JP2011049311A - 半導体パッケージ及び製造方法 - Google Patents

半導体パッケージ及び製造方法 Download PDF

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Publication number
JP2011049311A
JP2011049311A JP2009195737A JP2009195737A JP2011049311A JP 2011049311 A JP2011049311 A JP 2011049311A JP 2009195737 A JP2009195737 A JP 2009195737A JP 2009195737 A JP2009195737 A JP 2009195737A JP 2011049311 A JP2011049311 A JP 2011049311A
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Japan
Prior art keywords
semiconductor element
semiconductor
heat dissipation
heat sink
dissipation plate
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Pending
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JP2009195737A
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English (en)
Japanese (ja)
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JP2011049311A5 (https=
Inventor
Shuji Negoro
修司 根来
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2009195737A priority Critical patent/JP2011049311A/ja
Priority to US12/861,008 priority patent/US20110049702A1/en
Publication of JP2011049311A publication Critical patent/JP2011049311A/ja
Publication of JP2011049311A5 publication Critical patent/JP2011049311A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07302—Connecting or disconnecting of die-attach connectors using an auxiliary member
    • H10W72/07304—Connecting or disconnecting of die-attach connectors using an auxiliary member the auxiliary member being temporary, e.g. a sacrificial coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07327—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2009195737A 2009-08-26 2009-08-26 半導体パッケージ及び製造方法 Pending JP2011049311A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009195737A JP2011049311A (ja) 2009-08-26 2009-08-26 半導体パッケージ及び製造方法
US12/861,008 US20110049702A1 (en) 2009-08-26 2010-08-23 Semiconductor package and method of producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009195737A JP2011049311A (ja) 2009-08-26 2009-08-26 半導体パッケージ及び製造方法

Publications (2)

Publication Number Publication Date
JP2011049311A true JP2011049311A (ja) 2011-03-10
JP2011049311A5 JP2011049311A5 (https=) 2012-09-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009195737A Pending JP2011049311A (ja) 2009-08-26 2009-08-26 半導体パッケージ及び製造方法

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US (1) US20110049702A1 (https=)
JP (1) JP2011049311A (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103954260A (zh) * 2014-05-28 2014-07-30 苏州艾酷玛赫设备制造有限公司 汽车散热器检测装置
US10607857B2 (en) * 2017-12-06 2020-03-31 Indium Corporation Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger
TR201816893A2 (tr) * 2018-11-09 2019-02-21 Kale Oto Radyatoer Sanayi Ve Ticaret Anonim Sirketi Çok Sıra Tüplü Otomatik Radyatör Dizme Makinesi
US11710677B2 (en) * 2019-07-08 2023-07-25 Intel Corporation Ultraviolet (UV)-curable sealant in a microelectronic package
US11842944B2 (en) * 2019-12-26 2023-12-12 Intel Corporation IC assemblies including die perimeter frames suitable for containing thermal interface materials

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01220852A (ja) * 1988-02-29 1989-09-04 Hitachi Ltd 半導体装置
JPH0269962A (ja) * 1988-09-05 1990-03-08 Sumitomo Electric Ind Ltd 半導体デバイス製造装置
JPH06112350A (ja) * 1992-09-30 1994-04-22 Mitsubishi Electric Corp 半導体装置
JP2005217295A (ja) * 2004-01-30 2005-08-11 Renesas Technology Corp 半導体装置の製造方法
JP2006049732A (ja) * 2004-08-09 2006-02-16 Sony Corp 半導体パッケージの製造方法および半導体パッケージの製造装置
WO2007084572A2 (en) * 2006-01-18 2007-07-26 Honeywell International Inc. Thermal interconnect and interface systems, methods of production and uses thereof
JP2008244473A (ja) * 2007-03-26 2008-10-09 Endicott Interconnect Technologies Inc スタンドオフ付きフレキシブル電子回路パッケージ、及びその製造方法
JP2008300561A (ja) * 2007-05-30 2008-12-11 Renesas Technology Corp 半導体装置の製造方法

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US5900675A (en) * 1997-04-21 1999-05-04 International Business Machines Corporation Organic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion rates
US6288900B1 (en) * 1999-12-02 2001-09-11 International Business Machines Corporation Warpage compensating heat spreader
JP3881488B2 (ja) * 1999-12-13 2007-02-14 株式会社東芝 回路モジュールの冷却装置およびこの冷却装置を有する電子機器
US7061102B2 (en) * 2001-06-11 2006-06-13 Xilinx, Inc. High performance flipchip package that incorporates heat removal with minimal thermal mismatch
JP3868777B2 (ja) * 2001-09-11 2007-01-17 株式会社東芝 半導体装置
US6748350B2 (en) * 2001-09-27 2004-06-08 Intel Corporation Method to compensate for stress between heat spreader and thermal interface material
US6848172B2 (en) * 2001-12-21 2005-02-01 Intel Corporation Device and method for package warp compensation in an integrated heat spreader
US20050155743A1 (en) * 2002-06-28 2005-07-21 Getz George Jr. Composite heat sink with metal base and graphite fins
US6930884B2 (en) * 2003-06-11 2005-08-16 Hewlett-Packard Development Company, L.P. Land grid array assembly using a compressive liquid
US7319591B2 (en) * 2005-05-26 2008-01-15 International Business Machines Corporation Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages
US20080157345A1 (en) * 2006-12-29 2008-07-03 Daoqiang Lu Curved heat spreader design for electronic assemblies
US7737550B2 (en) * 2007-08-30 2010-06-15 International Business Machines Corporation Optimization of electronic package geometry for thermal dissipation
US7795724B2 (en) * 2007-08-30 2010-09-14 International Business Machines Corporation Sandwiched organic LGA structure

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01220852A (ja) * 1988-02-29 1989-09-04 Hitachi Ltd 半導体装置
JPH0269962A (ja) * 1988-09-05 1990-03-08 Sumitomo Electric Ind Ltd 半導体デバイス製造装置
JPH06112350A (ja) * 1992-09-30 1994-04-22 Mitsubishi Electric Corp 半導体装置
JP2005217295A (ja) * 2004-01-30 2005-08-11 Renesas Technology Corp 半導体装置の製造方法
JP2006049732A (ja) * 2004-08-09 2006-02-16 Sony Corp 半導体パッケージの製造方法および半導体パッケージの製造装置
WO2007084572A2 (en) * 2006-01-18 2007-07-26 Honeywell International Inc. Thermal interconnect and interface systems, methods of production and uses thereof
JP2008244473A (ja) * 2007-03-26 2008-10-09 Endicott Interconnect Technologies Inc スタンドオフ付きフレキシブル電子回路パッケージ、及びその製造方法
JP2008300561A (ja) * 2007-05-30 2008-12-11 Renesas Technology Corp 半導体装置の製造方法

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