JP2011058027A - 電解銅粉の集合体及び該電解銅粉の製造方法 - Google Patents
電解銅粉の集合体及び該電解銅粉の製造方法 Download PDFInfo
- Publication number
- JP2011058027A JP2011058027A JP2009206209A JP2009206209A JP2011058027A JP 2011058027 A JP2011058027 A JP 2011058027A JP 2009206209 A JP2009206209 A JP 2009206209A JP 2009206209 A JP2009206209 A JP 2009206209A JP 2011058027 A JP2011058027 A JP 2011058027A
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic copper
- copper powder
- electrolytic
- aggregate
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 189
- 238000000034 method Methods 0.000 title abstract description 11
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 19
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 19
- 239000011593 sulfur Substances 0.000 claims abstract description 19
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 19
- 229910000365 copper sulfate Inorganic materials 0.000 claims abstract description 18
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims abstract description 18
- 239000000243 solution Substances 0.000 claims abstract description 13
- 239000008151 electrolyte solution Substances 0.000 claims description 41
- 238000004519 manufacturing process Methods 0.000 claims description 37
- 229910052802 copper Inorganic materials 0.000 claims description 36
- 239000010949 copper Substances 0.000 claims description 36
- 239000000843 powder Substances 0.000 claims description 24
- 239000002245 particle Substances 0.000 claims description 23
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 claims description 15
- PBYZMCDFOULPGH-UHFFFAOYSA-N tungstate Chemical compound [O-][W]([O-])(=O)=O PBYZMCDFOULPGH-UHFFFAOYSA-N 0.000 claims description 14
- 238000005169 Debye-Scherrer Methods 0.000 claims description 13
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 10
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 claims description 5
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 5
- HTKFORQRBXIQHD-UHFFFAOYSA-N allylthiourea Chemical compound NC(=S)NCC=C HTKFORQRBXIQHD-UHFFFAOYSA-N 0.000 claims description 5
- 229960001748 allylthiourea Drugs 0.000 claims description 5
- 150000003566 thiocarboxylic acids Chemical class 0.000 claims description 5
- GNVMUORYQLCPJZ-UHFFFAOYSA-M Thiocarbamate Chemical compound NC([S-])=O GNVMUORYQLCPJZ-UHFFFAOYSA-M 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 abstract description 14
- 239000003792 electrolyte Substances 0.000 abstract description 11
- 210000001787 dendrite Anatomy 0.000 abstract description 7
- 230000001376 precipitating effect Effects 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 24
- 230000000052 comparative effect Effects 0.000 description 18
- 238000005452 bending Methods 0.000 description 16
- 238000000465 moulding Methods 0.000 description 16
- 239000000654 additive Substances 0.000 description 10
- 239000013078 crystal Substances 0.000 description 10
- 238000000151 deposition Methods 0.000 description 10
- 230000000996 additive effect Effects 0.000 description 8
- 238000007796 conventional method Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000007873 sieving Methods 0.000 description 6
- -1 aromatic azo compound Chemical class 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 description 4
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- 238000004220 aggregation Methods 0.000 description 4
- 230000002776 aggregation Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- BQJTUDIVKSVBDU-UHFFFAOYSA-L copper;sulfuric acid;sulfate Chemical compound [Cu+2].OS(O)(=O)=O.[O-]S([O-])(=O)=O BQJTUDIVKSVBDU-UHFFFAOYSA-L 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052700 potassium Inorganic materials 0.000 description 4
- 239000011591 potassium Substances 0.000 description 4
- 238000004663 powder metallurgy Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229920002907 Guar gum Polymers 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000002783 friction material Substances 0.000 description 2
- 229960002154 guar gum Drugs 0.000 description 2
- 235000010417 guar gum Nutrition 0.000 description 2
- 239000000665 guar gum Substances 0.000 description 2
- PZOUSPYUWWUPPK-UHFFFAOYSA-N indole Natural products CC1=CC=CC2=C1C=CN2 PZOUSPYUWWUPPK-UHFFFAOYSA-N 0.000 description 2
- RKJUIXBNRJVNHR-UHFFFAOYSA-N indolenine Natural products C1=CC=C2CC=NC2=C1 RKJUIXBNRJVNHR-UHFFFAOYSA-N 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- NMHMDUCCVHOJQI-UHFFFAOYSA-N lithium molybdate Chemical compound [Li+].[Li+].[O-][Mo]([O-])(=O)=O NMHMDUCCVHOJQI-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- OARRHUQTFTUEOS-UHFFFAOYSA-N safranin Chemical compound [Cl-].C=12C=C(N)C(C)=CC2=NC2=CC(C)=C(N)C=C2[N+]=1C1=CC=CC=C1 OARRHUQTFTUEOS-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 235000015393 sodium molybdate Nutrition 0.000 description 2
- 239000011684 sodium molybdate Substances 0.000 description 2
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 description 2
- XMVONEAAOPAGAO-UHFFFAOYSA-N sodium tungstate Chemical compound [Na+].[Na+].[O-][W]([O-])(=O)=O XMVONEAAOPAGAO-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 2
- DLLMHEDYJQACRM-UHFFFAOYSA-N 2-(carboxymethyldisulfanyl)acetic acid Chemical compound OC(=O)CSSCC(O)=O DLLMHEDYJQACRM-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 150000004657 carbamic acid derivatives Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 150000003558 thiocarbamic acid derivatives Chemical class 0.000 description 1
- CMPGARWFYBADJI-UHFFFAOYSA-L tungstic acid Chemical compound O[W](O)(=O)=O CMPGARWFYBADJI-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Electrolytic Production Of Metals (AREA)
- Powder Metallurgy (AREA)
Abstract
【解決手段】電解銅粉自体の強度を増して高い強度に成形できる電解銅粉を析出するために電解銅粉を構成する結晶子のサイズを微細化させることを目的として、電解液に電流を流すことによって電解銅粉を析出させる電解銅粉の製造方法において、前記電解液が硫酸銅水溶液中にタングステン酸塩、モリブデン酸塩及び硫黄含有有機化合物から選択される一種又は二種以上を添加する。
【選択図】 図1
Description
β=b−B
L=Kλ/βcosθ
2 入射X線
3 反射X線
β=b−B
L=Kλ/βcosθ
2 入射X線
3 反射X線
Claims (4)
- シェラー法を用いて面指数(200)の回折線に基づき測定した結晶子の平均粒径が20〜100nmであることを特徴とする電解銅粉。
- 請求項1記載の電解銅粉を含む電解銅粉の集合体であって、見掛け密度が0.60〜1.80g/cm3 であることを特徴とする電解銅粉の集合体。
- 電解液に電流を流すことによって電解銅粉を析出させる電解銅粉の製造方法において、前記電解液が硫酸銅水溶液中にタングステン酸塩、モリブデン酸塩及び硫黄含有有機化合物から選択される一種又は二種以上が添加されているものであることを特徴とする電解銅粉の製造方法。
- 硫黄含有有機化合物がチオ尿素、アリルチオ尿素、メルカプトアルキルスルホン酸、ジスルフィド、チオカルボン酸アミド及びチオカルバメートから選択される一種又は二種以上のものである請求項2乃至4のいずれかに記載の電解銅粉の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009206209A JP4697643B2 (ja) | 2009-09-07 | 2009-09-07 | 電解銅粉の集合体及び該電解銅粉の製造方法 |
CN2010101807715A CN102009169A (zh) | 2009-09-07 | 2010-05-14 | 电解铜粉以及该电解铜粉的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009206209A JP4697643B2 (ja) | 2009-09-07 | 2009-09-07 | 電解銅粉の集合体及び該電解銅粉の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011058027A true JP2011058027A (ja) | 2011-03-24 |
JP4697643B2 JP4697643B2 (ja) | 2011-06-08 |
Family
ID=43839603
