実装フレキシブルプリント基板 | |
JP2011135109A (ja) | 放熱基板および発光ダイオード用基板 | |
JP2012116003A (ja) | 金属積層体、led搭載用基板及び光源装置 | |
WO2021200279A1 (ja) | フッ素樹脂シート及びその製造方法 | |
JP2021161271A (ja) | フッ素樹脂シート、および電子装置 | |
JP2008042121A (ja) | 熱伝導基板とその製造方法及びこれを用いた電子機器 | |
JP2010275404A (ja) | ガラスクロス含有白色フィルム、金属積層体及びled搭載用基板 | |
JP2021163876A (ja) | 電子装置 | |
KR20180022423A (ko) | 방열 기판 및 이의 제조 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20121127 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130731 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130806 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130930 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140128 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140206 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |