JP2011044715A5 - - Google Patents

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Publication number
JP2011044715A5
JP2011044715A5 JP2010185136A JP2010185136A JP2011044715A5 JP 2011044715 A5 JP2011044715 A5 JP 2011044715A5 JP 2010185136 A JP2010185136 A JP 2010185136A JP 2010185136 A JP2010185136 A JP 2010185136A JP 2011044715 A5 JP2011044715 A5 JP 2011044715A5
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JP
Japan
Prior art keywords
embossing
substrate
structural material
applying
pressure
Prior art date
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Application number
JP2010185136A
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English (en)
Japanese (ja)
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JP5693090B2 (ja
JP2011044715A (ja
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Priority claimed from EP20090010779 external-priority patent/EP2287666B1/de
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Publication of JP2011044715A publication Critical patent/JP2011044715A/ja
Publication of JP2011044715A5 publication Critical patent/JP2011044715A5/ja
Application granted granted Critical
Publication of JP5693090B2 publication Critical patent/JP5693090B2/ja
Active legal-status Critical Current
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JP2010185136A 2009-08-22 2010-08-20 基板のエンボス加工用装置 Active JP5693090B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP20090010779 EP2287666B1 (de) 2009-08-22 2009-08-22 Vorrichtung zum Prägen von Substraten
EP09010779.8 2009-08-22

Publications (3)

Publication Number Publication Date
JP2011044715A JP2011044715A (ja) 2011-03-03
JP2011044715A5 true JP2011044715A5 (https=) 2013-06-13
JP5693090B2 JP5693090B2 (ja) 2015-04-01

Family

ID=41429335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010185136A Active JP5693090B2 (ja) 2009-08-22 2010-08-20 基板のエンボス加工用装置

Country Status (3)

Country Link
US (2) US9116424B2 (https=)
EP (1) EP2287666B1 (https=)
JP (1) JP5693090B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4814682B2 (ja) * 2006-04-18 2011-11-16 株式会社日立ハイテクノロジーズ 微細構造パターンの転写方法及び転写装置
CN103558801A (zh) * 2013-11-08 2014-02-05 无锡英普林纳米科技有限公司 一种纳米压印设备
CN112445066A (zh) 2014-04-22 2021-03-05 Ev 集团 E·索尔纳有限责任公司 用于压印纳米结构的方法和装置
JP6489309B2 (ja) * 2015-05-14 2019-03-27 パナソニックＩｐマネジメント株式会社 インプリント方法およびインプリント装置
WO2022008033A1 (de) 2020-07-06 2022-01-13 Ev Group E. Thallner Gmbh Verfahren und vorrichtung zum erzeugen von mikro- und/oder nanostrukturen

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0741001B1 (de) * 1995-05-04 2002-02-06 Gietz AG Präge-Druck- und Stanzmaschine
US20050160934A1 (en) * 2004-01-23 2005-07-28 Molecular Imprints, Inc. Materials and methods for imprint lithography
FI20030919L (fi) * 2003-06-19 2004-12-20 Avantone Oy Menetelmä ja laitteisto elektronisen ohutkalvokomponentin valmistamiseksi sekä elektroninen ohutkalvokomponentti
JP2005101201A (ja) * 2003-09-24 2005-04-14 Canon Inc ナノインプリント装置
JP4069081B2 (ja) * 2004-01-13 2008-03-26 東京エレクトロン株式会社 位置調整方法及び基板処理システム
JP4481698B2 (ja) * 2004-03-29 2010-06-16 キヤノン株式会社 加工装置
JP4574240B2 (ja) * 2004-06-11 2010-11-04 キヤノン株式会社 加工装置、加工方法、デバイス製造方法
US8011916B2 (en) 2005-09-06 2011-09-06 Canon Kabushiki Kaisha Mold, imprint apparatus, and process for producing structure
US7316554B2 (en) * 2005-09-21 2008-01-08 Molecular Imprints, Inc. System to control an atmosphere between a body and a substrate
US7491049B2 (en) * 2005-09-30 2009-02-17 Hon Hai Precision Industry Co., Ltd. Apparatus for hot embossing lithography
CN101573659A (zh) * 2005-12-08 2009-11-04 分子制模股份有限公司 排除位于基板和模具之间的气体的方法
JPWO2007094213A1 (ja) 2006-02-14 2009-07-02 パイオニア株式会社 インプリント装置及びインプリント方法
CN101405087A (zh) * 2006-04-03 2009-04-08 分子制模股份有限公司 光刻印刷系统
JP4995478B2 (ja) * 2006-04-18 2012-08-08 株式会社日立ハイテクノロジーズ ナノインプリント用スペーサ、及びこれを用いた電子顕微鏡調整用試料の製造方法、並びに電子顕微鏡調整用試料、及びこれを備えた電子顕微鏡
JP4908369B2 (ja) 2007-10-02 2012-04-04 株式会社東芝 インプリント方法及びインプリントシステム
NL1036034A1 (nl) * 2007-10-11 2009-04-15 Asml Netherlands Bv Imprint lithography.

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