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009206209A Active JP4697643B2 (ja) | 2009-09-07 | 2009-09-07 | 電解銅粉の集合体及び該電解銅粉の製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4697643B2 (ja) |
CN (1) | CN102009169A (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016089199A (ja) * | 2014-10-31 | 2016-05-23 | 住友金属鉱山株式会社 | 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート |
KR20170003639A (ko) | 2014-07-07 | 2017-01-09 | 스미토모 긴조쿠 고잔 가부시키가이샤 | 동분 및 그것을 이용한 도전성 페이스트, 도전성 도료, 도전성 시트, 대전 방지 도료 |
KR20170003634A (ko) | 2014-06-25 | 2017-01-09 | 스미토모 긴조쿠 고잔 가부시키가이샤 | 동분 및 그것을 이용한 동페이스트, 도전성 도료, 도전성 시트 |
KR20170031215A (ko) | 2014-09-12 | 2017-03-20 | 스미토모 긴조쿠 고잔 가부시키가이샤 | 은코팅 동분 및 그것을 이용한 도전성 페이스트, 도전성 도료, 도전성 시트 |
JP2018168445A (ja) * | 2017-03-30 | 2018-11-01 | タツタ電線株式会社 | 塩化銀被覆粒子 |
US10654101B2 (en) | 2015-05-15 | 2020-05-19 | Sumitomo Metal Mining Co., Ltd. | Silver-coated copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing silver-coated copper powder |
US10695830B2 (en) | 2015-05-15 | 2020-06-30 | Sumitomo Metal Mining Co., Ltd. | Copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing copper powder |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5320442B2 (ja) * | 2011-07-13 | 2013-10-23 | 三井金属鉱業株式会社 | デンドライト状銅粉 |
CN105705276B (zh) * | 2014-02-14 | 2018-01-19 | 三井金属矿业株式会社 | 铜粉 |
EP3187279A4 (en) | 2014-08-26 | 2018-04-18 | Sumitomo Metal Mining Co., Ltd. | Silver-coated copper powder, and conductive paste, conductive coating material and conductive sheet each of which uses same |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1994024334A1 (en) * | 1993-04-19 | 1994-10-27 | Magma Copper Company | Process for making copper metal powder, copper oxides and copper foil |
WO2004094700A1 (ja) * | 2003-02-18 | 2004-11-04 | Shinshu University | 金属粒子およびその製造方法 |
JP2008231564A (ja) * | 2007-03-23 | 2008-10-02 | Furukawa Electric Co Ltd:The | 銅微粒子の製造方法 |
JP2008285764A (ja) * | 1994-03-14 | 2008-11-27 | Umicore Ag & Co Kg | 高分散性金属コロイドの調製方法としての金属塩の電気化学的還元ならびに金属塩の電気化学的還元による基材に固定された金属クラスター |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10110298A (ja) * | 1996-10-08 | 1998-04-28 | Japan Energy Corp | 電解液の浄化方法 |
JP3794613B2 (ja) * | 2000-05-18 | 2006-07-05 | 三井金属鉱業株式会社 | 電解銅箔の電解装置 |
CN1320672C (zh) * | 2005-07-25 | 2007-06-06 | 北京中科天华科技发展有限公司 | 一种适用于锂离子电池的纳米电解铜箔的制备方法 |
CN101275242A (zh) * | 2007-12-20 | 2008-10-01 | 金川集团有限公司 | 一种生产铜始极片的电解液添加剂及使用方法 |
-
2009
- 2009-09-07 JP JP2009206209A patent/JP4697643B2/ja active Active
-
2010
- 2010-05-14 CN CN2010101807715A patent/CN102009169A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1994024334A1 (en) * | 1993-04-19 | 1994-10-27 | Magma Copper Company | Process for making copper metal powder, copper oxides and copper foil |
JP2008285764A (ja) * | 1994-03-14 | 2008-11-27 | Umicore Ag & Co Kg | 高分散性金属コロイドの調製方法としての金属塩の電気化学的還元ならびに金属塩の電気化学的還元による基材に固定された金属クラスター |
WO2004094700A1 (ja) * | 2003-02-18 | 2004-11-04 | Shinshu University | 金属粒子およびその製造方法 |
JP2008231564A (ja) * | 2007-03-23 | 2008-10-02 | Furukawa Electric Co Ltd:The | 銅微粒子の製造方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170003634A (ko) | 2014-06-25 | 2017-01-09 | 스미토모 긴조쿠 고잔 가부시키가이샤 | 동분 및 그것을 이용한 동페이스트, 도전성 도료, 도전성 시트 |
CN106457386A (zh) * | 2014-06-25 | 2017-02-22 | 住友金属矿山株式会社 | 铜粉及使用其的铜膏、导电性涂料、导电性片材 |
KR20170003639A (ko) | 2014-07-07 | 2017-01-09 | 스미토모 긴조쿠 고잔 가부시키가이샤 | 동분 및 그것을 이용한 도전성 페이스트, 도전성 도료, 도전성 시트, 대전 방지 도료 |
KR20170031215A (ko) | 2014-09-12 | 2017-03-20 | 스미토모 긴조쿠 고잔 가부시키가이샤 | 은코팅 동분 및 그것을 이용한 도전성 페이스트, 도전성 도료, 도전성 시트 |
