JP2011109027A - サポートバー及び基板収納カセット - Google Patents
サポートバー及び基板収納カセット Download PDFInfo
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- JP2011109027A JP2011109027A JP2009265373A JP2009265373A JP2011109027A JP 2011109027 A JP2011109027 A JP 2011109027A JP 2009265373 A JP2009265373 A JP 2009265373A JP 2009265373 A JP2009265373 A JP 2009265373A JP 2011109027 A JP2011109027 A JP 2011109027A
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- support bar
- layer
- damping elastic
- elastic layer
- inner layer
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- 239000000758 substrate Substances 0.000 title claims abstract description 39
- 238000013016 damping Methods 0.000 claims abstract description 97
- 229920002430 Fibre-reinforced plastic Polymers 0.000 claims abstract description 29
- 239000011151 fibre-reinforced plastic Substances 0.000 claims abstract description 29
- 238000003860 storage Methods 0.000 claims description 26
- 229920000049 Carbon (fiber) Polymers 0.000 description 11
- 239000004917 carbon fiber Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
- 239000003365 glass fiber Substances 0.000 description 5
- 238000004904 shortening Methods 0.000 description 5
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 239000000806 elastomer Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920005549 butyl rubber Polymers 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229920001084 poly(chloroprene) Polymers 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
- H01L21/67323—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Vibration Prevention Devices (AREA)
- Laminated Bodies (AREA)
- Packaging Frangible Articles (AREA)
Abstract
【解決手段】 サポートバー10においては、繊維強化プラスチックからなる内側層11と外側層13との間に、内側層11の周方向において連続し且つ基端10aから先端10bに渡って延在するように制振弾性層12が配置されている。これにより、振動減衰時間の短縮化等、振動減衰特性の向上を図ることができる。しかも、繊維強化プラスチックからなる内側層11が円管状であり、繊維強化プラスチックからなる内側層11と外側層13とで制振弾性層12が挟まれている。これにより、制振弾性層12の適用に起因した剛性の低下を防止することができる。
【選択図】 図3
Description
[第1実施形態]
[第2実施形態]
[第3実施形態]
[実施例]
Claims (6)
- 基端を固定端とし且つ先端を自由端として水平方向に延在した状態で基板を支持するためのサポートバーであって、
繊維強化プラスチックからなり、前記基端から前記先端に渡って延在する円管状の内側層と、
少なくとも前記内側層における前記基端側の部分の上側及び下側に配置された制振弾性層と、
繊維強化プラスチックからなり、前記制振弾性層を覆うように前記内側層の外側に配置された外側層と、を備えることを特徴とするサポートバー。 - 前記制振弾性層は、前記内側層の周方向において連続していることを特徴とする請求項1記載のサポートバー。
- 前記制振弾性層は、前記基端から前記先端に渡って延在していることを特徴とする請求項1又は2記載のサポートバー。
- 前記制振弾性層の積層数は、前記先端側よりも前記基端側のほうが多くなっていることを特徴とする請求項1〜3のいずれか一項記載のサポートバー。
- 複数層の前記制振弾性層が積層される場合、前記制振弾性層は、繊維強化プラスチックからなる中間層を介して積層されていることを特徴とする請求項1〜4のいずれか一項記載のサポートバー。
- 基板を収容するための筐体と、
前記筐体内に複数本設置された請求項1〜5のいずれか一項記載のサポートバーと、を備えることを特徴とする基板収納カセット。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009265373A JP5495731B2 (ja) | 2009-11-20 | 2009-11-20 | サポートバー及び基板収納カセット |
CN201080052128.2A CN102668055B (zh) | 2009-11-20 | 2010-11-18 | 支承杆和基板容纳盒 |
BR112012012041A BR112012012041A2 (pt) | 2009-11-20 | 2010-11-18 | barra de suporte e cassete que contém substrato. |
KR1020127014559A KR101696180B1 (ko) | 2009-11-20 | 2010-11-18 | 서포트 바 및 기판 수납 카세트 |
PCT/JP2010/070558 WO2011062219A1 (ja) | 2009-11-20 | 2010-11-18 | サポートバー及び基板収納カセット |
