WO2014059909A3 - 数据中心模块及由微模块组成的数据中心 - Google Patents

数据中心模块及由微模块组成的数据中心 Download PDF

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Publication number
WO2014059909A3
WO2014059909A3 PCT/CN2013/085174 CN2013085174W WO2014059909A3 WO 2014059909 A3 WO2014059909 A3 WO 2014059909A3 CN 2013085174 W CN2013085174 W CN 2013085174W WO 2014059909 A3 WO2014059909 A3 WO 2014059909A3
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WO
WIPO (PCT)
Prior art keywords
data center
modules
module
information technology
technology equipment
Prior art date
Application number
PCT/CN2013/085174
Other languages
English (en)
French (fr)
Other versions
WO2014059909A2 (zh
Inventor
朱利伟
李典林
杨晓伟
朱华
徐文鹏
Original Assignee
腾讯科技（深圳）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 腾讯科技（深圳）有限公司 filed Critical 腾讯科技（深圳）有限公司
Publication of WO2014059909A2 publication Critical patent/WO2014059909A2/zh
Priority to US14/682,972 priority Critical patent/US9814162B2/en
Publication of WO2014059909A3 publication Critical patent/WO2014059909A3/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/30—Means for acting in the event of power-supply failure or interruption, e.g. power-supply fluctuations
    • G06F1/305—Means for acting in the event of power-supply failure or interruption, e.g. power-supply fluctuations in the event of power-supply fluctuations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1497—Rooms for data centers; Shipping containers therefor

Abstract

一种数据中心微模块，包括：壳体及所述壳体内的机柜系统、供电系统及冷却系统；所述机柜系统用安装信息设备，所述供电系统用于给所述信息设备及所述冷却系统供应电力，所述冷却系统用于对所述信息设备进行冷却；所述壳体外还具有用于与其他数据中心模块或者连接装置连接的接口。上述的数据中心模块将供电系统、冷却系统及信息设备整合于同一个模块中，从而可在工厂中直接加工，在建立数据中心将数据中心模块组合拼装即可，极大程度减少据中心建设周期，还可根据具体的部署要求灵活改变硬件架构，降低了数据中心的建设成本。此外，本发明还提供一种由上述数据中心模块拼装的数据中心。
PCT/CN2013/085174 2012-10-15 2013-10-14 数据中心模块及由微模块组成的数据中心 WO2014059909A2 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/682,972 US9814162B2 (en) 2012-10-15 2015-04-09 Data center micro-module and data center formed by micro-modules

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201210388782.1A CN103729328A (zh) 2012-10-15 2012-10-15 数据中心模块及由微模块组成的数据中心
CN201210388782.1 2012-10-15

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/682,972 Continuation US9814162B2 (en) 2012-10-15 2015-04-09 Data center micro-module and data center formed by micro-modules

Publications (2)

Publication Number Publication Date
WO2014059909A2 WO2014059909A2 (zh) 2014-04-24
WO2014059909A3 true WO2014059909A3 (zh) 2016-05-12

Family

ID=50453408

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PCT/CN2013/085174 WO2014059909A2 (zh) 2012-10-15 2013-10-14 数据中心模块及由微模块组成的数据中心

Country Status (3)

Country Link
US (1) US9814162B2 (zh)
CN (1) CN103729328A (zh)
WO (1) WO2014059909A2 (zh)

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CN105376986B (zh) * 2014-07-16 2018-01-02 阿里巴巴集团控股有限公司 模块化数据中心
CN105528667A (zh) * 2014-10-24 2016-04-27 中兴通讯股份有限公司 一种微模块管理的方法、装置及系统
US20180213669A1 (en) * 2015-07-10 2018-07-26 Prasad Lalathuputhanpura KOCHUKUNJU Micro data center (mdc) in a box system and method thereof
US10517194B2 (en) * 2016-01-20 2019-12-24 Dell Products L.P. Changing air flow direction on air-cooled electronic devices
CN107680004A (zh) * 2017-07-17 2018-02-09 国网浙江海盐县供电公司 微模块式数据中心及资源管理方法
CN108601312B (zh) * 2018-06-25 2023-08-04 中国科学院电工研究所 一种绿色节能微模块数据中心
CN112737803A (zh) * 2019-10-28 2021-04-30 中国信息通信研究院 一种微模块数据中心监控方法和系统
CN113490392A (zh) * 2021-06-18 2021-10-08 杭州华宏通信设备有限公司 一种冷却节能的智能化dc舱
CN117279343B (zh) * 2023-11-22 2024-01-30 湖南省康普通信技术有限责任公司 一种微模块数据中心
CN117295282B (zh) * 2023-11-27 2024-01-30 湖南省康普通信技术有限责任公司 一种可扩展式的微模块数据中心

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Also Published As

Publication number Publication date
CN103729328A (zh) 2014-04-16
WO2014059909A2 (zh) 2014-04-24
US9814162B2 (en) 2017-11-07
US20150359144A1 (en) 2015-12-10

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