JP2016089199A (ja) * | 2014-10-31 | 2016-05-23 | 住友金属鉱山株式会社 | 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート |
US10654101B2 (en) | 2015-05-15 | 2020-05-19 | Sumitomo Metal Mining Co., Ltd. | Silver-coated copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing silver-coated copper powder |
US10695830B2 (en) | 2015-05-15 | 2020-06-30 | Sumitomo Metal Mining Co., Ltd. | Copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing copper powder |
JP2018168445A (ja) * | 2017-03-30 | 2018-11-01 | タツタ電線株式会社 | 塩化銀被覆粒子 |
Also Published As
Publication number | Publication date |
---|---|
JP4697643B2 (ja) | 2011-06-08 |
CN102009169A (zh) | 2011-04-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4697643B2 (ja) | 電解銅粉の集合体及び該電解銅粉の製造方法 | |
Zhang et al. | Silver nanowires: Synthesis technologies, growth mechanism and multifunctional applications | |
Li et al. | Electro-codeposition of Ni-SiO2 nanocomposite coatings from deep eutectic solvent with improved corrosion resistance | |
Avramović et al. | Correlation between crystal structure and morphology of potentiostatically electrodeposited silver dendritic nanostructures | |
Nikolić et al. | Comparative morphological and crystallographic analysis of copper powders obtained under different electrolysis conditions | |
Yang et al. | Effective inhibition of zinc dendrites during electrodeposition using thiourea derivatives as additives | |
Al-Salman et al. | Facile synthesis of micrometer-long antimony nanowires by template-free electrodeposition for next generation Li-ion batteries | |
Genovese et al. | Electrochemical deposition of Ag2Se nanostructures | |
Ye et al. | Nucleation and growth mechanism of electrodeposited Ni− W alloy | |
De Sa et al. | Electrodeposition of gold thin films from 1-butyl-1-methylpyrrolidinium dicyanamide Au3+ solutions | |
Rafailović et al. | Synthesis and characterization of electrodeposited hierarchical nanodendritic NiCoFe alloy powders | |
JPWO2004094700A1 (ja) | 金属粒子およびその製造方法 | |
JP5376109B2 (ja) | 銀微粒子の製造方法 | |
Pavlović et al. | Correlation between crystal orientation and morphology of electrolytically produced powder particles: analysis of the limiting cases | |
Shetty et al. | Electrofabrication of Ni-Co-CNT composite coatings for hydrogen energy | |
Arenas Esteban et al. | 3D characterization of the structural transformation undergone by Cu@ Ag core–shell nanoparticles following CO2 reduction reaction | |
Raja | Production of copper nanoparticles by electrochemical process | |
CN1544707A (zh) | 复合电沉积制备镍基纳米碳管复合材料的方法 | |
Mathur et al. | Effect of electrodeposition parameters on morphology of copper thin films | |
Avramović et al. | The particle size distribution (PSD) as criteria for comparison of silver powders obtained by different methods of synthesis and by conditions of electrolysis | |
JP2004360006A (ja) | 金メッキ液および金メッキ方法 | |
RU2420613C1 (ru) | Способ получения электролитических порошков металлов | |
JP5737677B2 (ja) | 多孔質アルミニウム材料の製造方法 | |
Wojtaszek et al. | ElEctrochEmical mEthod of coppEr powdEr SynthESiS on rotating ElEctrodE in thE prESEncE of SurfactantS | |
Haider et al. | Synthesis of silver nanoparticles by electrochemical method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110208 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110218 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4697643 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |