JP2011018696A - Electronic component assembly and production system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component assembly and production system capable of automatically preventing occurrence of an error without need of an operator coping with it and fully eliminating occurrence of failures.SOLUTION: The system transmits data of inspection results obtained by a solder print inspection device 4, a mounting inspection device 6, a soldering appearance inspection device 8 and an X-ray inspection device 9 serving as a soldering transmission inspection device, which carry out kinds of inspection processes during each production process in a surface mounting line, to a line control server 12 via a communication line 11. When occurrence of an error is predicted according to the data of the inspection results, the line control server 12 changes the set value (selects the optimum set value among the data of each production process history based on data of past inspection results) for statistically coping with the error via the communication line 11 for a solder printer 3, respective component mounting instruments 5a-5c and a reflow furnace 7 of respective facilities concerned with the respective production processes so as to perform numerical control (NC).

Description

  The present invention relates to solder printing of a wiring pattern on a wiring board on one transport line, automatic mounting of electronic components on a printed wiring board created by solder printing, and electronic mounting on a printed wiring board by automatic mounting. The present invention relates to an electronic parts assembly and production system in which electronic parts are assembled and produced by performing soldering of parts in a series of processes, and a state inspection process is introduced during each production process.

  Conventionally, in this kind of electronic component assembly production system, it is created by a printing process and a printing process in which a printed wiring board is created by solder-printing a wiring pattern with a solder paste on a carried-in wiring board on one transport line. A mounting process for automatically mounting electronic components at predetermined locations on the printed wiring board, and heating and melting the solder paste in the wiring pattern for the electronic components mounted on the printed wiring board by the mounting process. A type has been developed in which electronic parts are assembled and produced by performing a soldering process for joining parts together by soldering in a series of configurations.

  Normally, a solder printing machine is used in the printing process, a component mounting machine is used in the mounting process, and a reflow furnace is used in the soldering process, and these parts are connected by a conveyor to form a surface mounting line (also simply called a mounting line). . In addition, as a state inspection during each of these production processes, solder printing inspection for a printed wiring board after forming a wiring pattern by solder printing, mounting inspection after mounting electronic components on the printed wiring board, It is also customary to conduct soldering inspections.

  Therefore, in recent electronic component assembly production systems, a solder printing inspection device for inspecting the printed state of solder paste in a printed wiring board created for solder printing inspection, mounted on the printed wiring board for mounting inspection Various inspections using a mounting inspection device that inspects the mounting state of electronic components, and a solder inspection device that inspects the soldering state of a printed wiring board on which electronic components are soldered through a reflow furnace for soldering appearance inspection. Many apparatuses are built in such a manner that they are attached after each production process in the surface mounting line, and a series of production processes including various inspection processes are performed. For example, as an example of such an electronic component assembly production system, a printed circuit board (printed wiring board) that can perform automatic quality control that suppresses the occurrence of defects without worrying about the correlation between processes. Examples include an automatic quality control method and apparatus (see Patent Document 1) in a component mounting process.

  In such an electronic component assembly production system, generally, the result of inspection by various inspection devices, that is, the printed state of solder paste on the printed wiring board by the solder printing inspection device, the mounting state of the electronic component on the printed wiring substrate by the mounting inspection device A function to warn the operator of abnormality information when abnormalities are recognized as a result of automatically inspecting the soldering state of electronic components to the printed wiring board by the solder inspection device, and to give the operator instructions to take countermeasures In addition, a technique for improving the accuracy of various inspection functions has been proposed.

  As a well-known technique, calibration for updating control parameters for controlling the printing apparatus and the electronic component mounting apparatus is performed based on the solder position data obtained by the printing inspection apparatus and the part position data obtained by the mounting state inspection apparatus. An electronic component mounting system and electronic component mounting method (see Patent Document 2) that can perform quality control in the mounting process more precisely and efficiently by performing in-line, and abnormalities in the mounting state of electronic components In order to prevent, abnormalities based on the results of analyzing and analyzing the cause based on alarm information indicating that there is a risk of occurring in each device of the mounting system including at least a solder printing machine and each surface mounting machine (component mounting machine) And a mounting system (see Patent Document 3) that performs a corresponding process for solving the problem.

JP 11-298200 A JP 2002-134899 A JP 2007-194252 A

  According to the electronic parts assembly and production system according to Patent Document 1 to Patent Document 3 designed to improve the accuracy of the automatic quality control and various inspection functions described above, when an abnormality occurs, the cause can be immediately grasped and dealt with. In addition, the occurrence of an abnormality can be suppressed to some extent, and the occurrence of an abnormality can be avoided by taking preventive measures to prompt a warning even when an abnormality is expected.

