JP2011054588A - 半導体装置およびその製造方法 - Google Patents
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Abstract
【解決手段】半導体チップ5と、前記半導体チップと電気的に接続された、金属を主構成材料とする複数のリード3と、前記半導体チップを封止する封止体2とを備えた半導体装置において、リード3と封止封止体(モールド封止体)の密着性を向上させるため、リード3の表面材料と封止体2の組合せとして、格子整合性の良い材料の組合せを用い、アセン類を主構材料とする封止体2を用いる。
【選択図】 図1
Description
(1)半導体チップと、前記半導体チップと電気的に接続された、金属を主構成材料とす る複数のリードと、前記半導体チップを封止する封止体とを備えた半導体装置におい て、前記封止体としてアセン類をマトリックス有機物とする材料を用いることが有効 である。
(2)半導体チップと、前記半導体チップと電気的に接続された、金属を主構成材料とす る複数のリードと、前記半導体チップを封止する封止体とを備えた半導体装置におい て、前記封止体としてテトラセン,ペンタセン,ヘキサセンの群から選ばれる少なく ともひとつのアセン類をマトリックス有機物とする材料を用いることが有効である。
(3)半導体チップと、前記半導体チップと電気的に接続された、金属を主構成材料とす る複数のリードと、前記半導体チップを封止する封止体とを備えた半導体装置におい て、前記封止体としてテトラセン,ペンタセン,ヘキサセンの群から選ばれる少なく ともひとつのアセン類をマトリックス有機物とする材料を用い、前記封止体に無機セ ラミックス粉末をフィラー(充填材)として含有させることが有効である。
(4)半導体チップと、前記半導体チップと電気的に接続された、金属を主構成材料とす る複数のリードと、前記半導体チップを封止する封止体とを備えた半導体装置におい て、前記封止体としてテトラセン,ペンタセン,ヘキサセンの群から選ばれる少なく ともひとつのアセン類をマトリックス有機物とする材料を用い、前記封止体に窒化ホ ウ素,窒化アルミニウムの群から選ばれる少なくともひとつからなる無機セラミック ス粉末をフィラー(充填材)として含有させることが有効である。
(5)半導体チップと、前記半導体チップと電気的に接続された、金属を主構成材料とす る複数のリードと、前記半導体チップを封止する封止体とを備えた半導体装置におい て、前記封止体としてテトラセン,ペンタセン,ヘキサセンの群から選ばれる少なく ともひとつのアセン類をマトリックス有機物とする材料を用い、前記アセン類が持つ CHのボンドのうち12%以上85%以下をCOOH,COH,CNH2,CSに置 き換え、前記封止体に窒化ホウ素,窒化アルミニウムの群から選ばれる少なくともひ とつからなる無機セラミックス粉末をフィラー(充填材)として含有させることがさ らに有効である。
(6)半導体チップと、前記半導体チップと電気的に接続された、金属を主構成材料とす る複数のリードと、前記半導体チップを封止する封止体とを備え、前記複数のリード のそれぞれの一部が前記封止体から露出するアウターリード部分と封止体に埋め込ま れたインナーリード部分を有する半導体装置において、前記封止体としてテトラセン ,ペンタセン,ヘキサセンの群から選ばれる少なくともひとつのアセン類をマトリッ クス有機物とする材料を用い、前記アセン類が持つCHのボンドのうち12%以上8 5%以下をCOOH,COH,CNH2,CSに置き換え、前記封止体に窒化ホウ素 ,窒化アルミニウムの群から選ばれる少なくともひとつからなる無機セラミックス粉 末をフィラー(充填材)として含有させ、さらに前記封止体にエポキシ樹脂,ポリエ ステル樹脂,フェノール樹脂,アクリル樹脂の群から選ばれる少なくともひとつから なる樹脂を添加物として含有させ、前記インナーリード部分の表面材料に銅またはパ ラジウムを主構成材料とする材料を用いることがさらに有効である。
ドとリードとを接続する。
2,24 封止体
3,26 リード
3a アウターリード
3b インナーリード
4 タブ
5,20a 半導体チップ
5a ボンディングパッド
6,23 ワイヤ
10,15 めっき膜
20 半導体ウェハ
21 ブレード
22 リードフレーム
201 マトリックス有機物
202 セラミックス粉末
a,b,c 結晶軸
L,P 間隔
Claims (13)
- 半導体チップと、前記半導体チップと電気的に接続された、金属を主構成材料とする複数のリードと、前記半導体チップを封止する封止体とを備えた半導体装置において、前記封止体がアセン類をマトリックス材料とすることを特徴とする半導体装置。
- 前記封止体が、テトラセン,ペンタセン,ヘキサセンの群から選ばれる少なくともひとつのアセン類をマトリックス材料とすることを特徴とする請求項1記載の半導体装置。
- 前記封止体が、無機セラミックス粉末をフィラーとして含有することを特徴とする請求項2記載の半導体装置。
- 前記封止体が、窒化ホウ素,窒化アルミニウムの群から選ばれる少なくともひとつからなる無機セラミックス粉末をフィラーとして含有することを特徴とする請求項3記載の半導体装置。
- 前記アセンが持つCHのボンドのうち12%以上85%以下がCOOH,COH,CNH2,CSに置き換えることを特徴とする請求項4記載の半導体装置。
- 前記封止体が、エポキシ樹脂,ポリエステル樹脂,フェノール樹脂,アクリル樹脂の群から選ばれる少なくともひとつからなる樹脂を添加物として含有することを特徴とする請求項5記載の半導体装置。
- 半導体チップと、前記半導体チップと電気的に接続された、金属を主構成材料とする複数のリードと、前記半導体チップを封止する封止体とを備えた半導体装置において、前記封止体がアセン類を主構成材料とし、前記複数のリードのそれぞれの一部が前記封止体から露出するアウターリード部分と封止体に埋め込まれたインナーリード部分を有し、かつ前記インナーリード部分の表面材料が銅またはパラジウムを主構成材料とすることを特徴とする半導体装置。
- 前記封止体が、テトラセン,ペンタセン,ヘキサセンの群から選ばれる少なくともひとつのアセン類をマトリックス材料とすることを特徴とする請求項7記載の半導体装置。
- 前記封止体が、無機セラミックス粉末をフィラーとして含有することを特徴とする請求項8記載の半導体装置。
- 前記封止体が、窒化ホウ素,窒化アルミニウムの群から選ばれる少なくともひとつからなる無機セラミックス粉末をフィラーとして含有することを特徴とする請求項9記載の半導体装置。
- 前記アセン類が持つCHのボンドのうち12%以上85%以下がCOOH,COH,CNH2,CSに置き換えることを特徴とする請求項10記載の半導体装置。
- 前記封止体が、エポキシ樹脂,ポリエステル樹脂,フェノール樹脂,アクリル樹脂の群から選ばれる少なくともひとつからなる樹脂を添加物として含有することを特徴とする請求項11記載の半導体装置。
- (a)金属を主構成材料とするリードフレームを用意する工程と、
(b)前記リードフレームに形成されている複数のリードの表面に、銅またはパラジウムを主構成材料とするめっき膜を35℃以上で形成する工程と、
(c)前記リードフレームのタブ上に半導体チップを搭載する工程と、
(d)前記半導体チップと、前記リードフレームに形成されている前記複数のリードと
をワイヤで接続する工程と、
(e)前記半導体チップの周囲に、アセン類をマトリックス材料とする封止体が溶けた1,2,4−トリクロロベンゼンまたは3,4−ジクロロトルエンを塗布する工程と、
(f)180〜200℃の温度で加熱して封止体を形成する工程と、
(g)前記リードフレームを切断して前記封止体を個片化する工程とを備え、
前記アセン類がテトラセン,ペンタセン,ヘキサセンの群から選ばれる少なくともひとつであることを特徴とする半導体装置の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009199189A JP5341679B2 (ja) | 2009-08-31 | 2009-08-31 | 半導体装置 |
CN2010102547170A CN102005418B (zh) | 2009-08-31 | 2010-08-11 | 半导体装置及其制造方法 |
KR1020100080142A KR20110023761A (ko) | 2009-08-31 | 2010-08-19 | 반도체 장치 및 그 제조 방법 |
US12/805,834 US8653650B2 (en) | 2009-08-31 | 2010-08-20 | Semiconductor device with acene heat spreader |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2009199189A JP5341679B2 (ja) | 2009-08-31 | 2009-08-31 | 半導体装置 |
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JP2011054588A true JP2011054588A (ja) | 2011-03-17 |
JP5341679B2 JP5341679B2 (ja) | 2013-11-13 |
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JP2009199189A Expired - Fee Related JP5341679B2 (ja) | 2009-08-31 | 2009-08-31 | 半導体装置 |
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US (1) | US8653650B2 (ja) |
JP (1) | JP5341679B2 (ja) |
KR (1) | KR20110023761A (ja) |
CN (1) | CN102005418B (ja) |
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US9559064B2 (en) | 2013-12-04 | 2017-01-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Warpage control in package-on-package structures |
KR20190058695A (ko) * | 2014-02-21 | 2019-05-29 | 미쓰이금속광업주식회사 | 내장 캐패시터층 형성용 동장 적층판, 다층 프린트 배선판 및 다층 프린트 배선판의 제조 방법 |
