JP2011084621A - Heat conductive material - Google Patents
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Abstract
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本発明は、熱伝導性材料に関する。 The present invention relates to a thermally conductive material.
電子部品の多くは使用中に熱を発生させるので、その電子部品を適切に機能させるためには、その電子部品から熱を取り除くことが必要である。電子部品からの熱を外部に逃すために、ヒートシンク等の放熱体が広く用いられている。電子部品から発生する熱を放熱体に効率よく伝導させるために、一般に電子部品と放熱体との間には熱伝導性材料が使用される。特に近年では、電子部材の高密度化や小型パソコンをはじめとする電子機器の小型・薄型・軽量化に伴い、それらに用いられる放熱部材の低熱抵抗化の要求が益々高まっており、放熱部材の薄化が要求されている。 Since many electronic components generate heat during use, it is necessary to remove the heat from the electronic component in order for the electronic component to function properly. In order to release heat from the electronic component to the outside, a heat radiating body such as a heat sink is widely used. In order to efficiently conduct heat generated from the electronic component to the heat radiating body, a heat conductive material is generally used between the electronic component and the heat radiating body. In particular, in recent years, with the increase in the density of electronic members and the downsizing, thinning, and weight reduction of electronic devices such as small personal computers, there has been an increasing demand for low heat resistance of the heat dissipation members used in them. Thinning is required.
熱伝導性材料としては、シリコーンゲルに熱伝導性無機粉末が充填された硬化物からなる放熱シート（特許文献１）、シリコーンゲルに熱伝導性無機粉末が充填され、柔軟性を有する硬化物からなる放熱スペーサー（特許文献２）、液状シリコーンに熱伝導性無機粉末が充填された流動性のある放熱グリース（特許文献３）、樹脂の相変化を利用したフェーズチェンジ型放熱部材等が例示される（特許文献４）。これらのうち、薄化が容易なものは、放熱グリース及びフェーズチェンジ型放熱部材であるが、汎用品においては、価格が安い放熱グリースが好んで使用されることがある。放熱グリースはその性状が液体に近く、放熱シートと比べて、発熱性電子部品や放熱体表面の凹凸に影響されることなく両者に密着して界面熱抵抗を小さくすることができる。このような放熱グリースとしては、シリコーンオイルをベースとして、アルミニウム粉末などの熱伝導性充填剤を配合したシリコーングリース組成物が提案されている（特許文献５）。 As the heat conductive material, a heat radiation sheet (Patent Document 1) made of a cured product in which a silicone gel is filled with a heat conductive inorganic powder, and from a cured product having a flexibility in which a silicone gel is filled with a heat conductive inorganic powder. Exemplified are a heat dissipation spacer (Patent Document 2), a fluid heat dissipation grease (Patent Document 3) in which liquid silicone is filled with a heat conductive inorganic powder, a phase change type heat dissipation member utilizing a phase change of a resin, and the like. (Patent Document 4). Among these, those that can be easily thinned are the heat radiation grease and the phase change type heat radiation member, but in general-purpose products, the heat radiation grease with a low price may be preferred. The heat dissipating grease has a property close to that of a liquid, and compared with the heat dissipating sheet, the heat dissipating grease can be in close contact with the heat generating electronic component and the unevenness of the heat dissipating member surface to reduce the interfacial thermal resistance. As such a heat dissipating grease, there has been proposed a silicone grease composition in which a heat conductive filler such as aluminum powder is blended based on silicone oil (Patent Document 5).
しかし、アルミニウム粉末や窒化アルミニウム粉末などの高熱伝導性無機粉末は、高温高湿下や高温下において、加水分解等により変質し、グリースの性能を劣化させるという問題点がある。 However, highly heat-conductive inorganic powders such as aluminum powder and aluminum nitride powder have a problem that they deteriorate due to hydrolysis or the like under high temperature and high humidity or high temperature, and degrade grease performance.
本発明の目的は、高温条件および高温高湿条件においても高い熱伝導性を示す熱伝導性材料を提供することを目的とする。 An object of the present invention is to provide a thermally conductive material exhibiting high thermal conductivity even under high temperature conditions and high temperature and high humidity conditions.
本発明は、上記の課題を解決するために、以下の手段を採用する。
（１）平均粒径（５０％体積径）１．０〜２５μｍのアルミナ粉末が２０〜５５体積％、平均粒径（５０％体積径）０．２〜１．０μｍの酸化亜鉛粉末が５〜２８体積％、残部の体積％がシリコーンゲルであり、かつアルミナ粉末と酸化亜鉛粉末の合計量１００質量部に対して、アルキルアルコキシシランを０．５〜３．０質量部添加すること特徴とする熱伝導性材料。
（２）アルキルアルコキシシランがアルキル基の炭素の数が３以下のメトキシシラン又はアルキル基の炭素の数が８のトリエトキシシランであること特徴とする前記（１）に記載の熱伝導性材料。
The present invention employs the following means in order to solve the above problems.
(1) Alumina powder having an average particle diameter (50% volume diameter) of 1.0 to 25 μm is 20 to 55 volume%, and zinc oxide powder having an average particle diameter (50% volume diameter) of 0.2 to 1.0 μm is 5 to 5. 28% by volume, the remaining volume% is silicone gel, and 0.5 to 3.0 parts by mass of alkylalkoxysilane is added to 100 parts by mass of the total amount of alumina powder and zinc oxide powder. Thermally conductive material.
(2) The heat conductive material as described in (1) above, wherein the alkylalkoxysilane is methoxysilane having 3 or less carbon atoms in the alkyl group or triethoxysilane having 8 carbon atoms in the alkyl group.
本発明の熱伝導性材料を電子部品に用いることにより、電子部品を高温条件又は高温高湿条件で使用した場合の耐久性を高め、実装時における信頼性をさらに向上させ、長期にわたって電子部品の本来の性能を発揮させることができる。 By using the heat conductive material of the present invention for an electronic component, the durability when the electronic component is used under a high temperature condition or a high temperature and high humidity condition is further improved, and the reliability at the time of mounting is further improved. The original performance can be exhibited.
本発明で用いられるシリコーンゲルは、付加反応型シリコーンゲルまたは、縮合反応型シリコーンゲルの少なくとも一方であることが好ましい。また、シリコーンゲル成分の一部をシリコーンゴムに置き換えても差し支えない。該シリコーンゴムは付加反応型シリコーンゴムまたは、過酸化物加硫タイプのシリコーンゴムの少なくとも一方であることが好ましい。これらのシリコーンゲル、シリコーンゴムのいずれにおいても、平均組成式が、Ｒ１ａＳｉＯ（４−ａ）／２（式中、Ｒ１は同一又は異種の非置換又は置換の１価炭化水素基であり、ａは１．９８〜２．０２の正数である。）で示されるオルガノポリシロキサンを主成分としたものが好ましい。また、シリコーンゲルとしては低粘度のものが好ましく、粘度が１００〜１１００ｍＰａ・ｓであるものが好ましい。 The silicone gel used in the present invention is preferably at least one of an addition reaction type silicone gel or a condensation reaction type silicone gel. Further, a part of the silicone gel component may be replaced with silicone rubber. The silicone rubber is preferably at least one of addition reaction type silicone rubber or peroxide vulcanization type silicone rubber. In any of these silicone gels and silicone rubbers, the average composition formula is R 1 aSiO (4-a) / 2 (wherein R 1 is the same or different unsubstituted or substituted monovalent hydrocarbon group. , A is a positive number of 1.98 to 2.02). The silicone gel preferably has a low viscosity, and preferably has a viscosity of 100 to 1100 mPa · s.
本発明の熱伝導性無機粉末としては、アルミナ粉末と酸化亜鉛粉末が用いられる。本発明において、アルミナ粉末と酸化亜鉛粉末の平均粒径（５０％体積径）を異ならせ、しかもアルミナ粉末の平均粒径（５０％体積径）を酸化亜鉛粉末のそれよりも大きくしているのは、熱伝導性無機粉末を高充填しても熱伝導性材料の柔軟性を保たせ、熱伝導性を改善するためである。アルミナ粉末の平均粒径（５０％体積径）が１．０μｍ未満では材料の粘度が高くなり過ぎ、２５μｍをこえると、グリースが薄肉化したときにそれが表面に突出し、低熱抵抗化が困難となる。一方、酸化亜鉛粉末の平均粒径（５０％体積径）が０．２μｍ未満であると、グリ−スの粘度が高くなりすぎて薄化が容易でなくなり、１．０μｍをこえると、アルミナ粉末を多く充填することに悪影響を及ぼす。特に好適な平均粒径（５０％体積径）は、アルミナ粉末が１．０〜１０μｍ、酸化亜鉛粉末が０．３〜０．８μｍである。 As the thermally conductive inorganic powder of the present invention, alumina powder and zinc oxide powder are used. In the present invention, the average particle diameter (50% volume diameter) of the alumina powder and the zinc oxide powder is made different, and the average particle diameter (50% volume diameter) of the alumina powder is made larger than that of the zinc oxide powder. This is to maintain the flexibility of the heat conductive material and improve the heat conductivity even when highly filled with the heat conductive inorganic powder. If the average particle diameter (50% volume diameter) of the alumina powder is less than 1.0 μm, the viscosity of the material becomes too high. If the average particle diameter exceeds 25 μm, when the grease becomes thin, it protrudes to the surface, making it difficult to reduce the thermal resistance. Become. On the other hand, if the average particle diameter (50% volume diameter) of the zinc oxide powder is less than 0.2 μm, the viscosity of the grease becomes too high and thinning becomes difficult, and if it exceeds 1.0 μm, the alumina powder Adversely affects the filling of more. Particularly suitable average particle diameter (50% volume diameter) is 1.0 to 10 μm for alumina powder and 0.3 to 0.8 μm for zinc oxide powder.
熱伝導性材料中の熱伝導性無機粉末の含有率は、アルミナ粉末が２０〜５５体積％、特に３３〜４２体積％、酸化亜鉛粉末が５〜２８体積％、特に２０〜２４体積％、シリコーンゲルが３５〜６０体積％、特に４０〜４７体積％であることが好ましい。シリコーンゲルの含有率が６０体積％をこえると、熱伝導率を向上させる効果が少なく、グリースをいくら薄化しても低熱抵抗化は困難となる。また、シリコーンゲルの含有率が３５体積％未満であると、グリースの粘度が高くなり、流動性が悪化する。 The content of the thermally conductive inorganic powder in the thermally conductive material is 20 to 55% by volume of alumina powder, particularly 33 to 42% by volume, 5 to 28% by volume of zinc oxide powder, particularly 20 to 24% by volume, silicone. It is preferable that the gel is 35 to 60% by volume, particularly 40 to 47% by volume. When the content of the silicone gel exceeds 60% by volume, the effect of improving the thermal conductivity is small, and it is difficult to reduce the thermal resistance no matter how thin the grease is. On the other hand, when the silicone gel content is less than 35% by volume, the viscosity of the grease increases and the fluidity deteriorates.
アルミナ粉末は、高熱伝導率の付与を担っている。そのため、その含有率が２０体積％未満ではその効果が少なく、５５体積％をこえると熱伝導性材料の粘度が高くなりすぎて薄化が困難となりその効果が少なくなる。 Alumina powder is responsible for imparting high thermal conductivity. Therefore, if the content is less than 20% by volume, the effect is small, and if it exceeds 55% by volume, the viscosity of the heat conductive material becomes too high, making it difficult to thin the effect.
酸化亜鉛粉末は、アルミナ粉末の粒子と粒子の隙間を埋め、熱伝導性を一段と向上させるために用いており、その含有率が５体積％未満ではその効果が認められず、２８体積％をこえると熱伝導性材料の粘度が高くなる。 Zinc oxide powder is used to fill the gaps between the particles of alumina powder and further improve the thermal conductivity. If the content is less than 5% by volume, the effect is not recognized and exceeds 28% by volume. And the viscosity of the heat conductive material becomes high.