  However, the technology is basically to suppress the occurrence of an abnormality or to prompt the operator to warn of the occurrence of an abnormality, and it is only the operator himself that performs the countermeasures and preventive measures. If it occurs continuously regardless of the content, the operator has to put effort into the treatment, and the inconvenience that the abnormality cannot be prevented automatically so that the operator does not have to take the treatment. There is.

  For example, the technology according to Patent Document 3 can automatically suppress the occurrence of defects without worrying about the correlation between processes, but here, in each step when a failure treatment is taken. Since measurement data is stored in a database in advance, and automatic processing is performed based on the result of determining the corresponding failure treatment by referring to the database when a failure occurs, the occurrence of failure can be prevented sufficiently It is a function that cannot be resolved.

  Under such circumstances, in recent electronic component assembly production systems, there is a demand for a function that can automatically prevent abnormality so that an operator does not have to take any action, and can sufficiently eliminate the occurrence of defects.

  The present invention has been made to solve such problems, and the technical problem is that an operator can automatically prevent occurrence of an abnormality without having to take any action, and can sufficiently eliminate the occurrence of a defect. It is to provide an electronic component assembly production system.

  In order to solve the above technical problem, the electronic component assembling production system of the present invention is a solder for producing a printed wiring board by solder printing a wiring pattern on a carried wiring board with a solder paste on one transport line. A printing machine, a solder printing inspection apparatus that performs a solder printing inspection on a printed wiring board after a wiring pattern is formed by solder printing, and at least one electronic component that is automatically mounted at a predetermined location on the printed wiring board subjected to the printing inspection A component mounting machine, a mounting inspection device that performs mounting inspection after mounting electronic components on a printed wiring board, and a solder paste in a wiring pattern for electronic components mounted on a printed wiring board that has been mounted and inspected Solder for joining the printed wiring board and the electronic component by soldering Soldering device, soldering appearance inspection device for inspecting the appearance of the soldered state based on the result of inspecting the appearance of the joined state between the electronic component after soldering and the printed wiring board, and the electronic component and printed wiring board after the appearance inspection And a soldering transmission inspection device that performs a transmission inspection of the soldered state based on the result of visualizing and inspecting a portion where the joint state is invisible, and as a configuration of the surface mounting line, a solder printer, a solder printing inspection device, Connected to the component mounting machine, mounting inspection device, soldering device, soldering appearance inspection device, and soldering transmission inspection device, solder printing inspection from the solder printing inspection device, mounting inspection from the mounting inspection device, solder Soldering appearance inspection from the soldering appearance inspection device and soldering state transmission inspection from the soldering transmission inspection device For the numerical control that is data of the solder printing process history, mounting process history, and soldering process history for statistically dealing with the expected abnormal contents, while accumulating and storing at least one inspection result for A storage unit storing the set value for use in a set value change process for changing the set value, and executing the set value change process when an abnormality is predicted according to the at least one inspection result; The printer includes a line control server that performs numerical control based on a changed set value for at least one facility of the printing machine, the component mounting machine, and the soldering apparatus.

  In the electronic component assembly production system, the soldering transmission inspection device is an X-ray inspection device that inspects for defective defects in the bonding state between the electronic component and the printed wiring board by X-rays as a soldering state transmission inspection, Or it is preferable that it is an ultrasonic inspection apparatus which inspects the same defective defect with an ultrasonic wave, respectively.

  In one embodiment of the electronic component assembly production system, when the line control server predicts that the occurrence of an abnormality is caused by the solder printer according to the result of the solder print inspection from the solder print inspection apparatus, When the setting value changing process is executed for the solder printer, or the line control server predicts that the occurrence of an abnormality is caused by the component mounting machine according to the result of the mounting inspection from the mounting inspection apparatus The setting control process is executed for the component mounting machine, or the line control server performs soldering according to the result of the appearance inspection of the soldering state from the soldering appearance inspection device. When it is predicted to be caused by the apparatus, the setting value changing process is executed for the soldering apparatus, or the line control server When predicted abnormality according to the result of transmission inspection of soldered state from I I with transmission inspection device, it is characterized in performing a set value changing process for at least one facility.

  Furthermore, in another embodiment of any one of the above electronic component assembly and production systems, the line control server may perform a set value change process when at least one inspection result is predicted to be abnormal or at least one piece of equipment. It is characterized by having a function of saving a history of execution and referring to data of the saved contents when necessary.

  In addition, in another embodiment of any one of the electronic component assembly production systems described above, the line control server records the history when the set value change process is executed for at least one piece of equipment, and thereafter at least one inspection. It is characterized by having a function of reflecting when an abnormality occurrence is predicted as a result, or when performing the set value changing process for the at least one facility.

  According to the electronic component assembly production system of the present invention, when the occurrence of an abnormality is predicted according to the inspection results of various inspection apparatuses related to each production process, the line control server statistically reports the abnormality for each equipment related to each production process. In order to perform numerical control (NC) by performing a set value change process for changing the set value to cope with the problem, there is no need for the operator to take any action, and there is a built-in for quality maintenance by automatic adjustment. Occurrence can be prevented, and the occurrence of defects can be sufficiently resolved to produce an electronic component assembly with good quality and yield.

1 is a schematic block diagram illustrating a basic configuration of an electronic component assembly production system according to Embodiment 1 of the present invention. It is the simple flowchart which showed the operation | movement process of the whole electronic component assembly production system shown in FIG. It is the block diagram which showed the detailed structure of the line control server with which the electronic component assembly production system shown in FIG. 1 is equipped. It is the flowchart which showed the detailed operation | movement process of the setting value change process which concerns on the printing process implemented with the electronic component assembly production system shown in FIG. It is the flowchart which showed the detailed operation | movement process of the setting value change process which concerns on the mounting process implemented with the electronic component assembly production system shown in FIG. It is the flowchart which showed the detailed operation | movement process of the setting value change process which concerns on the soldering process implemented with the electronic component assembly production system shown in FIG.

  Hereinafter, an electronic component assembly production system of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a schematic block diagram showing a basic configuration of an electronic component assembly production system 1 according to Embodiment 1 of the present invention.

  This electronic component assembly production system 1 includes a loader (substrate supply machine) 2 for supplying and carrying a substrate to be wired on one transport line, and solder-printing a wiring pattern on the carried substrate by solder paste. A solder printing machine 3 for creating a printed wiring board, a solder printing inspection apparatus 4 for performing a solder printing inspection on the printed wiring board after forming a wiring pattern by solder printing, and a predetermined location on the printed wiring board subjected to the printing inspection The three component mounting machines 5a to 5c that automatically mount the electronic components according to the stage, the mounting inspection apparatus 6 that performs the mounting inspection after mounting the electronic components on the printed wiring board, and the mounting-inspected print By heating and melting the solder paste in the wiring pattern for electronic components mounted on the wiring board, the printed wiring board Reflow furnace 7 as a soldering apparatus for joining the electronic component and the electronic component by soldering, and solder for inspecting the appearance of the soldered state based on the result of inspecting the appearance of the joined state between the electronic component and the printed wiring board after soldering X as a soldering transmission inspection device that performs transmission inspection of the soldering state based on the result of inspection by transparently inspecting the invisible portion of the bonding state between the electronic appearance inspection device 8 and the electronic component after the visual inspection and the printed wiring board A line inspection apparatus 9 and an unloader (substrate storage machine) 10 for storing an electronic component assembly carried out after the transmission inspection are provided as a configuration of the surface mounting line. In other words, each part here is connected by a conveyor to form a surface mounting line.

  Note that the X-ray inspection apparatus 9 as the soldering transmission inspection apparatus here inspects for defective defects in the bonding state between the electronic component and the printed wiring board by X-rays as the transmission inspection in the soldering state. Since the same defective defect can be obtained by an ultrasonic inspection apparatus that inspects by ultrasonic waves, an ultrasonic inspection apparatus may be used instead of the X-ray inspection apparatus 9.

  The electronic component assembly production system 1 includes a solder printing machine 3, a solder printing inspection device 4, each component mounting machine 5a to 5c, a mounting inspection device 6, a reflow furnace 7 as a soldering device, a soldering appearance inspection device 8, And an X-ray inspection device 9 as a soldering transmission inspection device are connected to each part via a communication line 11, solder printing inspection from the solder printing inspection device 4, mounting inspection from the mounting inspection device 6, and soldering appearance inspection device. 8. Accumulate and store at least one inspection result for the soldering state visual inspection from 8 and the soldering state transmission inspection from the X-ray inspection device 9 as a soldering transmission inspection device, and an expected abnormality Setting value for numerical control (NC), which is data of solder printing process history, mounting process history, and soldering process history to deal with the contents statistically A solder printing machine having storage means for storing setting values (setting value data) used for changing the setting values to be changed, and executing the setting value changing processing when an abnormality is predicted according to at least one inspection result 3. It includes a line control server 12 that performs numerical control based on a changed set value for at least one facility of the component mounting machines 5a to 5c and the reflow furnace 7 as a soldering apparatus.

  FIG. 2 is a simplified flowchart showing the operation process of the entire electronic component assembly production system 1.

  In the electronic component assembly production system 1, first, the loader 2 performs a process of carrying a printed board (step S101) for supplying (carrying in) a printed board (wiring board) to the surface mounting line, and then carrying it on the surface mounting line. The printed board (wiring board) is conveyed to the solder printer 3. In the solder printing machine 3, a printed wiring board is created by solder-printing a wiring pattern with a solder paste (step S102) on the printed board (wiring board) that has been carried in.

  Next, the printed wiring board on which the wiring pattern is printed is transported to the solder printing inspection apparatus 4, and the solder printing inspection apparatus 4 performs solder printing inspection on the printed wiring board after the wiring pattern is formed by the carried solder printing. The process of (Step S103) is performed. Here, the shape of the solder paste in the wiring pattern is inspected, and data of the inspection result is transmitted to the line control server 12.

  Therefore, the line control server 12 accumulates and stores the inspection result data, and determines whether or not an abnormality is predicted in the shape of the solder paste. Printing to change the set value for numerical control (NC) on the solder printing history to warn the operator of the risk of abnormality occurrence and to statistically deal with the expected abnormality content Process setting value change processing (step S104) is performed, and an optimal setting value selected from the setting values (printing process history data based on past inspection result data) is selected for the solder printer 3 To perform numerical control (NC). At this time, the printing process history whose design value has been changed is stored in the line control server 12, and the history can be referred to as needed.

  The printed wiring board that has undergone the printing inspection (step S103) is transported to the component mounting machines 5a to 5c.

  In each of the component mounting machines 5a to 5c, when the printed wiring board is carried in, the electronic component mounting 1 (step S105) and the electronic component mounting 2 (step S106), mounting electronic components on the printed circuit board is completed by performing electronic component mounting 3 (step S107).

  The printed wiring board on which the mounting of the electronic components is completed is transported to the mounting inspection apparatus 6, and the mounting inspection apparatus 6 inspects the mounting state of the electronic components mounted on the printed wiring board carried in (step S108). )I do. The inspection result data is also transmitted to the line control server 12.

  Therefore, the line control server 12 accumulates and stores the inspection result data, and determines whether or not an abnormality is predicted in the mounting state. When the abnormality is predicted in the mounting state, the line control server 12 Implementation to change the setting value for numerical control (NC) on the implementation history to warn the operator of the risk of occurrence of an abnormality and notify the abnormal content statistically to cope with the expected abnormality content. Process setting value change processing (step S109) is performed, and the setting value changed for each component mounting machine 5a-5c (optimized from the setting value which is data of each mounting process history based on the data of past inspection results) Numerical control (NC) is performed. At this time, each mounting process history in which the design value has been changed is also stored in the line control server 12, and the history can be referred to as needed.

  The printed wiring board that has undergone mounting inspection is transported to a reflow furnace 7 as a soldering apparatus, and in the reflow furnace 7, a solder paste in a wiring pattern for an electronic component that has been mounted on the printed wiring board that has been inspected for mounting. Is heated and melted by reflow (step S110), and the printed wiring board and the electronic component are joined by soldering to produce an electronic component assembly.

  The soldered electronic component assembly is transported to the soldering appearance inspection device 8, and in the soldering appearance inspection device 8, the electronic component assembly after soldering and the printed wiring board in the carried electronic component assembly are checked. A soldering appearance inspection (step S111) is performed based on the result of the appearance inspection. The inspection result data is also transmitted to the line control server 12.

  Therefore, the line control server 12 accumulates and stores the inspection result data, determines whether or not an abnormality is predicted in the soldering state, and determines that an abnormality is predicted in the soldering state. Numerical control (NC) on the soldering history for notifying the soldering appearance inspection device 8 of warnings of abnormalities and prompting the operator to risk the occurrence of abnormalities and statistically dealing with the expected abnormalities Setting value change processing (step S112) of the soldering process for changing the set value for the set value is performed on the reflow furnace 7 (the soldering process history data based on the past inspection result data) Numerical control (NC) is performed by selecting an optimal value from a set value. At this time, the soldering process history in which the design value is changed is also stored in the line control server 12, and the history can be referred to as needed.

  The electronic component assembly that has undergone the soldering appearance inspection is transported to an X-ray inspection device 9 as a soldering transmission inspection device, and the X-ray inspection device 9 performs an electronic component assembly and a printed wiring board. An X-ray inspection in a soldered state (step S113) is performed based on the result of inspecting a portion in which the bonding state is invisible with X-rays. The inspection result data is also transmitted to the line control server 12.

  Therefore, the line control server 12 accumulates and stores the inspection result data in the same manner as described above, determines whether an abnormality is predicted in the soldering state, and the abnormality is predicted in the soldering state. If there is an error, the X-ray inspection apparatus 9 is notified of an abnormality prediction to prompt the operator to risk the occurrence of the abnormality, and numerical control of the soldering history for statistically dealing with the expected abnormality content ( NC), the setting value change process (step S114) of the soldering process for changing the setting value for the soldering process is performed, and the setting value changed for the reflow furnace 7 (based on the past inspection result data) Numerical control (NC) is performed by selecting the optimum setting value from the data). At this time, the soldering process history in which the design value is changed is also stored in the line control server 12, and the history can be referred to as needed.