US20170174894A1 (en) * | 2015-12-17 | 2017-06-22 | Sri Chaitra Chavali | Stress tolerant composite material and architecture |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1112438A (ja) * | 1997-06-23 | 1999-01-19 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2006016576A (ja) * | 2004-07-05 | 2006-01-19 | Hitachi Chem Co Ltd | 封止用液状エポキシ樹脂組成物及び電子部品装置 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3701373B2 (ja) | 1995-11-17 | 2005-09-28 | 大日本印刷株式会社 | リードフレームとリードフレームの部分貴金属めっき方法、及び該リードフレームを用いた半導体装置 |
US5767575A (en) * | 1995-10-17 | 1998-06-16 | Prolinx Labs Corporation | Ball grid array structure and method for packaging an integrated circuit chip |
JP2001230360A (ja) * | 2000-02-18 | 2001-08-24 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
CN100454042C (zh) * | 2001-11-30 | 2009-01-21 | 株式会社尼康 | 光学用树脂前体组合物、光学用树脂、光学元件及光学物品 |
JP2003282798A (ja) | 2002-03-26 | 2003-10-03 | Hitachi Ltd | 半導体装置 |
EP1502922A1 (en) * | 2003-07-30 | 2005-02-02 | Loctite (R & D) Limited | Curable encapsulant compositions |
JP2005057067A (ja) * | 2003-08-05 | 2005-03-03 | Renesas Technology Corp | 半導体装置およびその製造方法 |
US20060241215A1 (en) * | 2005-04-25 | 2006-10-26 | Shin-Etsu Chemical Co., Ltd. | Semiconductor encapsulating epoxy resin composition and semiconductor device |
WO2007062122A2 (en) * | 2005-11-22 | 2007-05-31 | Shocking Technologies, Inc. | Semiconductor devices including voltage switchable materials for over-voltage protection |
US20070207322A1 (en) * | 2006-03-01 | 2007-09-06 | Shin-Etsu Chemical Co., Ltd. | Semiconductor encapsulating epoxy resin composition and semiconductor device |
JP2008098478A (ja) * | 2006-10-13 | 2008-04-24 | Renesas Technology Corp | 半導体装置及びその製造方法 |
JP5334373B2 (ja) * | 2007-03-05 | 2013-11-06 | 新日鉄住金化学株式会社 | 新規なリン含有エポキシ樹脂、該エポキシ樹脂を必須成分とするエポキシ樹脂組成物及びその硬化物 |
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---|---|---|---|---|
JPH1112438A (ja) * | 1997-06-23 | 1999-01-19 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2006016576A (ja) * | 2004-07-05 | 2006-01-19 | Hitachi Chem Co Ltd | 封止用液状エポキシ樹脂組成物及び電子部品装置 |
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CN102005418B (zh) | 2013-09-11 |
KR20110023761A (ko) | 2011-03-08 |
US8653650B2 (en) | 2014-02-18 |
US20110049689A1 (en) | 2011-03-03 |
JP5341679B2 (ja) | 2013-11-13 |
CN102005418A (zh) | 2011-04-06 |
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