シランカップリング剤は、下記の一般式で表すことができる。
Ｒ２ ｂＲ３ ｃＳｉ（ＯＲ４）４−（ｂ＋ｃ）
式中、式中のＲ２は、炭素原子数１〜１５のアルキル基であり、例えばメチル基、エチル基、プロピル基、ヘキシル基、ノニル基、デシル基、ドデシル基、テトラデシル基等が挙げられる。また、Ｒ３は炭素原子数１〜８の飽和又は不飽和の一価炭化水素基であり、例えばメチル基、エチル基、プロピル基、ヘキシル基、オクチル基等のアルキル基、シクロペンチル基、シクロヘキシル基等のシクロヘキシル基、ビニル基、アリル基等のアルケニル基、フェニル基、トリル基等のアリール基、２−フェニルエチル基、２−メチル−２−フェニルエチル基等のアラルキル基、３，３，３−トリフロロプロピル基、２−（パーフロロブチル）エチル基、２−（パーフロロオクチル）エチル基、ｐ−クロロフェニル基等のハロゲン化炭化水素基などが挙げられる。Ｒ４はメチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基などの炭素原子数１〜６の１種もしくは２種以上のアルキル基であり、好ましくはメチル基、エチル基である。ｂは１〜３の整数であり、好ましくは１である。ｃは０〜２の整数、ｂ＋ｃは１〜３の整数である。
A silane coupling agent can be represented by the following general formula.
R 2 b R 3 c Si (OR 4 ) 4- (b + c)
In the formula, R 2 in the formula is an alkyl group having 1 to 15 carbon atoms, and examples thereof include a methyl group, an ethyl group, a propyl group, a hexyl group, a nonyl group, a decyl group, a dodecyl group, and a tetradecyl group. . R 3 is a saturated or unsaturated monovalent hydrocarbon group having 1 to 8 carbon atoms, for example, an alkyl group such as a methyl group, an ethyl group, a propyl group, a hexyl group, an octyl group, a cyclopentyl group, or a cyclohexyl group. Cyclohexyl group such as vinyl group, aryl group such as vinyl group and allyl group, aryl group such as phenyl group and tolyl group, aralkyl group such as 2-phenylethyl group and 2-methyl-2-phenylethyl group, 3, 3, 3 -Halogenated hydrocarbon groups such as -trifluoropropyl group, 2- (perfluorobutyl) ethyl group, 2- (perfluorooctyl) ethyl group and p-chlorophenyl group. R 4 is one or more alkyl groups having 1 to 6 carbon atoms such as methyl group, ethyl group, propyl group, butyl group, pentyl group and hexyl group, preferably methyl group or ethyl group. . b is an integer of 1 to 3, and preferably 1. c is an integer of 0 to 2, and b + c is an integer of 1 to 3.
シランカップリング剤として、本発明では、下記の条件のアルコキシシランを用いることが好ましい。
前記のＲ２が、炭素原子数３以下又は８のアルキル基であり、例えばメチル基、エチル基、プロピル基、オクチル基が挙げられる。
前記のＲ４が炭素原子数１又は２の飽和の一価炭化水素基であり、例えばメチル基、エチル基などが挙げられ、好ましくは前記のＲ２の炭素原子数３以下の場合はメチル基、炭素原子数８の場合はエチル基である。
前記のｂが１〜３の整数であり、好ましくは前記のＲ２の炭素原子数３以下の場合は１、炭素原子数８の場合は１である。
前記のｃが０〜２の整数であり、好ましくは０である。
As the silane coupling agent, in the present invention, it is preferable to use alkoxysilane under the following conditions.
Said R < 2 > is a C3 or less or C8 alkyl group, for example, a methyl group, an ethyl group, a propyl group, and an octyl group are mentioned.
R 4 is a saturated monovalent hydrocarbon group having 1 or 2 carbon atoms, and examples thereof include a methyl group and an ethyl group. Preferably, when R 2 has 3 or less carbon atoms, it is a methyl group. In the case of 8 carbon atoms, it is an ethyl group.
The b is an integer of 1 to 3, preferably 1 when the R 2 has 3 or less carbon atoms, and 1 when the carbon atom has 8 carbon atoms.
Said c is an integer of 0-2, Preferably it is 0.
アルコキシシランは、熱伝導性無機粉末とシリコーンゲルの濡れ性を向上させることにより、熱伝導率、耐熱性、耐湿性に寄与する。アルミナ粉末と酸化亜鉛粉末の合計量１００質量部に対するアルキルアルコキシシランの添加量は０．５〜３．０質量部である。０．５質量部未満では濡れ性向上効果が小さく、また３．０質量部以上では遊離アルコキシシランが多くなり信頼性に悪影響を与える。 Alkoxysilane contributes to thermal conductivity, heat resistance, and moisture resistance by improving the wettability of the thermally conductive inorganic powder and the silicone gel. The addition amount of the alkyl alkoxysilane with respect to 100 mass parts of total amounts of an alumina powder and a zinc oxide powder is 0.5-3.0 mass parts. If it is less than 0.5 parts by mass, the effect of improving wettability is small, and if it is 3.0 parts by mass or more, the amount of free alkoxysilane increases and adversely affects reliability.
アルコキシシランとして、炭素数３以下のアルキルメトキシシラン、又は炭素の数が８のトリエトキシシランを用いると、高温信頼性及び高温高湿信頼性が著しく向上する。 When alkoxymethoxysilane having 3 or less carbon atoms or triethoxysilane having 8 carbon atoms is used as the alkoxysilane, high temperature reliability and high temperature and high humidity reliability are remarkably improved.
本発明の熱伝導性材料は、上記材料を万能混合攪拌機、ニーダー等で混練りすることによって製造することができる。 The heat conductive material of the present invention can be produced by kneading the above materials with a universal mixing stirrer, kneader or the like.
本発明を実施例により具体的に説明するが、本発明は実施例に限定されるものではない。
熱伝導性無機粉末として表１に示されるアルミナ粉末（住友化学社製商品名「ＡＡ−２」、電気化学社製商品名「ＤＡＷ−１０」「ＡＳＦＰ−２０」「ＤＡＷ−４５」）および酸化亜鉛粉末（堺化学工業社製商品名「一種」「ＬＰＺＩＮＣ−２」、ハクスイテック社製商品名「Ｚｉｎｃｏｎｘ Ｓｕｐｅｒ Ｆ−１」）から選ばれた少なくとも１種の熱伝導性無機粉末、シリコーンゲルとして表２に示される、モメンティブ・パフォーマンス・マテリアル・ジャパン合同会社製商品名「ＸＥ１４−Ｂ８５３０」（粘度 ３５０ｍＰａ・ｓ）、「ＴＳＥ−３０７０」（粘度 ８００ｍＰａ・ｓ）、東レ・ダウコーニング社製商品名「ＳＥ１８８５」（粘度 ５００ｍＰａ・ｓ）、シランカップリング剤として表３に示される、東レ・ダウコーニング社製商品名「Ｚ−６３４１」「Ｚ−６０１３」「Ｚ−６５８６」とを、表４の配合で内容量１５０ｍｌの容器に量り取り、ハイブリットミキサー（シンキー社製商品名「あわとり練太郎 ＡＲ−２５０」、回転数２０００ｒｐｍ）を用いて５分間混練した。次いで、得られた混合物を１１０℃で３時間、加熱硬化させた。その後、再び同ハイブリットミキサーを用いて均一になるように混練し、熱伝導性材料を得た。
実施例３〜５では２種類のアルミナ粉末を用いて平均粒径の調整を行い、実施例３と４では２種類の酸化亜鉛粉末を用いて平均粒径の調整を行った。
EXAMPLES The present invention will be specifically described with reference to examples, but the present invention is not limited to the examples.