  When the line control server 12 determines that an abnormality is predicted based on the inspection result of the soldering state of the invisible portion by the X-ray inspection apparatus 9, numerical control (NC In addition, the numerical control (NC) may be selectively performed using the changed set value for the solder printer 3 and the component mounting machines 5a to 5c.

  Finally, the X-ray inspected electronic component assembly is transported to the unloader 10 which is the end of the surface mounting line, and at this time, the printed board (electronic component assembly including the printed wiring board) is carried out (step S115). The unloader 10 stores the unloaded electronic component assembly. As a result, creation (manufacture) of an electronic component assembly by a series of automatic production processes is completed.

  That is, in this electronic component assembly production system, a solder printing inspection apparatus 4, a mounting inspection apparatus 6, a soldering appearance inspection apparatus 8, and an X-ray inspection apparatus for performing various inspection processes during each production process in the surface mounting line. 9 is transmitted to the line control server 12, and when the line control server 12 predicts the occurrence of an abnormality according to the data of the inspection result, the solder printer 3 of each facility related to each production process, Since each component mounting machine 5a to 5c and the reflow furnace 7 are subjected to a numerical value control (NC) by performing a setting value changing process for changing a setting value for statistically dealing with an abnormality, it is necessary for an operator to take an action. In order to prevent the occurrence of abnormalities, it is possible to prevent the occurrence of abnormalities by making adjustments for quality maintenance by automatic adjustment, and to produce electronic component assemblies with high quality and yield by sufficiently eliminating the occurrence of defects. Door can be.

  FIG. 3 is a block diagram showing a detailed configuration of the line control server 12. Broadly speaking, the line control server 12 roughly predicts the occurrence of an abnormality in the inspection result storage unit 111 that stores and stores inspection result data obtained from various inspection apparatuses, and in each facility related to each production process. It includes a change history storage unit 112 that stores and stores data of each production process history for changing set values.

  Among these, the inspection result storage unit 111 includes a printing state storage unit 113 that stores inspection result data from the solder printing inspection apparatus 4, and a mounting state storage unit 114 that stores inspection result data from the mounting inspection apparatus 6. And a soldering state storage unit 115 for storing the inspection result data from the soldering appearance inspection device 8 and the X-ray inspection device 9 so that they can be identified.

  In addition, the change history storage unit 112 includes a printing process history storage unit 116 that stores data of a printing process history in which setting values have been changed for the solder printer 3 when the printing process is performed, and each component mounting when the mounting process is performed. A mounting process history storage unit 117 for storing mounting process history data for which the set values have been changed for the machines 5a to 5c, and a soldering process history for which the set values have been changed for the reflow furnace 7 during the soldering process. And a soldering process history storage unit 118 for storing data.

  In addition, the line control server 12 has a process for predicting the occurrence of an abnormality based on inspection result data from various inspection apparatuses, and a set value for statistically dealing with the abnormality for each facility in each production process. A CPU (central processing unit) (not shown) for executing a process for performing a change process (selecting an optimum one from set values which are data of each production process history based on past inspection result data) by software (program) Processing device).

  FIG. 4 is a flowchart showing the detailed operation process of the setting value change process related to the printing process performed in the electronic component assembly production system 1.

  The detailed operation of the setting value changing process related to the printing process is to send the inspection result data of the solder paste shape printed from the solder printing inspection apparatus 4 to the line control server 12 via the communication line 11, that is, the solder printing inspection. The apparatus 4 is started by executing a process of transmitting inspection result data to the line control server 12 (step S201).

  Thereby, in the line control server 12, when the process of receiving the inspection result data from the solder printing inspection apparatus 4 (step S202) is performed, the inspection result data is stored in the printing state storage unit 113 of the inspection result storage unit 111. (Step S203).

  Accordingly, the line control server 12 determines whether or not there is an abnormality determination by determining whether or not the transmitted inspection result data is approaching an abnormal value or is already an abnormal value (step S204). )I do.

  If there is an abnormality determination as a result of this determination, the process proceeds to the process of selecting a setting value for an appropriate printed solder state from the printing process history storage unit 116 of the change history storage unit 112 (step S207), but there is no abnormality determination. For example, the current risk level is calculated from the inspection result data (step S205). The calculation of the degree of risk predicts and judges that an ideal value of the solder paste shape is approaching an abnormal value when it exceeds 70, based on the ratio when the ideal solder paste shape is 0% and the threshold value of the solder printing inspection apparatus 4 is 100%. . Therefore, it is determined whether or not the risk level is 0 or more and 70 or less (0 ≦ risk level ≦ 70) (step S206), and if the risk level is 0 or more and 70 or less, The operation process is terminated without changing the setting value. If the degree of risk exceeds 70, the operation value is estimated to be approaching an abnormal value and the setting value is set from the printing process history storage unit 116 of the change history storage unit 112. The process proceeds to the selection (step S207).

