JP2011081779A5 - - Google Patents

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Publication number
JP2011081779A5
JP2011081779A5 JP2010187727A JP2010187727A JP2011081779A5 JP 2011081779 A5 JP2011081779 A5 JP 2011081779A5 JP 2010187727 A JP2010187727 A JP 2010187727A JP 2010187727 A JP2010187727 A JP 2010187727A JP 2011081779 A5 JP2011081779 A5 JP 2011081779A5
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JP
Japan
Prior art keywords
module
voltage
bmc
coupled
supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2010187727A
Other languages
English (en)
Japanese (ja)
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JP2011081779A (ja
Filing date
Publication date
Priority claimed from US12/551,116 external-priority patent/US8286009B2/en
Application filed filed Critical
Publication of JP2011081779A publication Critical patent/JP2011081779A/ja
Publication of JP2011081779A5 publication Critical patent/JP2011081779A5/ja
Withdrawn legal-status Critical Current

Links

JP2010187727A 2009-08-31 2010-08-25 キャリアボードを含むコンピュータおよび組み立て方法 Withdrawn JP2011081779A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/551,116 US8286009B2 (en) 2009-08-31 2009-08-31 Computer including a carrier board and methods of assembly

Publications (2)

Publication Number Publication Date
JP2011081779A JP2011081779A (ja) 2011-04-21
JP2011081779A5 true JP2011081779A5 (enExample) 2013-08-22

Family

ID=43066719

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010187727A Withdrawn JP2011081779A (ja) 2009-08-31 2010-08-25 キャリアボードを含むコンピュータおよび組み立て方法

Country Status (5)

Country Link
US (1) US8286009B2 (enExample)
EP (1) EP2290497A1 (enExample)
JP (1) JP2011081779A (enExample)
KR (1) KR20110023836A (enExample)
CN (1) CN102004525A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11983138B2 (en) 2015-07-26 2024-05-14 Samsung Electronics Co., Ltd. Self-configuring SSD multi-protocol support in host-less environment
TWI559155B (zh) * 2015-11-26 2016-11-21 英業達股份有限公司 輸入／輸出埠切換方法及其電子裝置及系統
US10210123B2 (en) 2016-07-26 2019-02-19 Samsung Electronics Co., Ltd. System and method for supporting multi-path and/or multi-mode NMVe over fabrics devices
US10346041B2 (en) 2016-09-14 2019-07-09 Samsung Electronics Co., Ltd. Method for using BMC as proxy NVMeoF discovery controller to provide NVM subsystems to host
US11461258B2 (en) 2016-09-14 2022-10-04 Samsung Electronics Co., Ltd. Self-configuring baseboard management controller (BMC)
US10762023B2 (en) 2016-07-26 2020-09-01 Samsung Electronics Co., Ltd. System architecture for supporting active pass-through board for multi-mode NMVe over fabrics devices
CN107977322A (zh) * 2016-10-21 2018-05-01 英业达科技有限公司 基板管理控制器外接卡、主机系统及管理主机周边构件方法
US10028402B1 (en) * 2017-03-22 2018-07-17 Seagate Technology Llc Planar expansion card assembly
EP3521954B1 (en) * 2018-02-05 2025-05-21 ABB Schweiz AG A flexible expandable automation device with hot-swappable i/o-units
CN111399613B (zh) * 2018-12-14 2023-03-03 华为技术有限公司 一种存储装置以及电子设备
CN113131613B (zh) * 2021-04-07 2023-04-07 山东英信计算机技术有限公司 一种电源管理装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6935868B1 (en) * 2004-06-29 2005-08-30 Intel Corporation Adjustable-width, dual-connector card module
US7751333B2 (en) 2004-12-29 2010-07-06 Intel Corporation Method and apparatus to couple a module to a management controller on an interconnect
US7502882B2 (en) * 2005-03-14 2009-03-10 Intel Corporation Advanced mezzanine card adapter
US7266627B2 (en) * 2005-03-23 2007-09-04 Intel Corporation Method and apparatus to couple a rear transition module to a carrier board
US20060221590A1 (en) * 2005-03-31 2006-10-05 Edoardo Campini System and method for Advanced Mezzanine Card connection
US7414837B2 (en) * 2005-11-01 2008-08-19 Adlink Technology Inc. ATCA board compatible hard disk mounting structure
US20070124529A1 (en) * 2005-11-28 2007-05-31 Carr Brian A Subrack with front and rear insertion of AMC modules
US7821790B2 (en) * 2006-03-24 2010-10-26 Slt Logic, Llc Modular chassis providing scalable mechanical, electrical and environmental functionality for MicroTCA and Advanced TCA boards
CN101202933B (zh) 2006-12-13 2010-12-08 华为技术有限公司 一种通信设备、先进夹层卡及其电源供应方法
US20080201515A1 (en) * 2007-02-20 2008-08-21 Scott Birgin Method and Systems for Interfacing With PCI-Express in an Advanced Mezannine Card (AMC) Form Factor
EP2009819A1 (en) 2007-06-26 2008-12-31 Nokia Siemens Networks Oy Advanced Mezzanine Card-module
CN101425907B (zh) 2007-10-30 2011-05-04 华为技术有限公司 通用硬件平台及相应的架构系统

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