TW099140063A TWI498260B (zh) | 2009-11-20 | 2010-11-19 | Support rod and substrate storage case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009265373A JP5495731B2 (ja) | 2009-11-20 | 2009-11-20 | サポートバー及び基板収納カセット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011109027A true JP2011109027A (ja) | 2011-06-02 |
JP5495731B2 JP5495731B2 (ja) | 2014-05-21 |
Family
ID=44059693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009265373A Expired - Fee Related JP5495731B2 (ja) | 2009-11-20 | 2009-11-20 | サポートバー及び基板収納カセット |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5495731B2 (ja) |
KR (1) | KR101696180B1 (ja) |
CN (1) | CN102668055B (ja) |
BR (1) | BR112012012041A2 (ja) |
TW (1) | TWI498260B (ja) |
WO (1) | WO2011062219A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014188853A (ja) * | 2013-03-27 | 2014-10-06 | Jx Nippon Oil & Energy Corp | 支持部材 |
JP2014226892A (ja) * | 2013-05-24 | 2014-12-08 | Jx日鉱日石エネルギー株式会社 | パイプ成形体 |
WO2018038174A1 (ja) * | 2016-08-24 | 2018-03-01 | Jxtgエネルギー株式会社 | 支持部材 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6668304B2 (ja) * | 2017-10-04 | 2020-03-18 | Jxtgエネルギー株式会社 | 支持部材 |
KR101859153B1 (ko) * | 2017-10-11 | 2018-05-16 | 주식회사 넥스컴스 | 외팔보 형태로 된 카세트용 서포트바의 진동감쇠장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005150510A (ja) * | 2003-11-18 | 2005-06-09 | Toshio Tanimoto | 制振性産業用梁構造部材 |
JP2005340480A (ja) * | 2004-05-26 | 2005-12-08 | Nippon Oil Corp | 基板カセット用サポートバー |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3204627B2 (ja) * | 1997-06-05 | 2001-09-04 | 住友ゴム工業株式会社 | 繊維強化プラスチック成形品 |
JP4029104B2 (ja) * | 2006-01-30 | 2008-01-09 | 新日本石油株式会社 | 楕円状支持部材 |
JP5189843B2 (ja) * | 2008-01-04 | 2013-04-24 | Jx日鉱日石エネルギー株式会社 | Cfrp製搬送用部材及びそれを用いたロボットハンド |
-
2009
- 2009-11-20 JP JP2009265373A patent/JP5495731B2/ja not_active Expired - Fee Related
-
2010
- 2010-11-18 KR KR1020127014559A patent/KR101696180B1/ko active IP Right Grant
- 2010-11-18 BR BR112012012041A patent/BR112012012041A2/pt not_active IP Right Cessation
- 2010-11-18 WO PCT/JP2010/070558 patent/WO2011062219A1/ja active Application Filing
- 2010-11-18 CN CN201080052128.2A patent/CN102668055B/zh not_active Expired - Fee Related
- 2010-11-19 TW TW099140063A patent/TWI498260B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005150510A (ja) * | 2003-11-18 | 2005-06-09 | Toshio Tanimoto | 制振性産業用梁構造部材 |
JP2005340480A (ja) * | 2004-05-26 | 2005-12-08 | Nippon Oil Corp | 基板カセット用サポートバー |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014188853A (ja) * | 2013-03-27 | 2014-10-06 | Jx Nippon Oil & Energy Corp | 支持部材 |
JP2014226892A (ja) * | 2013-05-24 | 2014-12-08 | Jx日鉱日石エネルギー株式会社 | パイプ成形体 |
WO2018038174A1 (ja) * | 2016-08-24 | 2018-03-01 | Jxtgエネルギー株式会社 | 支持部材 |
Also Published As
Publication number | Publication date |
---|---|
CN102668055A (zh) | 2012-09-12 |
TWI498260B (zh) | 2015-09-01 |
KR101696180B1 (ko) | 2017-01-13 |
JP5495731B2 (ja) | 2014-05-21 |
KR20120107954A (ko) | 2012-10-04 |
BR112012012041A2 (pt) | 2019-09-24 |
TW201125792A (en) | 2011-08-01 |
WO2011062219A1 (ja) | 2011-05-26 |
CN102668055B (zh) | 2015-07-29 |
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