  The printing process history storage unit 116 stores past performance data (printing process history data) for setting values that are in an appropriate printed solder state. Therefore, the setting value is selected and numerical control (NC) data is selected. (Step S208), the numerical control (NC) data is transmitted to the solder printer 3 via the communication line 11 (step S209). For example, assuming a case where the amount of printed solder tends to increase, as a countermeasure, the set value of the solder printing pressure of the solder printer 3 is increased, or the set value of the speed at which the solder paste is printed is increased. The case of doing so is mentioned.

  Thereafter, the line control server 12 saves the setting value used for the numerical control (NC) data whose setting value has been changed, that is, the selected setting value in the printing process history storage unit 116 (step S212), and the next and subsequent times. The operation process is ended after the data is used for the search (note that the data of the inspection result is also stored in the print state storage unit 113 of the inspection result storage unit 111).

  On the other hand, when receiving the numerical control (NC) data in which the set value is changed from the line control server 12 (step S210), the solder printing machine 3 receives the numerical control (NC) received in the held numerical control (NC) data. By overwriting the data, a process of overwriting the numerical control (NC) data holding the transmitted numerical control (NC) data is performed (step S211). As a result, the occurrence of abnormality associated with solder printing of the solder printer 3 can be prevented and preventive measures can be taken, and the occurrence of defects in the printing process can be sufficiently eliminated.

  FIG. 5 is a flowchart showing the detailed operation process of the set value change process related to the mounting process performed in the electronic component assembly production system 1.

  The detailed operation of the setting value changing process of the mounting process is that the mounting inspection device 6 transmits data of the inspection result of the mounting state of the electronic component mounted on the printed wiring board to the line control server 12 via the communication line 11. That is, the mounting inspection apparatus 6 is started by executing processing for transmitting inspection result data to the line control server 12 (step S301).

  Thereby, in the line control server 12, when the process of receiving the inspection result data from the mounting inspection apparatus 6 is performed (step S302), the inspection result data is stored in the mounting state storage unit 114 of the inspection result storage unit 111 ( Step S303).

  Therefore, the line control server 12 determines whether or not there is a component deviation indicating a positional deviation of the electronic component from the transmitted inspection result data (step S304).

  If there is no component deviation as a result of this determination, the operation processing is terminated. If there is a component deviation, one past inspection result data is retrieved from the mounting state storage unit 114 of the inspection result storage unit 111 (step S305). Then, it is determined whether or not there is no component deviation in the retrieved inspection result (step S306). Incidentally, when the line control server 12 here predicts that there is a possibility of an abnormality from the inspection result data of the mounting inspection device 6, the line control server 12 sets an abnormal preliminary flag at the corresponding location in the inspection result storage unit 111. Inspection result data is stored (stored) in the mounting state storage unit 114. As a result, when searching for a place where an abnormal reserve flag is set and it is predicted that there is a possibility of a deviation abnormality, it is determined whether or not there is an abnormal reserve flag recently set at the same place from the mounting state storage unit 114. The search operation is performed.

  As a result of the determination as to whether or not there is any component deviation (step S306), if there is no component deviation, the operation process is terminated. If there is a component deviation, the current inspection result data transmitted is searched. After calculating the average deviation amount of past inspection result data (step S307), the calculated average value is written in the numerical control (NC) data as a deviation correction value (step S308) processing (setting value change processing) I do.

  Therefore, the line control server 12 replaces each of the component mounting machines 5a to 5c (one of them) loaded with an electrical component that may be misaligned from the personal computer (PC) assigned to each of the component mounting machines 5a to 5c. The numerical control (NC) data in which the setting value for performing the search (step S309) to determine and correct the deviation is written is transmitted to any of the component mounting machines 5a to 5c via the communication line 11 (step S310).

  Thereafter, the line control server 12 stores the setting value used for the numerical control (NC) data whose setting value has been changed, that is, the selected setting value, in the mounting process history storage unit 117 of the change history storage unit 112 (step S313). The operation process is ended after the data is used for the next and subsequent searches (the inspection result data is also saved in the mounting state storage unit 114 of the inspection result storage unit 111).

  On the other hand, when any of the component mounting machines 5a to 5c receives the numerical control (NC) data whose setting value has been changed from the line control server 12 (step S311), the received numerical control (NC) data is received. By overwriting the numerical control (NC) data, the process of overwriting the numerical control (NC) data holding the transmitted numerical control (NC) data is performed (step S312). As a result, the occurrence of misalignment due to the mounting of the electronic components of each of the component mounting machines 5a to 5c can be prevented and preventive measures can be taken, and the occurrence of defects in the mounting process can be sufficiently eliminated.

  FIG. 6 is a flowchart showing a detailed operation process of the set value change process related to the soldering process performed in the electronic component assembly production system 1.

