JP2011116638A5 - - Google Patents

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Publication number
JP2011116638A5
JP2011116638A5 JP2010257622A JP2010257622A JP2011116638A5 JP 2011116638 A5 JP2011116638 A5 JP 2011116638A5 JP 2010257622 A JP2010257622 A JP 2010257622A JP 2010257622 A JP2010257622 A JP 2010257622A JP 2011116638 A5 JP2011116638 A5 JP 2011116638A5
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JP
Japan
Prior art keywords
coherent
glass
nozzle
continuous ribbon
brittle material
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Granted
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JP2010257622A
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English (en)
Japanese (ja)
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JP5563430B2 (ja
JP2011116638A (ja
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Priority claimed from US12/621,068 external-priority patent/US8171753B2/en
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Publication of JP2011116638A publication Critical patent/JP2011116638A/ja
Publication of JP2011116638A5 publication Critical patent/JP2011116638A5/ja
Application granted granted Critical
Publication of JP5563430B2 publication Critical patent/JP5563430B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010257622A 2009-11-18 2010-11-18 脆性材料を切断する方法 Expired - Fee Related JP5563430B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/621,068 2009-11-18
US12/621,068 US8171753B2 (en) 2009-11-18 2009-11-18 Method for cutting a brittle material

Publications (3)

Publication Number Publication Date
JP2011116638A JP2011116638A (ja) 2011-06-16
JP2011116638A5 true JP2011116638A5 (OSRAM) 2013-12-05
JP5563430B2 JP5563430B2 (ja) 2014-07-30

Family

ID=43332619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010257622A Expired - Fee Related JP5563430B2 (ja) 2009-11-18 2010-11-18 脆性材料を切断する方法

Country Status (6)

Country Link
US (1) US8171753B2 (OSRAM)
EP (1) EP2332890B1 (OSRAM)
JP (1) JP5563430B2 (OSRAM)
KR (1) KR101605917B1 (OSRAM)
CN (1) CN102167505A (OSRAM)
TW (1) TWI417262B (OSRAM)

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CN102203943B (zh) * 2008-10-29 2013-07-31 欧瑞康太阳能股份公司(特吕巴赫) 通过多激光束照射将在基板上形成的半导体膜划分成多个区域的方法
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
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TWI513670B (zh) * 2010-08-31 2015-12-21 Corning Inc 分離強化玻璃基板之方法
US8677783B2 (en) 2011-11-28 2014-03-25 Corning Incorporated Method for low energy separation of a glass ribbon
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
CN105189022B (zh) 2013-01-30 2017-09-01 康宁股份有限公司 用于柔性玻璃连续激光切割的设备和方法
CN103288340B (zh) * 2013-05-20 2016-08-10 深圳市华星光电技术有限公司 玻璃基板的切割裂片装置及其切割裂片方法
US9260337B2 (en) 2014-01-09 2016-02-16 Corning Incorporated Methods and apparatus for free-shape cutting of flexible thin glass
TWI658015B (zh) 2014-02-20 2019-05-01 Corning Incorporated 在撓性薄玻璃中切割多個半徑的方法和設備與以其製造之玻璃基板
US10017411B2 (en) * 2014-11-19 2018-07-10 Corning Incorporated Methods of separating a glass web
WO2017091529A1 (en) * 2015-11-25 2017-06-01 Corning Incorporated Methods of separating a glass web
DE102019113635A1 (de) * 2019-05-22 2020-11-26 Schott Ag Verfahren und Vorrichtung zur Verarbeitung von Glaselementen
CN111014961A (zh) * 2019-12-25 2020-04-17 深圳市韵腾激光科技有限公司 一种激光切割裂片装置
CN114734153B (zh) * 2022-03-31 2023-02-14 武汉华日精密激光股份有限公司 一种用于激光器加工脆性材料的裂片方法及系统

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