JP2011134978A - 流体冷却式ヒートシンク - Google Patents

流体冷却式ヒートシンク Download PDF

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Publication number
JP2011134978A
JP2011134978A JP2009294937A JP2009294937A JP2011134978A JP 2011134978 A JP2011134978 A JP 2011134978A JP 2009294937 A JP2009294937 A JP 2009294937A JP 2009294937 A JP2009294937 A JP 2009294937A JP 2011134978 A JP2011134978 A JP 2011134978A
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JP
Japan
Prior art keywords
cooling fluid
heat sink
fluid
cooling
heat
Prior art date
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Pending
Application number
JP2009294937A
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English (en)
Japanese (ja)
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JP2011134978A5 (enExample
Inventor
Akio Adachi
昭夫 安達
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP2009294937A priority Critical patent/JP2011134978A/ja
Priority to CN2010105859263A priority patent/CN102110665A/zh
Publication of JP2011134978A publication Critical patent/JP2011134978A/ja
Publication of JP2011134978A5 publication Critical patent/JP2011134978A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2009294937A 2009-12-25 2009-12-25 流体冷却式ヒートシンク Pending JP2011134978A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009294937A JP2011134978A (ja) 2009-12-25 2009-12-25 流体冷却式ヒートシンク
CN2010105859263A CN102110665A (zh) 2009-12-25 2010-12-08 流体冷却式散热器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009294937A JP2011134978A (ja) 2009-12-25 2009-12-25 流体冷却式ヒートシンク

Publications (2)

Publication Number Publication Date
JP2011134978A true JP2011134978A (ja) 2011-07-07
JP2011134978A5 JP2011134978A5 (enExample) 2012-08-09

Family

ID=44174779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009294937A Pending JP2011134978A (ja) 2009-12-25 2009-12-25 流体冷却式ヒートシンク

Country Status (2)

Country Link
JP (1) JP2011134978A (enExample)
CN (1) CN102110665A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013065427A1 (ja) * 2011-11-04 2013-05-10 アイシン・エィ・ダブリュ株式会社 半導体モジュール及びその製造方法
KR101314723B1 (ko) 2011-07-27 2013-10-08 주식회사 글로벌스탠다드테크놀로지 공정냉각시스템용 열교환기
JP2019219090A (ja) * 2018-06-19 2019-12-26 株式会社豊田中央研究所 熱交換器
CN119009540A (zh) * 2024-10-25 2024-11-22 浙江合丰科技有限公司 一种新能源汽车连接器

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109640601A (zh) * 2019-01-31 2019-04-16 英特换热设备(浙江)有限公司 一种用介质冷却的散热器，以及具有该散热器的空调变频器、电子设备
CN112344781B (zh) * 2019-08-06 2025-02-11 波音公司 用于感应焊接的散热器和形成散热器的方法
CN111182769A (zh) * 2020-01-15 2020-05-19 盐城工业职业技术学院 一种用于电子仪器仪表的温度补偿散热装置
CN117878078B (zh) * 2024-01-19 2024-10-01 派德芯能半导体(上海)有限公司 液冷散热器

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60139182U (ja) * 1984-02-23 1985-09-14 三菱自動車工業株式会社 熱交換装置
JP2004128439A (ja) * 2002-08-07 2004-04-22 Fuji Electric Fa Components & Systems Co Ltd 発熱体冷却装置
JP2005136278A (ja) * 2003-10-31 2005-05-26 Mitsubishi Electric Corp パワー半導体モジュール及びその製造方法
JP2007335588A (ja) * 2006-06-14 2007-12-27 Toyota Motor Corp ヒートシンクおよび冷却器
JP2008171987A (ja) * 2007-01-11 2008-07-24 T Rad Co Ltd フィンタイプ液冷ヒートシンク
JP2008172014A (ja) * 2007-01-11 2008-07-24 Toyota Motor Corp 半導体素子の冷却構造
JP2008179786A (ja) * 2001-05-14 2008-08-07 Duresco Gmbh バイポーラプレート製造用成形組成物
JP2008288330A (ja) * 2007-05-16 2008-11-27 Toyota Motor Corp 半導体装置
JP2010021311A (ja) * 2008-07-10 2010-01-28 Nippon Soken Inc 半導体素子冷却用ヒートシンク

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11126870A (ja) * 1997-10-21 1999-05-11 Denso Corp フィン一体型放熱板及びその製造方法
JP2003008264A (ja) * 2001-06-26 2003-01-10 Nissan Motor Co Ltd 電子部品の冷却装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60139182U (ja) * 1984-02-23 1985-09-14 三菱自動車工業株式会社 熱交換装置
JP2008179786A (ja) * 2001-05-14 2008-08-07 Duresco Gmbh バイポーラプレート製造用成形組成物
JP2004128439A (ja) * 2002-08-07 2004-04-22 Fuji Electric Fa Components & Systems Co Ltd 発熱体冷却装置
JP2005136278A (ja) * 2003-10-31 2005-05-26 Mitsubishi Electric Corp パワー半導体モジュール及びその製造方法
JP2007335588A (ja) * 2006-06-14 2007-12-27 Toyota Motor Corp ヒートシンクおよび冷却器
JP2008171987A (ja) * 2007-01-11 2008-07-24 T Rad Co Ltd フィンタイプ液冷ヒートシンク
JP2008172014A (ja) * 2007-01-11 2008-07-24 Toyota Motor Corp 半導体素子の冷却構造
JP2008288330A (ja) * 2007-05-16 2008-11-27 Toyota Motor Corp 半導体装置
JP2010021311A (ja) * 2008-07-10 2010-01-28 Nippon Soken Inc 半導体素子冷却用ヒートシンク

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101314723B1 (ko) 2011-07-27 2013-10-08 주식회사 글로벌스탠다드테크놀로지 공정냉각시스템용 열교환기
WO2013065427A1 (ja) * 2011-11-04 2013-05-10 アイシン・エィ・ダブリュ株式会社 半導体モジュール及びその製造方法
JP2019219090A (ja) * 2018-06-19 2019-12-26 株式会社豊田中央研究所 熱交換器
CN119009540A (zh) * 2024-10-25 2024-11-22 浙江合丰科技有限公司 一种新能源汽车连接器

Also Published As

Publication number Publication date
CN102110665A (zh) 2011-06-29

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