JP2011014661A5 - - Google Patents

Download PDF

Info

Publication number
JP2011014661A5
JP2011014661A5 JP2009156325A JP2009156325A JP2011014661A5 JP 2011014661 A5 JP2011014661 A5 JP 2011014661A5 JP 2009156325 A JP2009156325 A JP 2009156325A JP 2009156325 A JP2009156325 A JP 2009156325A JP 2011014661 A5 JP2011014661 A5 JP 2011014661A5
Authority
JP
Japan
Prior art keywords
region
resin
lead portions
lead
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009156325A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011014661A (ja
JP5178648B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009156325A priority Critical patent/JP5178648B2/ja
Priority claimed from JP2009156325A external-priority patent/JP5178648B2/ja
Priority to US12/793,751 priority patent/US8450153B2/en
Priority to CN2010102151737A priority patent/CN101937850B/zh
Publication of JP2011014661A publication Critical patent/JP2011014661A/ja
Publication of JP2011014661A5 publication Critical patent/JP2011014661A5/ja
Priority to US13/799,803 priority patent/US8847379B2/en
Application granted granted Critical
Publication of JP5178648B2 publication Critical patent/JP5178648B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009156325A 2009-06-30 2009-06-30 パッケージの製造方法、及び半導体装置 Expired - Fee Related JP5178648B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009156325A JP5178648B2 (ja) 2009-06-30 2009-06-30 パッケージの製造方法、及び半導体装置
US12/793,751 US8450153B2 (en) 2009-06-30 2010-06-04 Package manufacturing method and semiconductor device
CN2010102151737A CN101937850B (zh) 2009-06-30 2010-06-25 封装制造方法和半导体装置
US13/799,803 US8847379B2 (en) 2009-06-30 2013-03-13 Package manufacturing method and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009156325A JP5178648B2 (ja) 2009-06-30 2009-06-30 パッケージの製造方法、及び半導体装置

Publications (3)

Publication Number Publication Date
JP2011014661A JP2011014661A (ja) 2011-01-20
JP2011014661A5 true JP2011014661A5 (enExample) 2012-08-09
JP5178648B2 JP5178648B2 (ja) 2013-04-10

Family

ID=43379782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009156325A Expired - Fee Related JP5178648B2 (ja) 2009-06-30 2009-06-30 パッケージの製造方法、及び半導体装置

Country Status (3)

Country Link
US (2) US8450153B2 (enExample)
JP (1) JP5178648B2 (enExample)
CN (1) CN101937850B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106686888A (zh) * 2015-11-11 2017-05-17 旭景科技股份有限公司 形成增强型生物传感模块的印刷电路板元件及其制造方法
US9978675B2 (en) * 2015-11-20 2018-05-22 Canon Kabushiki Kaisha Package, electronic component, and electronic apparatus
CN106024823B (zh) * 2016-07-29 2020-04-21 格科微电子（上海）有限公司 Cmos图像传感器的封装方法
KR102847046B1 (ko) * 2019-05-08 2025-08-18 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3921880B2 (ja) 1999-07-09 2007-05-30 松下電器産業株式会社 樹脂封止型半導体装置の製造方法
JP3500361B2 (ja) 2001-02-14 2004-02-23 松下電器産業株式会社 リードフレーム及びその製造方法
US6720207B2 (en) * 2001-02-14 2004-04-13 Matsushita Electric Industrial Co., Ltd. Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
JP2003234425A (ja) * 2002-02-07 2003-08-22 Mitsui Chemicals Inc 半導体素子装着用中空パッケージ
EP1357605A1 (en) * 2002-04-22 2003-10-29 Scientek Corporation Image sensor semiconductor package with castellation
JP4779614B2 (ja) * 2005-12-08 2011-09-28 ヤマハ株式会社 半導体装置
EP1795496A2 (en) * 2005-12-08 2007-06-13 Yamaha Corporation Semiconductor device for detecting pressure variations
JP2008098478A (ja) * 2006-10-13 2008-04-24 Renesas Technology Corp 半導体装置及びその製造方法
CN101601133B (zh) * 2006-10-27 2011-08-10 宇芯（毛里求斯）控股有限公司 部分图案化的引线框以及在半导体封装中制造和使用其的方法
KR101187903B1 (ko) * 2007-07-09 2012-10-05 삼성테크윈 주식회사 리드 프레임 및 이를 구비한 반도체 패키지

Similar Documents

Publication Publication Date Title
JP2008118142A5 (enExample)
JP2011176271A5 (enExample)
JP2014110333A5 (ja) Ｌｅｄ装置の製造方法
JP2016096292A5 (enExample)
JP2011119502A5 (enExample)
JP2016072493A5 (enExample)
JP2010245280A5 (enExample)
JP2009164481A5 (enExample)
TW200703531A (en) Methods for packaging an image sensor and a packaged image sensor
JP2011222596A5 (enExample)
JP2011061116A5 (enExample)
JP2012109350A5 (enExample)
JP2014517531A5 (enExample)
JP2014011456A5 (enExample)
JP2015015313A5 (enExample)
JP2016072492A5 (enExample)
JP2011060807A5 (ja) 半導体チップの製造方法
JP2011014661A5 (enExample)
JP2020526004A5 (enExample)
JP2013243221A5 (enExample)
JP2014049558A5 (enExample)
EP2469614A3 (en) Light emitting device package and method of manufacturing the same
JP2016092300A5 (enExample)
JP2016518725A5 (enExample)
JP2012069918A5 (ja) チップパッケージビルドアップ方法