JP2011081779A - キャリアボードを含むコンピュータおよび組み立て方法 - Google Patents

キャリアボードを含むコンピュータおよび組み立て方法 Download PDF

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Publication number
JP2011081779A
JP2011081779A JP2010187727A JP2010187727A JP2011081779A JP 2011081779 A JP2011081779 A JP 2011081779A JP 2010187727 A JP2010187727 A JP 2010187727A JP 2010187727 A JP2010187727 A JP 2010187727A JP 2011081779 A JP2011081779 A JP 2011081779A
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JP
Japan
Prior art keywords
module
voltage
carrier board
computer
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2010187727A
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English (en)
Japanese (ja)
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JP2011081779A5 (enExample
Inventor
David S Slaton
デビッド・エス・スレイトン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Abaco Systems Inc
Original Assignee
GE Fanuc Embedded Systems Inc
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Application filed by GE Fanuc Embedded Systems Inc filed Critical GE Fanuc Embedded Systems Inc
Publication of JP2011081779A publication Critical patent/JP2011081779A/ja
Publication of JP2011081779A5 publication Critical patent/JP2011081779A5/ja
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Sources (AREA)
JP2010187727A 2009-08-31 2010-08-25 キャリアボードを含むコンピュータおよび組み立て方法 Withdrawn JP2011081779A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/551,116 US8286009B2 (en) 2009-08-31 2009-08-31 Computer including a carrier board and methods of assembly

Publications (2)

Publication Number Publication Date
JP2011081779A true JP2011081779A (ja) 2011-04-21
JP2011081779A5 JP2011081779A5 (enExample) 2013-08-22

Family

ID=43066719

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010187727A Withdrawn JP2011081779A (ja) 2009-08-31 2010-08-25 キャリアボードを含むコンピュータおよび組み立て方法

Country Status (5)

Country Link
US (1) US8286009B2 (enExample)
EP (1) EP2290497A1 (enExample)
JP (1) JP2011081779A (enExample)
KR (1) KR20110023836A (enExample)
CN (1) CN102004525A (enExample)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
JP2022510800A (ja) * 2018-12-14 2022-01-28 ホアウェイ・テクノロジーズ・カンパニー・リミテッド 記憶装置及び電子デバイス

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US11983138B2 (en) 2015-07-26 2024-05-14 Samsung Electronics Co., Ltd. Self-configuring SSD multi-protocol support in host-less environment
TWI559155B (zh) * 2015-11-26 2016-11-21 英業達股份有限公司 輸入／輸出埠切換方法及其電子裝置及系統
US10210123B2 (en) 2016-07-26 2019-02-19 Samsung Electronics Co., Ltd. System and method for supporting multi-path and/or multi-mode NMVe over fabrics devices
US10346041B2 (en) 2016-09-14 2019-07-09 Samsung Electronics Co., Ltd. Method for using BMC as proxy NVMeoF discovery controller to provide NVM subsystems to host
US11461258B2 (en) 2016-09-14 2022-10-04 Samsung Electronics Co., Ltd. Self-configuring baseboard management controller (BMC)
US10762023B2 (en) 2016-07-26 2020-09-01 Samsung Electronics Co., Ltd. System architecture for supporting active pass-through board for multi-mode NMVe over fabrics devices
CN107977322A (zh) * 2016-10-21 2018-05-01 英业达科技有限公司 基板管理控制器外接卡、主机系统及管理主机周边构件方法
US10028402B1 (en) * 2017-03-22 2018-07-17 Seagate Technology Llc Planar expansion card assembly
EP3521954B1 (en) * 2018-02-05 2025-05-21 ABB Schweiz AG A flexible expandable automation device with hot-swappable i/o-units
CN113131613B (zh) * 2021-04-07 2023-04-07 山东英信计算机技术有限公司 一种电源管理装置

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US6935868B1 (en) * 2004-06-29 2005-08-30 Intel Corporation Adjustable-width, dual-connector card module
US7751333B2 (en) 2004-12-29 2010-07-06 Intel Corporation Method and apparatus to couple a module to a management controller on an interconnect
US7502882B2 (en) * 2005-03-14 2009-03-10 Intel Corporation Advanced mezzanine card adapter
US7266627B2 (en) * 2005-03-23 2007-09-04 Intel Corporation Method and apparatus to couple a rear transition module to a carrier board
US20060221590A1 (en) * 2005-03-31 2006-10-05 Edoardo Campini System and method for Advanced Mezzanine Card connection
US7414837B2 (en) * 2005-11-01 2008-08-19 Adlink Technology Inc. ATCA board compatible hard disk mounting structure
US20070124529A1 (en) * 2005-11-28 2007-05-31 Carr Brian A Subrack with front and rear insertion of AMC modules
US7821790B2 (en) * 2006-03-24 2010-10-26 Slt Logic, Llc Modular chassis providing scalable mechanical, electrical and environmental functionality for MicroTCA and Advanced TCA boards
CN101202933B (zh) 2006-12-13 2010-12-08 华为技术有限公司 一种通信设备、先进夹层卡及其电源供应方法
US20080201515A1 (en) * 2007-02-20 2008-08-21 Scott Birgin Method and Systems for Interfacing With PCI-Express in an Advanced Mezannine Card (AMC) Form Factor
EP2009819A1 (en) 2007-06-26 2008-12-31 Nokia Siemens Networks Oy Advanced Mezzanine Card-module
CN101425907B (zh) 2007-10-30 2011-05-04 华为技术有限公司 通用硬件平台及相应的架构系统

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022510800A (ja) * 2018-12-14 2022-01-28 ホアウェイ・テクノロジーズ・カンパニー・リミテッド 記憶装置及び電子デバイス
JP7207812B2 (ja) 2018-12-14 2023-01-18 ホアウェイ・テクノロジーズ・カンパニー・リミテッド 記憶装置及び電子デバイス
US11699061B2 (en) 2018-12-14 2023-07-11 Huawei Technologies Co., Ltd. Storage apparatus and electronic device

Also Published As

Publication number Publication date
EP2290497A1 (en) 2011-03-02
CN102004525A (zh) 2011-04-06
KR20110023836A (ko) 2011-03-08
US8286009B2 (en) 2012-10-09
US20110055595A1 (en) 2011-03-03

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