JP2011023721A5 - - Google Patents

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Publication number
JP2011023721A5
JP2011023721A5 JP2010158372A JP2010158372A JP2011023721A5 JP 2011023721 A5 JP2011023721 A5 JP 2011023721A5 JP 2010158372 A JP2010158372 A JP 2010158372A JP 2010158372 A JP2010158372 A JP 2010158372A JP 2011023721 A5 JP2011023721 A5 JP 2011023721A5
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JP
Japan
Prior art keywords
nickel
intermetallic compound
containing layer
solder bump
copper
Prior art date
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Application number
JP2010158372A
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English (en)
Japanese (ja)
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JP5604665B2 (ja
JP2011023721A (ja
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Publication date
Priority claimed from US12/501,686 external-priority patent/US8378485B2/en
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Publication of JP2011023721A publication Critical patent/JP2011023721A/ja
Publication of JP2011023721A5 publication Critical patent/JP2011023721A5/ja
Application granted granted Critical
Publication of JP5604665B2 publication Critical patent/JP5604665B2/ja
Active legal-status Critical Current
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JP2010158372A 2009-07-13 2010-07-13 銅の追加によるハンダ相互接続の改良 Active JP5604665B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/501,686 US8378485B2 (en) 2009-07-13 2009-07-13 Solder interconnect by addition of copper
US12/501,686 2009-07-13

Publications (3)

Publication Number Publication Date
JP2011023721A JP2011023721A (ja) 2011-02-03
JP2011023721A5 true JP2011023721A5 (enrdf_load_stackoverflow) 2013-07-18
JP5604665B2 JP5604665B2 (ja) 2014-10-08

Family

ID=43027609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010158372A Active JP5604665B2 (ja) 2009-07-13 2010-07-13 銅の追加によるハンダ相互接続の改良

Country Status (6)

Country Link
US (2) US8378485B2 (enrdf_load_stackoverflow)
EP (1) EP2276063A3 (enrdf_load_stackoverflow)
JP (1) JP5604665B2 (enrdf_load_stackoverflow)
KR (1) KR101704030B1 (enrdf_load_stackoverflow)
CN (1) CN101958259B (enrdf_load_stackoverflow)
TW (1) TWI394632B (enrdf_load_stackoverflow)

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