Alumina powder (trade name “AA-2”, manufactured by Sumitomo Chemical Co., Ltd., trade names “DAW-10”, “ASFP-20”, “DAW-45”) manufactured by Sumitomo Chemical Co., Ltd. At least one kind of thermally conductive inorganic powder selected from zinc powder (trade name “kind” “LPZINC-2”, trade name “Zinconx Super F-1” manufactured by Sakai Chemical Industry Co., Ltd.) as a silicone gel Product name “XE14-B8530” (viscosity 350 mPa · s), “TSE-3070” (viscosity 800 mPa · s), product name “Toray Dow Corning” SE 1885 ”(viscosity 500 mPa · s), shown in Table 3 as a silane coupling agent, Toray Dow Corning Product names “Z-6341”, “Z-6013”, and “Z-6586” were weighed into a 150 ml container with the formulation shown in Table 4 and hybrid mixer (trade name “Awori Nertaro AR-250, manufactured by Shinky Corporation”). And kneading for 5 minutes. The resulting mixture was then heat cured at 110 ° C. for 3 hours. Then, it knead | mixed uniformly using the said hybrid mixer again, and obtained the heat conductive material.
In Examples 3 to 5, the average particle size was adjusted using two types of alumina powder, and in Examples 3 and 4, the average particle size was adjusted using two types of zinc oxide powder.
得られた熱伝導性材料の平均粒径（５０％体積径）、熱伝導率、高温試験、高温高湿試験、ちょう度の測定を以下に従って行った。それらの結果を表４、表５に示す。 The average particle diameter (50% volume diameter), thermal conductivity, high temperature test, high temperature and high humidity test, and consistency of the obtained heat conductive material were measured as follows. The results are shown in Tables 4 and 5.
（１）平均粒径（５０％体積径）：島津製作所製「レーザー回折式粒度分布測定装置ＳＡＬＤ−２２００」を用いて測定を行った。評価サンプルは、ガラスビーカーに５０ｃｃの純水と測定する熱伝導性粉末を５ｇ添加して、スパチュラを用いて撹拌し、その後超音波洗浄機で１０分間、分散処理を行った。分散処理を行った熱伝導性材料の粉末の溶液をスポイドを用いて、装置のサンプラ部に一滴ずつ添加して、吸光度が測定可能になるまで安定するのを待った。このようにして吸光度が安定になった時点で測定を行う。レーザー回折式粒度分布測定装置では、センサで検出した粒子による回折／散乱光の光強度分布のデータから粒度分布を計算する。粒子径（体積径）は測定される粒子径の値に相対粒子量（差分％）を掛けて、相対粒子量の合計（１００％）で割って求められる。 (1) Average particle diameter (50% volume diameter): Measurement was performed using “Laser diffraction particle size distribution analyzer SALD-2200” manufactured by Shimadzu Corporation. As an evaluation sample, 5 g of 50 cc of pure water and a heat conductive powder to be measured were added to a glass beaker, stirred using a spatula, and then subjected to a dispersion treatment for 10 minutes using an ultrasonic cleaner. The solution of the powder of the heat conductive material that had been subjected to the dispersion treatment was added drop by drop to the sampler portion of the apparatus using a dropper, and waited until the absorbance became measurable. The measurement is performed when the absorbance becomes stable in this way. In the laser diffraction particle size distribution measuring device, the particle size distribution is calculated from the data of the light intensity distribution of the diffracted / scattered light by the particles detected by the sensor. The particle diameter (volume diameter) is obtained by multiplying the value of the particle diameter to be measured by the relative particle amount (difference%) and dividing by the total relative particle amount (100%).