  The detailed operation of the setting value changing process of the soldering process is to transmit the soldering inspection result data from the soldering appearance inspection device 8 or the X-ray inspection device 9 to the line control server 12 via the communication line 11. That is, execution of the process in which the soldering appearance inspection apparatus 8 transmits the inspection result to the line control server 12 (step S401) or the process in which the X-ray inspection apparatus 9 transmits the inspection result to the line control server 12 (step S402). Is started.

  Thereby, in the line control server 12, when the process of receiving the inspection result data from the soldering appearance inspection apparatus 8 or the X-ray inspection apparatus 9 is performed (step S403), the soldering state storage unit of the inspection result storage unit 111 is performed. Each of the inspection result data is stored in 115 (step S404). However, the data of the inspection result of the soldering state stored (stored) in the soldering state storage unit 115 is the appearance inspection by the soldering appearance inspection device 8 whereas the X-ray inspection device 9 is the transmission inspection. Therefore, these data are identified and stored.

  Therefore, the line control server 12 determines whether there is no abnormality in the inspection result of the soldering state from the transmitted inspection result data (step 405).

  As a result of this determination, if there is no abnormality in the soldering state inspection result, the operation process is terminated, but if it is expected that the soldering state inspection result is abnormal, the inspection result of the portion that is expected to be abnormal And the solder printing state (inspection result of the printed solder paste shape) at the same location (the same location of the abnormal location) on the same printed circuit board as the searched location is printed in the print status storage unit of the inspection result storage unit 111 A search is performed from 113 (step S406), and it is determined whether or not there is any abnormality in the printing state by checking whether or not the data of the inspection result of the solder paste shape thus searched is abnormal (step S407).

  As a result of this determination, if there is an abnormality in the printing state, it is regarded as out of treatment here, and the operation process is terminated. If there is no abnormality in the printing state, whether the amount of solder is large or small from the inspection result of the soldering state As a process for confirming, it is determined whether the amount of solder in the soldered state is large or small (step S408), and if it is determined that the amount of solder is small, the conveyance speed value of the flow furnace 7 is decreased (step S409). Processing is performed to prepare a value that decreases the conveyance speed. Conversely, when it is determined that the amount of solder is large, the conveyance speed value of the reflow furnace 7 is increased (step S410), and the conveyance speed is increased. A value is prepared, and in any case, the changed conveyance speed value (setting value) is written in numerical control (NC) data (step S411) (the setting value changing process).

  Therefore, the line control server 12 transmits the numerical control (NC) data in which the changed set value of the conveyance speed value is written to the reflow furnace 7 via the communication line 11 (step S412), and then changes the conveyance speed value. The set value used for the numerical control (NC) data, that is, the selected set value is stored in the soldering process history storage unit 118 of the change history storage unit 112 (step S415) and used for the next and subsequent searches (inspection results). The data is also stored in the soldering state storage unit 115 of the inspection result storage unit 111), and the operation process is terminated.

  On the other hand, when the reflow furnace 7 receives numerical control (NC) data in which the set value (conveyance speed value) is changed from the line control server 12 (step S413), the numerical value received in the numerical control (NC) data held therein. By overwriting the control (NC) data, a process of overwriting the numerical control (NC) data holding the transmitted numerical control (NC) data (step S414) is performed. As a result, the occurrence of an abnormality in the soldering state of the reflow furnace 7 can be prevented and preventive measures can be taken, so that the occurrence of defects in the soldering process can be sufficiently eliminated.

  The above-described setting value changing process for the printing process described with reference to FIG. 4, the setting value changing process for the mounting process described with reference to FIG. 5, and the setting value changing process for the soldering process described with reference to FIG. However, on the function of the electronic component assembly production system 1, these may be selectively executed by arbitrarily combining them or may be executed with correlation with each other. Is possible. For example, since the data of the invisible part is handled for the data of the inspection result from the X-ray inspection apparatus 9 described in FIG. 6, the method for pre-treating the abnormality is not necessarily the numerical value for the reflow furnace 7 that contributes to the soldering state. Changing the setting value of the control (NC) is not necessarily optimal, but changing the setting value of the numerical control (NC) for any one of the solder printing machine 3 and the component mounting machines 5a to 5c of other equipment Even in this case, it can be effectively dealt with. In such a case, when the occurrence of an abnormality in each facility related to each production process is predicted, a known statistical processing technique represented by, for example, regression processing is used in order to appropriately perform preparatory treatment with as much correlation as possible. If the (program having the process) is applied to the arithmetic function of the CPU, an accurate result can be obtained.

