JP4305253B2 - 放熱器 - Google Patents
放熱器 Download PDFInfo
- Publication number
- JP4305253B2 JP4305253B2 JP2004111660A JP2004111660A JP4305253B2 JP 4305253 B2 JP4305253 B2 JP 4305253B2 JP 2004111660 A JP2004111660 A JP 2004111660A JP 2004111660 A JP2004111660 A JP 2004111660A JP 4305253 B2 JP4305253 B2 JP 4305253B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- water
- radiator
- heat
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 50
- 239000000498 cooling water Substances 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 230000005855 radiation Effects 0.000 description 7
- 230000020169 heat generation Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Semiconductor Lasers (AREA)
Description
2 上部放熱板
3 中間放熱板
4 下部放熱板
5 排水孔
6 給水孔
7 下部水路
8 放熱フィン
9 排水孔
10 連通孔
10a 水入口
10b 水出口
10c 折返し水路
12 上部水路
13 放熱フィン
14 発熱体
17 上板
18 中板
19 下板
20 往水路
21 通水孔
22 復水路
Claims (2)
- 一端をそれぞれ受熱端部とする上部放熱板、中間放熱板及び下部放熱板が上下3層に積層され、
前記下部放熱板には他端に排水孔が設けられ、かつこの排水孔と前記受熱端部との中間に給水孔が設けられるとともに、上面に前記給水孔から前記受熱端部に達する下部水路が溝状に形成され、
前記中間放熱板には前記下部放熱板の排水孔に通じるように排水孔が設けられるとともに、前記受熱端部に前記下部水路と重なるように連通孔が設けられ、
前記上部放熱板には下面に前記中間放熱板の連通孔と排水孔とに跨るように上部水路が溝状に形成されるとともに、前記受熱端部の上面に発熱体が接合され、
前記給水孔から前記下部水路、前記連通孔及び前記上部水路を通して前記排水孔に流される冷却水により前記発熱体を冷却する放熱器において、
前記中間放熱板の連通孔の水入口と水出口との間に、コ字状に反転する折返し水路を前記中間放熱板の板面と平行に形成し、この迂回通路を流れる前記冷却水により前記中間放熱板の受熱端部を冷却するようにしたことを特徴とする放熱器。 - 前記中間放熱板を上下3層に積層する上板、中板及び下板から構成し、前記下板に前記水入口を設けるとともに、前記下板の上面に一端が前記水入口に通じる往水路を溝状に形成し、前記中板に前記下板の往水路の他端に通じる通水孔を設け、前記上板に前記水出口を設けるとともに、前記上板の下面に一端が前記水出口に通じ他端が前記中板の通水孔に通じる復水路を溝状に形成し、前記上板、中板及び下板を積層することにより、前記下板の往水路、前記中板の通水孔及び前記上板の復水路を連続させて前記折返し水路を形成するようにしたことを特徴とする請求項1記載の放熱器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004111660A JP4305253B2 (ja) | 2004-04-06 | 2004-04-06 | 放熱器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004111660A JP4305253B2 (ja) | 2004-04-06 | 2004-04-06 | 放熱器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005294769A JP2005294769A (ja) | 2005-10-20 |
JP4305253B2 true JP4305253B2 (ja) | 2009-07-29 |
Family
ID=35327321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004111660A Expired - Fee Related JP4305253B2 (ja) | 2004-04-06 | 2004-04-06 | 放熱器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4305253B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109822242A (zh) * | 2019-04-01 | 2019-05-31 | 苏州匠恒智造科技有限公司 | 一种具有组合式微通道散热装置的激光加工设备 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008026856A1 (de) * | 2008-06-05 | 2009-12-17 | Jenoptik Laserdiode Gmbh | Kühlelement für ein elektronisches Bauelement und Vorrichtung mit einem elektronischen Bauelement |
CN101882753B (zh) * | 2010-06-23 | 2012-06-13 | 中国科学院上海光学精密机械研究所 | 大功率激光二极管热沉 |
JPWO2022038998A1 (ja) | 2020-08-19 | 2022-02-24 |
-
2004
- 2004-04-06 JP JP2004111660A patent/JP4305253B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109822242A (zh) * | 2019-04-01 | 2019-05-31 | 苏州匠恒智造科技有限公司 | 一种具有组合式微通道散热装置的激光加工设备 |
Also Published As
Publication number | Publication date |
---|---|
JP2005294769A (ja) | 2005-10-20 |
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