（２）熱伝導率：ＡＳＴＭＤ５４７０に準拠して測定した。すなわち、ヒーターの埋め込まれた直方体の銅製治具（先端が１０ｍｍ角）と、冷却ユニットを有する直方体の銅製治具（先端が１０ｍｍ角）とを、試料（熱伝導性材料）約０．５ｃｍ３を挟んで０．０２５ｍｍの厚さに設定し、密着させて銅製冷却治具とした。試料量は、密着面全体を埋めるのに十分な量であり、少しはみ出させた状態とした。ヒーターに電力２０Ｗをかけて３０分間保持し、銅製治具と銅製治具との温度差（℃）を測定した。式、熱抵抗（℃／Ｗ）＝温度差（℃）／電力（Ｗ）、により熱抵抗を算出した。この熱抵抗から、式、熱伝導率（Ｗ／ｍＫ）＝｛電力（Ｗ）×厚み（ｍ）｝／｛温度差（Ｋ）×測定面積（ｍ２）｝にて、算出した。 (2) Thermal conductivity: measured in accordance with ASTM D5470. That is, a rectangular parallelepiped copper jig (tip is 10 mm square) embedded with a heater and a rectangular copper jig (tip is 10 mm square) having a cooling unit are approximately 0.5 cm 3 of a sample (thermally conductive material). Was set to a thickness of 0.025 mm, and was brought into close contact to form a copper cooling jig. The amount of the sample was a sufficient amount to fill the entire adhesion surface, and was in a state where it protruded slightly. An electric power of 20 W was applied to the heater and held for 30 minutes, and the temperature difference (° C.) between the copper jig and the copper jig was measured. The thermal resistance was calculated by the equation, thermal resistance (° C./W)=temperature difference (° C.) / Power (W). From this thermal resistance, it was calculated by the formula, thermal conductivity (W / mK) = {power (W) × thickness (m)} / {temperature difference (K) × measurement area (m 2 )}.
（３）高温下放置後の熱抵抗の測定：ポリイミドフィルム（東レ・デュポン社製商品名「カプトン」厚さ５０．８μｍ）を縦８０×横３０ｍｍにカットしたものとスライドグラス（松浪硝子工業社製商品名「Ｓ１１１１」縦７６×横２６ｍｍ、厚さ０．８ｍｍ）の間に熱伝導性材料を面積１９７６ｍｍ２、厚さ０．２ｍｍで挟み込み、大気中１３０℃雰囲気下で１００時間放置した後、再度、同銅製冷却冶具により測定した。 (3) Measurement of thermal resistance after standing at high temperature: Polyimide film (trade name “Kapton” 50.8 μm thickness manufactured by Toray DuPont) cut into 80 × 30 mm and slide glass (Matsunami Glass Industrial Co., Ltd.) The product name “S1111” is 76 × 26 mm in length and 0.8 mm in thickness, and a thermally conductive material is sandwiched in an area of 1976 mm 2 and a thickness of 0.2 mm, and left in an atmosphere at 130 ° C. for 100 hours. Measured again with the same copper cooling jig.
（４）高温高湿下放置後の熱抵抗の測定：ポリイミドフィルム（東レ・デュポン社製商品名「カプトン」厚さ５０．８μｍ）を縦８０×横３０ｍｍにカットしたものとスライドグラス（松浪硝子工業社製商品名「Ｓ１１１１」縦７６×横２６ｍｍ、厚さ０．８ｍｍ）の間に熱伝導性材料を挟み込み、１３０℃、０．１９６ＭＰａ、相対湿度８５％の雰囲気下で１００時間放置した後、再度、同銅製冷却冶具により測定した。 (4) Measurement of thermal resistance after leaving under high temperature and high humidity: Polyimide film (trade name “Kapton” 50.8 μm thickness manufactured by Toray DuPont) cut into 80 × 30 mm and slide glass (Matsunami Glass) After sandwiching a heat conductive material between the trade name “S1111” manufactured by Kogyo Co., Ltd. (76 × 26 × 0.8 mm, thickness 0.8 mm) and left in an atmosphere of 130 ° C., 0.196 MPa and relative humidity 85% for 100 hours. Measured again with the same copper cooling jig.
（５）ちょう度：ＪＩＳＫ ２２２０に基づき測定した。 (5) Consistency: Measured according to JISK 2220.
本発明の熱伝導性材料は、表４の各実施例から明らかなように、高温および高温高湿条件における熱特性の低下を抑制することができた。 As is clear from the respective examples in Table 4, the thermally conductive material of the present invention was able to suppress a decrease in thermal characteristics under high temperature and high temperature and high humidity conditions.
本発明の熱伝導性材料は、例えば、発熱性電子部品の放熱部材等として使用できる。
The heat conductive material of the present invention can be used as, for example, a heat radiating member of a heat-generating electronic component.
Claims (2)
The heat conductive material according to claim 1, wherein the alkylalkoxysilane is methoxysilane having 3 or less carbon atoms in the alkyl group or triethoxysilane having 8 carbon atoms in the alkyl group.
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