CN102004525A - 包括载板的计算机和组装方法 - Google Patents

包括载板的计算机和组装方法 Download PDF

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Publication number
CN102004525A
CN102004525A CN2010102774579A CN201010277457A CN102004525A CN 102004525 A CN102004525 A CN 102004525A CN 2010102774579 A CN2010102774579 A CN 2010102774579A CN 201010277457 A CN201010277457 A CN 201010277457A CN 102004525 A CN102004525 A CN 102004525A
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China
Prior art keywords
module
voltage
support plate
coupled
computing machine
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Pending
Application number
CN2010102774579A
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English (en)
Chinese (zh)
Inventor
D·S·斯拉顿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Abaco Systems Inc
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GE Fanuc Embedded Systems Inc
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Filing date
Publication date
Application filed by GE Fanuc Embedded Systems Inc filed Critical GE Fanuc Embedded Systems Inc
Publication of CN102004525A publication Critical patent/CN102004525A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Sources (AREA)
CN2010102774579A 2009-08-31 2010-08-31 包括载板的计算机和组装方法 Pending CN102004525A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/551,116 US8286009B2 (en) 2009-08-31 2009-08-31 Computer including a carrier board and methods of assembly
US12/551116 2009-08-31

Publications (1)

Publication Number Publication Date
CN102004525A true CN102004525A (zh) 2011-04-06

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ID=43066719

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010102774579A Pending CN102004525A (zh) 2009-08-31 2010-08-31 包括载板的计算机和组装方法

Country Status (5)

Country Link
US (1) US8286009B2 (enExample)
EP (1) EP2290497A1 (enExample)
JP (1) JP2011081779A (enExample)
KR (1) KR20110023836A (enExample)
CN (1) CN102004525A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11983138B2 (en) 2015-07-26 2024-05-14 Samsung Electronics Co., Ltd. Self-configuring SSD multi-protocol support in host-less environment
TWI559155B (zh) * 2015-11-26 2016-11-21 英業達股份有限公司 輸入／輸出埠切換方法及其電子裝置及系統
US10346041B2 (en) 2016-09-14 2019-07-09 Samsung Electronics Co., Ltd. Method for using BMC as proxy NVMeoF discovery controller to provide NVM subsystems to host
US10210123B2 (en) 2016-07-26 2019-02-19 Samsung Electronics Co., Ltd. System and method for supporting multi-path and/or multi-mode NMVe over fabrics devices
US11461258B2 (en) 2016-09-14 2022-10-04 Samsung Electronics Co., Ltd. Self-configuring baseboard management controller (BMC)
US10762023B2 (en) 2016-07-26 2020-09-01 Samsung Electronics Co., Ltd. System architecture for supporting active pass-through board for multi-mode NMVe over fabrics devices
CN107977322A (zh) * 2016-10-21 2018-05-01 英业达科技有限公司 基板管理控制器外接卡、主机系统及管理主机周边构件方法
US10028402B1 (en) * 2017-03-22 2018-07-17 Seagate Technology Llc Planar expansion card assembly
EP3521954B1 (en) * 2018-02-05 2025-05-21 ABB Schweiz AG A flexible expandable automation device with hot-swappable i/o-units
CN111399613B (zh) * 2018-12-14 2023-03-03 华为技术有限公司 一种存储装置以及电子设备
CN113131613B (zh) * 2021-04-07 2023-04-07 山东英信计算机技术有限公司 一种电源管理装置

Citations (3)

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Publication number Priority date Publication date Assignee Title
US7266627B2 (en) * 2005-03-23 2007-09-04 Intel Corporation Method and apparatus to couple a rear transition module to a carrier board
CN101202933A (zh) * 2006-12-13 2008-06-18 华为技术有限公司 一种通信设备、先进夹层卡及其电源供应方法
WO2009056020A1 (fr) * 2007-10-30 2009-05-07 Huawei Technologies Co., Ltd. Plateforme matérielle générale, système à architecture correspondante, et procédé d'alimentation électrique pour carte mezzanine avancée

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US6935868B1 (en) 2004-06-29 2005-08-30 Intel Corporation Adjustable-width, dual-connector card module
US7751333B2 (en) 2004-12-29 2010-07-06 Intel Corporation Method and apparatus to couple a module to a management controller on an interconnect
US7502882B2 (en) 2005-03-14 2009-03-10 Intel Corporation Advanced mezzanine card adapter
US20060221590A1 (en) 2005-03-31 2006-10-05 Edoardo Campini System and method for Advanced Mezzanine Card connection
US7414837B2 (en) 2005-11-01 2008-08-19 Adlink Technology Inc. ATCA board compatible hard disk mounting structure
US20070124529A1 (en) 2005-11-28 2007-05-31 Carr Brian A Subrack with front and rear insertion of AMC modules
WO2007112109A2 (en) 2006-03-24 2007-10-04 Slt Logic Llc Modular chassis providing scalable mechanical, electrical and environmental functionality for microtca and advanced tca boards
US20080201515A1 (en) 2007-02-20 2008-08-21 Scott Birgin Method and Systems for Interfacing With PCI-Express in an Advanced Mezannine Card (AMC) Form Factor
EP2009819A1 (en) 2007-06-26 2008-12-31 Nokia Siemens Networks Oy Advanced Mezzanine Card-module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7266627B2 (en) * 2005-03-23 2007-09-04 Intel Corporation Method and apparatus to couple a rear transition module to a carrier board
CN101202933A (zh) * 2006-12-13 2008-06-18 华为技术有限公司 一种通信设备、先进夹层卡及其电源供应方法
WO2009056020A1 (fr) * 2007-10-30 2009-05-07 Huawei Technologies Co., Ltd. Plateforme matérielle générale, système à architecture correspondante, et procédé d'alimentation électrique pour carte mezzanine avancée

Also Published As

Publication number Publication date
US20110055595A1 (en) 2011-03-03
JP2011081779A (ja) 2011-04-21
EP2290497A1 (en) 2011-03-02
KR20110023836A (ko) 2011-03-08
US8286009B2 (en) 2012-10-09

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