1 Electronic component assembly production system 2 Loader (substrate feeder)
DESCRIPTION OF SYMBOLS 3 Solder printer 4 Solder print inspection apparatus 5a, 5b, 5c Component mounting machine 6 Mounting inspection apparatus 7 Reflow furnace 8 Soldering appearance inspection apparatus 9 X-ray inspection apparatus 10 Unloader (electronic component assembly storage machine)
DESCRIPTION OF SYMBOLS 11 Communication line 12 Line control server 111 Inspection result storage part 112 Change history storage part 113 Printing state storage part 114 Mounting state storage part 115 Soldering state storage part 116 Printing process history storage part 117 Mounting process history storage part 118 Soldering process history Storage

Claims (9)

A solder printing machine for creating a printed wiring board by solder printing a wiring pattern on a carried wiring board using a solder paste on a carried wiring board, and the printed wiring after the wiring pattern is formed by the solder printing A solder printing inspection apparatus for performing a solder printing inspection on a substrate; at least one component mounting machine for automatically mounting an electronic component at a predetermined location on the printed wiring substrate subjected to the printing inspection; and the electronic component on the printed wiring substrate. A mounting inspection apparatus that performs mounting inspection after mounting, and the printed wiring board by melting the solder paste in the wiring pattern of the electronic component mounted on the printed wiring board that has been mounted and inspected A soldering device for joining the electronic component and the electronic component by soldering, Soldering appearance inspection apparatus for inspecting the appearance of the soldered state based on the result of inspecting the appearance of the joined state between the electronic component after soldering and the printed wiring board, and the electronic component and the printed wiring after the appearance inspection A soldering transmission inspection device that performs a transmission inspection of a soldering state based on a result of inspection by visualizing and inspecting a portion where the bonding state with the substrate is invisible is provided as a configuration of the surface mounting line,
Connected to the solder printing machine, the solder printing inspection apparatus, the component mounting machine, the mounting inspection apparatus, the soldering apparatus, the soldering appearance inspection apparatus, and the soldering transmission inspection apparatus, from the solder printing inspection apparatus The solder printing inspection, the mounting inspection from the mounting inspection device, the soldering appearance inspection from the soldering appearance inspection device, and the soldering state transmission inspection from the soldering inspection device. At least one inspection result is accumulated and stored, and the setting value for numerical control that is data of solder printing process history, mounting process history, and soldering process history for statistically dealing with expected abnormal contents Storage means for storing the set value for use in a set value change process for changing the set value, and responding to the at least one test result. When the abnormality is predicted, the setting value changing process is executed to perform numerical control with the changed setting value for at least one facility of the solder printing machine, the component mounting machine, and the soldering apparatus. An electronic component assembly production system comprising a line control server.   2. The electronic component assembly production system according to claim 1, wherein the soldering transmission inspection apparatus inspects a defective defect in a bonding state between the electronic component and the printed wiring board by X-ray as the soldering transmission inspection. An electronic parts assembly production system characterized by being an X-ray inspection apparatus.   2. The electronic component assembly production system according to claim 1, wherein the soldering transmission inspection apparatus inspects a defect defect in a bonding state between the electronic component and the printed wiring board by ultrasonic as the transmission inspection in the soldering state. 3. An electronic component assembly production system characterized by being an ultrasonic inspection apparatus.   4. The electronic component assembly production system according to claim 1, wherein the line control server has an abnormality caused by the solder printing machine according to a result of the solder printing inspection from the solder printing inspection apparatus. 5. When it is determined, the electronic component assembly and production system, wherein the setting value changing process is executed for the solder printer.   4. The electronic component assembly production system according to claim 1, wherein the line control server predicts that an occurrence of an abnormality is caused by the component mounting machine according to a result of the mounting inspection from the mounting inspection device. 5. When this is the case, the electronic component assembly and production system is characterized in that the setting value changing process is executed for the component mounting machine.   4. The electronic component assembly production system according to claim 1, wherein the line control server generates an abnormality according to a result of an appearance inspection of the soldering state from the soldering appearance inspection device. An electronic component assembling and producing system characterized by executing the set value changing process for the soldering device when it is predicted to be caused by the soldering device.   The electronic component assembly production system according to any one of claims 1 to 3, wherein the line control server predicts an occurrence of an abnormality according to a result of a penetration inspection of the soldering state from the soldering transmission inspection device. When this is the case, the electronic component assembly and production system is characterized in that the set value changing process is executed for the at least one facility.   The electronic component assembly production system according to any one of claims 1 to 3, wherein the line control server predicts occurrence of an abnormality from the at least one inspection result, or the setting for the at least one facility. An electronic component assembly production system characterized by storing a history when a value change process is executed and having a function of referring to data of the stored contents when necessary.   The electronic component assembly production system according to any one of claims 4 to 7, wherein the line control server records a history when the set value change processing is executed on the at least one facility, and thereafter the at least An electronic component assembly production system having a function of reflecting when an abnormality occurrence is predicted based on one inspection result or when the set value changing process is performed on the at least one facility.

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